CN116744580A - Circuit board manufacturing method - Google Patents
Circuit board manufacturing method Download PDFInfo
- Publication number
- CN116744580A CN116744580A CN202310937138.3A CN202310937138A CN116744580A CN 116744580 A CN116744580 A CN 116744580A CN 202310937138 A CN202310937138 A CN 202310937138A CN 116744580 A CN116744580 A CN 116744580A
- Authority
- CN
- China
- Prior art keywords
- blind hole
- copper layer
- circuit board
- layer
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 66
- 229910052802 copper Inorganic materials 0.000 claims abstract description 66
- 239000010949 copper Substances 0.000 claims abstract description 66
- 238000009966 trimming Methods 0.000 claims abstract description 41
- 239000004020 conductor Substances 0.000 claims abstract description 34
- 239000003292 glue Substances 0.000 claims abstract description 17
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000001569 carbon dioxide Substances 0.000 claims abstract description 8
- 229910002092 carbon dioxide Inorganic materials 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 9
- 238000003754 machining Methods 0.000 claims description 5
- 239000007800 oxidant agent Substances 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical group [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 3
- 239000005751 Copper oxide Substances 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 229910000431 copper oxide Inorganic materials 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000012286 potassium permanganate Substances 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical group [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims description 3
- 229960002218 sodium chlorite Drugs 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000002791 soaking Methods 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 79
- 239000000463 material Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The application discloses a circuit board manufacturing method, which relates to the technical field of circuit boards and comprises a preposed step, a blackening step, a blind hole forming step, a flattening step, a blacking step, a gumming step and a forming step; according to the application, a blind hole is formed in a multilayer plate by carbon dioxide laser, a trimming groove which is matched with the blind hole and has a flat groove bottom is formed in a second copper layer by ultraviolet laser, then glue is removed, a conductor is filled in the blind hole and the trimming groove, the top end of the conductor is in contact with a first copper layer, the bottom end of the conductor is embedded into the trimming groove on the second copper layer, and the trimming groove is formed by irradiating a groove with ultraviolet rays of about 3 micrometers on the surface of the second copper layer, so that residual glue or carbide cannot be left due to coarse bottom copper after processing, and the performance of a circuit board is improved.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a circuit board manufacturing method.
Background
The circuit board is also called a PCB, a printed circuit board and the like, is an important electronic component, is a support body of an electronic component, and is a carrier for electrically connecting the electronic component.
The blind hole is a part of the circuit board, and the blind hole is a through hole which connects the surface layer and the inner layer without penetrating the whole board. The top and bottom surfaces of the printed wiring board have a depth for connection of the top layer of wiring and the underlying inner layer of wiring, the depth of the holes typically not exceeding a certain ratio.
In the prior art, the bottom wall of a blind hole on a board for producing a circuit board is directly the outer surface of a copper layer, the outer surface of the copper layer is rough, carbide residues or unclean resin glue often occur after processing, when an electroplated conductor is filled, the thermal expansion coefficients of the conductor, the residual resin and the colloid are different, and the circuit board is easily damaged after being heated at high temperature.
Disclosure of Invention
The present application solves the problems of the prior art with the following technical structure.
In order to achieve the above purpose, the application adopts the following technical scheme:
a method of manufacturing a circuit board, comprising:
the preceding step S110: providing a multi-layer plate, wherein the plate body comprises a first copper layer, an insulating layer and a second copper layer which are sequentially arranged; wherein the thickness of the first copper layer is less than 15 microns;
blackening step S120: soaking the multi-layer plate by using a strong oxidant to form a blackened layer on the surface of the first copper layer;
blind hole forming step S130: processing a blind hole from the outside of the blackening layer to the inside of the multilayer board by laser, wherein the blind hole penetrates through the first copper layer and the second insulating layer;
a flattening step S140; machining a trimming groove in the second copper layer through the blind hole, wherein the average roughness of the central line of the groove bottom of the trimming groove is less than 3 microns;
step S150 of blacking: cleaning the multilayer plate by SPS acidic microetching solution, and removing the blackened layer on the surface of the first copper layer;
and (5) a glue removing step S160: removing glue from the hole wall of the blind hole by wet glue removal, and removing residual glue and carbide attached to the hole wall;
shaping step S170: and electroplating in the trimming groove and the blind hole to form a conductor for connecting the first copper layer and the second copper layer.
