CN116730001A

CN116730001A - PCB integrated mark processing equipment

Info

Publication number: CN116730001A
Application number: CN202210194284.7A
Authority: CN
Inventors: 邓旭辉
Original assignee: Suzhou Weixincheng Technology Co ltd
Current assignee: Suzhou Weixincheng Technology Co ltd
Priority date: 2022-03-01
Filing date: 2022-03-01
Publication date: 2023-09-12

Abstract

The application provides a PCB integrated mark processing device. This PCB board integration sign processing equipment includes: the device comprises a conveying line, a feeding module, a golden finger protection module, a laser module, a labeling module and a blanking module, wherein all the processing modules are sequentially arranged along the conveying line; the conveying line is used for conveying the PCB to each module of the equipment for processing; the feeding module is used for storing and feeding the materials of the previous station or the stack; the golden finger protection module is used for protecting golden fingers of the PCB; the laser module is used for laser carving the two-dimensional code on the PCB; the labeling module is used for attaching the label to the PCB; the blanking module is used for taking down and storing the processed PCB. The processing technology of each mark is integrated, so that the equipment volume is reduced, the distance of each technological link is shortened, the continuity, the integrity and the production efficiency of the processing process are improved, the production information can be immediately uploaded, the timeliness of the production information is ensured, and the quality tracing is achieved.

Description

PCB integrated mark processing equipment

Technical Field

The application relates to the field of PCB (printed circuit board) mark processing equipment, in particular to PCB integrated mark processing equipment.

Background

PCB boards (Printed Circuit Board, chinese name printed circuit boards), which are the base of integrated circuits, are one of the most important components in the electronics industry. In the production of PCB boards, quality control is an important ring, and directly affects the economic benefit and the environmental benefit of enterprises. The marking operation of each PCB on the production line is a means for quality control. The integration level of the traditional PCB mark processing equipment is low, the efficiency is low, and errors can occur among various processing links. In addition, the existing equipment is difficult to integrate and upload information after the PCB identification processing, and the condition of the production line cannot be immediately known and mastered.

Disclosure of Invention

The application provides a PCB integrated mark processing device for solving the technical problems. This PCB board integration sign indicating number processing equipment, with last unloading, golden finger protection, radium-shine, paste mark and sweep sign indicating number and upload database function integration as an organic wholely, reduced equipment volume, drawn up the distance of each process link, improved the continuity of course of working, integrality and production efficiency, can also be immediately to the integral uploading of production information, guaranteed the timeliness of production information, done the quality and traced to the source.

In order to achieve the above purpose, the application adopts the following technical scheme:

PCB board integration sign processing equipment, its characterized in that includes:

a conveying line, a processing module group,

the processing module includes: a feeding module, a golden finger protection module, a laser module, a labeling module, a blanking module,

the conveying line is used for conveying the PCB to each module of the equipment for processing;

the feeding module is used for storing and feeding the materials of the previous station or the stack;

the golden finger protection module is used for protecting golden fingers of the PCB;

the laser module is used for laser engraving a two-dimensional code on the PCB;

the labeling module is used for attaching the label to the PCB;

the blanking module is used for reading the engraved two-dimensional code on the PCB and uploading the database, and taking down and storing the processed PCB.

Specifically, this transfer chain includes: the two rows of parallel guide rails are divided into a first guide rail and a second guide rail, the guide rails on the two sides are provided with belt pulleys, a bearing belt and a motor, the bearing belt is fixed on the belt pulleys, the belt pulleys are fixed on the guide rails, and the motor drives the belt pulleys to rotate, so that the bearing belt is driven, and the PCB is conveyed to each module of the equipment for processing.

