CN213462756U - Air-cooled electronic module microchannel heat exchanger - Google Patents

Abstract

The utility model relates to an air-cooled electronic module microchannel heat exchanger. The heat dissipation device solves the problem that the heat dissipation effect of the heat dissipation device of the electronic element in the prior art is poor. It includes gas collecting body and the mass flow body that corresponds the setting from top to bottom, the gas collecting body is located the mass flow body top, be equipped with the microchannel body of a plurality of vertical settings between gas collecting body and the mass flow body in proper order, the microchannel body is flat tubulose and inside has the heat transfer passageway group of intercommunication gas collecting body and mass flow body, each microchannel body is located the lateral surface with one side and forms the cooling surface jointly, the one end outside that the cooling surface lower extreme is close to the mass flow body is equipped with the heating panel, and between two adjacent microchannel tubes or microchannel tube body lateral surface are equipped with the radiating fin that contacts with the cooling surface. The utility model has the advantages that: the air inlet mode is flexible, and the radiating effect is good.

Description

Air-cooled electronic module microchannel heat exchanger

Technical Field

The utility model relates to an electronic components heat dissipation technical field, concretely relates to air-cooled electronic module microchannel heat exchanger.

Background

With the progress and development of integrated circuit technology, computer chips have been developed to have high integration, miniaturization and high frequency, and the heat generated per unit area of electronic components has been greatly increased. Advanced electronic chip heat dissipation technology becomes the core to solve the heat dissipation problem. Meanwhile, a single chip cannot meet the existing requirements, and at present, in the process of multi-chip assembly, if each chip cannot be effectively radiated, the service life and the processing efficiency of the chip are greatly influenced along with the rise of the surface temperature of the chip, so that the stability of a system is influenced. In the existing multi-chip assembly, the problem that different types of chips form bosses with different heights on the surface of an integrated circuit exists, and the processing complexity and the assembly requirement are increased; moreover, most of the existing chip heat dissipation devices adopt a single heat dissipation mode, so that the heat exchange area is small, the heat exchange is insufficient, and the heat dissipation effect is poor.

In order to solve the defects of the prior art, people have long searched for and put forward various solutions. For example, the chinese patent document discloses a parallel microchannel multi-chip heat sink [ CN201510109891.9], which includes a microchannel flat tube set with one end attached to a vertically arranged chip of an integrated circuit and a cavity with a fin set arranged at the other end of the microchannel flat tube, wherein: the micro-channel flat pipe group comprises a plurality of flat pipes with holes, and the axial direction of the holes is consistent with the length direction of the flat pipes and is opposite to the cavity.

Above-mentioned scheme has solved to a certain extent among the prior art when heat abstractor is to the different boss of multicore piece, processes complicacy and assembles trouble problem, but this scheme still has a great deal of not enoughly, for example: the heat dissipation mode is single, and the heat transfer area is little, and the heat transfer is not abundant enough, and the radiating effect is not good.

Disclosure of Invention

The utility model aims at the above-mentioned problem, a reasonable in design provides an air-cooled electronic module microchannel heat exchanger that the radiating effect is good.

In order to achieve the above purpose, the utility model adopts the following technical proposal: the air-cooled electronic module micro-channel heat exchanger comprises a gas collecting pipe body and a current collecting pipe body which are arranged in an up-down corresponding manner, wherein the gas collecting pipe body is positioned above the current collecting pipe body, a plurality of micro-channel pipe bodies which are vertically arranged are sequentially arranged between the gas collecting pipe body and the current collecting pipe body, the micro-channel pipe bodies are flat and tubular, a heat exchange channel group communicated with the gas collecting pipe body and the current collecting pipe body is arranged in the micro-channel pipe bodies, the outer side surfaces of the micro-channel pipe bodies positioned at the same side form a heat radiating surface together, and a heat radiating plate which is contacted with the heat radiating surface and is, and the area between the gas collecting tube body and the current collecting tube body, which is close to one side of the gas collecting tube body and is not provided with the heat dissipation plate, forms an air cooling heat dissipation area, and radiating fins which are contacted with the radiating surface are arranged between two adjacent microchannel tubes or on the outer side surface of each microchannel tube, and the radiating fins are positioned in the air cooling radiating area. Set up the heating panel between cooling surface and components and parts and link to each other to through setting up radiating fin at air-cooled radiating zone, utilize the heat transfer passageway group of setting in the microchannel tube body to transmit the heat to air-cooled radiating zone, effectively dispel the heat through radiating fin, increased heat transfer area, the radiating effect is good.

In the air-cooled electronic module microchannel heat exchanger, one side of the gas collecting pipe body, which corresponds to the gas collecting pipe body, is provided with a plurality of pipe slots in sequence, the end parts of the microchannel pipe body are inserted into the pipe slots respectively, and the width of the outer side surface of the microchannel pipe body along the width direction is larger than that of the outer side surface along the thickness direction.

In the air-cooled electronic module microchannel heat exchanger, the pipe slots are arranged along the axial extension of the gas collecting pipe body and the flow collecting pipe body, and the outer side surfaces of two adjacent microchannel pipe bodies along the thickness direction are corresponding, and the outer side surfaces of the two microchannel pipe bodies along the width direction are sequentially positioned on the same plane from top to bottom so as to form the radiating surface. The radiating surface is formed in the width direction of the microchannel tube body, so that the radiating area is effectively increased.

In the air-cooled electronic module microchannel heat exchanger, the radiating fins are respectively arranged on at least one outer side surface of the microchannel tube body along the width direction through the mounting structure.

In foretell air-cooled electronic module microchannel heat exchanger, mounting structure includes the backplate that sets up along microchannel body width direction's lateral surface axial extension, backplate both ends are respectively towards microchannel body one side buckling and continuous with the microchannel body, and backplate one side and microchannel body form the fin constant head tank that is used for placing radiating fin along between width direction's the lateral surface, radiating fin sets up in the fin constant head tank, and radiating fin one side supports and leans on in backplate one side, the opposite side supports and leans on the lateral surface of microchannel body along width direction. Can effectively fix the radiating fin who is located microchannel body width direction's the outside through mounting structure, prevent that radiating fin from lodging or warping.

In foretell air-cooled electronic module microchannel heat exchanger, the chase all sets up along gas collecting tube body and mass flow body circumference level, and two adjacent microchannel bodys are corresponding along width direction's lateral surface, and each microchannel body personally submits the arc and distributes in proper order from top to bottom along the outside of thickness direction and forms above-mentioned cooling surface.

In the air-cooled electronic module microchannel heat exchanger, one side of the heat dissipation plate, which is close to the microchannel tube body, is respectively provided with a plurality of heat dissipation positioning grooves, one side of the microchannel tube body is inserted into the heat dissipation positioning grooves, and the heat dissipation positioning grooves are respectively contacted with the outer side surface of the microchannel tube body in the thickness direction and the partial or whole outer side surface of the microchannel tube body in the width direction. Through inserting the thickness direction of microchannel body and local width direction insert the heat dissipation constant head tank, increased the area of contact of microchannel body and heating panel, effectively improved the radiating effect.

In the air-cooled electronic module microchannel heat exchanger, the radiating fins are respectively arranged between two adjacent microchannel tubes, and two sides of each radiating fin are respectively abutted against the outer side surfaces of the two adjacent microchannel tubes in the width direction. The radiating fins are arranged between the width directions of the micro-channel tube bodies, so that the mounting space is saved.

In foretell air-cooled electronic module microchannel heat exchanger, gas collecting pipe body and mass flow body all present the horizontal corresponding setting from top to bottom, and microchannel pipe body equidistant mutual parallel arrangement in proper order is between gas collecting pipe body and mass flow body, heat transfer passageway group has a plurality of heat dissipation microchannels that set gradually and axially run through the microchannel pipe body along microchannel pipe body width direction, gas collecting pipe body and mass flow body both ends are sealed through the end cover respectively, and form between the heat dissipation microchannels of gas collecting pipe body and mass flow body and each microchannel pipe body and seal the inner chamber. Set up like this, the heat dissipation is more even, and the radiating efficiency is high.

In the air-cooled electronic module microchannel heat exchanger, the heat dissipation plate is sheet-shaped and made of aluminum material, the heat dissipation plate is connected with the microchannel tube body into a whole in a welding mode or a bonding mode, and one side of the heat dissipation plate, which is far away from the microchannel tube body, is provided with a heat conduction adhesive layer which is in contact with the electronic module.

Compared with the prior art, the utility model has the advantages of: the structure is simple, the heat dissipation is uniform, the microchannel tube body is inserted into the tube slot along the thickness direction and the width direction respectively, when the microchannel tube body is inserted into the tube slot along the thickness direction, heat dissipation surfaces are formed on two sides in the width direction, the heat dissipation fins are arranged on two sides in the width direction of the microchannel tube body, and at the moment, cold air enters and exits the heat dissipation fins along the axial direction of the gas collection tube body or the fluid collection tube body; when the microchannel tube body is inserted into the tube slot along the width direction, the radiating fins are arranged between the width directions of the microchannel tube body, and at the moment, cold air enters and exits the radiating fins along the radial direction of the microchannel tube body, so that the radiating mode is flexible, and the radiating effect is good.

Drawings

FIG. 1 is a schematic view of the overall structure in the first embodiment;

FIG. 2 is a cross-sectional view of the microchannel tube and the heat sink being connected in the first embodiment;

FIG. 3 is a partial sectional view of the first embodiment;

FIG. 4 is a schematic view of a header body coupled to a microchannel body according to one embodiment;

FIG. 5 is a side view of the overall structure in the first embodiment;

FIG. 6 is an enlarged view of the structure at A in FIG. 5;

FIG. 7 is a schematic view of the overall structure in the second embodiment;

FIG. 8 is a side view of the whole structure in the second embodiment;

FIG. 9 is a cross-sectional view of the second embodiment of the present invention showing the microchannel tube inserted into the heat sink;

fig. 10 is a schematic view of the structure of the second embodiment in which the collector tubes are connected to the microchannel tubes;

fig. 11 is a schematic view of the heat dissipation plate structure in the second embodiment.

In the figure, a gas collecting tube body 1, a closed inner cavity 11, a gas collecting tube body 2, a micro-channel tube body 3, a heat radiating surface 31, a heat exchange channel group 4, a heat radiating micro-channel 41, a heat radiating plate 5, a heat radiating positioning groove 51, an air cooling heat radiating area 6, a heat radiating fin 7, a tube slot 8, a mounting structure 9, a guard plate 91 and a fin positioning groove 92.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

Example one

As shown in fig. 1-6, the air-cooled micro-channel heat exchanger for electronic modules comprises a gas collecting tube body 1 and a current collecting tube body 2 which are arranged up and down correspondingly, the gas collecting tube body 1 is positioned above the current collecting tube body 2, a plurality of vertically arranged micro-channel tube bodies 3 are sequentially arranged between the gas collecting tube body 1 and the current collecting tube body 2, the micro-channel tube bodies 3 are in flat tube shape and internally provided with heat exchange channel groups 4 communicating the gas collecting tube body 1 and the current collecting tube body 2, the outer side surfaces of the micro-channel tube bodies 3 positioned at the same side form a heat radiating surface 31, the outer side of one end of the lower end of the heat radiating surface 31 close to the current collecting tube body 2 is provided with a heat radiating plate 5 which is contacted with the heat radiating surface 31 and is used for connecting with the electronic modules, an air-cooled heat radiating area 6 is formed in an area which is close to one side of the gas collecting tube body 1, and the radiating fins 7 are all positioned in the air-cooled radiating area 6. Through setting up radiating fin 7 on the cooling surface 31 that micro-channel tube 3 width direction lateral surface formed, it has effectively increased heat transfer area, and the radiating effect is good.

Wherein, the gas collecting body 1 and the mutual one side that corresponds of collecting body 2 are equipped with a plurality of tube slots 8 respectively in proper order, and 3 tip of microchannel body peg graft respectively in tube slot 8, and the width size of the lateral surface of microchannel body 3 along width direction is greater than the width size of the lateral surface along thickness direction.

As can be seen, the tube slots 8 are all axially extended along the gas collecting tube body 1 and the gas collecting tube body 2, the outer side surfaces of two adjacent microchannel tubes 3 along the thickness direction correspond to each other, and the outer side surfaces of each microchannel tube 3 along the width direction are sequentially located on the same plane from top to bottom, thereby forming the heat dissipation surface 31. The radiating fins 7 are arranged on the radiating surface 31 formed on the outer side surface of the micro-channel tube body 3 in the width direction, so that the radiating fins 7 protrude out of the micro-channel tube body 3, and the air cooling effect is enhanced.

Further, the heat radiation fins 7 are respectively provided on at least one outer side surface of the microchannel tube body 3 in the width direction by the mounting structures 9.

Specifically, mounting structure 9 includes backplate 91 that sets up along the lateral surface axial extension of 3 width direction of microchannel body, backplate 91 both ends are respectively towards 3 lateral buckling of microchannel body and link to each other with microchannel body 3, and backplate 91 one side and microchannel body 3 form the fin constant head tank 92 that is used for placing radiating fin 7 between width direction's lateral surface, radiating fin 7 sets up in fin constant head tank 92, and radiating fin 7 one side supports and leans on in backplate 91 one side, the opposite side supports and leans on microchannel body 3 along width direction's lateral surface. The mounting structure 9 is mainly used to fix the heat dissipating fins 7 and prevent the heat dissipating fins 7 from falling down or deforming.

Preferably, the gas collecting tube body 1 and the fluid collecting tube body 2 are horizontally arranged in a corresponding manner from top to bottom, the microchannel tube bodies 3 are sequentially arranged between the gas collecting tube body 1 and the fluid collecting tube body 2 in parallel at equal intervals, the heat exchange channel group 4 is provided with a plurality of heat dissipation microchannels 41 which are sequentially arranged along the width direction of the microchannel tube bodies 3 and axially penetrate through the microchannel tube bodies 3, two ends of the gas collecting tube body 1 and two ends of the fluid collecting tube body 2 are respectively sealed through end covers, and a sealed inner cavity 11 is formed between the gas collecting tube body 1 and the fluid collecting tube body 2 and between the heat dissipation microchannels 41 of the microchannel tube bodies 3. The heat-dissipating micro-channel 41 is provided with a cooling liquid at one end thereof adjacent to the heat-dissipating plate 5.

In detail, the heat sink 5 is sheet-shaped and made of aluminum material, the heat sink 5 is connected with the microchannel tube 3 by welding or bonding, and a side of the heat sink 5 away from the microchannel tube 3 has a thermal conductive adhesive layer contacting with the electronic module.

The principle of the embodiment is as follows: the heating panel 5 conducts the heat of the electronic module to the heat dissipation micro-channel 41 with one end of the cooling liquid through the heat conducting adhesive layer, the cooling liquid is heated and evaporated to become gas, the heat is brought to one end of the heat dissipation micro-channel 41 with the heat dissipation fins 7, the heat dissipation fins 7 are cooled to take away the heat, so that the gas at one end of the heat dissipation micro-channel 41 becomes liquid, the gas flows into one end of the cooling liquid in the heat dissipation micro-channel 41 again under the influence of gravity, and the circulation is reciprocating.

Example two

As shown in fig. 7-11, the principle of this embodiment is the same as that of the first embodiment, except that: and a heat radiating fin 7 which is contacted with the heat radiating surface 31 is arranged between two adjacent microchannel tubes 3.

Specifically, the pipe chase 8 is all along gas collector body 1 and the horizontal setting of mass flow body 2 circumference, and two adjacent microchannel body 3 are corresponding along width direction's lateral surface, and each microchannel body 3 personally submits the arc and distributes in proper order from top to bottom along the outside of thickness direction and forms above-mentioned cooling surface 31. By inserting the microchannel tubes 3 into the tube slots 8 along the width,

wherein, the heating panel 5 has a plurality of heat dissipation constant head tank 51 respectively near microchannel tube 3 one side, and grafting in heat dissipation constant head tank 51 in microchannel tube 3 one side, and heat dissipation constant head tank 51 contacts with microchannel tube 3 along the lateral surface of thickness direction and microchannel tube 3 along the part or whole lateral surface of width direction respectively. The heat-conducting contact area is increased by inserting the microchannel tube 3 into the heat-dissipating positioning groove 51 in the thickness direction.

In detail, the heat dissipation fins 7 are respectively disposed between two adjacent microchannel tubes 3, and two sides of the heat dissipation fins 7 respectively abut against the outer side surfaces of the two adjacent microchannel tubes 3 in the width direction. The radiating fins 7 are arranged between the two adjacent micro-channel tube bodies 3 in the width direction, the occupied area is reduced, and cold air enters and exits the radiating fins along the radial direction of the micro-channel tube bodies to be cooled and radiated.

The principle of the embodiment is as follows: two ends of each micro-channel pipe body 3 are horizontally arranged in the pipe groove 8 along the width direction, so that the micro-channel pipe bodies 3 are correspondingly arranged in the width direction, and the radiating fins 7 are arranged between the two adjacent micro-channel pipe bodies 3 in the width direction, so that cold air enters and exits the radiating fins along the radial direction of the micro-channel pipe bodies to be cooled and radiated; the first matching embodiment is freely arranged according to actual conditions, and the air inlet mode is flexible.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Although the terms collector body 1, closed inner cavity 11, collector body 2, microchannel tube body 3, heat dissipation surface 31, heat exchange channel group 4, heat dissipation microchannel 41, heat dissipation plate 5, heat dissipation positioning groove 51, air-cooled heat dissipation area 6, heat dissipation fins 7, tube slots 8, mounting structure 9, guard plate 91, fin positioning groove 92, etc. are used more herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed in a manner that is inconsistent with the spirit of the invention.

Claims (10)

1. The utility model provides an air-cooled electronic module microchannel heat exchanger, corresponds gas collecting body (1) and mass flow body (2) that set up including from top to bottom, gas collecting body (1) be located mass flow body (2) top, gas collecting body (1) and mass flow body (2) between be equipped with microchannel body (3) of a plurality of vertical settings in proper order, microchannel body (3) be flat tubulose and inside have heat transfer passageway group (4) of intercommunication gas collecting body (1) and mass flow body (2), its characterized in that, each microchannel body (3) are located the lateral surface with one side and form cooling surface (31) jointly, the one end outside that cooling surface (31) lower extreme is close to mass flow body (2) be equipped with and contact with cooling surface (31) and be used for heating panel (5) that link to each other with electronic module, just gas collecting body (1) and mass flow body (2) between be close to gas collecting body (1) one side and the region that does not set up heating panel (5) Form air-cooled heat dissipation region (6), and between two adjacent microchannel body (3) or microchannel body (3) lateral surface be equipped with fin (7) that contact with cooling surface (31), just fin (7) all be located air-cooled heat dissipation region (6).

2. The air-cooled electronic module microchannel heat exchanger according to claim 1, wherein a plurality of pipe slots (8) are respectively sequentially arranged on the mutually corresponding sides of the gas collecting pipe body (1) and the gas collecting pipe body (2), the end parts of the microchannel pipe body (3) are respectively inserted into the pipe slots (8), and the width of the outer side surface of the microchannel pipe body (3) along the width direction is larger than the width of the outer side surface along the thickness direction.

