CN116634684A - Processing method for reducing pulling stress of semi-electroplated through hole orifice copper sheet - Google Patents
Processing method for reducing pulling stress of semi-electroplated through hole orifice copper sheet Download PDFInfo
- Publication number
- CN116634684A CN116634684A CN202310613019.2A CN202310613019A CN116634684A CN 116634684 A CN116634684 A CN 116634684A CN 202310613019 A CN202310613019 A CN 202310613019A CN 116634684 A CN116634684 A CN 116634684A
- Authority
- CN
- China
- Prior art keywords
- copper sheet
- outer layer
- electroplated
- hole
- orifice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 52
- 239000010949 copper Substances 0.000 title claims abstract description 52
- 238000003672 processing method Methods 0.000 title claims abstract description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 37
- 238000005530 etching Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 238000003801 milling Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 18
- 238000003466 welding Methods 0.000 claims description 7
- 230000002265 prevention Effects 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a processing method for reducing the pulling stress of a semi-electroplated through hole orifice copper sheet, which comprises the following steps: an outer layer dry film, exposing and developing a half-plated through hole orifice on the film and a bonding pad structure of an outer layer circuit on a substrate; forming an oblique angle of a preset angle at the joint of the half-electroplated through hole orifice and the outer layer circuit copper sheet; etching the outer layer, namely etching a tin ring concave position inwards at the joint of the half-electroplated through hole orifice and the outer layer circuit copper sheet; and (5) routing, namely forward and reverse routing is performed on the tin ring concave position. Through the design of the bevel angle and the tin ring concave position and through forward and reverse routing, copper sheet residues at the orifice position can be reduced, orifice burrs are effectively reduced, and the product quality is improved.
Description
Technical Field
The invention relates to the technical field of half PTH (plated through hole), in particular to a processing method for reducing the pulling stress of a semi-electroplated through hole orifice copper sheet.
Background
The semi-plating through hole is an electroplating through hole with an opening, which is arranged on the edge of a circuit board, the requirement on the circuit board with a semi-hole type on the edge of the board is larger and larger in the market, the hole opening of the semi-plating through hole is subjected to forward and reverse routing and other methods in the forming process, as shown in fig. 1, the position pointed by an arrow is the joint of the hole opening of the semi-plating through hole and an outer layer circuit, the outer layer circuit and a board are required to be removed by routing the joint, a plurality of problems such as hole burrs and burrs are easy to generate after routing in the design of the general semi-plating through hole, the semi-plating through hole has a serious copper skin raising burr at the edge of the formed board, and the semi-plating through hole easily falls onto the board surface to cause element short circuit in the processing of a client, so that the performance is affected.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide a processing method for reducing the pulling stress of a semi-electroplated through hole orifice copper sheet, so as to reduce orifice burrs and improve the product quality.
In view of the above, a processing method for reducing the pulling stress of a copper sheet at an orifice of a half-plated through hole is provided, which comprises the following steps:
an outer layer dry film, exposing and developing a half-plated through hole orifice on the film and a bonding pad structure of an outer layer circuit on a substrate; forming an oblique angle of a preset angle at the joint of the half-electroplated through hole orifice and the outer layer circuit copper sheet;
etching the outer layer, namely etching a tin ring concave position inwards at the joint of the half-electroplated through hole orifice and the outer layer circuit copper sheet;
and (5) routing, namely forward and reverse routing is performed on the tin ring concave position.
Further, the preset angle of the bevel angle is 40-50 degrees.
Further, the depth of the tin ring concave position is 4 mil-6 mil.
Further, before routing, the method further comprises:
and (3) preventing welding wire marks, namely performing oil covering and welding prevention on the outer peripheral side of the semi-electroplated through hole orifice and the outer circuit copper layer connected with the semi-electroplated through hole orifice.
Further, the forward and reverse routing is performed on the tin ring concave position, specifically:
and (3) controlling the milling tool to align the concave position of the tin ring for clockwise coarse milling and then counterclockwise coarse milling.
Further, the control milling cutter is aligned to the concave position of the tin ring to perform clockwise coarse milling, then perform anticlockwise coarse milling, and then,
and (3) controlling the milling cutter to conduct clockwise fine milling on the concave position of the tin ring, and conducting anticlockwise fine milling until the arc-shaped outer copper sheet is cut off.