Specifically, the feeding module comprises a feeding bin, a feeding carrying module,

feeding bin includes:

the base plate is fixedly provided with a bracket and an XY bin opening assembly and is used for switching the feeding bin and fixing the PCB;

the bin in-place detection sensor is fixed on the bottom plate and used for detecting the movement condition of the XY bin opening assembly;

the Z-axis lifting servo is fixed on the bottom plate and provided with a lifting tray for lifting and conveying the PCB;

the in-place detection sensor is arranged at the top of the Z-axis lifting servo and is used for detecting the position of the PCB;

the tray detection sensor is arranged on the bracket and used for detecting whether the lifting tray is provided with materials or not;

the positioning cylinder is arranged at the top of the feeding bin and is used for positioning the PCB to the position to be adsorbed;

material loading transport module includes:

an X-axis guide rail arranged above the conveying line, wherein a motor is fixed at the end part of the X-axis guide rail and used for driving a Z-axis lifting servo to act in the X-axis direction;

the Z-axis lifting servo is configured on the X-axis guide rail, the top is provided with a vacuum generator, and the bottom is provided with a vacuum chuck assembly for adsorbing and carrying the PCB stacked by the feeding bin onto the conveying line.

Specifically, the golden finger protection module comprises: a turnover module, a tape sticking module,

the adhesive tape sticking module comprises a first adhesive tape sticking module and a second adhesive tape sticking module, wherein a turnover module is arranged between the two adhesive tape sticking modules and is used for turning over after the high-temperature adhesive tape is stuck on the front surface so as to be convenient for sticking the high-temperature adhesive tape on the back surface;

the rubberizing tape module includes: the Y-axis guide rail is arranged on an X-axis guide rail on which a Z-axis lifting mechanism is arranged, a high-temperature adhesive tape unreeling roll is fixed on the Z-axis lifting mechanism, and an adhesive tape pasting component is arranged at the bottom and used for pasting the high-temperature adhesive tape on a golden finger of the PCB;

the upset module includes: and the motor is connected with a turnover mechanism on the motor, the front end of the turnover mechanism is fixedly provided with a PCB grabbing hand, the motor drives the turnover mechanism, and the turnover mechanism grabs the PCB and overturns the PCB.

Specifically, the laser module comprises:

the laser machines are arranged above and below the conveying line and are used for laser engraving two-dimensional codes on the front and back surfaces of the PCB;

the laser protection cover surrounds the laser machine, the conveying line passes through the laser protection cover, and a smoke suction through hole is arranged at the top of the laser protection cover for discharging smoke dust and preventing pollution caused by the laser dust;

the PCB positioning cylinder is positioned below the conveying line and is used for positioning the PCB to a laser position;

the laser dust removing assembly is arranged in the laser protective cover and is used for discharging smoke and dust generated by laser.

Specifically, the labeling module comprises a label feeder and an XYZ labeling module,

a label feeder comprising: a substrate, wherein a label unreeling roll and a label receiving roll are arranged on one side of the substrate; the top is provided with a label stripping knife and a label receiving platform for stripping labels; a lower CCD assembly and a stepping motor are arranged on the other side of the substrate, the lower CCD assembly is used for identifying the two-dimensional code of the PCB to be attached, and the stepping motor and the label receiving roll are used for recycling the release film of the label;

XYZ pastes mark module, includes: an X-axis guide rail arranged above the conveying line, a Y-axis guide rail arranged on the X-axis guide rail, a quick-change label absorbing assembly and a vacuum generator arranged on the Y-axis guide rail for absorbing labels, and an upper CCD assembly arranged on one side of the quick-change label absorbing assembly for identifying two-dimensional codes of the PCB; a Z-axis jacking assembly is arranged below the conveying line, and a PCB supporting plate is arranged on the Z-axis jacking assembly and used for supporting and protecting the PCB during labeling; and the guide rails at two sides of the conveying line positioned at the section of the XYZ labeling module are fixed with PCB positioning pressing plates for stably positioning the PCB.

