CN115799119A - Multifunctional film pasting device and method - Google Patents
Multifunctional film pasting device and method Download PDFInfo
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- CN115799119A CN115799119A CN202211584144.7A CN202211584144A CN115799119A CN 115799119 A CN115799119 A CN 115799119A CN 202211584144 A CN202211584144 A CN 202211584144A CN 115799119 A CN115799119 A CN 115799119A
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Abstract
The invention discloses a multifunctional film sticking device and a method, which comprises a feeding manipulator, a film ring stacking mechanism, a film ring film sticking mechanism and a vacuum film sticking mechanism, wherein the feeding manipulator is arranged on the feeding manipulator; the feeding manipulator is used for feeding the wafer into the wafer ring film sticking mechanism or the vacuum film sticking mechanism; the sheet ring stacking mechanism comprises a placing table for placing the iron ring and a first clamping assembly for moving the iron ring, and the first clamping assembly can be lifted; the film ring film sticking mechanism comprises a movable film sticking table top and a rolling film sticking assembly, and the film sticking table top can move to the position below the first clamping assembly; the vacuum film pasting mechanism comprises a vacuum cavity and a liftable sealing cover, and a wafer adsorption table board is arranged in the vacuum cavity. The invention comprises two film pasting modes of rolling film pasting and vacuum film pasting, can switch the film pasting mode randomly according to the requirements, meets the film pasting requirements of different wafers, and has low equipment cost and small occupied space.
Description
Technical Field
The invention relates to the technical field of wafer film pasting, in particular to a multifunctional film pasting device and method.
Background
The wafer dicing is to separate each die on the wafer by dicing, and before dicing, a protective film (dicing film or dicing protective film) is attached to the non-circuit board surface (back surface) of the wafer, and then the wafer is sent to the wafer dicing machine for dicing. After cutting, a grain can be orderly arranged and stuck on the adhesive tape, and the grain can be prevented from collision caused by the fold of the adhesive tape due to the support of the frame.
At present, the conventional film pasting mode includes vacuum film pasting and rolling film pasting, wherein the rolling film pasting refers to that a wafer circuit board surface (front surface) is placed downwards, a film is covered on the upper surface (back surface) of a wafer, and then the film pasting is realized by utilizing roller rolling. The vacuum film pasting is to place the cutting film and the wafer in a vacuum cavity and to paste the film and the wafer by a vacuumizing mode. Both the two film pasting modes have respective advantages and disadvantages, so that two sets of equipment, namely vacuum film pasting equipment and rolling film pasting equipment, are required to be arranged in a plurality of factories to carry out film pasting operation on different types of wafers. And the two sets of film sticking equipment not only have high cost, but also occupy large space.
Disclosure of Invention
In order to solve the problems, the invention provides a multifunctional film pasting device and method, which can provide various film pasting modes, meet the film pasting requirements of different wafers, reduce the equipment cost, and are economical and practical.
Therefore, the technical scheme of the invention is as follows: a multifunctional film sticking device comprises a feeding manipulator, a film ring stacking mechanism, a film ring sticking mechanism, a vacuum film sticking mechanism and a film ring transmission mechanism;
the feeding manipulator is used for feeding the wafer into the wafer ring film sticking mechanism or the vacuum film sticking mechanism;
the sheet ring stacking mechanism comprises a placing table for placing an iron ring and a first clamping assembly for moving the iron ring, and the first clamping assembly can be lifted;
the film ring film sticking mechanism comprises a movable film sticking table top and a rolling film sticking assembly, and the film sticking table top can move to the position below the first clamping assembly;
the vacuum film sticking mechanism comprises a vacuum cavity and a sealing cover capable of lifting, and a wafer adsorption table board is arranged in the vacuum cavity;
the sheet ring transfer mechanism comprises a second clamping component and a moving track, wherein the second clamping component is provided with a suction nozzle, and can translate along the moving track.
After the wafer is taken down from the feeding tray, the feeding manipulator of the invention selectively sends the wafer to the film pasting table board of the film ring film pasting mechanism or the wafer adsorption table board of the vacuum film pasting mechanism according to the requirement: the film on the film sticking mechanism of the film ring can be changed into a precut film, and the film sticking operation can be realized.
