CN116940445A - 用于可变间距进出的真空机器人装置 - Google Patents

用于可变间距进出的真空机器人装置 Download PDF

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Publication number
CN116940445A
CN116940445A CN202280017908.6A CN202280017908A CN116940445A CN 116940445 A CN116940445 A CN 116940445A CN 202280017908 A CN202280017908 A CN 202280017908A CN 116940445 A CN116940445 A CN 116940445A
Authority
CN
China
Prior art keywords
end effector
rotation
axis
forearm
upper arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280017908.6A
Other languages
English (en)
Chinese (zh)
Inventor
拉尹库曼·塔努
杰弗里·C·赫金斯
卡鲁帕萨米·穆图马克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN116940445A publication Critical patent/CN116940445A/zh
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/91Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311Horizontal transfer of a batch of workpieces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00Gripping heads and other end effectors
    • B25J15/0014Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J5/00Manipulators mounted on wheels or on carriages
    • B25J5/02Manipulators mounted on wheels or on carriages travelling along a guideway
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Program-controlled manipulators
    • B25J9/02Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302Mechanical parts of transfer devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN202280017908.6A 2021-03-01 2022-02-11 用于可变间距进出的真空机器人装置 Pending CN116940445A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/188,374 2021-03-01
US17/188,374 US11358809B1 (en) 2021-03-01 2021-03-01 Vacuum robot apparatus for variable pitch access
PCT/US2022/016209 WO2022186968A1 (en) 2021-03-01 2022-02-11 Vacuum robot apparatus for variable pitch access

Publications (1)

Publication Number Publication Date
CN116940445A true CN116940445A (zh) 2023-10-24

Family

ID=81944143

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280017908.6A Pending CN116940445A (zh) 2021-03-01 2022-02-11 用于可变间距进出的真空机器人装置

Country Status (6)

Country Link
US (2) US11358809B1 (https=)
JP (1) JP7682288B2 (https=)
KR (1) KR102834294B1 (https=)
CN (1) CN116940445A (https=)
TW (1) TWI861471B (https=)
WO (1) WO2022186968A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
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KR102833850B1 (ko) * 2020-03-24 2025-07-14 주식회사 원익아이피에스 이송로봇 및 이를 포함하는 기판처리시스템
US11358809B1 (en) * 2021-03-01 2022-06-14 Applied Materials, Inc. Vacuum robot apparatus for variable pitch access
US12226896B2 (en) 2021-10-22 2025-02-18 Applied Materials, Inc. Operations of robot apparatuses within rectangular mainframes
CN115632023B (zh) * 2022-12-22 2023-08-04 河北博特半导体设备科技有限公司 一种双臂晶圆传输装置

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KR20140133534A (ko) * 2012-02-10 2014-11-19 브룩스 오토메이션 인코퍼레이티드 기판 프로세싱 장치
CN104380452A (zh) * 2012-04-12 2015-02-25 应用材料公司 具有独立能旋转机身中段的机械手系统、设备及方法
CN105164799A (zh) * 2013-03-15 2015-12-16 应用材料公司 基板沉积系统、机械手移送设备及用于电子装置制造的方法
CN111133563A (zh) * 2017-09-19 2020-05-08 应用材料公司 包括垂直偏移、水平重叠的蛙腿连杆的双叶片机器人和包括其的系统和方法
US20200185245A1 (en) * 2013-09-09 2020-06-11 Persimmon Technologies, Crop. Substrate Transport Vacuum Platform
US20200384634A1 (en) * 2019-06-07 2020-12-10 Applied Materials, Inc. Robot apparatus including dual end effectors with variable pitch and methods

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AU2002327249A1 (en) * 2001-07-13 2003-01-29 Brooks Automation, Inc. Substrate transport apparatus with multiple independent end effectors
US7578649B2 (en) * 2002-05-29 2009-08-25 Brooks Automation, Inc. Dual arm substrate transport apparatus
KR20080004118A (ko) * 2006-07-04 2008-01-09 피에스케이 주식회사 기판 처리 설비
JP2008135630A (ja) * 2006-11-29 2008-06-12 Jel:Kk 基板搬送装置
JP4979530B2 (ja) * 2007-09-28 2012-07-18 日本電産サンキョー株式会社 産業用ロボット
JP5610952B2 (ja) * 2010-09-24 2014-10-22 日本電産サンキョー株式会社 産業用ロボット
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JP7183635B2 (ja) * 2018-08-31 2022-12-06 東京エレクトロン株式会社 基板搬送機構、基板処理装置及び基板搬送方法
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US11358809B1 (en) * 2021-03-01 2022-06-14 Applied Materials, Inc. Vacuum robot apparatus for variable pitch access

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KR20140133534A (ko) * 2012-02-10 2014-11-19 브룩스 오토메이션 인코퍼레이티드 기판 프로세싱 장치
CN104380452A (zh) * 2012-04-12 2015-02-25 应用材料公司 具有独立能旋转机身中段的机械手系统、设备及方法
CN105164799A (zh) * 2013-03-15 2015-12-16 应用材料公司 基板沉积系统、机械手移送设备及用于电子装置制造的方法
US20200185245A1 (en) * 2013-09-09 2020-06-11 Persimmon Technologies, Crop. Substrate Transport Vacuum Platform
CN111133563A (zh) * 2017-09-19 2020-05-08 应用材料公司 包括垂直偏移、水平重叠的蛙腿连杆的双叶片机器人和包括其的系统和方法
US20200384634A1 (en) * 2019-06-07 2020-12-10 Applied Materials, Inc. Robot apparatus including dual end effectors with variable pitch and methods

Also Published As

Publication number Publication date
KR20230152116A (ko) 2023-11-02
TW202241659A (zh) 2022-11-01
JP7682288B2 (ja) 2025-05-23
US11358809B1 (en) 2022-06-14
WO2022186968A1 (en) 2022-09-09
KR102834294B1 (ko) 2025-07-14
US20220274788A1 (en) 2022-09-01
TWI861471B (zh) 2024-11-11
JP2024509519A (ja) 2024-03-04

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