Specifically, the blanking module comprises a blanking carrying module and a blanking bin,

unloading transport module includes: an X-axis guide rail is arranged above the conveying line, a Y-axis guide rail is arranged on the X-axis guide rail, and a vacuum generator and a vacuum chuck assembly are arranged on the Y-axis guide rail and are used for adsorbing and conveying the PCB to a blanking bin;

unloading feed bin includes: the automatic feeding and discharging device comprises a bottom plate, wherein a support and an XY bin opening assembly are fixed on the bottom plate and used for switching a discharging bin and fixing a PCB, a bin in-place detection sensor is also fixed on the bottom plate and used for detecting the moving condition of the XY bin opening assembly, a Z-axis lifting servo is further arranged on the bottom plate, a lifting tray is arranged on the Z-axis lifting servo and used for lifting and conveying the PCB, a in-place detection sensor is arranged at the top of the Z-axis lifting servo and used for detecting the position of the PCB, and a tray detection sensor is arranged on the support and used for detecting whether materials exist on the lifting tray.

As a preferable scheme, the PCB integrated mark processing device is characterized in that the blanking module further comprises a code scanning module,

the code scanning module comprises: the upper code reading module is configured on the Y-axis guide rail, the lower code reading module is positioned below the conveying line, and the upper code reading module and the lower code reading module are matched to read two-dimensional codes on two sides of the PCB and upload the two-dimensional codes to the database.

As a preferable scheme, the PCB integrated mark processing device is characterized in that a conveying line is divided into a first conveying line and a second conveying line, a feeding module component is divided into a first feeding module and a second feeding module, a discharging module component is divided into a first discharging module and a second discharging module,

the first conveying line, the first feeding module and the first discharging module are matched, and the first conveying line and the golden finger protection module form a golden finger protection processing module together;

the second conveying line, the second feeding module and the second discharging module are matched with each other, and the second feeding module and the second discharging module are combined with the laser module to form the laser and label-sticking processing module.

As a preferred scheme, this PCB board integration sign processing equipment, its characterized in that still includes: the shell and the man-machine interaction module are arranged,

the housing includes:

a feeding door and a discharging door;

a tri-color lamp for indicating the operating condition of the apparatus;

the fan filter system is used for cooling equipment and filtering smoke dust generated by laser;

the man-machine interaction module includes: the display, the mouse and the keyboard, and the reset and scram switches are started.

Advantageous effects

Compared with the prior art, the PCB integrated mark processing equipment integrates the functions of feeding and discharging, golden finger protection, laser, labeling and code scanning uploading, reduces the volume of the equipment, shortens the distance of each process link, improves the continuity, the integrity and the production efficiency of the processing process, can integrate and upload production information immediately, ensures the timeliness of production information, and achieves quality tracing.

Drawings

FIG. 1 is a schematic perspective view of an apparatus according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a golden finger protection module according to an embodiment of the present application;

FIG. 3 is a schematic diagram of the loading module, laser module, labeling module, code scanning and unloading module of the device according to the embodiment of the application;

FIG. 4 is a schematic structural view of a conveyor line of the device according to the embodiment of the present application;

FIG. 5 is a schematic diagram of a loading and transporting module of the device according to the embodiment of the present application;

FIG. 6 is a schematic diagram of a tape module according to an embodiment of the present application;

FIG. 7 is a schematic diagram of a turnover module of the device according to the embodiment of the application;

FIG. 8 is a schematic diagram of a loading bin of the device according to the embodiment of the application;

FIG. 9 is a schematic diagram of a laser module of an embodiment of the present application;

FIG. 10 is a schematic structural diagram of an XYZ labeling module of the device according to the embodiment of the application;

FIG. 11 is a schematic view of a label feeder according to an embodiment of the present application;

FIG. 12 is a schematic diagram of the structure of the blanking and carrying module and the code scanning module of the device according to the embodiment of the present application;

fig. 13 is a schematic structural diagram of a blanking bin of the device according to the embodiment of the application.

Detailed Description

The above-described aspects are further described below in conjunction with specific embodiments. It should be understood that these examples are illustrative of the present application and are not intended to limit the scope of the present application. The implementation conditions employed in the examples may be further adjusted as in the case of the specific manufacturer, and the implementation conditions not specified are typically those in routine experiments.

Next, please refer to fig. 1 to 10 for a detailed description of a PCB board integrated label processing apparatus according to an embodiment of the present application.