It is further characterized in that,
the depth of the trimming groove is 3-5 microns.
The laser for forming the blind holes is carbon dioxide laser, and the wavelength of a laser beam adopted by the carbon dioxide laser is 10.6 microns.
The trimming groove is formed by processing with ultraviolet laser, and the wavelength of the laser beam adopted by the ultraviolet laser is 355 nm.
The outermost pore diameter of the blind hole is larger than the innermost pore diameter; the inner diameter of the trimming groove is equal to the aperture of the bottom of the blind hole.
The included angle alpha between the side wall of the trimming groove and the hole wall of the blind hole is 100-170 degrees.
The wet type adhesive removing adopts potassium permanganate solution.
And the photoresist removing step further comprises dry photoresist removing the hole wall of the blind hole by using plasma after the wet photoresist removing.
The blackening layer is a copper oxide layer.
The strong oxidizer component is sodium chlorite solution.
The structure of the application can achieve the following beneficial effects:
(1) The blind holes are formed in the multilayer board through carbon dioxide laser, the trimming grooves which are matched with the blind holes and are smooth in bottom are formed in the second copper layer through ultraviolet laser, then glue is removed, conductors are filled in the blind holes and the trimming grooves, the top ends of the conductors are in contact with the first copper layer, the bottom ends of the conductors are embedded into the trimming grooves in the second copper layer, grooves with the diameter of about 3 microns are formed in the surface of the second copper layer through ultraviolet laser, residual glue or carbide residues due to the roughness of bottom copper are avoided after machining, and performance of the circuit board is improved.
(2) An included angle alpha exists between the side wall of the trimming groove and the hole wall of the blind hole, so that the bonding strength between the conductor and the multi-layer plate is further improved. The bottom of the conductor is embedded into the trimming groove, so that the structure is more stable. Furthermore, the material of the conductor is the same as that of the first copper layer and the second copper layer, so that the connection stability between the conductor and the first copper layer and the connection stability between the conductor and the second copper layer are further enhanced.
Drawings
FIG. 1 is a flow chart of a method for manufacturing a circuit board according to a first embodiment;
fig. 2 is a structural cross-sectional view of a circuit board in the first embodiment;
FIG. 3 is a cross-sectional view of a multi-layered sheet of an embodiment;
FIG. 4 is an enlarged schematic view of the structure shown in FIG. 3A;
fig. 5 is a schematic structural diagram of the second embodiment.
In the figure: 1. a first copper layer; 2. an insulating layer; 3. a second copper layer; 4. trimming the groove; 5. an electric conductor; 6. and (5) a blind hole.
Detailed Description
In a first embodiment, referring to fig. 1-4, a method S100 for manufacturing a circuit board is disclosed, which sequentially includes a pre-step S110, a blackening step S120, a blind hole forming step S130, a flattening step S140, a de-blackening step S150, a de-gumming step S160, and a forming step S170. Specific embodiments of the plurality of steps S110 to S170 will be described below.
The preceding step S110: as shown in fig. 1 to 5, a multi-layered board is provided, wherein the board body comprises a first copper layer 1, an insulating layer 2 and a second copper layer 3 which are sequentially arranged; wherein the thickness of the first copper layer 1 is less than 15 micrometers.
Blackening step S120: the multi-layer board is soaked by strong oxidant (sodium chlorite solution), a blackening layer which makes the surface of the multi-layer board black is formed on the surface of the first copper layer 1, and the blackening layer is a copper oxide layer and covers the whole outer surface of the first copper layer 1.
Blind hole forming step S130: a blind hole 6 is processed from the blackened layer side by using carbon dioxide laser with the wavelength of 10.6 microns of the laser beam, and the blind hole 6 penetrates through the first copper layer 1 and the insulating layer 2 (at the moment, the bottom of the blind hole 6 is the rough surface of the second copper layer 3, and carbide or resin remains on the inner side wall and the bottom surface of the blind hole 6).
