CN116761400A - Split type liquid cooling plate - Google Patents
Split type liquid cooling plate Download PDFInfo
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- CN116761400A CN116761400A CN202310798503.7A CN202310798503A CN116761400A CN 116761400 A CN116761400 A CN 116761400A CN 202310798503 A CN202310798503 A CN 202310798503A CN 116761400 A CN116761400 A CN 116761400A
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- liquid cooling
- cooling plate
- upper cover
- liquid
- cover plate
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- 239000007788 liquid Substances 0.000 title claims abstract description 287
- 238000001816 cooling Methods 0.000 title claims abstract description 191
- 230000017525 heat dissipation Effects 0.000 claims abstract description 111
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 7
- 239000004020 conductor Substances 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 7
- 239000000110 cooling liquid Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000002470 thermal conductor Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000306 component Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides a split type liquid cooling plate, and relates to the technical field of liquid cooling heat dissipation. According to the application, the heat conduction element is arranged between the liquid cooling plate and the upper cover plate, so that the heat transferred from the heating element to the liquid cooling plate is transferred to the upper cover plate, and the heat conduction quantity of the heat conduction element is larger than that of the welding material, so that the liquid cooling plate and the upper cover plate can be better subjected to uniform temperature, and therefore, the heat exchange and the cooling can be carried out between the liquid cooling plate and the upper cover plate when the cold liquid flows, and the heat dissipation efficiency of the split type liquid cooling plate is improved. Furthermore, the heat conduction element is arranged between the liquid cooling plate and the external heat dissipation part, and the heat transferred to the liquid cooling plate is transferred to the external heat dissipation part, so that the heat dissipation efficiency of the split type liquid cooling plate is further improved.
Description
Technical Field
The application relates to the technical field of liquid cooling and heat dissipation, in particular to a split type liquid cooling plate.
Background
Along with the continuous increase of the power of the electronic chip, the heat flow density of the electronic chip is continuously increased, the heat on the surface of the CPU is concentrated, and the traditional air cooling can not meet the heat dissipation requirement of the CPU. The liquid cooling technology is widely applied due to the characteristics of high heat dissipation speed, low noise, stable heat dissipation effect and the like. The liquid cooling plate is used as a core component of a liquid cooling technology, and the working principle is that cooling liquid is introduced into the split type liquid cooling plate through an external cooling liquid pipe, and the cooling liquid takes away heat concentrated on the surface of the CPU in the split type liquid cooling plate through a forced convection mode.
However, the liquid cooling plate and the upper cover plate at the upper part are required to be processed respectively and then brazed into a whole. The inventor of the application discovers that, as the brazing material has poor heat conduction performance and the brazing process only has a welding line between the liquid cooling plate and the upper cover plate, the contact area between the liquid cooling plate and the upper cover plate is small, and heat transfer cannot be performed, the split type liquid cooling plate can only perform heat exchange and cooling with cold liquid through the liquid cooling plate, and the heat dissipation efficiency of the split type liquid cooling plate is affected.
Disclosure of Invention
The application provides a split type liquid cooling plate, which can realize the uniform temperature of the liquid cooling plate and an upper cover plate of the split type liquid cooling plate and improve the heat dissipation efficiency of the split type liquid cooling plate.
In a first aspect, the present application provides a split liquid cooling plate, comprising: the liquid cooling plate, the heat conduction element and the upper cover plate welded on the liquid cooling plate; the heating element is arranged on the lower surface of the liquid cooling plate and transfers heat to the liquid cooling plate; the heat conduction element is arranged between the liquid cooling plate and the upper cover plate and is used for transmitting heat transmitted to the liquid cooling plate to the upper cover plate; or the heat conduction element is arranged between the liquid cooling plate and the external heat dissipation part, and the heat transferred to the liquid cooling plate is transferred to the external heat dissipation part; the heat conduction quantity of the heat conduction element is larger than that of a welding material between the liquid cooling plate and the upper cover plate; the cold liquid flows in from the liquid inlet of the split type liquid cooling plate, and flows out from the liquid outlet, and exchanges heat with the liquid cooling plate and the upper cover plate.
