CN116631906A - Integrated wafer blue film laminating machine and control system thereof - Google Patents
Integrated wafer blue film laminating machine and control system thereof Download PDFInfo
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- CN116631906A CN116631906A CN202310504000.4A CN202310504000A CN116631906A CN 116631906 A CN116631906 A CN 116631906A CN 202310504000 A CN202310504000 A CN 202310504000A CN 116631906 A CN116631906 A CN 116631906A
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- 238000010030 laminating Methods 0.000 title claims abstract description 43
- 235000012431 wafers Nutrition 0.000 claims abstract description 149
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 81
- 230000007246 mechanism Effects 0.000 claims abstract description 49
- 238000007599 discharging Methods 0.000 claims abstract description 24
- 238000005520 cutting process Methods 0.000 claims abstract description 16
- 238000003475 lamination Methods 0.000 claims abstract description 6
- 238000005192 partition Methods 0.000 claims abstract description 4
- 238000001179 sorption measurement Methods 0.000 claims description 10
- 230000006835 compression Effects 0.000 claims description 8
- 238000007906 compression Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000000725 suspension Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 106
- 238000000034 method Methods 0.000 description 12
- 239000007888 film coating Substances 0.000 description 10
- 238000009501 film coating Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 210000002489 tectorial membrane Anatomy 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides an integrated wafer blue film laminating machine and a control system thereof, wherein the integrated wafer blue film laminating machine comprises a rack, wherein a CST (continuous processing unit) loading and unloading assembly for storing wafers subjected to film lamination, an iron ring loading assembly for adding wafers to be processed and a film lamination unreeling module for laminating the wafers are respectively arranged on the rack; the CST feeding and discharging assembly comprises a bin for storing wafers, wherein a supporting partition plate is arranged on the bin, and a linear module is arranged at a feed inlet of the bin; the iron ring feeding assembly comprises an iron ring feeding bin and a secondary positioning module, and an iron ring feeding manipulator is arranged above the iron ring feeding bin; the film pasting unreeling module comprises a film pasting channel, an unreeling mechanism and a reeling mechanism are sequentially mounted above the film pasting channel in a suspension mode, and a film cutting assembly is arranged between the unreeling mechanism and the reeling mechanism. According to the utility model, the wafer to be processed is only required to be placed in the iron ring feeding bin manually, the position of the wafer is not required to be debugged manually, and the processing efficiency of the wafer coating can be improved.
Description
Technical Field
The utility model relates to the field of wafer film sticking, in particular to an integrated wafer blue film laminating machine and a control system thereof.
Background
Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon crystal bar is ground, polished and sliced to form a silicon wafer, namely the wafer; before dicing a wafer, a thin film, i.e., a dicing film, is typically attached to the back surface of the wafer in order to protect the wafer during dicing.
Along with the wide application of automatic assembly production in the electronic industry, the defects of low manual efficiency, high defective rate and single finished work type appear in the wafer film coating process.
For example: the utility model patent (application number: 201921082722.0) discloses a multifunctional wafer film pasting and tearing integrated device in the following description: the utility model provides a multi-functional wafer pad pasting dyestripping integrated device, includes the pay-off platform and sets up the base in pay-off platform one side, be equipped with the locating piece that has the location chamber on the pay-off platform, be equipped with a pair of slide rail on the base, sliding connection has vertical ascending first removal frame on the slide rail, be equipped with first flexible cylinder between base and the first removal frame, the embedded first slider that is equipped with of horizontal spout, the outer end of first slider is equipped with vertical decurrent second and removes the frame, the top that is located the pay-off platform of second removal frame is equipped with first crossbearer, be equipped with a pair of second flexible cylinder of vertical decurrent on the first crossbearer, be equipped with on the holding down plate with locating piece complex tectorial membrane roller, be equipped with the second slider in the vertical spout, be equipped with the second crossbearer on the second crossbearer, a plurality of clamping jaws on the second crossbearer. The utility model has the function of film tearing and film sticking, and effectively improves the working efficiency; the above patent can be used to demonstrate the drawbacks of the prior art.
Therefore, we improve on this and put forward an integrated wafer blue film laminating machine and its control system.
Disclosure of Invention
The utility model aims at: the problem that the coating efficiency of wafers is low in a plurality of manual operation procedures existing at present is solved.