The invention has the beneficial effects that: the embodiment of the invention provides a processing method for reducing the pulling stress of a semi-electroplated through hole orifice copper sheet, which comprises the following steps: an outer layer dry film, exposing and developing a half-plated through hole orifice on the film and a bonding pad structure of an outer layer circuit on a substrate; forming an oblique angle of a preset angle at the joint of the half-electroplated through hole orifice and the outer layer circuit copper sheet; etching the outer layer, namely etching a tin ring concave position inwards at the joint of the half-electroplated through hole orifice and the outer layer circuit copper sheet; and (5) routing, namely forward and reverse routing is performed on the tin ring concave position. Through the design of the bevel angle and the tin ring concave position and through forward and reverse routing, copper sheet residues at the orifice position can be reduced, orifice burrs are effectively reduced, and the product quality is improved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a prior art bond pad design pattern for a half-plated via hole opening and an outer layer line;
FIG. 2 is a flow chart of steps of a method for reducing the pulling stress of a copper sheet at an aperture of a semi-plated through hole according to an embodiment of the present invention;
FIG. 3 is a diagram of a newly designed half-plated via hole and outer layer circuit used in a method for reducing the pulling stress of a half-plated via hole copper sheet according to an embodiment of the present invention;
FIG. 4 is a diagram of a newly designed semi-plated through hole opening and an outer layer circuit after etching a bonding pad structure in a method for reducing the pulling stress of a semi-plated through hole opening copper sheet according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a half-plated through hole after etching and forward and reverse routing of a pad structure of a newly designed half-plated through hole orifice and an outer layer circuit in a processing method for reducing a pulling stress of a copper sheet of the half-plated through hole orifice according to an embodiment of the present invention.
In the figure: a. an orifice; b. an outer layer line; c. welding-preventing cover oil; 1. semi-electroplated through-hole apertures; 2. an outer layer circuit copper sheet; 3. bevel angle; 4. a tin ring concave position; 5. and (5) covering an oil welding-proof layer.
Detailed Description
The embodiment of the invention provides a processing method for reducing the pulling stress of a semi-electroplated through hole orifice copper sheet, which reduces orifice burrs and improves the product quality.
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions in the embodiments of the present invention are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
Examples:
half-plated through holes are rows of holes drilled along the edges of the circuit board, and when the holes are plated with copper, the edges are trimmed away, halving the holes along the boundaries, making the edges of the circuit board appear to have copper in the plated surface holes.
The module type circuit board is basically designed with half holes, mainly convenient for welding, because the module area is small and the functional requirement is high, the half holes are designed on the circuit board at the most edge, half holes are formed in the routing process, only half holes are left on the circuit board, the requirement on the circuit board of a half-plating through hole type with a metalized hole on the board edge in the market is increased, in order to ensure the quality of half holes on the board edge, each circuit board manufacturer adopts a method of firstly drilling two reverse surfaces and then routing the front surface, the half holes formed by the routing process can lead to a plurality of problems such as half hole edge burrs and burrs due to pulling copper sheets, the cost is high, the efficiency is low, the half hole edge burrs are high, and the problems such as dimension super tolerance of board finished products and board deformation are finally caused.
As shown in fig. 1, fig. 1 is a pad design pattern of a half-plated through hole aperture a and an outer layer circuit b in the prior art, a half-plated through hole is formed according to the pad, and solder resist printing forms solder resist cover oil c only at the position of the outer layer circuit b, so that the problem of forming a burr at the position of the aperture a after routing is easy to occur.
Therefore, as shown in fig. 2, the embodiment of the invention provides a processing method for reducing the pulling stress of a semi-electroplated through hole orifice copper sheet, which comprises the following steps:
step S10: exposing and developing the pad structures of the half-plated through hole orifice 1 and the outer circuit copper sheet 2 on the film on the substrate by the outer dry film; the joint of the half-electroplated through hole orifice 1 and the outer layer circuit copper sheet 2 forms an oblique angle 3 with a preset angle;
specifically, in the outer dry film process, the pad structure of the half-plated through hole orifice 1 and the outer circuit copper sheet 2 on the film is shown in fig. 3, the joint of the half-plated through hole orifice 1 and the outer circuit copper sheet 2 forms an oblique angle 3 with a preset angle, the preset angle of the oblique angle 3 is 40-50 degrees, and the optimal angle is 45 degrees, and compared with other oblique angle designs in the prior art, the design of the oblique angle of the 45 degrees can play the roles of reducing the pulling stress of the half-plated through hole orifice copper sheet and reducing orifice burrs in the routing plate of the later-stage forming plate.
Step S20: etching the outer layer, namely etching a tin ring concave position 4 inwards at the joint of the half-electroplated through hole orifice 1 and the outer layer circuit copper sheet 2;
specifically, as shown in fig. 4, in the outer layer etching process, a tin ring concave position 4 is etched inwards at the joint of the half-plated through hole orifice 1 and the outer layer circuit copper sheet 2; the depth of the tin ring concave position 4 is 4 mil-6 mil. Through the cooperation of the tin ring concave position 4 and the bevel angle 3, a notch capable of routing is formed at the position of the plate electroplating through hole orifice 1.
And S30, routing, namely forward and reverse routing is performed on the tin ring concave position.
Specifically, the half-plated through hole plate after molding as shown in fig. 5 is obtained by forward and reverse routing at the position of the tin ring concave position 4.
Working principle: through designing the copper sheet junction of outer circuit copper sheet 2 and half electroplating through-hole drill way 1 to be 45 degrees, the degree of depth of the sunken position of etched tin circle 4 is 4 ~ 6mil, reduces gong sword and copper sheet stress and pulls, and in addition, the sunken position of tin circle 4 reduces gong and inclines and cause incomplete copper wire form to remain, in addition, the positive and negative gong production parameter of drill way position execution, clears up remaining copper wire through gong sword deburring.
