CN116936419B - Semiconductor process equipment and lifting sealing door mechanism thereof - Google Patents
Semiconductor process equipment and lifting sealing door mechanism thereof Download PDFInfo
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- CN116936419B CN116936419B CN202311175062.1A CN202311175062A CN116936419B CN 116936419 B CN116936419 B CN 116936419B CN 202311175062 A CN202311175062 A CN 202311175062A CN 116936419 B CN116936419 B CN 116936419B
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- 238000007789 sealing Methods 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims abstract description 69
- 230000008569 process Effects 0.000 title claims abstract description 66
- 230000007246 mechanism Effects 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 230000007704 transition Effects 0.000 claims description 17
- 238000012545 processing Methods 0.000 claims description 15
- 239000007788 liquid Substances 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000002378 acidificating effect Effects 0.000 abstract description 5
- 239000000428 dust Substances 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 abstract description 4
- 238000009434 installation Methods 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000007667 floating Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a semiconductor process device and a lifting sealing door mechanism thereof, wherein through the arrangement of a fixed plate, a door plate, a sealing element and a driving element, when the door opening and closing operation is carried out, liquid and/or gas in a process cavity can be effectively prevented from flowing out through an inclined channel and a drainage channel contacted with the sealing element; the fixing plate and the door plate which are contacted with the process cavity can be applied to an acidic environment when the PVC material is selected, and can avoid the pollution of metal dust, thereby expanding the application range; the lifting sealing door mechanism is simple in structure, production cost and assembly and maintenance cost can be greatly reduced, and production efficiency is improved.
Description
Technical Field
The invention belongs to the field of semiconductor equipment, and relates to semiconductor process equipment and a lifting sealing door mechanism thereof.
Background
In the process of semiconductor technology, wafers need to be subjected to multiple procedures, such as photoresist coating, exposure, development, etching, photoresist removal, cleaning and the like, and in each treatment process, chemical liquid or chemical gas is needed, and is usually harmful to human bodies or equipment, and the wafers need to repeatedly enter a process cavity in the process, so that the tightness of a door opening and closing of the process cavity is important.
The existing switch door of semiconductor process equipment mostly adopts the edge frame of heavy metal plate plus wear-resisting material to constitute, is difficult to realize sealedly, and the leakproofness of switch door can cause serious influence to semiconductor process, for example in the cleaning process of wafer, the leakproofness of process chamber is crucial, neither can produce the dust nor can gas leakage appear, and the existing switch door is not only complicated in structure, cost of maintenance is high, and leaks the risk higher, can't use in acidic environment.
Therefore, it is necessary to provide a semiconductor processing apparatus and a lifting sealing door mechanism thereof.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a semiconductor processing apparatus and a lifting sealing door mechanism thereof, which are used for solving the sealing problem of the opening and closing door of the semiconductor processing apparatus in the prior art.
To achieve the above and other related objects, the present invention provides a lifting sealing door mechanism in a semiconductor process apparatus, comprising:
the fixing plate is arranged on the outer side of the process cavity, a fixing plate opening communicated with the process cavity is formed in the fixing plate, a guide flange is arranged at the top end of the fixing plate on one side close to the process cavity, the top surface of the guide flange is a first inclined surface, the first inclined surface gradually inclines downwards from one side far away from the process cavity to one side close to the process cavity, and a drainage groove arranged along the circumferential direction is formed in the side wall, close to the process cavity, of the fixing plate;
the door plate is positioned at the inner side of the opening of the fixed plate and positioned in the process cavity, the top surface of the door plate is a second inclined surface which is arranged corresponding to the first inclined surface, the second inclined surface gradually inclines upwards from one side far away from the fixed plate to one side close to the fixed plate, and a sealing groove is arranged on one side, close to the fixed plate, of the door plate;
the sealing piece is arranged in the sealing groove and protrudes out of the sealing groove;
the driving piece is connected with the door plate and comprises a push-pull driving piece for driving the door plate to push and pull to reciprocate and a lifting driving piece for driving the door plate to lift to reciprocate;
when the door is closed, the lifting driving piece operates, the door plate ascends, the push-pull driving piece operates later, the door plate is close to the fixed plate, the sealing piece is in contact with the drainage groove of the fixed plate, and the first inclined surface and the second inclined surface form an inclined channel communicated with the process cavity;
when the door is opened, the push-pull driving piece operates, the door plate is far away from the fixed plate, the lifting driving piece operates afterwards, the door plate descends, and the drainage groove is exposed in the process cavity.
Optionally, the device further comprises a guide assembly, wherein the guide assembly comprises one or a combination of a push-pull guide assembly and a lifting guide assembly.