In order to achieve the above object, the present utility model provides the following integrated wafer blue film laminator to improve the above problems.
The utility model is specifically as follows:
the automatic film pasting machine comprises a frame, wherein a CST feeding and discharging assembly for storing wafers subjected to film pasting, an iron ring feeding assembly for adding wafers to be processed and a film pasting and unreeling module for pasting films on the wafers are respectively arranged on the frame;
the CST feeding and discharging assembly comprises a bin for storing wafers, wherein a plurality of supporting partition plates for supporting the two sides of the wafers are symmetrically arranged on the inner walls of the two sides of the bin, which are far away from each other, and a linear module for conveying the wafers into the bin is arranged at a feed inlet of the bin;
the iron ring feeding assembly comprises a plurality of iron ring feeding bins which are arranged side by side and used for storing wafers to be processed, a secondary positioning module which is used for adjusting the relative positions of the wafers and the iron rings again is arranged on the side surface of each iron ring feeding bin, an iron ring feeding manipulator which is used for taking and placing the wafers is suspended above each iron ring feeding bin, and each iron ring feeding bin is conveyed onto the film pasting and unreeling module by the corresponding iron ring feeding manipulator;
the film pasting unreeling module comprises a film pasting channel for transporting wafers, an unreeling mechanism for unreeling a blue film and a reeling mechanism for reeling the blue film are sequentially suspended above the film pasting channel, a film cutting component for cutting the blue film is arranged between the unreeling mechanism and the reeling mechanism, and a code spraying mechanism for spraying the blue film is further arranged on one side, close to the unreeling mechanism, of the reeling mechanism.
According to the technical scheme, the iron ring feeding bin comprises an iron ring bin for positioning and storing wafers, and an iron ring bin carrying assembly for dragging the iron ring bin to move horizontally is arranged at the bottom of the iron ring bin.
As the preferable technical scheme of the utility model, the film pasting channel comprises a conveying platform which is arranged on the frame, and the conveying platform horizontally slides to pass through the lower parts of the unreeling mechanism and the reeling mechanism respectively.
As the preferable technical scheme of the utility model, a jig carrier is arranged above the conveying platform, the jig carrier comprises a jig linear motor sliding plate used for being connected with the conveying platform and a jig platform positioned above the jig linear motor sliding plate, the jig platform is used for placing wafers, a jig platform mounting bottom plate is arranged below the jig platform, and the jig platform mounting bottom plate is connected with the jig linear motor sliding plate below through an air cylinder which is used for driving the jig platform to move up and down.
As the preferable technical scheme of the utility model, the automatic film laminating and feeding device comprises an iron ring blanking reversing assembly, wherein the iron ring blanking reversing assembly is arranged between the film laminating and unreeling module and the CST feeding and discharging assembly, and the iron ring blanking reversing assembly is used for reversing and putting the coated wafer into the CST feeding and discharging assembly.
As the preferable technical scheme of the utility model, a bubble removing component is arranged between the unreeling mechanism and the reeling mechanism; the bubble removing assembly is arranged on a supporting frame at the opposite side of the film cutting assembly, and a supporting plate and a compression ring are arranged at the upper and lower intervals at one side of the supporting frame, which faces to the film pasting channel; one end of the supporting plate extending to the upper part of the film pasting channel is provided with a telescopic part, a buffer part is arranged below the telescopic part, a mounting plate is arranged below the buffer part, and a rubber hemisphere used for extruding bubbles between the wafer and the blue film is arranged below the mounting plate.
As the preferred technical scheme of the utility model, the buffer part comprises a barrel body, the upper end of the barrel body is connected with the telescopic end of the lower end of the telescopic part, a piston is arranged in the barrel body in a sliding way, a sliding rod which extends out of the barrel body and is connected with the mounting disc is arranged below the piston, the sliding rod is in sliding connection with the barrel body, the bottom of the compression ring is provided with an annular adsorption groove, the upper end of the compression ring is communicated with the upper end of the interior of the barrel body through a communicating pipe, the inner space of the annular adsorption groove is communicated with the upper end space of the interior of the barrel body, and the top of the barrel body is provided with an electromagnetic pressure relief control valve.
