CN116706653A

CN116706653A - Semiconductor optical fiber coupling laser and optical fiber laser

Info

Publication number: CN116706653A
Application number: CN202310672050.3A
Authority: CN
Inventors: 陈晓华; 于振坤; 张一翔; 王宝华; 时敏; 段云锋; 郎超; 赵巨云
Original assignee: BWT Beijing Ltd
Current assignee: BWT Beijing Ltd
Priority date: 2021-08-05
Filing date: 2021-08-05
Publication date: 2023-09-05
Also published as: CN113346342A

Abstract

The invention discloses a semiconductor optical fiber coupling laser and an optical fiber laser. The semiconductor optical fiber coupling laser comprises an optical module, a cold plate and a cover plate, wherein the cover plate and the cold plate form the encapsulation of the optical module by adopting a cold plate direct pumping (DPoC) technology and a one-plate multi-pump (MPoC) technology, a tube shell encapsulation structure of a conventional pumping module is canceled, the cost, the weight and the volume of the semiconductor optical fiber coupling laser are reduced, the heat transfer path of a semiconductor laser single tube is shortened, the junction temperature of the semiconductor laser single tube is effectively reduced, the reliability and the service life of the laser are improved, and the high integration and the high power output of the semiconductor optical fiber coupling laser are realized; the optical fiber laser takes a semiconductor optical fiber coupling laser using a DPoC technology and an MPoC technology as a pumping source, and simultaneously winds an active optical fiber on a cold plate, and dissipates heat of the active optical fiber by means of the cold plate, so that the cost, weight and volume of the optical fiber laser are greatly reduced, and the high integration and high power output of the optical fiber laser are realized.

Description

Semiconductor optical fiber coupling laser and optical fiber laser

Technical Field

The invention belongs to the technical field of laser, and particularly relates to a semiconductor optical fiber coupling laser and an optical fiber laser.

Background

The laser has the advantages of good beam quality, high efficiency, high stability and the like, and is widely applied to the fields of laser fiber communication, laser space remote communication, laser engraving, laser marking, automobile manufacturing and the like. The fiber laser generally uses a plurality of semiconductor laser pump sources to pump the active fiber through a fiber beam combination to obtain high power output.

Referring to fig. 1 and 2, the present multi-pump assembly 10 includes a cold plate 102 and a plurality of semiconductor laser pump sources 101 fixed on the cold plate 102, and the conventional semiconductor laser pump sources 101 generally use a package 1011 with a stepped structure to independently package a COS (Chip 0n sub module), an optical path array, an electrode, an optical fiber holder and a pigtail. Therefore, in the working process of the multi-pump assembly, heat generated by the COS module in the semiconductor laser pump source is transferred to the cold plate through the tube shell, and then the cold plate is used for heat dissipation and temperature reduction treatment.

However, the package used for the semiconductor laser pump source is mostly made of copper alloy, the processing is time-consuming, and the outer surface of the bottom plate of the package is currently treated by gold plating entirely, including gold plating on non-critical surfaces, thereby wasting gold plating and increasing the cost. Meanwhile, the heat transfer path and the thermal resistance of the semiconductor chip are increased by the shell bottom plate which is currently used, so that the heat dissipation of the pump source module is not facilitated.

In addition, under the condition that the high-power output fiber laser is realized by combining a plurality of semiconductor laser pumping sources through optical fibers, as the single semiconductor laser pumping source still uses the traditional ladder tube shell bottom plate, the whole high weight, high cost, high thermal resistance and overlarge volume of the high-power output fiber laser are caused, and the plurality of pumping sources are independently designed and packaged, so that the integration level is lower. Meanwhile, the high power output of the fiber laser causes an increase in the amount of heat generated by the fiber, and therefore, it is necessary to provide a heat sink for the fiber to increase the heat dissipation area of the fiber, particularly the gain fiber having a large amount of heat generation. These problems together result in high power fiber lasers that are heavy, bulky, and costly.

Disclosure of Invention

In view of the above, the present invention discloses a semiconductor fiber coupled laser and a fiber laser, which overcome or at least partially solve the above-mentioned problems. The cold plate direct pumping technology (Direct Pump on Coldplate, called DPoC) and the one-plate multi-pump technology (Multiple Pump one Coldplate, called MPoC) are adopted, a tube shell used in a conventional semiconductor laser pumping source is canceled, a plurality of optical modules are directly arranged on the same cold plate, and the encapsulation of the optical modules is directly formed by means of a cover plate and the cold plate, so that the cost, the weight and the volume of a semiconductor optical fiber coupled laser are reduced, the heat transfer path of a semiconductor laser single tube is shortened, the junction temperature of the semiconductor laser single tube is effectively reduced, and the reliability and the service life of the laser are improved; the optical fiber laser takes a semiconductor optical fiber coupling laser using a DPoC technology and an MPoC technology as a pumping source, and simultaneously winds an active optical fiber on a cold plate to provide reliable heat dissipation for the active optical fiber, thereby achieving the purposes of reducing the cost, the weight and the volume of the optical fiber laser and realizing the high integration and the high power output of the laser.

In order to achieve the above purpose, the present invention adopts the following technical scheme:

the invention provides a semiconductor optical fiber coupling laser, which comprises an optical module, a cold plate and a cover plate; the optical module is provided with a COS module, an optical path array, an electrode, a tail fiber and an optical fiber bracket which are all connected with the cold plate; the cover plate is connected with the cold plate, and the cover plate and the cold plate form a package of the optical module.

Optionally, the COS module is directly disposed on the surface of the cold plate.

Optionally, the optical module includes a heat conducting component, and the COS module is connected with the cold plate through the heat conducting component.

Optionally, the heat conducting component is prepared from one or more materials selected from copper, tungsten copper, molybdenum copper, aluminum-silicon carbide, graphite, foam graphite, silicon carbide or aluminum.

Optionally, the semiconductor laser single tube in the COS module is directly connected with the heat conductive member.

Optionally, a mounting groove is formed in the surface of the cold plate; the heat conductive member extends through the mounting groove to be in contact with the cooling medium inside the cold plate.

Optionally, the heat conducting member is provided with fins, and the fins are in direct contact with the cooling medium inside the cold plate.

Optionally, a cooling channel for guiding the flow of the cooling medium is arranged in the cold plate, and the heat conduction component is provided with a drainage channel which is communicated with the cooling channel.

Optionally, the drainage channel is a straight channel, and an end surface of the drainage channel and the cooling channel are assembled by adopting inclined planes along the direction that the cooling medium passes through the drainage channel.

Optionally, the heat conducting component adopts a heat pipe, the COS module is disposed at an evaporation end of the heat pipe, and a condensation end of the heat pipe is connected with the cold plate.

Optionally, the condensing end of the heat pipe extends into contact with a cooling medium inside the cold plate.

Optionally, the heat conducting component is connected with the cold plate by bolts.

Optionally, the semiconductor fiber coupled laser includes a plurality of optical modules; the plurality of optical modules are sequentially arranged on the cold plate.

Optionally, the cover plate and the cold plate integrally encapsulate the plurality of light modules.

Optionally, the semiconductor fiber coupled laser includes a plurality of cover plates; and the plurality of cover plates are respectively connected with the cold plate to independently package the plurality of light modules.

Optionally, the cover plate comprises an upper cover plate and a lower cover plate; the light modules are respectively arranged on the upper surface of the cold plate and the lower surface of the cold plate, and the upper cover plate and the lower cover plate are respectively connected with the cold plate to form a package.

Optionally, the optical modules located on the upper surface of the cold plate and the optical modules located on the lower surface of the cold plate are staggered.

Optionally, the cooling channel inside the cold plate is disposed at a position corresponding to the COS module.

Optionally, a groove array is arranged in a region of the cold plate where the optical module is not arranged.

The invention provides an optical fiber laser, which comprises an optical fiber beam combiner, an active optical fiber and the semiconductor optical fiber coupling laser; the optical fiber combiner is connected with the tail fiber and the active optical fiber in the semiconductor optical fiber coupling laser.