Optionally, the guiding component comprises a linear bearing and a guiding shaft which are correspondingly arranged, or a sliding rail and a sliding rod which are correspondingly arranged.
Optionally, the door panel comprises a PVC door panel, and the fixing plate comprises a PVC fixing plate; and the door plate is also provided with a metal bracket.
Optionally, the door opening and closing device further comprises door opening and closing sensors and door opening and closing sensing pieces which are respectively positioned on the fixed plate and the door plate and are correspondingly arranged.
Optionally, the sliding device further comprises a transition mounting plate mounted on the door plate, the sliding driving piece is located on the transition mounting plate, and the transition mounting plate is further provided with a clamping groove which is arranged corresponding to the lifting driving piece.
Optionally, the seal comprises a seal body and a seal skirt, and the seal skirt extends obliquely outward along the seal body.
Optionally, a sealing ring is further arranged between the fixing plate and the process cavity.
Optionally, the lifting driving piece is arranged on the fixed plate or the process cavity, and the push-pull driving piece is arranged on the fixed plate or the process cavity; the lifting driving piece comprises a lifting cylinder, and the push-pull driving piece comprises a push-pull cylinder.
The invention also provides semiconductor process equipment which comprises any lifting sealing door mechanism.
As described above, according to the semiconductor processing equipment and the lifting sealing door mechanism thereof, through the arrangement of the fixed plate, the door plate, the sealing element and the driving element, when the door opening and closing operation is performed, the outflow of liquid and/or gas in the processing cavity can be effectively prevented through the inclined channel and the drainage channel contacted with the sealing element; the fixing plate and the door plate which are contacted with the process cavity can be applied to an acidic environment when the PVC material is selected, and can avoid the pollution of metal dust, thereby expanding the application range; the lifting sealing door mechanism is simple in structure, production cost and assembly and maintenance cost can be greatly reduced, and production efficiency is improved.
Drawings
Fig. 1 is a schematic view showing the overall structure of a lifting sealing door mechanism in an embodiment of the invention.
Fig. 2 shows a schematic cross-sectional structure along A-A' in fig. 1.
Fig. 3 is a schematic diagram of the front view of fig. 2.
Fig. 4 is a schematic view showing a partial enlarged structure of the region C in fig. 3.
Description of element reference numerals
1-a fixing plate; 2-a bottom frame; 3-lifting air cylinders; 4-lifting linear bearings; 5-lifting guide shafts; 6-a transition mounting plate; 7-a push-pull cylinder; 8-floating joint; 9-pushing and pulling the linear bearing; 10-pushing and pulling a guide shaft; 11-a metal stent; 12-door panels; 13-a seal; 14-a door opening and closing sensor; 15-opening and closing door sensing pieces; 16-a process chamber; 17-a fixed plate opening; 18-a first inclined surface; 19-a second inclined surface; 20-drainage grooves; 21-sealing the groove; 22-inclined channels; 23-sealing ring.
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
As shown in fig. 1 to 4, the present embodiment provides a lifting sealing door mechanism in a semiconductor processing apparatus, which includes a fixing plate 1, a door plate 12, a sealing member 13 and a driving member.
Referring to fig. 1 and 2, the fixing plate 1 is mounted on the outside of the process chamber 16, a fixing plate opening 17 that is communicated with the process chamber 16 is formed in the fixing plate 1, a guiding flange is disposed on a side of the top end of the fixing plate 1 adjacent to the process chamber 16, the top surface of the guiding flange is a first inclined surface 18, the first inclined surface 18 gradually inclines downwards from a side far from the process chamber 16 to a side near the process chamber 16, and a drainage groove 20 that is disposed along the circumferential direction is disposed on a side wall of the fixing plate 1 adjacent to the process chamber 16; the door plate 12 is located inside the fixing plate opening 17 and is located in the process cavity 16, the top surface of the door plate 12 is a second inclined surface 19 corresponding to the first inclined surface 18, the second inclined surface 19 gradually inclines upwards from one side far away from the fixing plate 1 to one side close to the fixing plate 1, and the door plate 12 is provided with a sealing groove 21 on one side close to the fixing plate 1; the seal 13 is disposed in the seal groove 21, and the seal 13 protrudes from the seal groove 21; the driving piece is connected with the door plate 12 and comprises a push-pull driving piece for driving the door plate 12 to push and pull to reciprocate and a lifting driving piece for driving the door plate 12 to lift to reciprocate.