As a preferable technical scheme of the utility model, the sliding rod is arranged outside the barrel body part and is provided with a spring for limiting the sliding rod to slide upwards.
As the preferable technical scheme of the utility model, the inside of the rubber hemisphere is hollow, the edge of the rubber hemisphere is connected with the lower part of the mounting plate, the lower part of the mounting plate is provided with a supporting ring in a suspending way through a connecting rod, the bottom of the mounting plate is provided with an electromagnetic block, the bottom of the inner wall of the rubber hemisphere is provided with an adhesion block used for being adsorbed and matched with the electromagnetic block, and the lower part of the adhesion block is connected with the inner wall of the rubber hemisphere.
The control system comprises an iron ring feeding module, a film pasting and unreeling module, a film coating processing device and a blanking module;
and the iron ring feeding module is used for conveying the wafer to be processed to a jig platform of the film pasting and unreeling module through an iron ring feeding manipulator according to feedback of the film pasting and unreeling module, and after the film pasting of the wafer is finished, the blanking manipulator of the blanking module is used for conveying the wafer with the film pasting finished to the inside of a bin of a CST feeding and discharging assembly, so that the film laminating processing of the wafer is finished.
Compared with the prior art, the utility model has the beneficial effects that:
in the scheme of the utility model:
1. in order to solve the problems of low manual efficiency, high defective rate and single finished work in the prior art, the utility model can conveniently and accurately convey the wafer to be processed to the jig carrier at the front end of the film pasting channel through the iron ring feeding assembly, and can conveniently store the processed wafer through the CST feeding assembly, thereby realizing the high-efficiency film coating processing of the wafer;
2. in order to solve the problem that in the prior art, in the wafer film coating process, bubbles are easy to occur when a blue film is directly attached to the upper part of a wafer, and the film coating quality is influenced, the utility model adopts the rubber hemispheroids, and as the bottommost part of the rubber hemispheroids is a circular cambered surface, the bottommost part of the rubber hemispheroids is firstly contacted with the center position of the wafer, and then the periphery of the rubber hemispheroids gradually contacts with the periphery of the wafer along with the continuous descending of the rubber hemispheroids, so that the bubbles between the wafer and the blue film are discharged from the periphery of the wafer, the function of removing the bubbles between the wafer and the blue film is realized, and the film coating quality is improved;
3. through setting up the rubber hemisphere into adjustable annular structure, be provided with the slide mechanism who is used for driving the rubber hemisphere and remove at the support frame, realized that rubber hemisphere and clamping ring are respectively used in the blue membrane both ends and are stretched the blue membrane, solved when the clamping ring diameter is less than the wafer diameter, inconvenient stretching the blue membrane around the wafer, avoid the problem of fold.
Drawings
FIG. 1 is a schematic diagram of the overall distribution provided by the present utility model;
FIG. 2 is a schematic diagram of the overall structure of the CST feeding and discharging assembly provided by the utility model;
FIG. 3 is a schematic diagram of the overall structure of the iron ring feeding assembly provided by the utility model;
fig. 4 is a schematic diagram of the overall structure of the film unreeling module provided by the utility model;
fig. 5 is a schematic perspective view of a jig carrier according to the present utility model;
FIG. 6 is a schematic view of the overall structure of the de-bubbling assembly according to the present utility model;
FIG. 7 is a schematic view of the internal structure of the cushioning member and rubber hemisphere provided by the present utility model;
FIG. 8 is a schematic view of a bottom view of the press ring according to the present utility model;
FIG. 9 is a schematic view of the de-bubbling assembly according to the present utility model in another operational state;
FIG. 10 is a flow chart of the control system of the integrated wafer blue film laminator provided by the utility model.