Optionally, the fiber laser includes a fiber cold plate and the active fiber is located on the fiber cold plate.

Optionally, the optical fiber cold plate and the cold plate adopt an integrated structure.

The invention has the advantages and beneficial effects that:

1. compared with a conventional semiconductor laser pumping source, in the semiconductor optical fiber coupling laser adopting the DPoC technology and the MPoC technology, the COS module, the optical path array, the electrode, the tail fiber and the optical fiber support which are originally fixed in the tube shell are directly and fixedly connected to the surface of the cold plate by omitting the tube shell, and the COS module, the optical path array, the electrode, the tail fiber and the optical fiber support are packaged by the connection of the cover plate and the cold plate. Therefore, the use and manufacturing cost of a tube shell are saved, the weight and the volume of the whole semiconductor optical fiber coupling laser are reduced, and the use flexibility of the semiconductor optical fiber coupling laser is improved; meanwhile, the COS module is directly connected with the cold plate, so that a heat transfer path between a semiconductor laser single tube and the cold plate in the COS module can be shortened, thermal resistance is reduced, junction temperature of the semiconductor laser single tube is effectively reduced, reliability and service life of the semiconductor laser single tube are improved, high-integration high-power output of the semiconductor optical fiber coupled laser is realized, and further application of a higher-power output scene is met.

2. Compared with the conventional fiber laser, the fiber laser provided by the invention uses the semiconductor fiber coupling laser adopting the DPoC technology and the MPoC technology as a pumping source, simultaneously, the active fiber is directly arranged on the cold plate, and the cold plate is utilized to provide reliable heat dissipation for the active fiber, so that the cost, the weight and the volume of the fiber laser are greatly reduced, and the high-integration high-power output of the fiber laser is realized.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:

FIG. 1 is a schematic diagram of a conventional multi-pump assembly;

FIG. 2 is a schematic diagram of a conventional semiconductor laser pump source;

FIG. 3 is a schematic diagram of a semiconductor fiber coupled laser according to the first embodiment;

FIG. 4 is a schematic top view of a semiconductor fiber coupled laser with a cover removed;

FIG. 5 is a schematic diagram of a COS module according to the first embodiment:

FIG. 6 is a schematic diagram of a semiconductor fiber coupled laser according to a second embodiment;

FIG. 7 is a schematic top view of a semiconductor fiber coupled laser with a cover removed;

FIG. 8 is a schematic view of the cross-sectional structure in the direction A-A in FIG. 7;

FIG. 9 is a schematic diagram showing connection between a COS module and a heat-conducting member in a second embodiment;

fig. 10 is a schematic structural diagram of a semiconductor fiber coupled laser in the third embodiment;

FIG. 11 is a schematic top view of a semiconductor fiber coupled laser with a cover removed;

FIG. 12 is a schematic view showing a sectional structure in the direction B-B in FIG. 11;

FIG. 13 is a schematic diagram showing connection between COS module and heat conduction member in the third embodiment;

fig. 14 is a schematic structural diagram of a semiconductor fiber coupled laser in the fourth embodiment;

FIG. 15 is a schematic top view of a semiconductor fiber coupled laser with a cover removed in a fourth embodiment;

FIG. 16 is a schematic view of the cross-sectional structure of FIG. 15 in the direction C-C;

FIG. 17 is a schematic diagram showing connection between COS module and heat conduction member in the fourth embodiment;

fig. 18 is a schematic structural diagram of a semiconductor fiber coupled laser in the fifth embodiment;

FIG. 19 is a schematic top view of a semiconductor fiber coupled laser with a cover removed;

FIG. 20 is a schematic view showing a sectional structure in the direction D-D in FIG. 19;

FIG. 21 is a schematic diagram showing connection between COS module and heat conduction member in fifth embodiment;

fig. 22 is a schematic structural diagram of a semiconductor fiber coupled laser in the sixth embodiment;

FIG. 23 is a schematic top view of a semiconductor fiber coupled laser with a cover removed;

FIG. 24 is a schematic view showing a cross-sectional structure in the direction E-E in FIG. 23;

FIG. 25 is a schematic diagram showing connection between a COS module and a heat-conducting member in a sixth embodiment;

fig. 26 is a schematic view showing four different structures of the heat conductive member in the sixth embodiment;

fig. 27 is a schematic structural diagram of a semiconductor fiber coupled laser in the seventh embodiment;

FIG. 28 is a schematic top view of a semiconductor fiber coupled laser with a cover removed;

FIG. 29 is a schematic view of the cross-sectional structure in the F-F direction in FIG. 28;

FIG. 30 is a schematic diagram showing connection between a COS module and a heat-conducting member according to a seventh embodiment;

fig. 31 is a schematic diagram of a semiconductor fiber coupled laser according to an eighth embodiment;

FIG. 32 is a schematic top view of a semiconductor fiber coupled laser with a cover removed in accordance with an eighth embodiment;

FIG. 33 is a schematic view showing a sectional structure in the direction G-G in FIG. 32;

FIG. 34 is a schematic diagram showing connection between COS module and heat conduction member in the eighth embodiment;

Fig. 35 is a schematic structural diagram of a semiconductor fiber coupled laser according to a ninth embodiment;

FIG. 36 is a schematic top view of a semiconductor fiber coupled laser with a cover removed;

FIG. 37 is a schematic view showing a cross-sectional structure in the H-H direction in FIG. 32;

FIG. 38 is a schematic illustration of a connection of a COS module to a thermally conductive member according to a ninth embodiment;

FIG. 39 is a schematic view showing a sectional structure in the J-J direction in FIG. 38;

fig. 40 is a schematic structural diagram of a semiconductor fiber coupled laser according to a tenth embodiment;

FIG. 41 is a schematic top view of a semiconductor fiber coupled laser with a cover removed;

FIG. 42 is a schematic view of the cross-sectional structure in the direction K-K in FIG. 41;

FIG. 43 is a schematic view showing connection of COS modules to a heat-conducting member according to a tenth embodiment;

fig. 44 is a schematic diagram of a semiconductor fiber coupled laser according to an eleventh embodiment;

FIG. 45 is a schematic top view of a semiconductor fiber coupled laser with a cover removed;

FIG. 46 is a schematic view of the cross-sectional structure in the M-M direction in FIG. 45;

FIG. 47 is a schematic view showing connection between a COS module and a heat-conducting member in accordance with an eleventh embodiment;

FIG. 48 is a schematic view of the cross-sectional structure in the N-N direction of FIG. 47;

fig. 49 is a schematic diagram of a semiconductor fiber coupled laser according to a twelfth embodiment;

FIG. 50 is a schematic top view of a semiconductor fiber coupled laser with a cover removed in accordance with a twelfth embodiment;

FIG. 51 is a schematic view of the cross-sectional structure in the P-P direction in FIG. 50;

FIG. 52 is a schematic diagram showing the connection of COS modules to a heat-conducting member according to the twelfth embodiment;

FIG. 53 is a schematic top view of a semiconductor fiber coupled laser with a cover removed in accordance with a thirteenth embodiment;

FIG. 54 is a schematic view of the cross-sectional structure in the Q-Q direction of FIG. 53;

FIG. 55 is a schematic diagram showing connection between COS module and heat conductive member in thirteenth embodiment;

FIG. 56 is a schematic top view of a semiconductor fiber coupled laser with a cover removed in accordance with a fourteenth embodiment;

FIG. 57 is a schematic view showing a cross-sectional structure of the R-R direction in FIG. 53;

FIG. 58 is a schematic diagram illustrating a connection between a COS module and a heat-conducting member according to a fourteenth embodiment;

FIG. 59 is a schematic bottom view of a semiconductor fiber coupled laser according to a fourteenth embodiment

FIG. 60 is a schematic diagram of a semiconductor fiber coupled laser in fifteen embodiments;

FIG. 61 is a schematic top view of a semiconductor fiber coupled laser with a cover removed in accordance with a fifteenth embodiment;

FIG. 62 is a schematic diagram of a fiber laser in a sixteenth embodiment;