In the lifting sealing door mechanism of this embodiment, when the door is closed, the lifting driving member operates, the door plate 12 rises, and then the push-pull driving member operates, the door plate 12 approaches the fixing plate 1, the sealing member 13 contacts the drainage groove 20 of the fixing plate 1, and the first inclined surface 18 and the second inclined surface 19 form an inclined channel 22 communicated with the process cavity 16, so that liquid flows into the process cavity 16 along the inclined channel 22; when the door is opened, the push-pull driving member operates, the door plate 12 is away from the fixed plate 1, and then the lifting driving member operates, the door plate 12 descends, and the drainage groove 20 is exposed to the process cavity 16, so that redundant liquid flows into the process cavity 16 along the drainage groove 20.
Therefore, when the lifting sealing door mechanism of the present embodiment performs door opening and closing operations, the inclined channel 22, the drainage channel 20 and the sealing member 13 can effectively prevent the liquid and/or gas in the process chamber 16 from flowing out, so that good sealing can be achieved.
As an example, a sealing ring 23 is also arranged between the fixing plate 1 and the process chamber 16.
Specifically, as shown in fig. 3, in the present embodiment, the sealing ring 23 is disposed between the fixing plate 1 and the process chamber 16, so as to improve the sealing performance by using the sealing ring 23, where the sealing ring 23 may be, for example, an O-ring, and the type and the disposition of the sealing ring 23 are not limited herein.
As an example, a guide assembly is also included, including one or a combination of a push-pull guide assembly and a lift guide assembly.
Specifically, as shown in fig. 1 and 2, in the present embodiment, in order to improve stability, the lifting guide assembly is provided in the lifting direction and the push-pull guide assembly is provided in the push-pull direction in the lifting sealing door mechanism, but the present invention is not limited thereto, and only the lifting guide assembly or the push-pull guide assembly may be provided as needed, and the present invention is not limited thereto.
The guide assembly can be selected from a linear bearing and a guide shaft which are correspondingly arranged, or a sliding rail and a sliding rod which are correspondingly arranged.
Specifically, in this embodiment, the lifting guide assembly is composed of a lifting linear bearing 4 and a lifting guide shaft 5 that are configured in a matching manner, and the push-pull guide assembly is composed of a push-pull linear bearing 9 and a push-pull guide shaft 10, that is, the lifting guide assembly and the push-pull guide assembly both adopt the corresponding linear bearings and guide shafts, but the types of the guide assemblies are not limited thereto, and the guide assemblies may also adopt, for example, corresponding sliding rails and sliding bars, as required, without being excessively limited thereto.
Further, it is preferable that the guide assemblies are symmetrically disposed along the corresponding driving members to further improve stability. In the embodiment, as shown in fig. 1 and 2, the lifting guide assembly and the push-pull guide assembly are respectively provided with 2 sets and are symmetrically arranged along the corresponding driving piece, but the number and distribution of the guide assemblies are not limited to this, for example, 1 set may be provided. It will be appreciated that the guide assembly may not be provided and that the balance stabilizing effect may be achieved by providing symmetrical driving members, not limited thereto.
As an example, the lifting driving member may be mounted on the fixing plate 1 or the process chamber 16, and the push-pull driving member may be mounted on the fixing plate 1 or the process chamber 16.
Specifically, in order to facilitate installation and replacement, as shown in fig. 1, in this embodiment, the lifting sealing door mechanism is provided with a bottom frame 2 on the fixing plate 1, and a detachable transition mounting plate 6 is installed on the door plate 12, so as to apply the bottom frame 2 and the transition mounting plate 6 as a mounting frame, where the lifting linear bearing 4 and the lifting driving piece are installed through the bottom frame 2, the push-pull linear bearing 9 and the push-pull driving piece are installed through the transition mounting plate 6, the lifting guide shaft 5 and the lifting driving piece are connected with the transition mounting plate 6, and lifting operation of the lifting driving piece drives the transition mounting plate 6 through lifting operation of the lifting driving piece, so as to drive the door plate 12 to lift operation, the push-pull guide shaft 10 and the push-pull driving piece are connected with the door plate 12, and push-pull operation of the push-pull driving piece drives the door plate 12 to push-pull operation.
For ease of installation, it is preferable that the transition mounting plate 6 is provided with a groove provided corresponding to the lift driver, but not limited thereto.
As an example, the elevation driving member includes an elevation cylinder; the push-pull driving piece comprises a push-pull cylinder.
Specifically, in this embodiment, the lift driving member and the push-pull driving member are all commonly used cylinders, that is, the lift driving member adopts the lift cylinder 3, and the push-pull driving member adopts the push-pull cylinder 7, but the types of the lift driving member and the push-pull driving member are not limited thereto, and may be selected according to the needs.