The figures indicate:
1. CST loading and unloading assembly; 101. a linear module; 102. a storage bin; 103. a drag chain;
2. an iron ring feeding assembly; 201. iron ring feeding manipulator; 202. a secondary positioning module; 203. iron ring feeding bin;
3. a blanking manipulator; 4. a blanking and stirring module;
5. a film pasting and unreeling module; 501. a film pasting channel; 502. a coil supporting mechanism; 503. an unreeling mechanism; 504. a winding mechanism; 505. a membrane cutting assembly; 506. the code spraying mechanism;
6. an iron ring blanking reversing assembly; 601. a reversing motor; 602. a reversing frame; 603. a lifting mechanism;
7. the product accurate positioning scanning assembly; 8. a product positioning assembly; 9. feeding and discharging bins on a Tray; 10. a frame; 12. a de-bubbling assembly; 1201. a support frame; 1202. a sliding mechanism; 1203. a telescoping member; 1204. a buffer member; 12041. a pressure relief control valve; 12042. a tub body; 12043 pistons; 12044. a spring; 12045. a slide bar; 1205. a mounting plate; 12051. a support ring; 12052. a blocking block; 12053. an electromagnetic block; 1206. rubber hemispheres; 1207. a communicating pipe; 1208. a compression ring; 12081. a boss; 12082. an annular adsorption groove; 1209. and a support plate.
Description of the embodiments
In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
As in the background art, the manual film coating processing procedure for the wafer is complicated, and the processing efficiency is low.
In order to solve the technical problem, the utility model provides an integrated wafer blue film laminating machine which is applied to integrated film laminating processing of a wafer.
Specifically, referring to fig. 1-5, the integrated wafer blue film laminating machine specifically includes: the machine frame 10, wherein the machine frame 10 is respectively provided with a CST feeding and discharging assembly 1 for storing wafers subjected to film pasting, an iron ring feeding assembly 2 for adding wafers to be processed and a film pasting and unreeling module 5 for pasting films on the wafers;
the CST feeding and discharging assembly 1 comprises a bin 102 for storing wafers, wherein a plurality of supporting partition plates for supporting the two sides of the wafers are symmetrically arranged on the inner walls of the two sides, far away from each other, of the bin 5, and a linear module 101 for conveying the wafers into the bin 102 is arranged at a feed inlet of the bin 102;
the iron ring feeding assembly 2 comprises a plurality of iron ring feeding bins 203 which are arranged side by side and used for storing wafers to be processed, a secondary positioning module 202 used for adjusting the relative positions of the wafers and the iron rings again is arranged on the side surface of each iron ring feeding bin 203, an iron ring feeding manipulator 201 used for taking and placing the wafers is suspended above each iron ring feeding bin 203, and each iron ring feeding manipulator 201 conveys each iron ring feeding bin 203 to the film pasting and unreeling module 5;
the film pasting unreeling module 5 comprises a film pasting channel 501 for transporting wafers, an unreeling mechanism 503 for unreeling a blue film and a reeling mechanism 504 for reeling the blue film are sequentially suspended above the film pasting channel 501, a film cutting component 505 for cutting the blue film is arranged between the unreeling mechanism 503 and the reeling mechanism 504, and a code spraying mechanism 506 for spraying codes on the blue film is further arranged on one side, close to the unreeling mechanism 503, of the reeling mechanism 504.
As a preferred technical scheme of the utility model, the iron ring feeding bin 203 comprises an iron ring bin 2031 for positioning and storing wafers, and an iron ring bin carrying assembly 2032 for dragging the iron ring bin 2031 to move horizontally is arranged at the bottom of the iron ring bin 2031.
As a preferred embodiment of the present utility model, the film laminating passage 501 includes a conveying platform mounted on the frame 1, and the conveying platform horizontally slides under the unreeling mechanism 503 and the reeling mechanism 504, respectively.
As a preferred technical scheme of the utility model, a jig carrying platform 507 is arranged above a conveying platform, the jig carrying platform 507 comprises a jig linear motor sliding plate 5071 used for being connected with the conveying platform and a jig platform 5072 positioned above the jig linear motor sliding plate 5071, the jig platform 5072 is used for placing a wafer, a jig platform mounting bottom plate 5073 is arranged below the jig platform 5072, the jig platform mounting bottom plate 5073 is connected with the jig linear motor sliding plate 5071 below through an air cylinder 5074, and the air cylinder 5074 is used for driving the jig platform 5072 to move up and down; a UVW platform is arranged below the jig platform 5072, and the relative position of the product and the iron ring can be adjusted during product feeding; the bottom of the jig platform 5072 is provided with a rotating platform which can be used for adjusting the relative angle of the film sticking jig on the film sticking unit.