In one possible implementation, the heat conducting element extends through the edges of the liquid cooling plate and the upper cover plate, and the heat conducting element has a conducting area that is larger than the conducting area of the solder material.
In one possible implementation, the heat conduction element includes one or more heat conductors disposed between the liquid cooling plate and the hot zone of the upper cover plate, or between the liquid cooling plate and the cold zone of the upper cover plate; the cold area is an area close to the liquid inlet, and the hot area is an area close to the liquid outlet.
In one possible implementation, the heat conducting element includes one or more heat conductors disposed alternately between the cold zone of the liquid cooling plate and the hot zone of the upper cover plate, or between the hot zone of the liquid cooling plate and the cold zone of the upper cover plate. Therefore, the heat conductors are arranged between the hot area and the cold area in a staggered manner, the liquid cooling plate and the upper cover plate can conduct better heat transfer, and the temperature equalizing effect between the liquid cooling plate and the upper cover plate is improved, so that the heat dissipation efficiency of the split liquid cooling plate is improved.
In one possible implementation, the heat conduction element includes a first heat conductor and a second heat conductor, the first heat conductor starting at a cold zone of the upper cover plate, ending at a hot zone of the liquid cooling plate along an edge of the upper cover plate to an edge of the liquid cooling plate; the second heat conductor starts from the hot area of the upper cover plate, extends from the edge of the upper cover plate to the edge of the liquid cooling plate, and ends at the cold area of the liquid cooling plate.
In one possible implementation manner, the heat conductor is in a square structure, is embedded in the liquid cooling plate and the upper cover plate, or is laid on the surfaces of the liquid cooling plate and the upper cover plate; or the heat conductor is of a sheet structure and is laid on the surfaces of the liquid cooling plate and the upper cover plate; or the heat conductor is of a tubular structure and is embedded in the liquid cooling plate and the upper cover plate.
In one possible implementation, the thermal conductor is a thermal conductor having a thermal conductivity greater than a preset value and a uniform thermal conductivity.
In one possible implementation manner, the liquid inlet and the liquid outlet are arranged in a staggered manner, and the flow of the cold liquid flowing through the heat dissipation teeth between the liquid inlet and the liquid outlet is the first flow, so that a same-path strong flow area is formed. On one hand, the liquid inlets and the liquid outlets are arranged in a staggered manner, so that the same-pass cold liquid in the same-pass strong flow area is realized, the flow resistance is the same, and the flow equalizing performance of the same-pass strong flow area is improved. On the other hand, the area of the same-distance strong flow area is increased, and the heat dissipation efficiency of the split type liquid cooling plate is improved.
In one possible implementation, the same Cheng Jiangliu area between the liquid inlet and the liquid outlet covers the mounting area of the heating element.
In one possible implementation, the spacing between the heat dissipating teeth is the same in the same-range strong current region.
In one possible implementation, the two sides of the strong flow area along the same path of the cold liquid flowing direction are weak flow areas; the flow path of the cold liquid between the heat dissipation teeth in the weak flow area is larger than that of the first flow path; the tooth density of the heat dissipation teeth in the weak current area is greater than that in the same-path strong current area.
In one possible implementation manner, at least one boss is arranged on the surface of each heat dissipation tooth in the same-path strong-flow region along the flowing direction of the cold liquid, and the boss is used for reducing the flowing area of the same-path strong-flow region; the cold liquid flow resistance of the strong flow area in the same path is similar to that of the weak flow area.
In one possible implementation manner, heat dissipation teeth are arranged on the inner surface of the upper cover plate and between the liquid inlet and the liquid outlet; the heat dissipation teeth on the inner surface of the upper cover plate and the heat dissipation teeth of the liquid cooling plate are arranged in a staggered manner to form a micro-channel. Therefore, the heat dissipation teeth of the upper cover plate and the heat dissipation teeth of the liquid cooling plate are arranged in a staggered manner to form a micro-channel, so that the cold liquid flow area is reduced, the cold liquid flow rate is improved, and the heat dissipation efficiency of the split type liquid cooling plate is improved.