When the wafer is placed on the film sticking table board, the iron ring is placed on the film sticking table board after being taken by the first clamping assembly, and then the film sticking table board moves to the position of the film rolling and sticking assembly for film sticking; the film is directly pasted on the wafer and is rolled and fixed, and then the wafer pasted with the film is taken down from the film pasting table board by the film ring transfer mechanism and is sent to other stations for the next procedure.
When the wafer is placed on a wafer adsorption table board of the vacuum film sticking mechanism, the iron ring is placed on a film sticking table board after being taken by the first clamping assembly, and then the film sticking table board moves to the position of the rolling film sticking assembly for film sticking; the film is directly attached to the iron ring, then the film and the iron ring are taken down from the film attaching table board by the ring transferring mechanism and are sent into the vacuum cavity, the sealing cover and the vacuum cavity are closed, vacuum pumping is carried out, the wafer and the film are automatically attached, and finally the wafer with the film attached is taken out from the vacuum cavity by the ring transferring mechanism and is sent to other stations for carrying out next working procedure.
Preferably, the device further comprises a positioning mechanism, a positioning table board is arranged on the positioning mechanism, and a camera shooting assembly is arranged above the positioning table board. Before the film is pasted on the wafer, the center positioning and the V-groove positioning are carried out on the wafer so as to ensure that the position and the direction of the wafer are consistent and the subsequent processing procedures of the wafer are unified. And after the wafer is taken off from the material loading disc by the material loading mechanical arm, the wafer is placed on the positioning mechanism for positioning, so that the wafers sent into the film sticking process are kept in the same state.
Preferably, piece ring pad pasting mechanism is including ordering about the first drive assembly that the pad pasting mesa removed, and roll extrusion pad pasting subassembly includes feed roll, guide roll, tension roll, waste recovery roller, press mold subassembly and cutting assembly, and membrane one end is convoluteed on the feed roll, and the other end passes guide roll, tension roll and fixes on the waste recovery roller, and the press mold subassembly is used for pressing the membrane to the pad pasting mesa, is equipped with rotatable cutting piece on the cutting assembly.
Preferably, an annular table surface is further arranged in the vacuum cavity of the vacuum film pasting mechanism, a wafer ring placement groove is formed in the annular table surface, the wafer adsorption table surface is placed in the middle of the annular table surface, and the wafer adsorption table surface can be lifted; the sealing cover is provided with a first lifting component for driving the sealing cover to move, the sealing cover can be tightly fixed with the vacuum cavity, the annular table top is used as a boundary, one side facing the sealing cover is an upper cavity, and the other side of the annular table top is a lower cavity; the upper cavity and the lower cavity are respectively connected with a vacuum device, and the pressure of the upper cavity is smaller than that of the lower cavity.
Preferably, the sheet-ring overturning mechanism further comprises a sheet-ring overturning mechanism, the sheet-ring overturning mechanism comprises an overturning table top and a rotating motor for driving the overturning table top to rotate 180 degrees, and a pneumatic clamp and a negative-pressure adsorption hole are arranged on the overturning table top. The wafer from the pad pasting station is placed on the overturning station with the wafer down and the film up, and is overturned by 180 degrees, so that the wafer is convenient for subsequent marking work with the wafer up and the film down.
The second technical scheme of the invention is as follows: a multifunctional film pasting method comprises the following steps:
1) taking the wafer from the feeding tray by the feeding mechanical arm, and executing the step 2) if the wafer is placed on the film pasting table top of the film ring film pasting mechanism, and executing the step 3) if the wafer is placed on the wafer adsorption table top of the vacuum film pasting mechanism;
2) The first clamping assembly places the iron ring on the film pasting table board and is positioned on the outer side of the wafer; moving the film pasting table top to the rolling film pasting assembly to finish rolling film pasting;
3) The first clamping assembly places the iron ring on the film pasting table top, the film pasting table top moves to the film rolling and pasting assembly, and the cutting film is pasted with the iron ring; the film ring transfer mechanism takes the cutting film and the iron ring off the film sticking table board and sends the cutting film and the iron ring into a vacuum cavity to finish vacuum film sticking;
4) And in the step 2) or the step 3), the wafer after the film pasting is sent to other stations by the wafer ring transfer mechanism, and the next process is carried out.