Further, before routing, the method further comprises:
and (3) preventing welding marks, and performing oil covering and welding prevention layers 5 on the outer periphery sides of the half-plating through hole orifice 1 and the outer circuit copper sheet 2 connected with the half-plating through hole orifice.
Specifically, through carrying out lid oil solder mask layer 5 in half electroplating through-hole drill way 1 and the outer circuit copper sheet 2 that connects with it, increased the hardness of substrate through this lid oil solder mask layer 5, prevent that gong sword from pulling the burr when gong board from remaining, perhaps the substrate blushing influences the apparent customer complains that causes.
Further, the forward and reverse routing is performed at the position of the tin ring concave position 4, specifically:
and (3) controlling the milling tool to align the tin ring concave position 4 for clockwise coarse milling and then counterclockwise coarse milling.
Specifically, the setting parameters are used for carrying out clockwise forward rough milling by using the milling cutter to align with the tin ring concave position 4 and then carrying out anticlockwise reverse rough milling.
Further, the control gong tool aligns the position 4 of the tin ring depression for clockwise coarse gong, then anticlockwise coarse gong, then the control gong tool aligns the position 4 of the tin ring depression for clockwise fine gong, and then anticlockwise fine gong is performed until the outer layer circuit copper sheet 2 and the corresponding substrate are cut off.
Specifically, the residual copper wires are cleaned by forward and reverse fine gong trimming of the gong.
In summary, the embodiment of the invention provides a processing method for reducing the pulling stress of a copper sheet at an orifice of a half-plated through hole, comprising the following steps: an outer layer dry film, exposing and developing a half-plated through hole orifice on the film and a bonding pad structure of an outer layer circuit on a substrate; forming an oblique angle of a preset angle at the joint of the half-electroplated through hole orifice and the outer layer circuit copper sheet; etching the outer layer, namely etching a tin ring concave position inwards at the joint of the half-electroplated through hole orifice and the outer layer circuit copper sheet; and (5) routing, namely forward and reverse routing is performed on the tin ring concave position. Through the design of the bevel angle and the tin ring concave position and through forward and reverse routing, copper sheet residues at the orifice position can be reduced, orifice burrs are effectively reduced, the inspection yield is improved to 100% from 30%, the customer complaint rate is 0, the process inspection efficiency is integrally improved by 50%, and the product quality is improved.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (6)
1. A processing method for reducing the pulling stress of a semi-electroplated through hole orifice copper sheet is characterized by comprising the following steps:
an outer layer dry film, exposing and developing a half-plated through hole orifice on the film and a bonding pad structure of an outer layer circuit on a substrate; forming an oblique angle of a preset angle at the joint of the half-electroplated through hole orifice and the outer layer circuit copper sheet;
etching the outer layer, namely etching a tin ring concave position inwards at the joint of the half-electroplated through hole orifice and the outer layer circuit copper sheet;
and (5) routing, namely forward and reverse routing is performed on the tin ring concave position.
2. The method of claim 1, wherein the predetermined angle of the bevel is 40 ° -50 °.
3. The method of claim 1, wherein the depth of the tin ring depression is 4mil to 6mil.
4. The method of claim 1, further comprising, prior to routing:
and (3) preventing welding wire marks, namely performing oil covering and welding prevention on the semi-electroplated through hole orifice and the outer periphery side of the outer circuit copper sheet connected with the semi-electroplated through hole orifice.
5. The method for reducing the pulling stress of the copper sheet at the hole opening of the half-plated through hole according to claim 1, wherein forward and reverse routing is performed at the concave position of the tin ring, specifically:
and (3) controlling the milling tool to align the concave position of the tin ring for clockwise coarse milling and then counterclockwise coarse milling.
6. The method of claim 5, wherein the controlling screw is used for clockwise thick screw-milling and counterclockwise thick screw-milling at the concave position of the tin ring, and then,
and (3) controlling the milling cutter to conduct clockwise fine milling on the concave position of the tin ring, and conducting anticlockwise fine milling until the arc-shaped outer copper sheet is cut off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310613019.2A CN116634684A (en) | 2023-05-26 | 2023-05-26 | Processing method for reducing pulling stress of semi-electroplated through hole orifice copper sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310613019.2A CN116634684A (en) | 2023-05-26 | 2023-05-26 | Processing method for reducing pulling stress of semi-electroplated through hole orifice copper sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116634684A true CN116634684A (en) | 2023-08-22 |
Family
ID=87612968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310613019.2A Pending CN116634684A (en) | 2023-05-26 | 2023-05-26 | Processing method for reducing pulling stress of semi-electroplated through hole orifice copper sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116634684A (en) |
-
2023
- 2023-05-26 CN CN202310613019.2A patent/CN116634684A/en active Pending
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