In one possible implementation manner, the heat dissipation teeth on the inner surface of the upper cover plate and the heat dissipation teeth of the liquid cooling plate are arranged in a one-to-one staggered manner, and the distances between two adjacent heat dissipation teeth are the same.
In one possible implementation manner, a distance between the heat dissipation teeth of the inner surface of the upper cover plate and the upper surface of the liquid cooling plate is a first distance; the distance between the heat dissipation teeth of the liquid cooling plate and the inner surface of the upper cover plate is a second distance; the first distance and the second distance are within a preset range.
In one possible implementation manner, the area corresponding to the weak flow area of the inner surface of the upper cover plate is not provided with heat dissipation teeth, and the flow resistance between the heat dissipation teeth in the weak flow area is similar to the flow resistance between the heat dissipation teeth in the same-distance strong flow area. In this way, through the different tooth densities of the weak flow area and the same-path strong flow area, the flow resistance of the weak flow area and the same-path strong flow area is balanced, the flow equalization between the weak flow area and the same Cheng Jiangliu area is realized, and the integral heat dissipation efficiency of the split type liquid cooling plate is improved.
In one possible implementation manner, the outer surface of the upper cover plate is provided with heat dissipation teeth along the wind direction of the external fan, and the height of the heat dissipation teeth on the outer surface of the upper cover plate is smaller than the height of the water nozzles at the liquid inlet and the liquid outlet. Therefore, the radiating teeth are added on the outer surface of the upper cover plate to radiate the split type liquid cooling plate in cooperation with the external fan, so that the radiating efficiency of the split type liquid cooling plate is further improved.
In one possible implementation, when the heat conductor is in a tubular structure and is embedded in the upper cover plate, the heat dissipation teeth on the outer surface of the upper cover plate are spaced from the heat conductor.
The application provides a split type liquid cooling plate, on the one hand, the heat conduction element is arranged between the liquid cooling plate and the upper cover plate, and the heat transmitted to the liquid cooling plate by the heating element is transmitted to the upper cover plate, so that the liquid cooling plate and the upper cover plate can be better subjected to uniform temperature due to the fact that the heat conduction quantity of the heat conduction element is larger than that of a welding material, and therefore, the liquid cooling plate can exchange heat with the liquid cooling plate and the upper cover plate for cooling when the cold liquid circulates, and the heat dissipation efficiency of the split type liquid cooling plate is improved. On the other hand, the heat conduction element is arranged between the liquid cooling plate and the external heat dissipation part, the heat transferred to the liquid cooling plate is transferred to the external heat dissipation part, and the heat dissipation efficiency of the split type liquid cooling plate is further improved through heat dissipation of the external heat dissipation part.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a split type liquid cooling plate according to an embodiment of the present application;
FIG. 2 is a schematic diagram of another split type liquid cooling plate according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a heat dissipation conduit in a split-type liquid cooling plate according to an embodiment of the present application;
FIG. 4 is a schematic side view of a split liquid cooling plate according to an embodiment of the present application;
FIG. 5 is a schematic cross-sectional view of a split type liquid cooling plate E-E' according to an embodiment of the present application;
FIG. 6 is a schematic side view of a split liquid cooling plate F-F' according to an embodiment of the present application;
FIG. 7 is a schematic diagram of another split type liquid cooling plate according to an embodiment of the present application;
fig. 8 is a schematic structural diagram of another split type liquid cooling plate according to an embodiment of the present application.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, techniques, etc., in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details.
In the description of the present application, "/" means "or" unless otherwise indicated, for example, A/B may mean A or B. "and/or" herein is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. Further, "at least one", "a plurality" means two or more. The terms "first," "second," and the like do not limit the number and order of execution, and the terms "first," "second," and the like do not necessarily differ.
In embodiments of the application, words such as "exemplary" or "such as" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g." in an embodiment should not be taken as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion that may be readily understood.
Furthermore, references to the terms "comprising" and "having" and any variations thereof in the description of the present application are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or modules is not limited to only those steps or modules but may, alternatively, include other steps or modules not listed or inherent to such process, method, article, or apparatus.
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the following description will be made with reference to the accompanying drawings of the present application by way of specific embodiments.