FIG. 63 is a schematic view of a fiber laser in seventeenth embodiment;

FIG. 64 is a schematic view of a fiber laser according to an eighteenth embodiment;

FIG. 65 is a schematic view of a fiber laser according to nineteenth embodiment;

in the figure: 10. a multi-pump assembly; 101. a semiconductor laser pump source; 102. a cold plate; 1011. a tube shell; 11. a semiconductor fiber coupled laser; 111. an optical module; 112. a cold plate; 113. a cover plate; 1111. a COS module; 1112. an optical path array; 1113. an electrode; 1114. tail fiber; 1115. an optical fiber bracket; 1121. a cooling liquid inlet; 1122. a cooling liquid outlet; 1123. a cooling channel; 11111. a semiconductor laser single tube; 11112. a heat sink; 12. a semiconductor fiber coupled laser; 121. an optical module; 122. a cold plate; 1211. a heat conductive member; 1221. a mounting groove; 1222. a cooling channel; 13. a semiconductor fiber coupled laser; 131. an optical module; 132. a cold plate; 133. a bolt; 134. a seal ring; 1311. a heat conductive member; 1321. a mounting groove; 1322. a threaded hole; 1323. a seal ring groove; 13111. bolt holes; 14. a semiconductor fiber coupled laser; 141. an optical module; 142. a cold plate; 1411. a heat conductive member; 1421. a mounting groove; 15. a semiconductor fiber coupled laser; 151. an optical module; 152. a cold plate; 153. a bolt; 154. a seal ring; 1511. a heat conductive member; 1521. a mounting groove; 1522. a seal ring groove; 1523. a threaded hole; 16. a semiconductor fiber coupled laser; 161. an optical module; 162. a cold plate; 1611. a heat conductive member; 16111. a fin; 17. a semiconductor fiber coupled laser; 171. an optical module; 172. a cold plate; 173. a bolt; 174. a seal ring; 1711. a heat conductive member; 1721. a mounting groove; 1722. a threaded hole; 1723. sealing grooves; 17111. bolt holes; 18. a semiconductor fiber coupled laser; 181. an optical module; 182. a cold plate; 1811. a heat conductive member; 1821. a cooling channel; 18111. a drainage channel; 19. a semiconductor fiber coupled laser; 191. an optical module; 192. a cold plate; 193. a seal ring; 1911. a heat conductive member; 19112. a drainage channel; 1921. a mounting groove; 1922. a cooling channel; 1923. sealing grooves; 19111. bolt holes; 20. a semiconductor fiber coupled laser; 201. an optical module; 202. a cold plate; 203. a seal ring; 2011. a heat conductive member; 2021. a cooling channel; 20111. a drainage channel; 20112. bolt holes; 20113. a seal ring groove; 21. a semiconductor fiber coupled laser; 211. an optical module; 212. a cold plate; 2111. a heat conductive member; 21111. an evaporation end; 21112. a condensing end; 22. a semiconductor fiber coupled laser; 221. an optical module; 222. a cold plate; 223. a bolt; 224. a seal ring; 2211. a heat conductive member; 2222. a threaded hole; 2223. sealing grooves; 22111. bolt holes; 23. a semiconductor fiber coupled laser; 231. an optical module; 232. a cold plate; 2311. a heat conductive member; 2321. a mounting groove; 2322. a cooling channel; 23111. an evaporation end; 23112. a condensing end; 24. a semiconductor fiber coupled laser; 241. an optical module; 242. a cold plate; 2411. a heat conductive member; 2421. a mounting groove; 2422. a cooling channel; 2423. an array of grooves; 24111. an evaporation end; 24112. a condensing end; 25. a semiconductor fiber coupled laser; 251. an optical module; 252. a cold plate; 253. a cover plate; 31. a fiber laser; 311. a semiconductor fiber coupled laser; 312. an optical fiber combiner; 313. an active optical fiber; 3111. an optical module; 3112. a cold plate; 3113. a cover plate; 32. a fiber laser; 321. a semiconductor fiber coupled laser; 322. an optical fiber cold plate; 3211. an optical module; 323. a connecting piece; 3212. a cold plate; 3213. a cover plate; 33. a fiber laser; 331. a semiconductor fiber coupled laser; 3311. a cold plate; 34. a fiber laser; 341. a semiconductor fiber coupled laser; 3411. an optical module; 3412. a cold plate; 3413. and a cover plate.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to specific embodiments of the present invention and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

The following describes in detail the technical solutions provided by the embodiments of the present invention with reference to the accompanying drawings.

Example 1

As shown in fig. 3 to 5, the present embodiment discloses a semiconductor fiber coupled laser 11. The semiconductor fiber coupled laser 11 includes six optical modules 111, a cold plate 112 and a cover plate 113. The six light modules 111 are sequentially arranged on the upper surface of the cold plate 112 along the length direction of the cold plate 112. The cover plate 113 adopts a thin shell structure and is connected with the cold plate 112 in a downward opening direction, and six light modules 111 are integrally packaged by the cover plate 113 and the cold plate 112.

Each of the optical modules 111 includes a COS module 1111, an optical path array 1112, an electrode 1113, a pigtail 1114, and an optical fiber holder 1115 directly connected to the cold plate 112, and the COS module 1111, the optical path array 1112, the electrode 1113, the pigtail 1114, and the optical fiber holder 1115 in this embodiment are identical to those in the conventional semiconductor laser pumping source and have the same arrangement positional relationship.

The COS module 1111 includes a semiconductor laser single tube 11111 and a heat sink 11112, the semiconductor laser single tube 11111 is fixed on the heat sink 11112 by sintering, and the COS module 1111 is fixed on the upper surface of the cold plate 112 by sintering, welding or bonding, so that the COS module 1111 is directly connected to the upper surface of the cold plate 112. In addition, the optical path array 1112, the electrode 1113, the pigtail 1114 and the optical fiber holder 1115 are also directly fixed to the upper surface of the cold plate 112 by sintering, welding, bonding or bolting, respectively.

In this embodiment, the heat sink 11112 is made of one or more of copper, aluminum nitride, silicon carbide, tungsten-copper alloy, molybdenum-copper alloy, cubic boron nitride, graphite, graphene, carbon nanotube composite material and diamond-copper composite material, so that the heat sink 11112 can form a good matching relationship with the thermal expansion coefficient of the semiconductor laser single tube 11111, and the influence of stress on the polarization state and wavelength of laser output is reduced.

Further, the cold plate 112 of the present embodiment takes the form of a rectangular parallelepiped flat plate structure, and is provided with a coolant inlet 1121, a coolant outlet 1122, and a serpentine cooling passage 1123 located inside thereof. Wherein, cooling channel 1123's both ends respectively with coolant inlet 1121 and coolant outlet 1122 intercommunication to six optical module 111 positions in proper order pass through, thereby the guide is as cooling medium's coolant liquid to flow through COS module 1111 position in proper order, realizes the accurate quick cooling effect to the biggest COS module 1111 of calorific capacity, promotes cooling medium's utilization ratio, improves the cooling effect of cold plate to optical module.

In this embodiment, six optical modules are arranged on the cold plate in order in a mutually parallel manner, so that the cooling channel is designed into a serpentine structure, and the areas where the six optical modules are located can be sequentially and accurately flowed through, and the accurate cooling effect on the COS module can be realized. Of course, in other embodiments, if the six optical modules are arranged in other ways, for example, in two directions or three directions, the cooling channels inside the cooling plate may be designed as an integral type, that is, a hollow cooling plate is adopted, so that the cooling medium passes through the whole inside of the cooling plate, so as to ensure heat dissipation and cooling of all COS modules.