Fig. 1 is a schematic perspective view of a device according to an embodiment of the present application, and is a PCB integrated label processing apparatus 100, including a housing 110, a fan filter system 130 on the top of the housing for cooling the apparatus and filtering smoke generated by laser, a tri-color lamp 140 for indicating the operation status of the apparatus, and a loading door 150, a unloading door 160, and a man-machine interaction module 120 on the front of the housing for controlling the operation of the apparatus.

Fig. 2 is a schematic diagram of a golden finger protection module structure of the device according to the embodiment of the application, which comprises a conveying line 230, a feeding bin 240, a taping module 210 and a turning module 220.

Fig. 3 is a schematic structural diagram of a feeding module, a laser module, a labeling module, a code scanning and discharging module 300 of the device according to the embodiment of the present application in fig. 3, which includes a conveying line 230, a feeding bin 240, a feeding transporting module 310, a laser module 320, an xyz labeling module 330, a label feeder 360, a discharging transporting module 340, and a discharging bin 350.

Fig. 4 is a schematic view showing a structure of a conveyor line 230 according to an embodiment of the present application, which includes two rows of parallel guide rails 232, both of which are provided with pulleys 234, a supporting belt 231 and a motor 233, wherein the supporting belt 231 is fixed to the pulleys 234, the pulleys are fixed to the guide rails 232, and the motor 233 drives the pulleys 234 to rotate, thereby driving the supporting belt 231 to convey PCB boards to respective module processes of the apparatus.

Fig. 5 is a schematic structural diagram of a loading and transporting module of the device according to the embodiment of the present application, including an X-axis guide rail 311, disposed above a conveyor line 230, a motor 312 fixed at an end of the X-axis guide rail for driving a Z-axis lifting servo 313 to act in an X-axis direction, the Z-axis lifting servo 313 disposed on the X-axis guide rail 311, a vacuum generator 314 disposed at a top portion thereof, and a vacuum chuck assembly 315 disposed at a bottom portion thereof for adsorbing and transporting PCB boards stacked in a loading bin 240 onto the conveyor line 230.

FIG. 6 is a schematic structural diagram of an embodiment of a tape module of the present application, comprising: the Y-axis guide rail 211, an X-axis guide rail 212 arranged on the Y-axis guide rail 211, a Z-axis lifting mechanism 213 arranged on the X-axis guide rail 212, a high-temperature adhesive tape unreeling roll 214 fixed on the Z-axis lifting mechanism, and an adhesive tape pasting component 215 arranged at the bottom for pasting the high-temperature adhesive tape on the golden finger of the PCB.

Fig. 7 is a schematic structural diagram of a turnover module of the device according to the embodiment of the application, which comprises a motor 221, a turnover mechanism 222 connected to the motor, and a PCB grabbing hand 223 fixed at the front end of the turnover mechanism, wherein the motor drives the turnover mechanism, and the turnover mechanism grabs the PCB and turns the PCB over.

Fig. 8 is a schematic structural diagram of a loading bin of the device according to the embodiment of the application, which comprises a bottom plate 242, wherein a bracket and an XY bin opening assembly 243 are fixed on the bottom plate 242, and are used for switching the loading bin 240 and fixing a PCB board; a bin in-place detection sensor 244 fixed on the base plate 242 for detecting the movement of the XY-bin-opening assembly 243; a Z-axis lifting servo 241 fixed on the bottom plate 242, and a lifting tray 245 arranged on the Z-axis lifting servo for lifting and conveying the PCB; the in-place detection sensor 248 is configured at the top of the Z-axis lifting servo 241 and is used for detecting the position of the PCB; a tray detection sensor 246 disposed on the support for detecting whether the lifting tray is loaded or not; and the positioning cylinder 247 is arranged at the top of the feeding bin and is used for positioning the PCB to the position to be adsorbed.

Fig. 9 is a schematic structural diagram of a laser module of the device according to the embodiment of the present application, including a laser 322 disposed on a conveying line 230 for laser engraving a two-dimensional code on a PCB board; the laser protection cover 321 surrounds the outside of the laser machine, the conveying line 230 passes through the laser protection cover 231, and a smoke suction through hole is arranged at the top for discharging smoke dust and preventing the laser dust from polluting; the PCB positioning cylinder is positioned below the conveying line and is used for positioning the PCB to a laser position; the laser dust removing component 323 is arranged in the laser protective cover and is used for discharging smoke and dust generated by laser.