As described in the background art, the brazing material between the upper cover plate and the lower heat dissipation plate of the split type liquid cooling plate has poor heat conduction performance, resulting in lower heat dissipation efficiency of the split type liquid cooling plate.
In order to solve the above technical problems, as shown in fig. 1 and fig. 2, the embodiment of the application provides a split type liquid cooling plate. The split type liquid cooling plate comprises a liquid cooling plate, a heat conduction element and an upper cover plate welded on the liquid cooling plate;
the heating element is arranged on the lower surface of the liquid cooling plate and transfers heat to the liquid cooling plate; the heat conduction element is arranged between the liquid cooling plate and the upper cover plate and is used for transmitting heat transmitted to the liquid cooling plate to the upper cover plate; or the heat conduction element is arranged between the liquid cooling plate and the external heat dissipation part, and the heat transferred to the liquid cooling plate is transferred to the external heat dissipation part; the heat conduction quantity of the heat conduction element is larger than that of a welding material between the liquid cooling plate and the upper cover plate;
the cold liquid flows in from the liquid inlet of the split type liquid cooling plate, and flows out from the liquid outlet, and exchanges heat with the liquid cooling plate and the upper cover plate.
In some embodiments, the heating element may be a CPU (central processing unit, central processing unit, LED (light emitting diode, light emitting diode), PCB (printed circuit board, printed wiring board), or the like.
In some embodiments, a heat conducting element extends through edges of the liquid cooling plate and the upper cover plate, the heat conducting element having a conducting area greater than a conducting area of the solder material.
As one possible implementation, the heat conduction element includes one or more heat conductors, and the heat conductors are disposed between the liquid cooling plate and the hot zone of the upper cover plate, or disposed between the liquid cooling plate and the cold zone of the upper cover plate; the cold area is an area close to the liquid inlet, and the hot area is an area close to the liquid outlet.
For example, in the embodiment of the application, a plurality of heat conductors may be vertically arranged at the edges of the hot zone of the liquid cooling plate and the hot zone of the upper cover plate, and a plurality of heat conductors may be vertically arranged at the edges of the cold zone of the liquid cooling plate and the cold zone of the upper cover plate.
In another exemplary embodiment, a plurality of heat conductors may be vertically disposed at edges of the warm region of the liquid cooling plate and the warm region of the upper cover plate. Wherein the warm zone is the region between the cold zone and the hot zone.
As another possible implementation, the heat conduction element includes one or more heat conductors, and is disposed between the cold region of the liquid cooling plate and the hot region of the upper cover plate, or between the hot region of the liquid cooling plate and the cold region of the upper cover plate in a staggered manner.
Illustratively, as shown in FIG. 3, the heat transfer element comprises a first heat conductor and a second heat conductor, the first heat conductor beginning at the cold zone of the upper cover plate, ending at the hot zone of the liquid cooling plate along the edge of the upper cover plate to the edge of the liquid cooling plate; the second heat conductor starts from the hot area of the upper cover plate, extends from the edge of the upper cover plate to the edge of the liquid cooling plate, and ends at the cold area of the liquid cooling plate.
For example, as shown in fig. 3, the first heat conductor may start from the cold zone of the upper cover plate, extend along the edge of the upper cover plate to the edge of the liquid cooling plate, and extend from the edge of the liquid cooling plate to the hot zone of the liquid cooling plate. The second heat conductor starts from the hot area of the upper cover plate, and is arranged on the edge of the upper cover plate along the direction perpendicular to the flowing direction of the cold liquid, and is arranged from the edge of the upper cover plate to the edge of the liquid cooling plate, and from the edge of the liquid cooling plate to the cold area of the liquid cooling plate. So, the crisscross setting of first heat conductor and second heat conductor realizes better heat transfer between liquid cooling board and the upper cover plate, has improved the samming effect between liquid cooling board and the upper cover plate to the radiating efficiency of split type liquid cooling board has been improved.
In some embodiments, the thermally conductive element comprises one or more thermal conductors. The heat conductor may be provided in various shapes such as square, sheet, and tube, and the present application is not limited thereto.