Preferably, in the step 1), after the feeding mechanical arm takes the wafer off the feeding tray, the wafer is clamped to the positioning mechanism for positioning; the camera on the positioning mechanism shoots the image of the wafer, compares the image with the pre-stored image, confirms the position difference of the V-shaped notch on the shot image and the pre-stored image, and adjusts the grabbing position of the feeding manipulator.
Preferably, the step 2) of rolling the film includes the following specific steps:
i) In an initial state, the film pasting table top is positioned above the object placing table of the sheet ring stacking mechanism, the wafer is placed on the film pasting table top by the feeding manipulator, and the film pasting table top is separated from the object placing table and moves to the side face;
II) the first clamping assembly clamps the iron ring from the object placing table and drives the iron ring to move upwards;
III) resetting the film sticking table board, moving the film sticking table board to a position below the object placing table, namely a position below the first clamping assembly, and placing the iron ring on the film sticking table board by the first clamping assembly and locating the iron ring outside the wafer;
IV) the film pasting table board drives the wafer and the iron ring to move to the position below the cutting assembly, the feeding roller sends out the cutting film, the cutting film is pasted on the wafer under the action of the guide roller and the tension roller, the cutting piece on the cutting assembly cuts off the redundant cutting film, and the film pressing assembly enables the cutting film to be more closely attached to the wafer;
v) taking the wafer after the film pasting from the film pasting table board by the film ring transfer mechanism, and sending the wafer to the next station.
Preferably, the vacuum film pasting in the step 3) comprises the following specific steps:
s1) in an initial state, the vacuum cavity and the sealing cover are in a separated state, the wafer is placed on the wafer adsorption table board by the feeding mechanical arm, and the wafer is fixed by using negative pressure;
s2) moving the film pasting table top away from the object placing table to move to the side;
s3) the first clamping assembly clamps the iron ring from the object placing table and drives the iron ring to move upwards;
s4) resetting the film pasting table board, moving the film pasting table board to a position below the object placing table, namely below the first clamping assembly, and placing the iron ring on the film pasting table board by the first clamping assembly;
s5) driving the iron ring to move below the cutting assembly by the film pasting table board, sending out the cutting film by the feeding roller, pasting the cutting film on the iron ring under the action of the guide roller and the tension roller, and cutting redundant cutting film by the cutting piece on the cutting assembly;
s6) taking down the cutting film and the iron ring from the film pasting table board by the film ring transfer mechanism, conveying the cutting film and the iron ring into a vacuum cavity, and placing the vacuum cavity into a film ring placing groove of an annular table board;
s7) moving the sealing cover downwards to be tightly fixed with the vacuum cavity, and separating the upper cavity from the lower cavity by the cutting film;
s8) starting vacuum equipment connected with the upper cavity and the lower cavity respectively to work, and sucking gas in the cavities to enable the pressure of the upper cavity to be smaller than that of the lower cavity; at the moment, the air pressure at the two sides of the cutting film is different, and the cutting film is in a concave arc state;
s9) moving the wafer adsorption table upwards, wherein the center of the wafer is firstly contacted with the cutting film, and along with the rising of the wafer, the contact surface of the wafer and the cutting film slowly diffuses outwards until the wafer and the cutting film are completely attached;
s10) simultaneously releasing atmospheric pressure from the upper cavity and the lower cavity, and exhausting bubbles between the wafer and the cutting film by using the atmospheric pressure, so that the cutting film at the edge of the wafer is more conformable;
s11) the sealing cover moves upwards to be separated from the vacuum cavity, and the wafer adhered with the cutting film can be taken down from the wafer adsorption table board by the ring conveying mechanism and is sent to the next station.
