CN116960043A - 晶片载放台 - Google Patents

晶片载放台 Download PDF

Info

Publication number
CN116960043A
CN116960043A CN202310007250.7A CN202310007250A CN116960043A CN 116960043 A CN116960043 A CN 116960043A CN 202310007250 A CN202310007250 A CN 202310007250A CN 116960043 A CN116960043 A CN 116960043A
Authority
CN
China
Prior art keywords
power supply
supply terminal
wafer
refrigerant flow
flow path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310007250.7A
Other languages
English (en)
Chinese (zh)
Inventor
久野达也
井上靖也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of CN116960043A publication Critical patent/CN116960043A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
CN202310007250.7A 2022-04-26 2023-01-04 晶片载放台 Pending CN116960043A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-072511 2022-04-26
JP2022072511A JP7620593B2 (ja) 2022-04-26 2022-04-26 ウエハ載置台

Publications (1)

Publication Number Publication Date
CN116960043A true CN116960043A (zh) 2023-10-27

Family

ID=88415788

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310007250.7A Pending CN116960043A (zh) 2022-04-26 2023-01-04 晶片载放台

Country Status (5)

Country Link
US (1) US12211671B2 (https=)
JP (1) JP7620593B2 (https=)
KR (1) KR102800130B1 (https=)
CN (1) CN116960043A (https=)
TW (1) TWI849797B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024241516A1 (ja) * 2023-05-24 2024-11-28 日本碍子株式会社 ウエハ載置台
WO2026053636A1 (ja) * 2024-09-03 2026-03-12 日本碍子株式会社 半導体製造装置用部材
JP7829111B1 (ja) * 2024-09-03 2026-03-12 日本碍子株式会社 半導体製造装置用部材
US20260100341A1 (en) * 2024-10-09 2026-04-09 Applied Materials, Inc. Sheath and Temperature Control of Process Kit

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3297771B2 (ja) * 1993-11-05 2002-07-02 ソニー株式会社 半導体製造装置
US5883778A (en) 1994-02-28 1999-03-16 Applied Materials, Inc. Electrostatic chuck with fluid flow regulator
US6072685A (en) 1998-05-22 2000-06-06 Applied Materials, Inc. Electrostatic chuck having an electrical connector with housing
JP5269335B2 (ja) * 2007-03-30 2013-08-21 東京エレクトロン株式会社 プラズマ処理装置
JP4898556B2 (ja) * 2007-05-23 2012-03-14 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6182082B2 (ja) * 2013-03-15 2017-08-16 日本碍子株式会社 緻密質複合材料、その製法及び半導体製造装置用部材
JP6342769B2 (ja) 2014-09-30 2018-06-13 日本特殊陶業株式会社 静電チャック
JP6475031B2 (ja) 2015-02-03 2019-02-27 日本特殊陶業株式会社 静電チャック
JP6918642B2 (ja) * 2017-08-25 2021-08-11 東京エレクトロン株式会社 冷媒用の流路を有する部材、冷媒用の流路を有する部材の制御方法及び基板処理装置
US10490435B2 (en) 2018-02-07 2019-11-26 Applied Materials, Inc. Cooling element for an electrostatic chuck assembly
KR102427974B1 (ko) * 2018-03-13 2022-08-02 엔지케이 인슐레이터 엘티디 웨이퍼 유지대
US11133211B2 (en) * 2018-08-22 2021-09-28 Lam Research Corporation Ceramic baseplate with channels having non-square corners
JP7221737B2 (ja) 2019-03-04 2023-02-14 日本碍子株式会社 ウエハ載置装置
JP6918042B2 (ja) 2019-03-26 2021-08-11 日本碍子株式会社 ウエハ載置装置
JP7313254B2 (ja) 2019-10-11 2023-07-24 日本特殊陶業株式会社 保持装置
JP7411383B2 (ja) * 2019-11-05 2024-01-11 日本特殊陶業株式会社 加熱装置
JP7676722B2 (ja) * 2021-08-19 2025-05-15 新光電気工業株式会社 ベースプレート、基板固定装置

Also Published As

Publication number Publication date
KR20230151880A (ko) 2023-11-02
TW202403950A (zh) 2024-01-16
JP2023161888A (ja) 2023-11-08
KR102800130B1 (ko) 2025-04-23
TWI849797B (zh) 2024-07-21
US20230343565A1 (en) 2023-10-26
US12211671B2 (en) 2025-01-28
JP7620593B2 (ja) 2025-01-23

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