The heat conductor is of a square structure, and is embedded in the liquid cooling plate and the upper cover plate or laid on the surfaces of the liquid cooling plate and the upper cover plate.
Still another exemplary, the heat conductor is a sheet-like structure, and is laid on the surfaces of the liquid cooling plate and the upper cover plate.
Still another exemplary, the heat conductor is a tubular structure embedded within the liquid cooling plate and the upper cover plate. For example, a strip-shaped tubular structure is embedded in the liquid cooling plate and the upper cover plate, so that the manufacturing and the assembly are more convenient.
In some embodiments, the thermal conductor is a thermal conductor having a thermal conductivity greater than a preset value and a uniform thermal conductivity.
The application provides a split type liquid cooling plate, on the one hand, the heat conduction element is arranged between the liquid cooling plate and the upper cover plate, and the heat transmitted to the liquid cooling plate by the heating element is transmitted to the upper cover plate, so that the liquid cooling plate and the upper cover plate can be better subjected to uniform temperature due to the fact that the heat conduction quantity of the heat conduction element is larger than that of a welding material, and therefore, the liquid cooling plate can exchange heat with the liquid cooling plate and the upper cover plate for cooling when the cold liquid circulates, and the heat dissipation efficiency of the split type liquid cooling plate is improved. On the other hand, the heat conduction element is arranged between the liquid cooling plate and the external heat dissipation part, the heat transferred to the liquid cooling plate is transferred to the external heat dissipation part, and the heat dissipation efficiency of the split type liquid cooling plate is further improved through heat dissipation of the external heat dissipation part.
Alternatively, as shown in fig. 4, fig. 5 and fig. 6, the liquid inlet and the liquid outlet are arranged in a staggered manner, and the flow of the cold liquid flowing through the heat dissipation teeth between the liquid inlet and the liquid outlet is a first flow, so that a same-path strong flow area is formed.
On one hand, due to the staggered arrangement of the liquid inlet and the liquid outlet, the same-pass design of cold liquid in the same-pass strong flow area is realized, the flow resistance is the same, and the flow equalizing performance in the strong flow area is improved.
Exemplary, as shown in fig. 6, after the cold liquid flows in from the liquid inlet, the cold liquid flows through the heat dissipation teeth of the same-path strong flow area and flows out from the liquid outlet, and the path of the cold liquid is the same, which is the first flow path. For example, cold fluid may flow from point A to point D and from point D to point B. For another example, the cold liquid may flow from point a to point C and then from point C to point B. The paths of the cold flow path ADB and ACB are the same. The flow resistance encountered by the cooling liquid during circulation is also the same. Therefore, the cold liquid flow equalization of the same-path strong flow area is realized, the imbalance phenomenon in the same-path strong flow area is avoided, and the heat dissipation efficiency of the same-path strong flow area is improved.
On the other hand, because inlet and liquid outlet dislocation overall arrangement, cold liquid in the strong flow district of journey is with Cheng Junliu, does not have unbalanced phenomenon in the strong flow district of journey, compares in inlet and the scheme that the liquid outlet set up in the middle of, has increased the area in strong flow district of journey, has also increased the radiating regional area of high efficiency in the split type liquid cooling board promptly, has improved the radiating efficiency of split type liquid cooling board.
In some embodiments, the region Cheng Jiangliu between the inlet and outlet covers the mounting area of the heating element.
It should be noted that, since the same-path strong-flow area is the area with the highest flow speed in the split type liquid cooling plate, the same-path strong-flow area is the main heat dissipation area of the split type liquid cooling plate. The strong flow area covers the installation area of the heating element, so that the heating element can be cooled to a greater extent, and the heat dissipation efficiency of the split type liquid cooling plate is further improved.
In some embodiments, the spacing between heat dissipating teeth in the same-pass high current region is the same. Therefore, the heat dissipation teeth are arranged at equal intervals, so that the flow resistance can be well balanced, and the current sharing in the same-path strong current area can be well realized.