Compared with a conventional semiconductor laser pumping source, in the semiconductor fiber coupled laser of this embodiment, by adopting the DPoC technology and the MPoC technology, the arrangement of the tube shell is omitted, the COS module, the optical path array, the electrode, the pigtail and the fiber support which are originally fixed inside the tube shell are directly and fixedly connected to the upper surface of the cold plate, and the encapsulation formed by the cover plate and the cold plate is used for replacing the encapsulation of the tube shell to the COS module, the optical path array, the electrode, the pigtail and the fiber support, thereby directly encapsulating the COS module, the optical path array, the electrode, the pigtail and the fiber support on the cold plate. Therefore, the cost of a tube shell is saved, the weight and the volume of the whole semiconductor optical fiber coupling laser are reduced, the use flexibility of the semiconductor optical fiber coupling laser is improved, meanwhile, the COS module is directly connected with the cold plate, the heat transfer path between a semiconductor laser single tube and the cold plate in the COS module is shortened, the heat resistance is reduced, the junction temperature of the semiconductor laser single tube is effectively reduced, the reliability and the service life of the semiconductor laser single tube are improved, and the application of a higher power output scene is further met.

In addition, six optical modules are arranged in the semiconductor fiber coupled laser of the embodiment, so that six paths of laser light can be output, but in other embodiments, the number of the optical modules can be completely adjusted according to the design requirements and different use environments, and the number of the optical modules packaged by the cover plate and the cold plate can be adjusted according to the requirements, so that the output effect of the laser light with different paths can be achieved.

Example two

As shown in connection with fig. 6 to 9, the present embodiment discloses a semiconductor fiber coupled laser 12. The semiconductor fiber coupled laser 12 includes six optical modules 121, a cold plate 122 and a cover plate 113. The six light modules 121 are sequentially arranged on the upper surface of the cold plate 122 along the length direction of the cold plate 122. The cover plate 113 adopts a thin-shell structure and is connected with the cold plate 122 in a downward opening direction, and six optical modules 121 are integrally packaged by the cover plate 113 and the cold plate 122.

In comparison with the first embodiment, the optical module 121 of the present embodiment further includes a heat conductive member 1211. Among them, the heat conductive member 1211 is located between the COS module 1111 and the cold plate 122 as a member having high heat conductive properties for a fixed connection between the COS module 1111 and the cold plate 122.

Meanwhile, the upper surface of the cold plate 122 is provided with a mounting groove 1221 for the fixed connection between the heat conductive member 1211 and the cold plate 122, and the cooling channel 1222 formed inside the cold plate 122 passes through the lower side of the mounting groove 1221, so that the heat conductive member 1211 after the fixed connection with the cold plate 122 can pass through the mounting groove 1221 to be in direct contact with the cooling liquid flowing in the cooling channel 1222, and further the COS module 1111 is in contact with the cooling liquid through the heat conductive member 1211.

At this time, the COS module is fixed in the mounting groove by the heat conduction member by opening the mounting groove at the position where the COS module is mounted on the cold plate and providing the heat conduction member in the optical module, so that the COS module is brought into contact with the coolant through the high heat conduction module. Therefore, the heat transfer path between the COS module and the cooling liquid can be further shortened by the heat conduction component, the heat transfer resistance is reduced, strong convection heat exchange is formed between the COS module and the cooling liquid, and the high-efficiency dissipation of heat generated by the COS module is achieved.

In this embodiment, the heat conducting component 1211 adopts a T-shaped structure, and is made of one or more materials selected from copper, tungsten copper, molybdenum copper, aluminum-silicon carbide, graphite foam, silicon carbide or aluminum, and is fixedly connected with the heat sink 11112 in the COS module 1111 by sintering, welding or bonding, so as to form a high heat conducting module. After that, the heat conductive member 1211 is inserted into the installation groove 1221 of the cold plate 122, and is connected and sealed with the installation groove 1221 by crimping, sintering, soldering or bonding, so that the COS module 1111 is completed, and the heat conductive member 1211 is brought into direct contact with the cooling liquid inside the cold plate 122 by the connection between the heat conductive member 1211 and the cold plate 122.

In this embodiment, the flatness of the relevant surface of the heat conducting component, which is connected with the COS module and the mounting groove, is controlled, for example, to be about 20 micrometers, so that the performance of sintering, welding or bonding the heat conducting component can be improved, and the heat dissipation effect of the heat conducting component on the COS module is ensured.

In addition, when the heat conducting component of the embodiment is prepared by adopting materials with the thermal expansion coefficients close to that of the semiconductor laser single tube, such as molybdenum copper or tungsten copper, a heat sink in a COS module can be omitted, and the semiconductor laser single tube is directly fixed on the surface of the heat conducting component in a sintering, welding or bonding mode, so that the heat transfer path of the semiconductor laser single tube can be further shortened, the heat transfer resistance is reduced, and the heat dissipation effect of the semiconductor laser single tube is improved.

Example III

As shown in fig. 10 to 13, the present embodiment discloses a semiconductor fiber coupled laser 13. The semiconductor fiber coupled laser 13 includes six optical modules 131, a cold plate 132, and a cover plate 113. The six light modules 131 are sequentially arranged on the upper surface of the cold plate 132 along the length direction of the cold plate 132. The cover plate 113 adopts a thin-shell structure and is connected with the cold plate 132 in a downward opening direction, and six optical modules 131 are integrally packaged by the cover plate 113 and the cold plate 132.

In comparison with the second embodiment, the heat conductive member 1311 in the optical module 131 of the present embodiment is provided with two bolt holes 13111, while corresponding screw holes 1322 are provided at the mounting groove 1321 of the cold plate 132.

At this time, after the heat-conducting member 1311 is inserted into the mounting groove 1321, the heat-conducting member 1311 is fixedly connected to the cold plate 132 by connecting the bolt 133 to the screw hole 1322 through the bolt hole 13111, so that the heat-conducting member 1311 is fixedly connected to the cold plate 132 by crimping, sintering, brazing, or bonding instead of the heat-conducting member 1311. Therefore, the fixed connection between the heat conduction component and the cold plate is more convenient, the processing and the manufacturing are convenient, the repeated dismounting operation between the heat conduction component and the cold plate can be allowed, the fault tolerance of installation is improved, the maintainability is enhanced, and the later maintenance cost is reduced.

Further, a seal ring groove 1323 is provided at the mounting groove 1321 of the cold plate 132 of the present embodiment, for mounting the seal ring 134. At the moment, the connection between the heat conducting component and the cold plate can be sealed by means of the sealing ring, so that the processing requirement on the surface of the heat conducting component, which is sealed with the cold plate, is reduced, the processing difficulty and the mounting difficulty of the heat conducting component are reduced, and the sealing quality and the manufacturing efficiency of the semiconductor optical fiber coupling laser are improved.

Example IV

Referring to fig. 14 to 17, the present embodiment discloses a semiconductor fiber coupled laser 14. The semiconductor fiber coupled laser 14 includes six optical modules 141, a cold plate 142, and a cover plate 113. The six light modules 141 are sequentially arranged on the upper surface of the cold plate 142 along the length direction of the cold plate 142. The cover plate 113 adopts a thin-shell structure and is connected with the cold plate 142 in a downward opening direction, and six optical modules 141 are integrally packaged by the cover plate 113 and the cold plate 142.

In comparison with the second embodiment, in this embodiment, all the COS modules 1111 in each optical module 141 are all fixed on the upper surface of the same heat conducting member 1411, i.e. one optical module 141 includes one heat conducting member 1411, and the plurality of COS modules 1111 are sequentially arranged and fixed on the heat conducting member 1411 by sintering, welding or bonding. Meanwhile, a mounting groove 1421 of a corresponding size is provided on the cold plate 142 for the heat conductive member 1411 in each of the light modules 141.

At this time, by fixing all COS modules in the same optical module on the same heat conducting component, and sealing and connecting the heat conducting component with the cold plate in a pressure welding, sintering, brazing or bonding mode, the accuracy of the installation position between all COS modules in the same optical module can be improved, the quality of laser output by the optical module is ensured, the connection between all COS modules in the optical module and the cold plate can be completed at one time, and the installation efficiency of the optical module is improved.

