KR102800130B1 - 웨이퍼 배치대 - Google Patents

웨이퍼 배치대 Download PDF

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Publication number
KR102800130B1
KR102800130B1 KR1020230025270A KR20230025270A KR102800130B1 KR 102800130 B1 KR102800130 B1 KR 102800130B1 KR 1020230025270 A KR1020230025270 A KR 1020230025270A KR 20230025270 A KR20230025270 A KR 20230025270A KR 102800130 B1 KR102800130 B1 KR 102800130B1
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KR
South Korea
Prior art keywords
power supply
supply terminal
wafer placement
wafer
terminal hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020230025270A
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English (en)
Korean (ko)
Other versions
KR20230151880A (ko
Inventor
다츠야 구노
세이야 이노우에
Original Assignee
엔지케이 인슐레이터 엘티디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엔지케이 인슐레이터 엘티디 filed Critical 엔지케이 인슐레이터 엘티디
Publication of KR20230151880A publication Critical patent/KR20230151880A/ko
Application granted granted Critical
Publication of KR102800130B1 publication Critical patent/KR102800130B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H01L21/68785—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H01L21/67109—
    • H01L21/6833—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020230025270A 2022-04-26 2023-02-24 웨이퍼 배치대 Active KR102800130B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2022-072511 2022-04-26
JP2022072511A JP7620593B2 (ja) 2022-04-26 2022-04-26 ウエハ載置台

Publications (2)

Publication Number Publication Date
KR20230151880A KR20230151880A (ko) 2023-11-02
KR102800130B1 true KR102800130B1 (ko) 2025-04-23

Family

ID=88415788

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230025270A Active KR102800130B1 (ko) 2022-04-26 2023-02-24 웨이퍼 배치대

Country Status (5)

Country Link
US (1) US12211671B2 (https=)
JP (1) JP7620593B2 (https=)
KR (1) KR102800130B1 (https=)
CN (1) CN116960043A (https=)
TW (1) TWI849797B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024241516A1 (ja) * 2023-05-24 2024-11-28 日本碍子株式会社 ウエハ載置台
WO2026053636A1 (ja) * 2024-09-03 2026-03-12 日本碍子株式会社 半導体製造装置用部材
JP7829111B1 (ja) * 2024-09-03 2026-03-12 日本碍子株式会社 半導体製造装置用部材
US20260100341A1 (en) * 2024-10-09 2026-04-09 Applied Materials, Inc. Sheath and Temperature Control of Process Kit

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002517093A (ja) * 1998-05-22 2002-06-11 アプライド マテリアルズ インコーポレイテッド ハウジングと共に電気コネクタを有する静電チャック
JP3982854B2 (ja) * 1995-07-18 2007-09-26 アプライド マテリアルズ インコーポレイテッド 流量レギュレータをもった静電チャック
JP2019041024A (ja) 2017-08-25 2019-03-14 東京エレクトロン株式会社 冷媒用の流路を有する部材、冷媒用の流路を有する部材の制御方法及び基板処理装置
US20190244848A1 (en) * 2018-02-07 2019-08-08 Applied Materials, Inc. Cooling element for an electrostatic chuck assembly

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3297771B2 (ja) * 1993-11-05 2002-07-02 ソニー株式会社 半導体製造装置
JP5269335B2 (ja) * 2007-03-30 2013-08-21 東京エレクトロン株式会社 プラズマ処理装置
JP4898556B2 (ja) * 2007-05-23 2012-03-14 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6182082B2 (ja) * 2013-03-15 2017-08-16 日本碍子株式会社 緻密質複合材料、その製法及び半導体製造装置用部材
JP6342769B2 (ja) 2014-09-30 2018-06-13 日本特殊陶業株式会社 静電チャック
JP6475031B2 (ja) 2015-02-03 2019-02-27 日本特殊陶業株式会社 静電チャック
KR102427974B1 (ko) * 2018-03-13 2022-08-02 엔지케이 인슐레이터 엘티디 웨이퍼 유지대
US11133211B2 (en) * 2018-08-22 2021-09-28 Lam Research Corporation Ceramic baseplate with channels having non-square corners
JP7221737B2 (ja) 2019-03-04 2023-02-14 日本碍子株式会社 ウエハ載置装置
JP6918042B2 (ja) 2019-03-26 2021-08-11 日本碍子株式会社 ウエハ載置装置
JP7313254B2 (ja) 2019-10-11 2023-07-24 日本特殊陶業株式会社 保持装置
JP7411383B2 (ja) * 2019-11-05 2024-01-11 日本特殊陶業株式会社 加熱装置
JP7676722B2 (ja) * 2021-08-19 2025-05-15 新光電気工業株式会社 ベースプレート、基板固定装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3982854B2 (ja) * 1995-07-18 2007-09-26 アプライド マテリアルズ インコーポレイテッド 流量レギュレータをもった静電チャック
JP2002517093A (ja) * 1998-05-22 2002-06-11 アプライド マテリアルズ インコーポレイテッド ハウジングと共に電気コネクタを有する静電チャック
JP2019041024A (ja) 2017-08-25 2019-03-14 東京エレクトロン株式会社 冷媒用の流路を有する部材、冷媒用の流路を有する部材の制御方法及び基板処理装置
US20190244848A1 (en) * 2018-02-07 2019-08-08 Applied Materials, Inc. Cooling element for an electrostatic chuck assembly

Also Published As

Publication number Publication date
KR20230151880A (ko) 2023-11-02
TW202403950A (zh) 2024-01-16
JP2023161888A (ja) 2023-11-08
CN116960043A (zh) 2023-10-27
TWI849797B (zh) 2024-07-21
US20230343565A1 (en) 2023-10-26
US12211671B2 (en) 2025-01-28
JP7620593B2 (ja) 2025-01-23

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