CN116940445A - 用于可变间距进出的真空机器人装置 - Google Patents
用于可变间距进出的真空机器人装置 Download PDFInfo
- Publication number
- CN116940445A CN116940445A CN202280017908.6A CN202280017908A CN116940445A CN 116940445 A CN116940445 A CN 116940445A CN 202280017908 A CN202280017908 A CN 202280017908A CN 116940445 A CN116940445 A CN 116940445A
- Authority
- CN
- China
- Prior art keywords
- end effector
- rotation
- axis
- forearm
- upper arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3311—Horizontal transfer of a batch of workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J5/00—Manipulators mounted on wheels or on carriages
- B25J5/02—Manipulators mounted on wheels or on carriages travelling along a guideway
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/188,374 | 2021-03-01 | ||
| US17/188,374 US11358809B1 (en) | 2021-03-01 | 2021-03-01 | Vacuum robot apparatus for variable pitch access |
| PCT/US2022/016209 WO2022186968A1 (en) | 2021-03-01 | 2022-02-11 | Vacuum robot apparatus for variable pitch access |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116940445A true CN116940445A (zh) | 2023-10-24 |
Family
ID=81944143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280017908.6A Pending CN116940445A (zh) | 2021-03-01 | 2022-02-11 | 用于可变间距进出的真空机器人装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11358809B1 (https=) |
| JP (1) | JP7682288B2 (https=) |
| KR (1) | KR102834294B1 (https=) |
| CN (1) | CN116940445A (https=) |
| TW (1) | TWI861471B (https=) |
| WO (1) | WO2022186968A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102833850B1 (ko) * | 2020-03-24 | 2025-07-14 | 주식회사 원익아이피에스 | 이송로봇 및 이를 포함하는 기판처리시스템 |
| US11358809B1 (en) * | 2021-03-01 | 2022-06-14 | Applied Materials, Inc. | Vacuum robot apparatus for variable pitch access |
| US12226896B2 (en) | 2021-10-22 | 2025-02-18 | Applied Materials, Inc. | Operations of robot apparatuses within rectangular mainframes |
| CN115632023B (zh) * | 2022-12-22 | 2023-08-04 | 河北博特半导体设备科技有限公司 | 一种双臂晶圆传输装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140133534A (ko) * | 2012-02-10 | 2014-11-19 | 브룩스 오토메이션 인코퍼레이티드 | 기판 프로세싱 장치 |
| CN104380452A (zh) * | 2012-04-12 | 2015-02-25 | 应用材料公司 | 具有独立能旋转机身中段的机械手系统、设备及方法 |
| CN105164799A (zh) * | 2013-03-15 | 2015-12-16 | 应用材料公司 | 基板沉积系统、机械手移送设备及用于电子装置制造的方法 |
| CN111133563A (zh) * | 2017-09-19 | 2020-05-08 | 应用材料公司 | 包括垂直偏移、水平重叠的蛙腿连杆的双叶片机器人和包括其的系统和方法 |
| US20200185245A1 (en) * | 2013-09-09 | 2020-06-11 | Persimmon Technologies, Crop. | Substrate Transport Vacuum Platform |
| US20200384634A1 (en) * | 2019-06-07 | 2020-12-10 | Applied Materials, Inc. | Robot apparatus including dual end effectors with variable pitch and methods |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002184834A (ja) * | 2000-12-15 | 2002-06-28 | Yaskawa Electric Corp | 基板搬送用ロボット |
| AU2002327249A1 (en) * | 2001-07-13 | 2003-01-29 | Brooks Automation, Inc. | Substrate transport apparatus with multiple independent end effectors |
| US7578649B2 (en) * | 2002-05-29 | 2009-08-25 | Brooks Automation, Inc. | Dual arm substrate transport apparatus |
| KR20080004118A (ko) * | 2006-07-04 | 2008-01-09 | 피에스케이 주식회사 | 기판 처리 설비 |
| JP2008135630A (ja) * | 2006-11-29 | 2008-06-12 | Jel:Kk | 基板搬送装置 |