Example five

Referring to fig. 18 to 21, the present embodiment discloses a semiconductor fiber coupled laser 15. The semiconductor fiber coupled laser 15 includes six optical modules 151, a cold plate 152 and a cover plate 113. The six light modules 151 are sequentially arranged on the upper surface of the cold plate 152 along the length direction of the cold plate 152. The cover plate 113 adopts a thin-shell structure and is connected with the cold plate 152 in a downward opening direction, and six optical modules 151 are integrally packaged by the cover plate 113 and the cold plate 152.

In comparison with the third embodiment, in this embodiment, all the COS modules 1111 in each of the optical modules 151 are all fixed on the upper surface of the same heat conducting member 1511, i.e. one optical module 151 includes one heat conducting member 1511, and the plurality of COS modules 1111 are sequentially arranged and fixed on the heat conducting member 1511 by sintering, welding or bonding. Meanwhile, a mounting groove 1521 and a sealing groove 1522 with corresponding dimensions are provided on the cold plate 152 for the heat conductive member 1511 in each of the optical modules 151.

At this time, all COS modules 1111 in the same optical module 151 are fixed to the same heat conductive member 1511, and then the heat conductive member 1511 is connected and sealed to the screw hole 1523 of the cold plate 152 by the bolts 153 and the seal ring 154. Therefore, the mounting position precision between all COS modules in the same optical module can be improved, the quality of laser output by the optical module is guaranteed, the connection between all COS modules in the optical module and the cold plate can be completed at one time, the mounting efficiency of the optical module is improved, the number of threaded holes formed in the cold plate can be reduced, the manufacturing efficiency of the cold plate is improved, and the manufacturing cost of the cold plate is reduced.

Example six

Referring to fig. 22-26, the present embodiment discloses a semiconductor fiber coupled laser 16. The semiconductor fiber coupled laser 16 includes six optical modules 161, a cold plate 162, and a cover plate 113. The six light modules 161 are sequentially arranged on the upper surface of the cold plate 162 along the length direction of the cold plate 162. The cover plate 113 adopts a thin shell structure and is connected with the cold plate 162 in a downward opening direction, and six light modules 161 are integrally packaged by the cover plate 113 and the cold plate 162.

Compared with the fourth embodiment, in this embodiment, one end of the heat conducting member 1611 is fixedly connected to the COS module 1111 by sintering, welding or bonding, and the other end is provided with the fins 16111, and the fins 16111 are located at the end of the heat conducting member 1611 that is in direct contact with the coolant.

At this time, the fins are arranged on the heat conducting component, and the heat conducting component is contacted with the cooling liquid through the fins, so that the contact area of the heat conducting component and the cooling liquid can be increased, the heat dissipation area of the heat conducting component is increased, the turbulence in the flowing process of the cooling liquid can be enhanced by utilizing the fins, the convection heat exchange capacity is enhanced, and the heat dissipation effect of the heat conducting component on the COS module is further improved.

According to different design requirements and use environments, the fins in the embodiment can be in different shapes such as straight fins, needle-shaped fins, columnar fins or polyhedrons, so as to achieve different contact heat exchange effects with the cooling liquid.

Example seven

Referring to fig. 27 to 30, the present embodiment discloses a semiconductor fiber coupled laser 17. The semiconductor fiber coupled laser 17 includes six optical modules 171, a cold plate 172, and a cover plate 113. The six light modules 171 are sequentially arranged on the upper surface of the cold plate 172 in the length direction of the cold plate 172. The cover plate 113 is of a thin-shell structure and is connected with the cold plate 172 in a downward opening direction, and six light modules 171 are integrally packaged by the cover plate 113 and the cold plate 172.

In comparison with the sixth embodiment, the heat conductive member 1711 in the optical module 171 of the present embodiment is provided with six bolt holes 17111, and the mounting groove 1721, and the screw hole 1722 and the seal groove 1723 located at the mounting groove 1721 are provided on the cold plate 172.

At this time, after the heat conducting member 1711 is inserted into the mounting groove 1721, the heat conducting member 1711 is fixedly connected to the cold plate 172 by connecting the heat conducting member 1711 to the screw hole 1722 through the bolt 173 passing through the screw hole 17111, and the connection between the heat conducting member 1711 and the cold plate 172 is sealed by the seal ring 174 provided in the seal groove 1723, so that the connection between the heat conducting member 1711 and the cold plate 172 is sealed by pressure bonding, sintering, brazing, or adhesion instead. Therefore, the processing requirements on the heat-conducting component and the cold plate can be reduced, the manufacturing cost is reduced, the repeated dismounting operation can be carried out on the heat-conducting component and the cold plate, the fault tolerance of installation is improved, the manufacturing quality of the semiconductor optical fiber coupling laser is ensured, the maintainability is enhanced, and the later maintenance cost is reduced.

Example eight

As shown in conjunction with fig. 31 to 34, the present embodiment discloses a semiconductor fiber-coupled laser 18. The semiconductor fiber coupled laser 18 includes six optical modules 181, a cold plate 182, and a cover plate 113. The six light modules 181 are sequentially arranged on the upper surface of the cold plate 182 in the length direction of the cold plate 182. The cover plate 113 adopts a thin-shell structure and is connected with the cold plate 182 in a downward opening direction, and six optical modules 181 are integrally packaged by the cover plate 113 and the cold plate 182.

In comparison with the fourth embodiment, the heat conduction member 1811 of the present embodiment is provided with the drainage channel 18111. The drainage channels 18111 penetrate through the whole heat conducting component 1811 along the arrangement direction of the COS module 1111, and the cooling channels 1821 in the cold plate 182 adopt a sectional structure, that is, after the heat conducting component 1811 is fixedly connected with the cold plate 182, the drainage channels 18111 are communicated with the cooling channels 1821, so as to form a complete channel for the cooling liquid to flow through the cold plate 182.

At this time, through the drainage channel that forms the intercommunication in the cooling channel through the one end that forms the contact with the coolant liquid in the heat conduction part, make the coolant liquid pass from the inside of heat conduction part to increase the area of contact of heat conduction part and coolant liquid, strengthen convection heat transfer ability, promote the radiating effect of this heat conduction part to COS module.

Example nine

As shown in fig. 35 to 39, the present embodiment discloses a semiconductor fiber coupled laser 19. The semiconductor fiber coupled laser 19 includes six optical modules 191, a cold plate 192, and a cover plate 113. The six optical modules 191 are sequentially arranged on the upper surface of the cold plate 192 along the length direction of the cold plate 192. The cover plate 113 adopts a thin-shell structure and is connected with the cold plate 192 in a downward opening direction, and six optical modules 191 are integrally packaged by the cover plate 113 and the cold plate 192.

In the optical module 191 of the present embodiment, the heat conductive member 1911 is provided with the bolt hole 19111, and the mounting groove 1921, the screw hole located at the mounting groove 1921, and the seal groove 1923 are provided on the cold plate 192, as compared to the eighth embodiment.

At this time, after the heat conductive member 1911 is inserted into the mounting groove 1921 and the drainage passage 19112 of the heat conductive member 1911 is aligned with the cooling passage 1922 of the cold plate 192, the heat conductive member 1911 is fixedly connected to the cold plate 192 by connecting bolts through the bolt holes 19111 and the threaded holes, and the connection seal between the heat conductive member 1911 and the cold plate is performed by means of the seal ring 193 provided in the seal groove 1923, instead of the connection seal between the heat conductive member 1911 and the cold plate 192 by crimping, sintering, brazing, or bonding. Therefore, the processing requirements on the heat-conducting component and the cold plate can be reduced, the manufacturing cost is reduced, the repeated dismounting operation can be carried out on the heat-conducting component and the cold plate, the fault tolerance of installation is improved, the manufacturing quality of the semiconductor optical fiber coupling laser is ensured, the maintainability is enhanced, and the later maintenance cost is reduced.

Further, in the present embodiment, the drainage channel in the heat conductive member is designed in a "gate" type structure so as to form a communicating relationship with the cooling channel in the thickness direction of the cold plate. Therefore, the sealing element is convenient to install between the cold plate and the heat conduction component, and the sealing effect of cooling liquid between the drainage channel and the cooling channel is guaranteed.