As an example, the door panel 12 comprises a PVC door panel and the fixing plate 1 comprises a PVC fixing plate.
Specifically, when the door plate 12 and the fixing plate 1 are both made of acid-resistant and corrosion-resistant PVC materials, the application range of the lifting sealing door mechanism can be enlarged, for example, the lifting sealing door mechanism can be applied to an acidic environment, and pollution caused by metal dust can be avoided.
In order to improve the firmness of the lifting sealing door mechanism, it is preferable to install a metal bracket 11 on the door plate 12, and further, in order to facilitate the installation, it is preferable to provide a clamping groove on the metal bracket 11, so as to facilitate the installation of the push-pull driving member, so that the push-pull driving member can be conveniently connected with the door plate 12, such as through a floating joint 8.
As an example, the seal 13 may comprise a seal body and a seal skirt, and the seal skirt extends obliquely outward along the seal body.
Specifically, as shown in fig. 4, the sealing body of the sealing member 13 is installed in the sealing groove 21 in the door panel 12, and the sealing skirt is disposed corresponding to the drainage groove 20 and extends obliquely outward along the sealing body, so that when the door panel 12 is closed, the sealing skirt may contact with the drainage groove 20 to achieve sealing, and meanwhile, the first inclined surface 18 and the second inclined surface 19 form the inclined channel 22, so that the liquid flows into the process cavity 16 conveniently.
Among them, the seal groove 21 is preferably a special-shaped groove to further improve the sealing property.
As shown in fig. 3, the bottom surfaces of the fixing plate 1 and the door plate 12 are preferably inclined surfaces to avoid condensation of the liquid.
As an example, the door opening/closing sensor 14 and the door opening/closing sensing piece 15 are respectively installed on the fixing plate 1 and the door plate 12.
Specifically, the door opening and closing sensor 14, the lifting cylinder 3 and the push-pull cylinder 7 may be connected with a controller, and by setting the door opening and closing sensor 14 and the door opening and closing sensing piece 15, the controller may accurately control the lifting cylinder 3 and the push-pull cylinder 7, so as to realize automatic and high-precision switch control of the door panel 12.
The specific type of the controller and the sensor and the communication method between the respective components are not limited herein, and may be selected as needed.
A specific installation method of the lifting sealing door mechanism is provided below, but not limited thereto, and specifically includes:
the fixing plate 1 is fixed on the process cavity 16 through bolts, and the contact surface is sealed through the sealing ring 23; the fixing plate 1 is provided with a bottom frame 2, the bottom surface of the bottom frame 2 is provided with a through hole, the bottom frame 2 is fixed on the fixing plate 1 through bolts, the lifting cylinder 3 is fixed on the bottom frame 2 through bolts, the two lifting linear bearings 4 are fixed on the bottom frame 2 through bolt connection, the two lifting guide shafts 5 are installed on the corresponding lifting linear bearings 4 through pin shaft connection, and one end of each lifting guide shaft is provided with a threaded hole; the transition mounting plate 6 is connected with the lifting guide shaft 5 through a bolt, and a clamping groove is formed in the middle of the transition mounting plate 6 so as to be connected with the lifting cylinder 3; the push-pull cylinder 7 is mounted on the transition mounting plate 6 through bolt connection, the floating joint 8 is integrally provided with a through hole, and is mounted at the end head of the push-pull cylinder 7 through bolt connection; two small push-pull linear bearings 9 are fixed on the transition mounting plate 6 through bolt connection, two small push-pull guide shafts 10 are installed on the corresponding push-pull linear bearings 9 through pin shaft connection, and one end of each small push-pull guide shaft is provided with a threaded hole; the metal bracket 11 is fixed with the push-pull guide shaft 10 through a bolt, and a clamping groove is formed in the middle of the metal bracket 11 so as to be directly clamped with the floating joint 8, thereby being connected with the push-pull cylinder 7; the door plate 12 is provided with a threaded hole and is fixed with the metal bracket 11 through a bolt, the door plate 12 is provided with a special-shaped groove, and the sealing ring 13 is directly clamped into the special-shaped groove of the door plate 12; the two door opening and closing sensors 14 are directly connected to the transition mounting plate 6 through pin holes, fixed and limited through bolt connection, and the two door opening and closing sensing pieces 15 are fixed to the metal bracket 11 through bolt connection.
The invention also provides a semiconductor process device, which adopts the lifting sealing door mechanism, and the specific structure of the lifting sealing door mechanism is not repeated here, wherein the semiconductor process device can comprise a semiconductor cleaning device, a semiconductor etching device and the like.