As a possible implementation manner, the two sides of the strong flow area along the same path of the cold liquid flowing direction are weak flow areas; the cold flow path between the cooling teeth in the weak flow region is greater than the first flow path. The tooth density of the heat dissipation teeth in the weak current area is greater than that in the same-path strong current area.
It should be noted that, compared with the path of the cold liquid flowing in the same-path strong-flow area, the path of the cold liquid flowing in the weak-flow area is longer, the flow resistance is larger, so that the cold liquid flow rate in the weak-flow area is smaller than that in the same-path strong-flow area, the heat dissipation of the weak-flow area is affected, and the phenomenon of over-flow at the edge of the weak-flow area may exist when severe, and the heat dissipation efficiency is lower.
According to the embodiment of the application, the tooth density of the weak flow area is larger than that of the same-range strong flow area, so that the problems of large flow and large flow resistance of the weak flow area can be offset, the flow resistance balance of the weak flow area and the same-range strong flow area is realized, the balance of the weak flow area and the same Cheng Jiangliu area is realized, and the integral heat dissipation efficiency of the split type liquid cooling plate is improved.
As another possible implementation manner, at least one boss is arranged on the surface of each heat dissipation tooth in the same-path strong-flow region along the flowing direction of the cold liquid, and the boss is used for reducing the flowing area of the same-path strong-flow region; the cold liquid flow resistance of the strong flow area in the same path is similar to that of the weak flow area.
Therefore, the boss between the radiating teeth can reduce the flow area of the same-path strong flow area, so that the cold liquid flow resistance of the same-path strong flow area is similar to that of the weak flow area, the flow resistance balance between the weak flow area and the same-path strong flow area is realized, the balance between the weak flow area and the same Cheng Jiangliu area is realized, and the integral radiating efficiency of the split type liquid cooling plate is improved.
Optionally, heat dissipation teeth are arranged on the inner surface of the upper cover plate between the liquid inlet and the liquid outlet; the heat dissipation teeth on the inner surface of the upper cover plate and the heat dissipation teeth of the liquid cooling plate are arranged in a staggered manner to form a micro-channel.
As a possible implementation mode, the liquid inlet and the liquid outlet are arranged in the middle, a strong flow area is formed between the liquid inlet and the liquid outlet, and the heat dissipation teeth of the upper cover plate and the heat dissipation teeth of the liquid cooling plate are arranged in a staggered manner to form a micro-channel, so that the flow area between the heat dissipation teeth in the strong flow area is reduced, the flow velocity of cold liquid in the strong flow area is improved, and the heat dissipation efficiency is improved.
As a possible implementation mode, the liquid inlet and the liquid outlet are arranged in a staggered mode, the same Cheng Jiangliu area is formed between the liquid inlet and the liquid outlet, the cold liquid flow is the first flow, the flow area between heat dissipation teeth in the strong flow area is reduced, the cold liquid flow velocity in the strong flow area is improved, the heat dissipation efficiency is improved, meanwhile, the cold liquid flow equalization in the same-path strong flow area is realized, the imbalance phenomenon in the same-path strong flow area is avoided, and the heat dissipation efficiency of the same-path strong flow area is further improved.
The higher the flow rate of the cold liquid, the better the heat dissipation efficiency of the split type liquid cooling plate. In order to improve the flow speed of the same-distance strong flow area, the embodiment of the application is provided with the heat dissipation teeth on the upper cover plate of the same-distance strong flow area, and the heat dissipation teeth of the liquid cooling plate are arranged in a staggered manner, so that the flow area between the heat dissipation teeth in the same-distance strong flow area is reduced, a micro-channel is formed in the same-distance strong flow area between the upper cover plate and the liquid cooling plate, the cold flow speed of the same-distance strong flow area is improved, and the heat dissipation efficiency of the split liquid cooling plate is improved.
In some embodiments, the heat dissipation teeth on the inner surface of the upper cover plate and the heat dissipation teeth of the liquid cooling plate are staggered one by one, and the distances between two adjacent heat dissipation teeth are the same.
Therefore, the upper radiating teeth and the lower radiating teeth are staggered one by one, the intervals are the same, and the cold liquid in the same-path strong flow area can be better subjected to flow equalization, so that the flow equalization effect of the same-path strong flow area is further improved.