A flattening step S140; machining a trimming groove 4 with the depth of 3-5 microns on the surface of the second copper layer 3 through the blind hole 6 by using ultraviolet laser with the laser beam wavelength of 355 nm, wherein the average roughness of the central line of the groove bottom of the trimming groove 4 is less than 3 microns (at the moment, the bottom of the blind hole 6 is the groove bottom wall of the trimming groove 4, and the groove bottom wall of the trimming groove 4 is leveled by ultraviolet laser machining); the outermost aperture of the blind hole 6 is larger than the innermost aperture; the inner diameter of the trimming groove 4 is equal to the aperture at the bottom of the blind hole 6, the angle alpha between the side wall of the trimming groove 4 and the wall of the blind hole 6 is 100-170 degrees, and the angle alpha can be specifically set according to the requirement.
Step S150 of blacking: cleaning the multilayer plate by SPS acidic microetching solution, removing the blackened layer on the surface of the first copper layer 1, exposing the outer surface of the first copper layer 1, and facilitating subsequent processing;
and (5) a glue removing step S160: the wall of the blind hole 15 is wet-type glue-removed by potassium permanganate solution to remove residual glue and carbide attached to the wall of the blind hole. It should be noted that in the photoresist removing step S160 of the present embodiment, it is preferable to further match plasma to dry photoresist on the hole wall of the blind hole 6 to ensure that residues (such as residual photoresist and carbide) adhered to the hole wall of the blind hole 6 can be removed, but the present application is not limited thereto.
Shaping step S170: and electroplating in the trimming groove 4 and the blind hole 6 to form a conductor 5, wherein the conductor 5 is connected with the first copper layer 1 and the second copper layer 2. In this embodiment, the material of the conductor 5 is copper metal, and the top surface of the conductor 5 is in the same plane with the outer surface of the first copper layer 1, and the bottom surface of the conductor 5 is in the same plane with the bottom wall of the trimming groove 4.
An included angle alpha exists between the side wall of the trimming groove 4 and the hole wall of the blind hole 6, so that the bonding strength between the conductor 5 and the multi-layer plate is further improved. The bottom of the conductor 5 is embedded into the trimming groove 4, so that the structure is more stable. Furthermore, the material of the conductor 5 is the same as that of the first copper layer 1 and the second copper layer 2, so that the connection stability between the conductor 5 and the first copper layer 1 and the second copper layer 2 is further enhanced.
The number of the conductors 5 is one in the present embodiment, but the circuit board may be provided with a plurality of conductors 5 at a plurality of arbitrary positions of the multi-layer board according to design requirements.
The manufacturing method S100 of a circuit board according to the present application is not limited to the processing and manufacturing of the structure according to the first embodiment, but includes another preferred embodiment (embodiment two) as shown in fig. 5: the plate comprises a plate body, wherein the plate body comprises three insulating layers 2 and a first same layer 1 which is respectively arranged on the opposite sides of two insulating layers 2 at the outermost side, and a second copper layer 3 is arranged between any two adjacent insulating layers 2; wherein the thickness of the first copper layer 1 is less than 15 micrometers; then, the blind holes 6 and the trimming grooves 4 are processed on both sides of the board body (on the sides where the two first copper layers 1 are located) respectively using the method S100 for manufacturing a circuit board according to the present application.
In summary, the blind holes 6 are formed in the multilayer plate by carbon dioxide laser, the trimming grooves 4 which are matched with the blind holes 6 and have a flat groove bottom are formed in the second copper layer 3 by ultraviolet laser, then the glue is removed, the blind holes 6 and the trimming grooves 4 are filled with the conductors 5, the top ends of the conductors 5 are in contact with the first copper layer 1, the bottom ends of the conductors 5 are embedded into the trimming grooves 4 on the second copper layer 3, the trimming grooves 4 are grooves which are formed in the surface of the second copper layer by ultraviolet laser and have about 3 micrometers, residual glue or carbide cannot be left due to the roughness of bottom copper after processing, and the performance of the circuit board is improved.