Examples ten

As shown in fig. 40 to 43, the present embodiment discloses a semiconductor fiber coupled laser 20. The semiconductor fiber coupled laser 20 includes six optical modules 201, a cold plate 202, and a cover plate 113. Six light modules 201 are sequentially arranged on the upper surface of the cold plate 202 along the length direction of the cold plate 202. The cover plate 113 adopts a thin shell structure and is connected with the cold plate 202 in a downward opening direction, and six optical modules 201 are integrally packaged by the cover plate 113 and the cold plate 202.

In comparison with the eighth embodiment, in the present embodiment, along the direction of the coolant passing through the drainage channel 20111, both end surfaces of the heat conducting member 2011 are in a slant structure, and both end surfaces of the drainage channel 20111 form slant assembly with the cooling channel 2021 in a downward slant direction, that is, the end surface of the cooling channel 2021 assembled with the drainage channel 20111 is a slant surface facing upward slant. Meanwhile, a bolt hole 20112 is provided in the heat conductive member 2011, a seal ring groove 20113 is provided at an end face of the heat conductive member 2011, and a screw hole is provided at a mounting groove of the cold plate 202.

At this time, by designing the end face of the cooling channel 2021 to be in an inclined surface structure form with an inclined surface facing upwards, the sealing ring 203 can be accurately mounted at a position where the drainage channel 20111 and the cooling channel 2021 form an inclined surface assembly, so that the cooling liquid seal between the drainage channel 20111 and the cooling channel 2021 is realized, and meanwhile, the connection seal between the heat conducting component 2011 and the cooling plate 202 is realized by connecting a bolt through the bolt hole 20112 and a threaded hole.

In this embodiment, compared with the ninth embodiment, the drainage channel and the cooling channel are designed to be in an inclined plane assembly form, and the sealing ring groove is formed at the inclined plane of the drainage channel, so that the drainage channel and the cooling channel are sealed by the sealing ring under the condition that the drainage channel is in a straight channel structure form. Thus, the processing of the drainage channel in the heat conduction component is convenient, the processing difficulty and cost are reduced, the drainage channel and the cooling channel are kept in the same horizontal state, the flow resistance loss of the cooling liquid is reduced to a greater extent, the thickness dimension of the cold plate can be reduced, and the weight of the whole cold plate is reduced.

Example eleven

As shown in fig. 44 to 48, the present embodiment discloses a semiconductor fiber coupled laser 21. The semiconductor fiber coupled laser 21 includes six optical modules 211, a cold plate 212 and a cover plate 113. The six light modules 211 are sequentially arranged on the upper surface of the cold plate 212 along the length direction of the cold plate 212. The cover plate 113 adopts a thin shell structure and is connected with the cold plate 212 in a downward opening direction, and six light modules 211 are integrally packaged by the cover plate 113 and the cold plate 212.

In comparison with the fourth embodiment, the heat conductive members 2111 in the optical module 211 of the present embodiment adopt a heat pipe structure of each Wen Banxing. The heat conductive member 2111 is formed by pressing a high heat conductive material having a low expansion coefficient such as copper, molybdenum copper, tungsten copper, or the like into a uniform temperature plate, and the surface is subjected to gold plating. The COS module 1111 is fixed to the evaporation end 21111 of the heat conductive member 2111 by sintering, welding or bonding, and the condensation end 21112 of the heat conductive member 2111 is brought into contact with the coolant.

At this time, the COS module is fixed at the evaporation end of the heat conductive member by designing the heat conductive member as a heat pipe structure of each Wen Banxing type and sealing the heat conductive member to the cold plate by crimping, sintering, soldering or bonding, etc., while the condensation end of the heat conductive member is in direct contact with the coolant.

Therefore, after the temperature of the evaporating end of the heat conducting component is increased by the COS module, the liquid working medium positioned in the vacuum cavity of the heat conducting component reaches the boiling point (generally 10-20 ℃) to generate a gasification phenomenon, the liquid working medium absorbs heat and rapidly expands in the vacuum cavity of the heat conducting component, the gasification working medium can rapidly fill the whole cavity, when steam contacts the condensing end of the heat conducting component, the vapor condenses and releases the heat absorbed during evaporation, and the heat is brought out of the whole semiconductor optical fiber coupling laser through cooling liquid in the water cooling channel. The condensed liquid working medium flows back to the evaporation end of the heat conduction component through the capillary phenomenon of the microstructure under the condition of not being influenced by gravity, and absorbs the heat generated by the COS module again. Compared with the heat dissipation capacity of the pure copper heat conduction component, the heat pipe structure in the form of the temperature equalization plate is adopted in the embodiment, so that the heat concentration problem can be solved, and the heat dissipation effect on the COS module is greatly improved.

In this embodiment, the heat conducting component adopts the uniform Wen Banxing type and makes the condensation end directly contact with the cooling liquid, so that not only can the concentrated heat be quickly homogenized by means of the uniform temperature plate, but also a larger temperature gradient can be formed between the evaporation end and the condensation end of the heat conducting component, so that the heat is taken away by utilizing strong convection heat transfer of the cooling liquid, and high-efficiency heat dissipation of the COS module is achieved.

However, in other embodiments, according to different designs and usage environments, the heat conducting component adopting the heat-conducting component Wen Banxing is not in direct contact with the cooling liquid, but the condensation end of the heat conducting component is in direct contact with the cold plate, so that the heat generated by the semiconductor laser single tube can be rapidly diffused by utilizing the diffusion effect of the heat-conducting component on the absorbed heat by the heat-conducting plate, the concentrated heat can be rapidly homogenized to reduce the single-point high temperature, the heat can be in contact with the cooling liquid in a larger range, and the high-efficiency heat dissipation effect on the COS module can be achieved.

Example twelve

As shown in conjunction with fig. 49 to 52, the present embodiment discloses a semiconductor fiber coupled laser 22. The semiconductor fiber coupled laser 22 includes six optical modules 221, a cold plate 222, and a cover plate 113. The six light modules 221 are sequentially arranged on the upper surface of the cold plate 222 along the length direction of the cold plate 222. The cover plate 113 adopts a thin-shell structure and is connected with the cold plate 222 in a downward opening direction, and six optical modules 221 are integrally packaged by the cover plate 113 and the cold plate 222.

In comparison with the eleventh embodiment, the heat conductive member 2211 in the optical module 221 of the present embodiment is provided with the bolt hole 22111, and the cooling plate 222 is provided with the mounting groove, and the screw hole 2222 and the seal groove 2223 located at the mounting groove.

At this time, after the heat-conducting member 2211 having been inserted into the mounting groove by using the respective Wen Banxing type heat-conducting members 2211 and the cooling liquid in the cooling plate 222 are brought into contact, the heat-conducting members 2211 are fixedly connected to the cooling plate 222 by means of bolts 223 passing through the bolt holes 22111 and being connected to the screw holes 2222, and the connection seal between the heat-conducting members 2211 and the cooling plate 222 is performed by means of the seal rings 224 provided in the seal grooves 2223, so that the connection seal between the heat-conducting members and the cooling plate by means of pressure welding, sintering, brazing or bonding is replaced in the eleventh embodiment. Therefore, the processing requirements on the heat-conducting component and the cold plate can be reduced, the manufacturing cost is reduced, the repeated dismounting operation can be carried out on the heat-conducting component and the cold plate, the fault tolerance of installation is improved, the manufacturing quality of the semiconductor optical fiber coupling laser is ensured, the maintainability is enhanced, and the later maintenance cost is reduced.

Example thirteen

As shown in fig. 53 to 55, the present embodiment discloses a semiconductor fiber coupled laser 23. The semiconductor fiber coupled laser 23 includes six optical modules 231, a cold plate 232, and a cover plate. The six light modules 231 are sequentially arranged on the upper surface of the cold plate 232 in the length direction of the cold plate 232. The cover plate adopts a thin shell structure and is connected with the cold plate 232 in a downward opening direction, and six optical modules 231 are integrally packaged by the cover plate and the cold plate 232.