In some embodiments, the distance between the heat dissipating teeth of the inner surface of the upper cover plate and the upper surface of the liquid cooling plate is a first distance; the distance between the heat dissipation teeth of the liquid cooling plate and the inner surface of the upper cover plate is a second distance; the first distance and the second distance are within a preset range.
Wherein, the preset range can be between 0 and 2mm, or can be between 1 and 3 mm. The preset range is determined according to the manufacturing volume of the split liquid cooling plate. For example, if the manufacturing volume of the split type liquid cooling plate is large, the preset range can be increased in adaptability.
It should be noted that, on the one hand, the split type liquid cooling board manufacturing installation of being convenient for can be made in the scope in advance to first distance and second distance, on the other hand, the heat dissipation tooth exists the interval with the internal surface, has taken into account cold liquid velocity of flow and flow resistance, has both guaranteed the mixed flow samming between the cold liquid, has improved cold liquid velocity of flow again, has promoted the microchannel effect.
In some embodiments, the area corresponding to the weak flow area of the inner surface of the upper cover plate is not provided with heat dissipation teeth, and the flow resistance between the heat dissipation teeth in the weak flow area is similar to the flow resistance between the heat dissipation teeth in the same-distance strong flow area.
It should be noted that, in the embodiment of the application, the same-path strong flow area of the upper cover plate is provided with the heat dissipation teeth, and the weak flow area is not provided with the heat dissipation teeth, so that the flow resistance in the weak flow area is similar to the flow resistance in the same-path strong flow area, the cold liquid balance between the weak flow area and the same-path strong flow area is realized, and the integral heat dissipation efficiency of the split type liquid cooling plate is improved.
Optionally, as shown in fig. 7 and fig. 8, heat dissipation teeth are arranged on the outer surface of the upper cover plate along the wind direction of the external fan, and the height of the heat dissipation teeth on the outer surface of the upper cover plate is smaller than the height of the water nozzle at the liquid inlet and the liquid outlet.
Therefore, the radiating teeth are added on the outer surface of the upper cover plate to radiate the split type liquid cooling plate in cooperation with the external fan, so that the radiating efficiency of the split type liquid cooling plate is further improved.
In addition, the height of heat dissipation tooth is less than the height of water injection well choke, can be convenient for the assembly of split type liquid cooling board, prevents that heat dissipation tooth from pressing from both sides water injection well choke and influencing the assembly.
In some embodiments, when the heat conductor is of a tubular structure and is embedded in the upper cover plate, the heat dissipation teeth on the outer surface of the upper cover plate are spaced from the heat conductor.
It should be noted that, the heat dissipation tooth and the heat conduction component interval setting of surface can reduce the manufacturing degree of difficulty, is convenient for the manufacturing of split type liquid cooling board.
The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.
Claims (10)
1. A split liquid cooling plate, comprising:
the device comprises a liquid cooling plate, a heat conduction element and an upper cover plate welded on the liquid cooling plate;
the heating element is arranged on the lower surface of the liquid cooling plate and transmits heat to the liquid cooling plate; the heat conduction element is arranged between the liquid cooling plate and the upper cover plate and is used for transmitting heat transmitted to the liquid cooling plate to the upper cover plate; or, the heat conduction element is arranged between the liquid cooling plate and the external heat dissipation part, and transmits the heat transmitted to the liquid cooling plate to the external heat dissipation part; the heat conduction quantity of the heat conduction element is larger than that of a welding material between the liquid cooling plate and the upper cover plate;
cold liquid flows in from the liquid inlet of the split type liquid cooling plate, and flows out from the liquid outlet, and exchanges heat with the liquid cooling plate and the upper cover plate.
2. The split liquid cooled plate of claim 1, wherein the heat conducting element extends through edges of the liquid cooled plate and the upper cover plate, the heat conducting element having a conducting area that is greater than a conducting area of the solder material.