An included angle alpha exists between the side wall of the trimming groove 4 and the hole wall of the blind hole 6, so that the bonding strength between the conductor 5 and the multi-layer plate is further improved. The bottom of the conductor 5 is embedded into the trimming groove 4, so that the structure is more stable. Furthermore, the material of the conductor 5 is the same as that of the first copper layer 1 and the second copper layer 2, so that the connection stability between the conductor 5 and the first copper layer 1 and the second copper layer 2 is further enhanced.
The above is only a preferred embodiment of the present application, and the present application is not limited to the above examples. It is to be understood that other modifications and variations which may be directly derived or contemplated by those skilled in the art without departing from the spirit and concepts of the present application are deemed to be included within the scope of the present application.
Claims (10)
1. A method of manufacturing a circuit board, comprising:
the preceding step S110: providing a multi-layer plate, wherein the plate body comprises a first copper layer (1), an insulating layer (2) and a second copper layer (3) which are sequentially arranged; wherein the thickness of the first copper layer (1) is less than 15 micrometers;
blackening step S120: soaking the multilayer plate by using a strong oxidant to form a blackened layer on the surface of the first copper layer (1);
blind hole forming step S130: processing a blind hole (6) from the outside of the blackening layer to the inside of the multilayer plate by using laser, wherein the blind hole (6) penetrates through the first copper layer (1) and the second insulating layer (2);
a flattening step S140; machining a trimming groove (4) in the second copper layer (3) through the blind hole (6), wherein the average roughness of the central line of the groove bottom of the trimming groove (4) is less than 3 microns;
step S150 of blacking: cleaning the multilayer plate by SPS acidic microetching solution, and removing the blackened layer on the surface of the first copper layer (1);
and (5) a glue removing step S160: removing glue from the hole wall of the blind hole (6) by wet glue removal, and removing residual glue and carbide attached to the hole wall;
shaping step S170: and electroplating in the trimming groove (4) and the blind hole (6) to form a conductor (5) for connecting the first copper layer (1) and the second copper layer (3).
2. The method for manufacturing a circuit board according to claim 1, wherein: the depth of the trimming groove (4) is 3-5 microns.
3. The method for manufacturing a circuit board according to claim 1, wherein: the laser for forming the blind holes (6) is carbon dioxide laser, and the wavelength of the laser beam adopted by the carbon dioxide laser is 10.6 microns.
4. The method for manufacturing a circuit board according to claim 1, wherein: the trimming groove (4) is formed by ultraviolet laser processing, and the wavelength of a laser beam adopted by the ultraviolet laser is 355 nanometers.
5. The method for manufacturing a circuit board according to claim 1, wherein: the outermost pore diameter of the blind hole (6) is larger than the innermost pore diameter; the inner diameter of the trimming groove (4) is equal to the aperture of the bottom of the blind hole (6).
6. The method for manufacturing a circuit board according to claim 5, wherein: the included angle alpha between the side wall of the trimming groove (4) and the hole wall of the blind hole (6) is 100-170 degrees.
7. The method for manufacturing a circuit board according to claim 1, wherein: the wet type adhesive removing adopts potassium permanganate solution.
8. The method for manufacturing a circuit board according to claim 1, wherein: the photoresist removing step further comprises dry photoresist removing of the hole wall of the blind hole (6) by plasma after the wet photoresist removing.
9. The method for manufacturing a circuit board according to claim 1, wherein: the blackening layer is a copper oxide layer.
10. The method for manufacturing a circuit board according to claim 1, wherein: the strong oxidant is sodium chlorite solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310937138.3A CN116744580A (en) | 2023-07-28 | 2023-07-28 | Circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310937138.3A CN116744580A (en) | 2023-07-28 | 2023-07-28 | Circuit board manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116744580A true CN116744580A (en) | 2023-09-12 |
Family
ID=87913580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310937138.3A Pending CN116744580A (en) | 2023-07-28 | 2023-07-28 | Circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116744580A (en) |
-
2023
- 2023-07-28 CN CN202310937138.3A patent/CN116744580A/en active Pending
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