In summary, according to the semiconductor process equipment and the lifting sealing door mechanism thereof, through the arrangement of the fixing plate, the door plate, the sealing piece and the driving piece, when the door opening and closing operation is performed, the outflow of liquid and/or gas in the process cavity can be effectively prevented through the inclined channel and the drainage channel contacted with the sealing piece; the fixing plate and the door plate which are contacted with the process cavity can be applied to an acidic environment when the PVC material is selected, and can avoid the pollution of metal dust, thereby expanding the application range; the lifting sealing door mechanism is simple in structure, production cost and assembly and maintenance cost can be greatly reduced, and production efficiency is improved.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (9)
1. A lift seal gate mechanism in a semiconductor processing apparatus, comprising:
the fixing plate is arranged on the outer side of the process cavity, a fixing plate opening communicated with the process cavity is formed in the fixing plate, a guide flange is arranged at the top end of the fixing plate on one side close to the process cavity, the top surface of the guide flange is a first inclined surface, the first inclined surface gradually inclines downwards from one side far away from the process cavity to one side close to the process cavity, and a drainage groove arranged along the circumferential direction is formed in the side wall, close to the process cavity, of the fixing plate;
the door plate is positioned at the inner side of the opening of the fixed plate and positioned in the process cavity, the top surface of the door plate is a second inclined surface which is arranged corresponding to the first inclined surface, the second inclined surface gradually inclines upwards from one side far away from the fixed plate to one side close to the fixed plate, and a sealing groove is arranged on one side, close to the fixed plate, of the door plate;
the sealing piece is arranged in the sealing groove and protrudes out of the sealing groove, the sealing piece comprises a sealing body and a sealing skirt, and the sealing skirt extends outwards in an inclined mode along the sealing body;
the driving piece is connected with the door plate and comprises a push-pull driving piece for driving the door plate to push and pull to reciprocate and a lifting driving piece for driving the door plate to lift to reciprocate;
when the door is closed, the lifting driving piece operates, the door plate ascends, the push-pull driving piece operates later, the door plate is close to the fixed plate, the sealing piece is in contact with the drainage groove of the fixed plate, and the first inclined surface and the second inclined surface form an inclined channel communicated with the process cavity;
when the door is opened, the push-pull driving piece operates, the door plate is far away from the fixed plate, the lifting driving piece operates afterwards, the door plate descends, and the drainage groove is exposed in the process cavity.
2. The lift seal door mechanism in a semiconductor processing apparatus of claim 1, wherein: the guide assembly comprises one or a combination of a push-pull guide assembly and a lifting guide assembly.
3. The lift seal door mechanism in a semiconductor processing apparatus of claim 2, wherein: the guide assembly comprises a linear bearing and a guide shaft which are correspondingly arranged, or a sliding rail and a sliding rod which are correspondingly arranged.
4. The lift seal door mechanism in a semiconductor processing apparatus of claim 1, wherein: the door plate comprises a PVC door plate, and the fixing plate comprises a PVC fixing plate; and the door plate is also provided with a metal bracket.
5. The lift seal door mechanism in a semiconductor processing apparatus of claim 1, wherein: the door opening and closing sensor and the door opening and closing sensing piece are respectively arranged on the fixed plate and the door plate and are correspondingly arranged.
6. The lift seal door mechanism in a semiconductor processing apparatus of claim 1, wherein: the sliding driving piece is positioned on the transition mounting plate, and the transition mounting plate is also provided with a clamping groove which is arranged corresponding to the lifting driving piece.
7. The lift seal door mechanism in a semiconductor processing apparatus of claim 1, wherein: and a sealing ring is also arranged between the fixing plate and the process cavity.
8. The lift seal door mechanism in a semiconductor processing apparatus of claim 1, wherein: the lifting driving piece is arranged on the fixed plate or the process cavity, and the push-pull driving piece is arranged on the fixed plate or the process cavity; the lifting driving piece comprises a lifting cylinder, and the push-pull driving piece comprises a push-pull cylinder.
9. A semiconductor processing apparatus comprising the lift gate seal mechanism of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311175062.1A CN116936419B (en) | 2023-09-13 | 2023-09-13 | Semiconductor process equipment and lifting sealing door mechanism thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311175062.1A CN116936419B (en) | 2023-09-13 | 2023-09-13 | Semiconductor process equipment and lifting sealing door mechanism thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116936419A CN116936419A (en) | 2023-10-24 |
| CN116936419B true CN116936419B (en) | 2023-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311175062.1A Active CN116936419B (en) | 2023-09-13 | 2023-09-13 | Semiconductor process equipment and lifting sealing door mechanism thereof |
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| CN (1) | CN116936419B (en) |
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| CN116936419A (en) | 2023-10-24 |
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