In comparison with the eleventh embodiment, the heat conductive member 2311 in the optical module 231 of the present embodiment adopts a heat pipe structure in the form of a bent pipe. The heat conductive member 2311 is made of copper, stainless steel, or the like, and the surface is subjected to gold plating. The plurality of COS modules 1111 in the same optical module 231 are sequentially arranged and fixed at the evaporation end 23111 of the heat-conducting member 2311 along the horizontal direction by sintering, welding or bonding, etc., the evaporation end 23111 of the heat-conducting member 2311 along the horizontal direction is fixed in the mounting groove 2321 formed on the cold plate 232, and the obliquely bent condensation end 23112 of the heat-conducting member 2311 extends into the cooling channel 2322 inside the cold plate 232 and is in direct contact with the cooling liquid.

Compared with the heat conduction component adopting the uniform Wen Banxing type, the heat conduction component adopting the bent pipe form not only can ensure that a larger temperature gradient exists between the evaporation end and the condensation end of the heat conduction component, so that heat is quickly taken away by means of strong convection heat exchange of cooling liquid, but also the mounting groove in the embodiment does not need to be communicated with the cooling channel completely, and only a through hole penetrating through the condensation end is formed, so that the structural strength of the cold plate can be improved.

In this embodiment, the heat conducting component adopts a sintering type heat pipe, and the surface of the heat conducting component is finished to have higher surface finish, for example, the surface roughness is controlled below 0.8 micrometers, and the flatness is controlled below 20 micrometers, so that good sintering, welding or bonding quality is ensured.

Examples fourteen

As shown in connection with fig. 56-58, the present embodiment discloses a semiconductor fiber coupled laser 24. The semiconductor fiber coupled laser 24 includes six optical modules 241, a cold plate 242 and a cover plate. The six light modules 241 are sequentially arranged on the upper surface of the cold plate 242 in the length direction of the cold plate 242. The cover plate adopts a thin shell structure and is connected with the cold plate 242 in a downward opening direction, and six optical modules 241 are integrally packaged by the cover plate and the cold plate 242.

In comparison with the thirteenth embodiment, in the present embodiment, each of the COS modules 1111 of the light module 241 is fixed to one of the heat conductive members 2411 by sintering, welding or bonding, respectively, and each of the heat pipes is in the form of a bent pipe, i.e., only one of the COS modules 1111 is provided at the evaporation end 24111 of one of the heat conductive members 2411. At the same time, a plurality of corresponding mounting grooves 2421 are formed on the cold plate 242 for correspondingly inserting the condensation ends 24112 of the plurality of heat conducting members 2411 so as to be in contact with the cooling liquid in the cooling channels 2422.

At this time, by arranging a heat conducting component in the form of a heat pipe for each COS module, the size of the evaporation end in each heat conducting component can be reduced, so that the processing difficulty of the heat conducting component is reduced, the surface smoothness requirement of the heat conducting component when being connected with a cold plate is more easily met, and good sintering, welding or bonding quality is further ensured. Meanwhile, steam formed by absorbing heat in the vacuum cavity of the heat conducting component can be contacted with the condensing end faster to release heat, so that a better heat dissipation effect is obtained.

Further, as shown in fig. 59, in the present embodiment, based on the design that six light modules are all arranged on the upper surface of the cold plate 242, the groove array 2423 is provided on the lower surface of the cold plate 242, that is, the surface of the cold plate 242 where no light module is provided with the groove array 2423 with different shapes, such as a triangular groove array, a circular groove array, or a hexagonal groove array, without affecting the cooling channel. Therefore, the quality of the cold plate can be reduced, the weight of the whole semiconductor optical fiber coupling laser is reduced, and the flexibility of installation and use is improved.

Of course, for the semiconductor optical fiber coupling lasers disclosed in the first to thirteenth embodiments, the surface of the cold plate, on which the optical module and the cover plate are not arranged, may be provided with a groove array, so as to achieve an optimized design with light weight.

Example fifteen

As shown in conjunction with fig. 60 and 61, the present embodiment discloses a semiconductor fiber-coupled laser 25. The semiconductor fiber coupled laser 25 includes twelve optical modules 251, a cold plate 252, and two cover plates 253. The twelve light modules 251 are grouped into two groups of six, and the two groups of light modules 251 are respectively arranged on the upper surface and the lower surface of the cold plate 252, i.e. the two surfaces of the cold plate 252 are simultaneously provided with the light modules 251. The two cover plates 253 are connected with the upper surface and the lower surface of the cold plate 252 by adopting a thin shell structure, and the two cover plates 253 and the cold plate 252 respectively encapsulate the two groups of optical modules 251.

The optical modules are arranged on the upper surface and the lower surface of the cold plate at the same time, and the optical modules positioned on the two surfaces of the cold plate are respectively packaged by means of the connection of the two cover plates and the cold plate, so that the double-sided semiconductor optical fiber coupled laser is formed. Therefore, the number of paths for outputting laser can be greatly increased, higher power can be output, and higher integration level can be obtained.

Preferably, in this embodiment, the optical modules located on the upper surface of the cold plate and the optical modules located on the lower surface of the cold plate are arranged in a staggered manner, that is, the optical modules are sequentially and alternately arranged on the upper surface and the lower surface of the cold plate along the length direction of the cold plate. Therefore, the installation of the optical module is convenient, the installation interference of the optical module in the direction of the thickness of the cold plate is avoided, the optical module can exchange heat with the cooling liquid in different areas in the cold plate, the concentration of the heat exchange areas is avoided, and the heat dissipation efficiency of the COS module is improved.

Examples sixteen

As shown in connection with fig. 62, the present embodiment discloses a fiber laser 31. The fiber laser 31 includes a semiconductor fiber coupled laser 311, a fiber combiner 312, and an active fiber 313. One end of the optical fiber combiner 312 is connected to the pigtail of the semiconductor optical fiber coupling laser 311, and the other end is connected to the active optical fiber 313, so that the multiple laser beams generated by the semiconductor optical fiber coupling laser 311 are coupled to serve as a pumping source of the optical fiber laser.

In the present embodiment, the fiber laser uses the semiconductor fiber coupled laser 311 using DPoC technology and MPoC technology as a pumping source, and simultaneously the cold plate 3112 for carrying the optical module 3111 is directly extended to the active optical fiber 313, so that the cold plate 3112 carries and dissipates heat and cools the active optical fiber 313, and the cover plate 3113 in the semiconductor fiber coupled laser 311 encapsulates all the optical modules 3111 integrally.

Therefore, the optical fiber laser utilizes the same cold plate to achieve the effect of simultaneously radiating and cooling the optical module and the active optical fiber, and the cold plate for radiating and cooling the optical module and the cold plate for cooling the active optical fiber are subjected to integrated structural design, so that the integrated arrangement of the semiconductor optical fiber coupling laser, the optical fiber beam combiner and the active optical fiber is realized, the integration level of the optical fiber laser is improved, and the cost, the weight and the volume of the whole optical fiber laser are reduced.

The semiconductor optical fiber coupling laser in this embodiment may be any one of the semiconductor optical fiber coupling lasers in the first to fourteen embodiments, so that the optical fiber laser may be used in different environments.

Example seventeen

As shown in connection with fig. 63, this embodiment discloses a fiber laser 32. The fiber laser 32 includes a semiconductor fiber coupled laser 321, a fiber cold plate 322, a fiber combiner 312, and an active fiber 313. One end of the optical fiber combiner 312 is connected to a pigtail of the semiconductor optical fiber coupling laser 321, and the other end is connected to the active optical fiber 313, so that the multiple laser beams generated by the semiconductor optical fiber coupling laser 321 are coupled and output to the active optical fiber 313. The optical module 3211 in the semiconductor fiber coupled laser 321 is fixed on the cold plate 3212 and is encapsulated by the cover plate 3213 and the cold plate 3212, and the optical fiber cold plate 322 is fixedly connected with the cold plate 3212 in the semiconductor fiber coupled laser 321 by a connector 323 for coiling and cooling the active optical fiber 313.