As a preferable technical scheme of the utility model, the film laminating and unreeling device comprises an iron ring blanking reversing assembly 6, wherein the iron ring blanking reversing assembly 6 is arranged between a film laminating and unreeling module 5 and a CST feeding and unreeling assembly 1, and the iron ring blanking reversing assembly 6 is used for reversing a wafer after film lamination and putting the wafer into the CST feeding and unreeling assembly 1.
In the processing and feeding process, the Tray is adopted for feeding, so that the wafer can be placed in the iron ring feeding bin, the workload of operators is reduced, and the wafer can be coated and processed more quickly and efficiently.
In addition, in the actual use process, because the product carrier plate in the jig platform 5072 and the iron ring carrier plate in the iron ring feeding bin are detachably connected, when products with different specifications are required to be processed, only the corresponding iron ring carrier plate and the corresponding product carrier plate need to be replaced.
When the wafer subjected to film coating processing is conveyed into the bin 102 of the CST feeding and discharging assembly 1 from the tail part of the film coating channel 501, the automatic feeding and discharging device further comprises a discharging manipulator 3, a discharging stirring module 4, an iron ring discharging reversing assembly 6 and a product accurate positioning scanning assembly 7, wherein the position distribution of each assembly is shown in figure 1;
the blanking manipulator 3 is used for taking out a wafer from the tail of the film pasting channel 501, the blanking stirring module 4 is used for stirring the processed wafer into the bin 102 of the CST feeding and discharging assembly 1, the iron ring blanking reversing assembly 6 is used for reversing the wafer, one surface of the wafer with a blue film faces downwards, and the product accurate positioning scanning assembly 7 is used for determining the position of each wafer in the jig platform 5072.
As shown in FIG. 10, the control system of the integrated wafer blue film laminating machine comprises an iron ring feeding module, a film unreeling module, a film laminating processing device and a blanking module;
the iron ring feeding module conveys the wafer to be processed to the jig platform 5072 of the film pasting and unreeling module through the iron ring feeding manipulator 201 according to feedback of the film pasting and unreeling module, and after the film pasting of the wafer is completed, the blanking manipulator of the blanking module conveys the wafer with the film pasting completed to the inside of the bin 102 of the CST feeding and discharging assembly, so that the film laminating processing of the wafer is completed.
In the integrated wafer blue film laminating machine provided by the utility model, in the use process, a wafer needing film laminating processing is manually placed into an iron ring feeding bin 203 of a blending and feeding assembly 2, then the wafer to be film laminating processed is driven to move onto a jig carrier 507 at the front end of a film laminating channel 501 under the action of an iron ring feeding manipulator 201, and then the wafer is driven by a jig linear motor sliding plate 5071 to pass under an unreeling mechanism 503 and a reeling mechanism 504; when the wafer passes under the unreeling mechanism 503 and the reeling mechanism 504, the attaching surface of the blue film contacts and attaches to the upper end surface of the wafer, and then the film cutting assembly 505 cuts the blue film covered on the wafer from the whole blue film according to the specific shape of the wafer, so as to complete film covering processing of the wafer; in the whole laminating processing process, only the wafer to be processed is placed inside the iron ring feeding bin 203 manually, the position of the wafer is not required to be debugged manually, the processing efficiency of the wafer laminating can be improved, and the reject ratio of products is reduced.
In order to make the person skilled in the art better understand the solution of the present utility model, the technical solution of the embodiment of the present utility model will be clearly and completely described below with reference to the accompanying drawings.
It should be noted that, under the condition of no conflict, the embodiments of the present utility model and the features and technical solutions in the embodiments may be combined with each other.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
Examples
Referring to fig. 6-9, an integrated wafer blue film laminating machine, a de-bubbling assembly 12 is further disposed between an unreeling mechanism 503 and a reeling mechanism 504; the bubble removing assembly 12 is arranged on a supporting frame 1201 on the opposite side of the film cutting assembly 505, and a supporting plate 1209 and a pressing ring 1208 are arranged on one side of the supporting frame 1201 facing the film pasting channel 501 at intervals up and down; one end of the support plate 1209 extending above the film pasting channel 501 is provided with a telescopic piece 1203, a buffer piece 1204 is arranged below the telescopic piece 1203, a mounting plate 1205 is arranged below the buffer piece 1204, and a rubber hemisphere 1206 for extruding bubbles between a wafer and a blue film is arranged below the mounting plate 1205.