Fig. 10 is a schematic structural diagram of an XYZ labeling module of an embodiment of the present application, an X-axis guide rail 331 is disposed above a conveying line 230, a Y-axis guide rail 332 is disposed on the X-axis guide rail 331, a quick-change label absorbing assembly 335 and a vacuum generator 334 are disposed on the Y-axis guide rail 332, for absorbing labels, and an upper CCD assembly 333 is disposed on one side of the label absorbing assembly, for identifying two-dimensional codes of a PCB board; a Z-axis jacking assembly 338 is arranged below the conveying line 230, and a PCB supporting plate is arranged on the Z-axis jacking assembly 338 and used for supporting and protecting the PCB during labeling; the guide rails at two sides of the conveying line at the section of the XYZ labeling module are fixed with a PCB positioning pressing plate 336 for stably positioning the PCB.

Fig. 11 is a schematic structural diagram of a label feeder according to an embodiment of the present application, including: a base plate 361, a label feed roll 367 and a label take-up roll 366 are arranged on one side of the base plate 361; a label peeling knife 362 and a label receiving platform 363 are arranged on the top for peeling labels; a lower CCD assembly 364 and a stepper motor 365 are disposed on the other side of the substrate, the lower CCD assembly 364 is used for identifying two-dimensional codes of the PCB board to be attached, and the stepper motor 365 and the label receiving roll 366 are used for recovering release films of labels.

Fig. 12 is a schematic structural diagram of a blanking and conveying module and a code scanning module of the device according to the embodiment of the present application, an X-axis guide rail 342 is disposed above a conveying line 230, a Y-axis guide rail 341 is disposed on the X-axis guide rail 342, and a vacuum generator 346 and a vacuum chuck assembly 345 are disposed on the Y-axis guide rail 342 for adsorbing and conveying PCB boards to a blanking bin 350; the code reading module comprises: the upper code reading module 343 and the lower code reading module 344 are configured on the Y-axis guide rail 341, and the lower code reading module 344 is located below the conveying line 230 and is used for reading two-dimensional codes on two sides of the PCB board and uploading the two-dimensional codes to the database.

Fig. 13 is a schematic structural diagram of a blanking bin of the device according to the embodiment of the present application, including: the bottom plate 351 is fixed with support and XY storehouse subassembly 352 on the bottom plate 351 for switch unloading feed bin and fixed PCB board, still be fixed with feed bin detection sensor 356 in place on the bottom plate 351 simultaneously for detect the removal condition of XY storehouse subassembly 352, still dispose Z axle lift servo 353 on the bottom plate 351, have lift tray 355 on the Z axle lift servo 353, be used for lifting and transporting the PCB board, Z axle lift servo 353 top has in place detection sensor 354, be used for detecting the PCB board position, have tray detection sensor on the support, be used for detecting whether there is the material on the lift tray.

As a preferred scheme, the conveyor line 230 is divided into a first conveyor line 230 (a) and a second conveyor line 230 (b), the feeding module 310 is divided into a first feeding module 310 (a) and a second feeding module 310 (b), the discharging module 350 is divided into a first discharging module 350 (a) and a second discharging module 350 (b),

the first conveying line 230 (a), the first feeding module 310 (a) and the first discharging module 350 (a) cooperate to form a golden finger protection processing module 200 together with the golden finger protection module;

the second conveyor line 230 (b), the second feeding module 310 (b) and the second discharging module 350 (b) cooperate with the laser module and the labeling module together form the laser and labeling processing module 300.

The following describes the example of PCB golden finger protection, laser processing and labeling processing.

