TWI849797B - 晶圓載置台 - Google Patents

晶圓載置台 Download PDF

Info

Publication number
TWI849797B
TWI849797B TW112109433A TW112109433A TWI849797B TW I849797 B TWI849797 B TW I849797B TW 112109433 A TW112109433 A TW 112109433A TW 112109433 A TW112109433 A TW 112109433A TW I849797 B TWI849797 B TW I849797B
Authority
TW
Taiwan
Prior art keywords
power supply
supply terminal
wafer
terminal hole
substrate
Prior art date
Application number
TW112109433A
Other languages
English (en)
Chinese (zh)
Other versions
TW202403950A (zh
Inventor
久野達也
井上靖也
Original Assignee
日商日本碍子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本碍子股份有限公司 filed Critical 日商日本碍子股份有限公司
Publication of TW202403950A publication Critical patent/TW202403950A/zh
Application granted granted Critical
Publication of TWI849797B publication Critical patent/TWI849797B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW112109433A 2022-04-26 2023-03-15 晶圓載置台 TWI849797B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-072511 2022-04-26
JP2022072511A JP7620593B2 (ja) 2022-04-26 2022-04-26 ウエハ載置台

Publications (2)

Publication Number Publication Date
TW202403950A TW202403950A (zh) 2024-01-16
TWI849797B true TWI849797B (zh) 2024-07-21

Family

ID=88415788

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112109433A TWI849797B (zh) 2022-04-26 2023-03-15 晶圓載置台

Country Status (5)

Country Link
US (1) US12211671B2 (https=)
JP (1) JP7620593B2 (https=)
KR (1) KR102800130B1 (https=)
CN (1) CN116960043A (https=)
TW (1) TWI849797B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024241516A1 (ja) * 2023-05-24 2024-11-28 日本碍子株式会社 ウエハ載置台
WO2026053636A1 (ja) * 2024-09-03 2026-03-12 日本碍子株式会社 半導体製造装置用部材
JP7829111B1 (ja) * 2024-09-03 2026-03-12 日本碍子株式会社 半導体製造装置用部材
US20260100341A1 (en) * 2024-10-09 2026-04-09 Applied Materials, Inc. Sheath and Temperature Control of Process Kit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150077895A1 (en) * 2013-03-15 2015-03-19 Ngk Insulators, Ltd. Cooling plate, method for manufacturing the same, and member for semiconductor manufacturing apparatus
TW201946202A (zh) * 2018-03-13 2019-12-01 日商日本碍子股份有限公司 晶圓支撐台
TW202025335A (zh) * 2018-08-22 2020-07-01 美商蘭姆研究公司 含具有非方形轉角之渠道的陶瓷底板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3297771B2 (ja) * 1993-11-05 2002-07-02 ソニー株式会社 半導体製造装置
US5883778A (en) 1994-02-28 1999-03-16 Applied Materials, Inc. Electrostatic chuck with fluid flow regulator
US6072685A (en) 1998-05-22 2000-06-06 Applied Materials, Inc. Electrostatic chuck having an electrical connector with housing
JP5269335B2 (ja) * 2007-03-30 2013-08-21 東京エレクトロン株式会社 プラズマ処理装置
JP4898556B2 (ja) * 2007-05-23 2012-03-14 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6342769B2 (ja) 2014-09-30 2018-06-13 日本特殊陶業株式会社 静電チャック
JP6475031B2 (ja) 2015-02-03 2019-02-27 日本特殊陶業株式会社 静電チャック
JP6918642B2 (ja) * 2017-08-25 2021-08-11 東京エレクトロン株式会社 冷媒用の流路を有する部材、冷媒用の流路を有する部材の制御方法及び基板処理装置
US10490435B2 (en) 2018-02-07 2019-11-26 Applied Materials, Inc. Cooling element for an electrostatic chuck assembly
JP7221737B2 (ja) 2019-03-04 2023-02-14 日本碍子株式会社 ウエハ載置装置
JP6918042B2 (ja) 2019-03-26 2021-08-11 日本碍子株式会社 ウエハ載置装置
JP7313254B2 (ja) 2019-10-11 2023-07-24 日本特殊陶業株式会社 保持装置
JP7411383B2 (ja) * 2019-11-05 2024-01-11 日本特殊陶業株式会社 加熱装置
JP7676722B2 (ja) * 2021-08-19 2025-05-15 新光電気工業株式会社 ベースプレート、基板固定装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150077895A1 (en) * 2013-03-15 2015-03-19 Ngk Insulators, Ltd. Cooling plate, method for manufacturing the same, and member for semiconductor manufacturing apparatus
TW201946202A (zh) * 2018-03-13 2019-12-01 日商日本碍子股份有限公司 晶圓支撐台
TW202025335A (zh) * 2018-08-22 2020-07-01 美商蘭姆研究公司 含具有非方形轉角之渠道的陶瓷底板

Also Published As

Publication number Publication date
KR20230151880A (ko) 2023-11-02
TW202403950A (zh) 2024-01-16
JP2023161888A (ja) 2023-11-08
KR102800130B1 (ko) 2025-04-23
CN116960043A (zh) 2023-10-27
US20230343565A1 (en) 2023-10-26
US12211671B2 (en) 2025-01-28
JP7620593B2 (ja) 2025-01-23

Similar Documents

Publication Publication Date Title
TWI849797B (zh) 晶圓載置台
TWI874797B (zh) 晶圓載置台
TWI912585B (zh) 晶圓載置台
US12308220B2 (en) Wafer placement table
CN116130324B (zh) 晶片载放台
TWI840855B (zh) 晶圓載置台
TWI866070B (zh) 晶圓載置台
TWI841078B (zh) 晶圓載置台
US20250014875A1 (en) Wafer placement table
TWI829212B (zh) 晶圓載置台
TWI814572B (zh) 晶圓載置台
WO2023063016A1 (ja) ウエハ載置台
TWI833589B (zh) 晶圓載置台
TW202541254A (zh) 晶圓載置台
CN116564779A (zh) 晶片载放台及采用了该晶片载放台的半导体制造装置用部件