As a preferred technical scheme of the utility model, the buffer member 1204 comprises a barrel 12042, the upper end of the barrel 12042 is connected with the telescopic end of the lower end of the telescopic member 1203, a piston 12043 is slidably arranged in the barrel 12042, a sliding rod 12045 extending out of the barrel 12042 and connected with a mounting plate 1205 is arranged below the piston 12043, the sliding rod 12045 is slidably connected with the barrel 12042, an annular adsorption groove 12082 is arranged at the bottom of the compression ring 1208, the upper end of the compression ring 1208 is communicated with the upper end in the barrel 12042 through a communication pipe 1207, the inner space of the annular adsorption groove 12082 is communicated with the upper end space in the barrel 12042, and an electromagnetic pressure relief control valve 12041 is arranged at the top of the barrel 12042.
As a preferred embodiment of the present utility model, the sliding rod 12045 is provided with a spring 12044 for restricting the sliding rod 12045 from sliding upward at the outer side of the tub 12042.
In this embodiment, in the actual wafer film coating process, when the wafer is driven by the linear motor slide 5071 to move directly below the bubble removal assembly 12, the jig carrier 507 stops moving, and then drives the expansion piece 1203 to extend downward, the lower end of the expansion piece 1203 drives the lowest rubber hemisphere 1206 to extrude the blue film covered on the wafer downward, so that the bubbles remained in the gap between the blue film and the wafer can be extruded and discharged, and the blue film can be attached to the wafer; since the lowest part of the rubber hemisphere 1206 is a circular arc surface, the lowest part of the rubber hemisphere 1206 is firstly contacted with the center position of the wafer, and then the periphery of the rubber hemisphere 1206 is gradually contacted with the periphery of the wafer along with the continuous descending of the rubber hemisphere 1206, so that bubbles between the wafer and the blue film are discharged from the periphery of the wafer;
in addition, in the process that the expansion piece 1203 stretches out downwards, the gas inside the buffer piece 1204 can be extruded, so that the gas is discharged from the lower side of the pressing ring 1208, then in the retracting process of the expansion piece 1203, the spring 12044 drives the sliding rod 12045 to return to the initial position, negative pressure inside the barrel 12042 is caused, the inside of the barrel 12042 is communicated with the adsorption groove 12082 inside the pressing ring 1208 through the communication pipe 1207, the lower side of the pressing ring 1208 is adsorbed above the blue film around the wafer, the effect of stabilizing the blue film around the wafer can be achieved, when the film cutting assembly 505 cuts the blue film around the wafer, the phenomenon that the blue film around the wafer is wrinkled under the effect of the film cutting assembly 505 is avoided, and the subsequent wafer film covering processing is prevented from being influenced by the wrinkling of the blue film.
In another embodiment, please refer to fig. 7, an integrated wafer blue film laminating machine, wherein the inside of a rubber hemisphere 1206 is hollow, the edge of the rubber hemisphere 1206 is connected with the lower portion of a mounting plate 1205, a supporting ring 12051 is mounted under the mounting plate 1205 through a connecting rod suspension, an electromagnetic block 12053 is arranged at the bottom of the mounting plate 1205, an adhesion block 12052 for being in adsorption fit with the electromagnetic block 12053 is arranged at the bottom of the inner wall of the rubber hemisphere 1206, and the lower portion of the adhesion block 12052 is connected with the inner wall of the rubber hemisphere 1206.
In this embodiment, in the use process, when the rubber hemisphere 1206 extrudes the wafer, the adhesion block 12052 inside the rubber hemisphere 1206 is adsorbed on the electromagnetic block 12053, so that a ring structure is formed below the rubber hemisphere 1206, then the rubber hemisphere 1206 is driven to move forward along the production line by the sliding mechanism 1202 (optionally, a linear motor) on the side surface of the support frame 1201, so that the rubber hemisphere 1206 moves to the side surface of the pressing ring 1208, and then the rubber hemisphere 1206 is driven to move downward and is pressed above the blue film, at this time, the rubber hemisphere 1206 and the pressing ring 1208 are respectively acted on two ends of the blue film, so that the blue film covered on the wafer is more tightly stretched, and when the film cutting assembly 505 is used for cutting, the blue film is prevented from being wrinkled (the processing mode is applicable to the situation that the size of the wafer is larger than the size of the pressing ring).