3. The split liquid cooled panel of claim 2, wherein the heat conducting element comprises at least one heat conductor disposed between the liquid cooled panel and a hot zone of the upper cover plate or between the liquid cooled panel and a cold zone of the upper cover plate;
or alternatively, the process may be performed,
the at least one heat conductor is arranged between the cold region of the liquid cooling plate and the hot region of the upper cover plate in a staggered manner, or between the hot region of the liquid cooling plate and the cold region of the upper cover plate;
the cold area is an area close to the liquid inlet, and the hot area is an area close to the liquid outlet.
4. A split liquid-cooled panel according to claim 3, wherein the thermally conductive element comprises a first thermally conductive body and a second thermally conductive body, the first thermally conductive body beginning at a cold zone of the upper cover plate, ending at a hot zone of the liquid-cooled panel along an edge of the upper cover plate to an edge of the liquid-cooled panel; the second heat conductor starts from a hot area of the upper cover plate, extends from the edge of the upper cover plate to the edge of the liquid cooling plate, and ends at a cold area of the liquid cooling plate.
5. The split type liquid cooling plate according to claim 1, wherein the liquid inlet and the liquid outlet are arranged in a staggered manner, and the flow of the cooling liquid flowing through the heat dissipation teeth between the liquid inlet and the liquid outlet is a first flow, so as to form a same Cheng Jiangliu area; the same Cheng Jiangliu area covers the mounting area of the heating element.
6. The split liquid cooling plate according to claim 5, wherein the two sides of the same-path strong flow area along the flowing direction of the cold liquid are weak flow areas; the flow path of the cold liquid between the radiating teeth in the weak flow area is larger than that of the first flow path; the tooth density of the heat dissipation teeth in the weak current area is greater than that of the heat dissipation teeth in the same-distance strong current area.
7. The split liquid cooling plate according to claim 1 or 5, wherein heat dissipation teeth are arranged between the liquid inlet and the liquid outlet on the inner surface of the upper cover plate; the heat dissipation teeth on the inner surface of the upper cover plate and the heat dissipation teeth of the liquid cooling plate are arranged in a staggered manner to form a micro-channel;
the distance between the heat dissipation teeth on the inner surface of the upper cover plate and the upper surface of the liquid cooling plate is a first distance; the distance between the heat dissipation teeth of the liquid cooling plate and the inner surface of the upper cover plate is a second distance; the first distance and the second distance are within a preset range.
8. The split liquid cooling plate according to claim 7, wherein the area corresponding to the weak flow area of the inner surface of the upper cover plate is not provided with heat dissipation teeth, and the flow resistance between the heat dissipation teeth in the weak flow area is similar to the flow resistance between the heat dissipation teeth in the same-distance strong flow area.
9. The split liquid cooling plate according to any one of claims 1 to 8, wherein heat radiating teeth are provided on an outer surface of the upper cover plate along a wind direction of the external fan, and a height of the heat radiating teeth on the outer surface of the upper cover plate is smaller than a height of the water nozzle at the liquid inlet and the liquid outlet.
10. The split liquid cooling plate of claim 9, wherein when the heat conductor is of a tubular structure and is embedded in the upper cover plate, heat dissipation teeth on the outer surface of the upper cover plate are spaced from the heat conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310798503.7A CN116761400A (en) | 2023-06-30 | 2023-06-30 | Split type liquid cooling plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310798503.7A CN116761400A (en) | 2023-06-30 | 2023-06-30 | Split type liquid cooling plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116761400A true CN116761400A (en) | 2023-09-15 |
Family
ID=87949524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310798503.7A Pending CN116761400A (en) | 2023-06-30 | 2023-06-30 | Split type liquid cooling plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116761400A (en) |
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2023
- 2023-06-30 CN CN202310798503.7A patent/CN116761400A/en active Pending
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Effective date of registration: 20231207 Address after: Room 208-38, Hengye Building, No. 100 Xiangxing Road, Xiang'an Industrial Zone, Xiamen Torch High tech Zone, Xiamen, Fujian Province, 361000 Applicant after: Xiamen Kehua shuneng Technology Co.,Ltd. Address before: 361101 Ma Long Road 457, Torch Garden, Xiamen Torch High-tech Zone, Fujian Province Applicant before: Kehua Data Co.,Ltd. |
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