Stacking the PCB stack in a feeding bin 240, lifting the PCB by a Z-axis lifting servo of the feeding bin to the top of the feeding bin, positioning the PCB by a positioning cylinder to a feeding and carrying module 310, adsorbing the PCB by a vacuum chuck assembly 315 of the feeding and carrying module 310, lifting the PCB by a Z-axis lifting servo 313, moving to the upper part of a conveying line 230 along an X-axis guide rail 311, putting down the PCB, driving the PCB by a bearing belt 231 of the conveying line to move to a golden finger protection module 200, moving down the adhesive tape module 210, attaching a high-temperature adhesive tape on the golden finger of the PCB, continuing to drive the PCB by the conveying line 230 to a turnover module 220, turning over the PCB, then conveying the PCB to a second adhesive tape module, attaching a high-temperature adhesive tape on the golden finger on the back side of the PCB, conveying the PCB to a 320 module by a conveying line, positioning the PCB by a positioning cylinder, positioning the PCB to a laser machine 322 to engrave two-dimensional codes on the front and back sides of the PCB, the generated smoke and dust are sucked out of the laser module by the laser dust removing component 323, the PCB is then conveyed to the XYZ labeling module 330, the label discharging roll 367 of the label feeder 360 conveys the label roll to the label peeling knife 362, the XYZ labeling module 330 removes labels to be attached from the label receiving platform 363 of the label feeder 360, transfers the labels to the PCB, the lower CCD module 364 recognizes and reads two-dimensional codes of the PCB, the stepping motor 365 and the label receiving roll 366 cooperate with recovering the release film of the labels, the PCB is then moved to the blanking carrying module and the code sweeping module 340, the X-axis guide 342 and the Y-axis guide combination move the 341 vacuum generator 346 and the vacuum chuck module which are arranged on the Y-axis guide to adsorb the PCB, and the upper code reading module 343 on the Y-axis guide and the lower code reading module 344 below the conveying line 230 read and recognize the two-dimensional codes of the front and the back of the PCB and upload the two-dimensional codes to the system database, the PCB is adsorbed to the blanking bin 350, and the PCB after being processed is stacked and collected by the Z-axis lifting servo 353 of the blanking bin 350.

The above embodiments are provided to illustrate the technical concept and features of the present application, and are intended to enable those skilled in the art to understand the present application and implement the same according to the present application, not to limit the scope of the present application. All equivalent changes or modifications made by the spirit of the application are intended to be covered by the scope of the application.

Claims

1. PCB board integration sign processing equipment, its characterized in that includes:

a conveying line, a processing module group,

the laser module is used for laser engraving a two-dimensional code on the PCB;

the labeling module is used for attaching the label to the PCB;

the blanking module is used for reading the engraved two-dimensional codes on the PCB and uploading the two-dimensional codes to the database, and taking down and storing the processed PCB.

2. The PCB panel integrated marking apparatus of claim 1, wherein the conveyor line comprises: the two rows of parallel guide rails are divided into a first guide rail and a second guide rail, the guide rails on two sides are provided with belt pulleys, a bearing belt and a motor, the bearing belt is fixed on the belt pulleys, the belt pulleys are fixed on the guide rails, the motor drives the belt pulleys to rotate, so that the bearing belt is driven, and a PCB (printed Circuit Board) is conveyed to each module of equipment for processing.

3. The PCB integrated mark processing device of claim 1, wherein the feeding module comprises a feeding bin and a feeding carrying module,

the material loading feed bin includes:

the bin in-place detection sensor is fixed on the bottom plate and is used for detecting the movement condition of the XY bin opening assembly;

the material loading transport module includes:

an X-axis guide rail arranged above the conveying line, wherein a motor is fixed at the end part of the X-axis guide rail and used for driving the Z-axis lifting servo to act in the X-axis direction;

and the Z-axis lifting servo is configured on the X-axis guide rail, the top of the Z-axis lifting servo is provided with a vacuum generator, and the bottom of the Z-axis lifting servo is provided with a vacuum chuck assembly which is used for adsorbing and conveying the PCB stacked by the feeding bin onto the conveying line.