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
It is apparent that the above-described embodiments are only some embodiments of the present utility model, but not all embodiments, and the preferred embodiments of the present utility model are shown in the drawings, which do not limit the scope of the patent claims. This utility model may be embodied in many different forms, but rather, embodiments are provided in order to provide a thorough and complete understanding of the present disclosure. Although the utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing description, or equivalents may be substituted for elements thereof. All equivalent structures made by the content of the specification and the drawings of the utility model are directly or indirectly applied to other related technical fields, and are also within the scope of the utility model.
Claims (10)
1. An integrated wafer blue film laminating machine comprises a frame (10), and is characterized in that the frame (10) is respectively provided with a CST feeding and discharging assembly (1) for storing wafers subjected to film lamination, an iron ring feeding assembly (2) for adding wafers to be processed and a film lamination unreeling module (5) for laminating the wafers;
the CST feeding and discharging assembly (1) comprises a bin (102) for storing wafers, wherein a plurality of supporting partition plates for supporting the two sides of the wafers are symmetrically arranged on the inner walls of the two sides of the bin (5) which are far away from each other, and a linear module (101) for conveying the wafers to the inside of the bin (102) is arranged at a feeding port of the bin (102);
the iron ring feeding assembly (2) comprises a plurality of iron ring feeding bins (203) which are arranged side by side and used for storing wafers to be processed, a secondary positioning module (202) used for adjusting the relative positions of the wafers and the iron rings again is arranged on the side face of each iron ring feeding bin (203), an iron ring feeding manipulator (201) used for taking and placing the wafers is suspended above each iron ring feeding bin (203), and each iron ring feeding manipulator (201) conveys each iron ring feeding bin (203) to the film pasting and unreeling module (5);
the film pasting unreeling module (5) comprises a film pasting channel (501) for transporting wafers, an unreeling mechanism (503) for unreeling a blue film and a reeling mechanism (504) for reeling the blue film are sequentially suspended above the film pasting channel (501), a film cutting component (505) for cutting the blue film is arranged between the unreeling mechanism (503) and the reeling mechanism (504), and a code spraying mechanism (506) for spraying codes on the blue film is further arranged on one side, close to the unreeling mechanism (503), of the reeling mechanism (504).
2. The integrated wafer blue film laminating machine according to claim 1, wherein the iron ring feeding bin (203) comprises an iron ring bin (2031) for positioning and storing wafers, and an iron ring bin carrying assembly (2032) for dragging the iron ring bin (2031) to move horizontally is arranged at the bottom of the iron ring bin (2031).
3. An integrated wafer blue film laminating machine according to claim 2, characterized in that the film laminating channel (501) comprises a conveying platform arranged on the frame (1), and the conveying platform horizontally slides under the unreeling mechanism (503) and the reeling mechanism (504) respectively.
4. The integrated wafer blue film laminating machine according to claim 3, wherein a jig carrying table (507) is arranged above the conveying platform, the jig carrying table (507) comprises a jig linear motor sliding plate (5071) used for being connected with the conveying platform and a jig platform (5072) located above the jig linear motor sliding plate (5071), the jig platform (5072) is used for placing a wafer, a jig table mounting bottom plate (5073) is arranged below the jig platform (5072), the jig table mounting bottom plate (5073) is connected with the jig linear motor sliding plate (5071) below through an air cylinder (5074), and the air cylinder (5074) is used for driving the jig platform (5072) to move up and down.
5. The integrated wafer blue film laminating machine according to claim 1, further comprising an iron ring blanking reversing assembly (6), wherein the iron ring blanking reversing assembly (6) is arranged between the film laminating unreeling module (5) and the CST feeding and discharging assembly (1), and the iron ring blanking reversing assembly (6) is used for reversing a wafer after lamination and placing the wafer into the CST feeding and discharging assembly (1).