Compared with the sixteenth embodiment, in this embodiment, an optical fiber cold plate is separately provided for performing independent heat dissipation and cooling treatment on the active optical fiber, and the optical fiber cold plate is fixedly connected with the semiconductor optical fiber coupled laser through a connecting piece. Therefore, under the condition that the active optical fiber can be subjected to heat dissipation and cooling treatment, the optical fiber cooling plates are independently arranged, so that the installation and the use can be more convenient, and the more flexible use effect can be obtained in different environments.

In addition, in this embodiment, the optical fiber cold plate uses the same circulating coolant as the cold plate in the semiconductor optical fiber coupling laser, that is, the coolant flows through the cold plate of the semiconductor optical fiber coupling laser and the optical fiber cold plate in sequence, so that the utilization rate of the coolant is improved. Of course, in other embodiments, the semiconductor fiber coupled laser and the active fiber may be separately subjected to heat-dissipating and cooling treatment by using independently circulating cooling fluids.

Example eighteen

As shown in connection with fig. 64, the present embodiment discloses a fiber laser 33. The semiconductor fiber coupled laser 331 in the fiber laser 33 adopts the double-sided semiconductor fiber coupled laser in the fifteen embodiment, and all laser light located on both surfaces of the cold plate 3311 is coupled out to the active optical fiber 313 by the fiber combiner.

Compared with the sixteenth embodiment, the optical fiber laser of the present embodiment is equivalent to the integration improvement of sharing the same cold plate for two optical fiber lasers, and the pump light power is doubled under the condition of only increasing the space volume occupied by one cover plate, so as to further improve the integration level of the optical fiber laser, thereby meeting the flexible use in a higher output power environment.

Of course, in other embodiments, according to different usage environments, the two optical fiber beam combiners may be used to respectively couple the laser beams output from the two surfaces of the cold plate and output the laser beams to the two active optical fibers, so that the optical fiber laser outputs two paths of laser beams.

Examples nineteenth

As shown in connection with fig. 65, this embodiment discloses a fiber laser 34. The fiber laser 34 includes a semiconductor fiber coupled laser 341, a fiber combiner 312, and an active fiber 313. The semiconductor fiber coupled laser 341 includes six optical modules 3411 sharing the same cold plate 3412, and the six optical modules 3411 perform a packaging operation with the cold plate 3412 through one cover plate 3413, respectively.

Compared with the seventeenth embodiment, in the optical fiber laser of the present embodiment, by adopting an independent packaging manner for the six optical modules, the packaging process can be directly performed on the single optical module after the adjustment of the single optical module is completed, so as to avoid the influence of mutual interference in the adjustment process of the plurality of optical modules, and improve the adjustment precision of the optical modules.

Of course, in other embodiments, the manner of this embodiment may also be adopted to independently package a plurality of optical modules in the semiconductor fiber coupled laser, so as to improve the tuning accuracy of the optical modules.

The foregoing is merely a specific embodiment of the invention and other modifications and variations can be made by those skilled in the art in light of the above teachings. It is to be understood by persons skilled in the art that the foregoing detailed description is provided for the purpose of illustrating the invention more fully, and that the scope of the invention is defined by the appended claims.

Claims

1. The semiconductor optical fiber coupling laser is characterized by comprising an optical module, a cold plate and a cover plate; the optical module is provided with a COS module, an optical path array, an electrode, a tail fiber and an optical fiber bracket which are all connected with the cold plate; the cover plate is connected with the cold plate, and the cover plate and the cold plate form a package of the optical module; the semiconductor optical fiber coupling laser comprises a plurality of optical modules which are sequentially arranged on the cold plate;

The surface of the cold plate is provided with a mounting groove, the heat conducting component extends to be in contact with cooling media in the cold plate through the mounting groove, and the surface of the COS module, the bottom surface matched with the mounting groove on the heat conducting component, the surface of the cold plate and the bottom surface of the mounting groove are approximately parallel.

2. The semiconductor fiber coupled laser of claim 1, wherein the thermally conductive member is located between the COS module and the cold plate as a member having high thermal conductivity.

3. The semiconductor fiber coupled laser of claim 1, wherein the cooling plate is provided with a cooling channel for guiding a cooling medium to flow inside, and the cooling channel is provided with an outlet and an inlet at the inner bottom surface of the mounting groove; the heat conduction component is provided with a drainage channel, the bottom surface of the heat conduction component is provided with a drainage inlet and a drainage outlet, the drainage channel extends from the drainage inlet and the drainage outlet to the inside in the heat conduction component perpendicular to the bottom surface of the heat conduction component to generate a longitudinal channel, the longitudinal channel is connected with a transverse channel parallel to the arrangement direction of the COS module right below the COS module, and the longitudinal channel and the transverse channel are communicated to form the drainage channel; the drainage inlet of the drainage channel is in sealing fit with the outlet of the cooling channel, the drainage outlet of the drainage channel is in sealing fit with the inlet of the cooling channel, two adjacent cooling channels are communicated, the drainage channel is a straight channel right below the COS module, and the drainage channels of the heat conduction components are connected in series through the cooling channels to form a complete cooling medium flow channel.

4. A semiconductor fiber coupled laser according to claim 3, wherein after the heat conducting member is inserted into the mounting groove and the drainage channel on the heat conducting member is aligned with the cooling channel on the cold plate, the heat conducting member is fixedly connected to the cold plate by means of a connection of bolts through bolt holes and with threaded holes, and the connection seal between the heat conducting member and the cold plate is made by means of a seal ring provided in a seal groove.

5. The semiconductor fiber coupled laser of claim 1, wherein a flatness of fit between a surface of the heat conductive member on which the COS module is mounted, a bottom surface of the heat conductive member that mates with the mounting groove, a surface of the cold plate, and a bottom surface of the mounting groove is 20 μm or less.

6. The semiconductor fiber coupled laser of claim 1, wherein the heat conducting member is first fixedly connected to the COS module to form a high heat conducting module, and then the heat conducting member is inserted into the mounting groove of the cold plate and is connected and sealed to the mounting groove.

7. The semiconductor fiber coupled laser according to claim 1, wherein all of the COS modules in each of the optical modules are all fixed to an upper surface of the same heat conductive member, and a plurality of the COS modules are sequentially arranged and fixed to the heat conductive member, and the cooling plate is provided with one of the mounting grooves for the heat conductive member of each of the optical modules.

8. The semiconductor fiber coupled laser of claim 1, wherein,

the heat conduction component is prepared by combining one or more materials of copper, tungsten copper, molybdenum copper, aluminum-silicon carbide, graphite, foam graphite, silicon carbide or aluminum; and/or

The semiconductor laser single tube in the COS module is directly connected with the heat conduction component; and/or

The heat conduction component adopts a heat pipe, the COS module is arranged at the evaporation end of the heat pipe, the condensation end of the heat pipe is connected with the cold plate, and the condensation end of the heat pipe extends to be in contact with a cooling medium in the cold plate; and/or

The heat conduction component is connected with the cold plate by bolts; and/or

The cover plate and the cold plate are used for integrally packaging the plurality of light modules; and/or

The semiconductor optical fiber coupling laser comprises a plurality of cover plates, wherein the cover plates are respectively connected with the cold plate to independently package the optical modules; the cover plate comprises an upper cover plate and a lower cover plate; the plurality of optical modules are respectively arranged on the upper surface of the cold plate and the lower surface of the cold plate, the upper cover plate and the lower cover plate are respectively connected with the cold plate to form packaging, and the optical modules on the upper surface of the cold plate and the optical modules on the lower surface of the cold plate are arranged in a staggered manner; and/or

And a groove array is arranged in the region of the cold plate where the optical module is not arranged.

9. A fibre laser comprising a fibre combiner, an active fibre and a semiconductor fibre coupled laser as claimed in any one of claims 1 to 8; the optical fiber combiner is connected with the tail fiber and the active optical fiber in the semiconductor optical fiber coupling laser.

10. The fiber laser of claim 9, wherein the fiber laser includes a fiber cold plate and the active fiber is located on the fiber cold plate, the fiber cold plate and the cold plate being of a unitary construction.