4. The PCB board integrated marking apparatus of claim 1, wherein the golden finger protection module comprises: a turnover module, a tape sticking module,

the rubberizing tape module includes: the X-axis guide rail is configured on the Y-axis guide rail, a Z-axis lifting mechanism is configured on the X-axis guide rail, a high-temperature adhesive tape unreeling roll is fixed on the Z-axis lifting mechanism, and an adhesive tape pasting component is arranged at the bottom and used for pasting a high-temperature adhesive tape on a golden finger of a PCB;

5. The PCB board integrated marking apparatus of claim 1, wherein the laser module comprises:

the laser protection cover surrounds the laser machine, the conveying line passes through the laser protection cover, and a smoke suction through hole is arranged at the top of the conveying line for discharging smoke dust and preventing pollution caused by the laser dust;

and the laser dust removing component is arranged in the laser protective cover and is used for discharging smoke and dust generated by laser.

6. The PCB integrated label processing device of claim 1, wherein the labeling module comprises a label feeder and an XYZ labeling module,

the label feeder includes: a substrate, wherein a label unreeling roll and a label receiving roll are arranged on one side of the substrate; the top is provided with a label stripping knife and a label receiving platform for stripping labels; a lower CCD assembly and a stepping motor are arranged on the other side of the substrate, the lower CCD assembly is used for identifying the two-dimensional code of the PCB to be attached, and the stepping motor and the label receiving roll are used for recycling the release film of the label;

the XYZ pastes mark module, include: an X-axis guide rail is arranged above the conveying line, a Y-axis guide rail is arranged on the X-axis guide rail, a quick-change label absorbing assembly and a vacuum generator are arranged on the Y-axis guide rail and used for absorbing labels, and an upper CCD assembly is arranged on one side of the quick-change label absorbing assembly and used for identifying two-dimensional codes of a PCB (printed circuit board); a Z-axis jacking assembly is arranged below the conveying line, and a PCB supporting plate is arranged on the Z-axis jacking assembly and used for supporting and protecting the PCB during labeling; and the guide rails at two sides of the conveying line positioned at the section of the XYZ labeling module are fixed with PCB positioning pressing plates for stably positioning the PCB.

7. The PCB integrated mark processing device of claim 1, wherein the blanking module comprises a blanking carrying module and a blanking bin,

the unloading transport module includes: an X-axis guide rail is arranged above the conveying line, a Y-axis guide rail is arranged on the X-axis guide rail, and a vacuum generator and a vacuum chuck assembly are arranged on the Y-axis guide rail and are used for adsorbing and conveying the PCB to a blanking bin;

the unloading feed bin includes: the automatic feeding and discharging device comprises a bottom plate, wherein a support and an XY bin opening assembly are fixed on the bottom plate and used for switching a discharging bin and fixing a PCB, a bin in-place detection sensor is also fixed on the bottom plate and used for detecting the moving condition of the XY bin opening assembly, a Z-axis lifting servo is further arranged on the bottom plate, a lifting tray is arranged on the Z-axis lifting servo and used for lifting and conveying the PCB, a in-place detection sensor is arranged at the top of the Z-axis lifting servo and used for detecting the position of the PCB, and a tray detection sensor is arranged on the support and used for detecting whether materials exist on the lifting tray.

8. The PCB integrated mark processing device of claim 7, wherein the blanking module further comprises a code scanning module,

9. The integrated label processing device of claim 1, wherein the conveying line is divided into a first conveying line and a second conveying line, the feeding die set is divided into a first feeding die set and a second feeding die set, the discharging die set is divided into a first discharging die set and a second discharging die set,

the first conveying line, the first feeding module and the first discharging module are matched, and form a golden finger protection processing module together with the golden finger protection module;

the second conveying line, the second feeding module cooperates with the second discharging module, and forms a laser and label-sticking processing module together with the laser module.

10. The PCB panel integrated marking apparatus of claim 1, further comprising: the shell and the man-machine interaction module are arranged,

the housing includes:

a feeding door and a discharging door;

a tri-color lamp for indicating the operating condition of the apparatus;

the man-machine interaction module comprises: the display, the mouse and the keyboard, and the reset and scram switches are started.