| JP4979530B2 (ja) * | 2007-09-28 | 2012-07-18 | 日本電産サンキョー株式会社 | 産業用ロボット |
| JP5610952B2 (ja) * | 2010-09-24 | 2014-10-22 | 日本電産サンキョー株式会社 | 産業用ロボット |
| CN201913647U (zh) * | 2010-12-21 | 2011-08-03 | 沈阳新松机器人自动化股份有限公司 | 机器人手臂机构 |
| JP6594304B2 (ja) * | 2013-10-18 | 2019-10-23 | ブルックス オートメーション インコーポレイテッド | 処理装置 |
| US20160332301A1 (en) * | 2015-05-13 | 2016-11-17 | Boris Kesil | Method of handling and transporting flat objects between a plurality of flat object pocessing units at robotic station |
| KR102587203B1 (ko) * | 2015-07-13 | 2023-10-10 | 브룩스 오토메이션 인코퍼레이티드 | 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치 |
| US10099377B2 (en) * | 2016-06-29 | 2018-10-16 | Applied Materials, Inc. | Methods and systems providing misalignment correction in robots |
| KR101929872B1 (ko) * | 2016-08-19 | 2019-03-15 | 피에스케이 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| JP7183635B2 (ja) * | 2018-08-31 | 2022-12-06 | 東京エレクトロン株式会社 | 基板搬送機構、基板処理装置及び基板搬送方法 |
| JP7225613B2 (ja) * | 2018-09-03 | 2023-02-21 | 東京エレクトロン株式会社 | 基板搬送機構、基板処理装置及び基板搬送方法 |
| US10636693B2 (en) * | 2018-09-11 | 2020-04-28 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer device and control method therefor |
| US20200384636A1 (en) | 2019-06-07 | 2020-12-10 | Applied Materials, Inc. | Dual pitch end effector robot apparatus, dual pitch load locks, systems, and methods |
| US11031269B2 (en) * | 2019-08-22 | 2021-06-08 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transport robot, substrate transport system, and substrate transport method |
| US11358809B1 (en) * | 2021-03-01 | 2022-06-14 | Applied Materials, Inc. | Vacuum robot apparatus for variable pitch access |
-
2021
- 2021-03-01 US US17/188,374 patent/US11358809B1/en active Active
-
2022
- 2022-02-11 CN CN202280017908.6A patent/CN116940445A/zh active Pending
- 2022-02-11 WO PCT/US2022/016209 patent/WO2022186968A1/en not_active Ceased
- 2022-02-11 JP JP2023551144A patent/JP7682288B2/ja active Active
- 2022-02-11 KR KR1020237033231A patent/KR102834294B1/ko active Active
- 2022-02-22 TW TW111106360A patent/TWI861471B/zh active
- 2022-05-11 US US17/742,228 patent/US20220274788A1/en not_active Abandoned
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140133534A (ko) * | 2012-02-10 | 2014-11-19 | 브룩스 오토메이션 인코퍼레이티드 | 기판 프로세싱 장치 |
| CN104380452A (zh) * | 2012-04-12 | 2015-02-25 | 应用材料公司 | 具有独立能旋转机身中段的机械手系统、设备及方法 |
| CN105164799A (zh) * | 2013-03-15 | 2015-12-16 | 应用材料公司 | 基板沉积系统、机械手移送设备及用于电子装置制造的方法 |
| US20200185245A1 (en) * | 2013-09-09 | 2020-06-11 | Persimmon Technologies, Crop. | Substrate Transport Vacuum Platform |
| CN111133563A (zh) * | 2017-09-19 | 2020-05-08 | 应用材料公司 | 包括垂直偏移、水平重叠的蛙腿连杆的双叶片机器人和包括其的系统和方法 |
| US20200384634A1 (en) * | 2019-06-07 | 2020-12-10 | Applied Materials, Inc. | Robot apparatus including dual end effectors with variable pitch and methods |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230152116A (ko) | 2023-11-02 |
| TW202241659A (zh) | 2022-11-01 |
| JP7682288B2 (ja) | 2025-05-23 |
| US11358809B1 (en) | 2022-06-14 |
| WO2022186968A1 (en) | 2022-09-09 |
| KR102834294B1 (ko) | 2025-07-14 |
| US20220274788A1 (en) | 2022-09-01 |
| TWI861471B (zh) | 2024-11-11 |
| JP2024509519A (ja) | 2024-03-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |