CN116682924A - 一种发光装置及其制造方法 - Google Patents

一种发光装置及其制造方法 Download PDF

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Publication number
CN116682924A
CN116682924A CN202310554922.6A CN202310554922A CN116682924A CN 116682924 A CN116682924 A CN 116682924A CN 202310554922 A CN202310554922 A CN 202310554922A CN 116682924 A CN116682924 A CN 116682924A
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CN
China
Prior art keywords
substrate
light
light emitting
emitting element
intermediate layer
Prior art date
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Pending
Application number
CN202310554922.6A
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English (en)
Chinese (zh)
Inventor
谢明勋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epistar Corp
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Epistar Corp
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Filing date
Publication date
Application filed by Epistar Corp filed Critical Epistar Corp
Publication of CN116682924A publication Critical patent/CN116682924A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07202—Connecting or disconnecting of bump connectors using auxiliary members
    • H10W72/07204—Connecting or disconnecting of bump connectors using auxiliary members using temporary auxiliary members, e.g. sacrificial coatings
    • H10W72/07207—Temporary substrates, e.g. removable substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Planar Illumination Modules (AREA)
CN202310554922.6A 2018-05-14 2019-05-14 一种发光装置及其制造方法 Pending CN116682924A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862670900P 2018-05-14 2018-05-14
US62/670,900 2018-05-14
US201862697387P 2018-07-12 2018-07-12
US62/697,387 2018-07-12
CN201910398713.0A CN110491987A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201910398713.0A Division CN110491987A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法

Publications (1)

Publication Number Publication Date
CN116682924A true CN116682924A (zh) 2023-09-01

Family

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Family Applications (3)

Application Number Title Priority Date Filing Date
CN202310554922.6A Pending CN116682924A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法
CN201910398713.0A Pending CN110491987A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法
CN202310554915.6A Pending CN116682923A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法

Family Applications After (2)

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CN201910398713.0A Pending CN110491987A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法
CN202310554915.6A Pending CN116682923A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法

Country Status (6)

Country Link
US (4) US10923641B2 (cg-RX-API-DMAC7.html)
JP (2) JP7441612B2 (cg-RX-API-DMAC7.html)
KR (2) KR102498453B1 (cg-RX-API-DMAC7.html)
CN (3) CN116682924A (cg-RX-API-DMAC7.html)
DE (2) DE102019112546B4 (cg-RX-API-DMAC7.html)
TW (2) TWI878222B (cg-RX-API-DMAC7.html)

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Also Published As

Publication number Publication date
TWI878222B (zh) 2025-04-01
JP2023181464A (ja) 2023-12-21
TW201947737A (zh) 2019-12-16
US20230187597A1 (en) 2023-06-15
TWI879686B (zh) 2025-04-01
KR102688372B1 (ko) 2024-07-24
TW202508018A (zh) 2025-02-16
US20210159379A1 (en) 2021-05-27
US20240234660A1 (en) 2024-07-11
DE102019112546A1 (de) 2019-11-14
DE102019009415B4 (de) 2026-05-28
US10923641B2 (en) 2021-02-16
CN116682923A (zh) 2023-09-01
US20190348588A1 (en) 2019-11-14
KR20230023696A (ko) 2023-02-17
US11894507B2 (en) 2024-02-06
CN110491987A (zh) 2019-11-22
JP2019201206A (ja) 2019-11-21
US12317664B2 (en) 2025-05-27
KR20190130518A (ko) 2019-11-22
JP7441612B2 (ja) 2024-03-01
DE102019112546B4 (de) 2023-09-28
KR102498453B1 (ko) 2023-02-09
US11621384B2 (en) 2023-04-04

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