3. The air-cooled electronic module microchannel heat exchanger according to claim 2, wherein the duct grooves (8) are arranged to extend axially along the gas collecting pipe body (1) and the current collecting pipe body (2), the outer side surfaces of two adjacent microchannel pipe bodies (3) in the thickness direction correspond to each other, and the outer side surfaces of each microchannel pipe body (3) in the width direction are sequentially located on the same plane from top to bottom so as to form the heat radiating surface (31).

4. The air-cooled electronic module microchannel heat exchanger according to claim 3, wherein the heat dissipating fins (7) are respectively provided on at least one outer side surface of the microchannel tube body (3) in the width direction by means of mounting structures (9).

5. The air-cooled electronic module microchannel heat exchanger according to claim 4, wherein the mounting structure (9) comprises a protective plate (91) extending axially along the outer side of the microchannel tube body (3) in the width direction, two ends of the protective plate (91) are respectively bent towards one side of the microchannel tube body (3) and connected with the microchannel tube body (3), a fin positioning groove (92) for placing the heat dissipation fin (7) is formed between one side of the protective plate (91) and the outer side of the microchannel tube body (3) in the width direction, the heat dissipation fin (7) is arranged in the fin positioning groove (92), one side of the heat dissipation fin (7) abuts against one side of the protective plate (91), and the other side abuts against the outer side of the microchannel tube body (3) in the width direction.

6. The air-cooled electronic module microchannel heat exchanger according to claim 2, wherein the duct slots (8) are all horizontally arranged along the circumferential direction of the gas collecting pipe body (1) and the current collecting pipe body (2), the outer side surfaces of two adjacent microchannel pipe bodies (3) along the width direction correspond to each other, and the outer side surfaces of the microchannel pipe bodies (3) along the thickness direction are arc-shaped and are sequentially distributed from top to bottom to form the heat radiating surface (31).

7. The air-cooled electronic module microchannel heat exchanger according to claim 6, wherein the heat dissipating plate (5) has a plurality of heat dissipating positioning grooves (51) on one side thereof adjacent to the microchannel tube (3), one side of the microchannel tube (3) is inserted into the heat dissipating positioning grooves (51), and the heat dissipating positioning grooves (51) are in contact with the outer side of the microchannel tube (3) in the thickness direction and part or the entire outer side of the microchannel tube (3) in the width direction.

8. The air-cooled electronic module microchannel heat exchanger according to claim 6, wherein the heat dissipating fins (7) are respectively disposed between two adjacent microchannel tube bodies (3), and both sides of the heat dissipating fins (7) respectively abut against outer side surfaces of the two adjacent microchannel tube bodies (3) in the width direction.

9. The air-cooled electronic module microchannel heat exchanger according to any one of claims 1 to 8, wherein the gas collecting tube body (1) and the current collecting tube body (2) are arranged in a horizontal up-down correspondence, the microchannel tubes (3) are sequentially arranged in parallel with each other at equal intervals between the gas collecting tube body (1) and the current collecting tube body (2), the heat exchange channel set (4) has a plurality of heat dissipation microchannels (41) which are sequentially arranged along the width direction of the microchannel tubes (3) and axially penetrate through the microchannel tubes (3), two ends of the gas collecting tube body (1) and the current collecting tube body (2) are respectively sealed by end caps, and a sealed inner cavity (11) is formed between the gas collecting tube body (1) and the current collecting tube body (2) and the heat dissipation microchannels (41) of each microchannel tube body (3).

10. The air-cooled electronic module microchannel heat exchanger according to claim 1, wherein the heat dissipating plate (5) is sheet-shaped and made of aluminum material, the heat dissipating plate (5) is connected with the microchannel tube (3) into a whole by welding or bonding, and a side of the heat dissipating plate (5) away from the microchannel tube (3) is provided with a heat conductive adhesive layer contacting with the electronic module.

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