6. The integrated wafer blue film laminating machine according to claim 1, wherein a de-bubbling assembly (12) is further arranged between the unreeling mechanism (503) and the reeling mechanism (504); the bubble removing assembly (12) is arranged on a supporting frame (1201) at the opposite side of the film cutting assembly (505), and a supporting plate (1209) and a pressing ring (1208) are arranged on one side of the supporting frame (1201) facing the film pasting channel (501) at an upper-lower interval; one end of the supporting plate (1209) extending to the upper side of the film pasting channel (501) is provided with a telescopic part (1203), a buffer part (1204) is arranged below the telescopic part (1203), a mounting plate (1205) is arranged below the buffer part (1204), and a rubber hemisphere (1206) used for extruding bubbles between a wafer and a blue film is arranged below the mounting plate (1205).
7. The integrated wafer blue film laminating machine according to claim 6, wherein the buffer member (1204) comprises a barrel body (12042), the upper end of the barrel body (12042) is connected with the telescopic end of the lower end of the telescopic member (1203), a piston (12043) is arranged in the barrel body (12042) in a sliding manner, a sliding rod (12045) extending out of the barrel body (12042) and connected with the mounting plate (1205) is arranged below the piston (12043), the sliding rod (12045) is in sliding connection with the barrel body (12042), an annular adsorption groove (12082) is arranged at the bottom of the compression ring (1208), the upper end of the compression ring is communicated with the upper end of the interior of the barrel body (12042) through a communication pipe (1207), the inner space of the annular adsorption groove (12082) is communicated with the upper end space of the interior of the barrel body (12042), and an electromagnetic pressure release control valve (12041) is arranged at the top of the barrel body (12042).
8. The integrated wafer blue film laminating machine according to claim 7, wherein the sliding rod (12045) is provided with a spring (12044) for limiting the sliding rod (12045) to slide upwards outside the barrel (12042).
9. The integrated wafer blue film laminating machine of claim 8, wherein the rubber hemisphere (1206) is hollow, the edge of the rubber hemisphere (1206) is connected with the lower part of the mounting plate (1205), the supporting ring (12051) is mounted below the mounting plate (1205) through the connecting rod in a suspending manner, the electromagnetic block (12053) is arranged at the bottom of the mounting plate (1205), the adhesion block (12052) used for being in adsorption fit with the electromagnetic block (12053) is arranged at the bottom of the inner wall of the rubber hemisphere (1206), and the lower part of the adhesion block (12052) is connected with the inner wall of the rubber hemisphere (1206).
10. An integrated control system for a wafer blue film laminating machine, which uses the wafer blue film laminating machine of any one of claims 1-9, and is characterized in that the control system comprises an iron ring feeding module, a film pasting and unreeling module, a film laminating processing device and a blanking module;
the wafer to be processed is conveyed onto a jig platform (5072) of the film pasting and unreeling module by the iron ring feeding module according to feedback of the film pasting and unreeling module, and after the film pasting of the wafer is completed, the wafer after the film pasting is completed is conveyed into a bin (102) of a CST feeding and discharging assembly by a discharging manipulator of the discharging module, so that the film laminating processing of the wafer is completed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310504000.4A CN116631906B (en) | 2023-05-06 | 2023-05-06 | Integrated wafer blue film laminating machine and control system thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310504000.4A CN116631906B (en) | 2023-05-06 | 2023-05-06 | Integrated wafer blue film laminating machine and control system thereof |
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| CN116631906B CN116631906B (en) | 2024-03-26 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112420590A (en) * | 2020-12-02 | 2021-02-26 | 厦门市弘瀚电子科技有限公司 | Full-automatic hoop stripping machine |
| CN218615517U (en) * | 2022-11-09 | 2023-03-14 | 江西兆驰半导体有限公司 | Wafer processing equipment |
| CN115799119A (en) * | 2022-12-09 | 2023-03-14 | 允哲半导体科技(浙江)有限公司 | Multifunctional film pasting device and method |
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- 2023-05-06 CN CN202310504000.4A patent/CN116631906B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112420590A (en) * | 2020-12-02 | 2021-02-26 | 厦门市弘瀚电子科技有限公司 | Full-automatic hoop stripping machine |
| CN218615517U (en) * | 2022-11-09 | 2023-03-14 | 江西兆驰半导体有限公司 | Wafer processing equipment |
| CN115799119A (en) * | 2022-12-09 | 2023-03-14 | 允哲半导体科技(浙江)有限公司 | Multifunctional film pasting device and method |
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