Preferably, in the step 4), the wafer ring transfer mechanism sends the filmed wafer to the turning station, the wafer falls into the marking station after being turned for 180 degrees, and the wafer is sent to the discharging box after marking is completed.
Compared with the prior art, the invention has the beneficial effects that:
1. the equipment comprises two film pasting modes of rolling film pasting and vacuum film pasting, the film pasting modes can be switched randomly according to requirements, the film pasting requirements of different wafers are met, the equipment cost is low, and the occupied space is small;
2. the automatic feeding and positioning system integrates automatic feeding of the wafer, positioning of the wafer, film pasting of the wafer, marking of the wafer and automatic discharging of the wafer, and is high in automation degree and working efficiency.
Drawings
The following detailed description is made with reference to the accompanying drawings and embodiments of the present invention
FIG. 1 and FIG. 2 are schematic structural views of the present invention;
FIG. 3 is a top view of the structure of the present invention;
FIG. 4 is a schematic structural diagram of the positioning mechanism of the present invention;
FIG. 5 is a schematic structural diagram of a ring stacking mechanism according to the present invention;
FIG. 6 is a schematic structural view of a film-sticking mechanism for a film ring according to the present invention;
FIG. 7 is a schematic structural view of a plate ring transfer mechanism according to the present invention;
FIG. 8 is a schematic structural view of a vacuum film pasting mechanism according to the present invention;
FIG. 9 is a schematic structural view of the vacuum film sticking mechanism in an open state according to the present invention;
FIG. 10 is a schematic structural view of the sheet ring turnover mechanism of the present invention.
Labeled as:
the device comprises a feeding mechanism 1 and a feeding manipulator 2;
a positioning mechanism 3, a positioning table 31 and a camera assembly 32;
the sheet ring stacking mechanism 4, the object placing table 41, the iron ring 42, the mounting frame 43, the suction cup 44 and the first linear module 45;
the device comprises a film ring film sticking mechanism 5, a film sticking table surface 51, a first driving assembly 52, a feeding roller 53, a guide roller 54, a tension roller 55, a waste recovery roller 56, a film pressing assembly 57 and a cutting assembly 58;
the sheet ring transfer mechanism 6, the second clamping assembly 61, the second moving track 62 and the second suction nozzle 63;
the vacuum film sticking mechanism 7, the vacuum cavity 71, the sealing cover 72, the wafer adsorption table surface 73, the annular table surface 74 and the first lifting assembly 75;
the sheet-ring overturning mechanism 8, the overturning table surface 81, the rotating assembly 82 and the pneumatic clamp 83;
marking mechanism 9, marking table 91 and marking machine 92;
a blanking mechanism 10.
Detailed Description
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate that the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention.
Furthermore, if any, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features. Thus, a definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the features, and in the description of the invention, "a number" or "a number" means two or more unless explicitly specified otherwise.
See the drawings. This embodiment multi-functional pad pasting device, including feed mechanism 1, material loading manipulator 2, positioning mechanism 3, piece ring pile up mechanism 4, piece ring pad pasting mechanism 5, piece ring transfer mechanism 6, vacuum pad pasting mechanism 7, piece ring tilting mechanism 8, marking mechanism 9 and unloading mechanism 10.
A feeding box is arranged in the feeding mechanism 1, and wafers which are not pasted with films are placed in the feeding box.
The feeding mechanical arm 2 can clamp and take the wafer from the feeding box and place the wafer into the positioning mechanism 3, the film ring sticking mechanism 5 or the vacuum sticking mechanism 7.
The positioning mechanism 3 is provided with a positioning table 31, and a camera assembly 32 is arranged above the positioning table 31. Before the film is pasted on the wafer, the center positioning and the V-groove positioning are carried out on the wafer so as to ensure the position and the direction of the wafer to be consistent and unify the subsequent processing procedures of the wafer. The feeding mechanical arm 2 takes the wafer off the feeding tray and then places the wafer on the positioning table surface 3 of the positioning mechanism 3 for positioning, so that the wafer fed into the film sticking process is ensured to be kept in the same state.
The sheet ring stacking mechanism 4 comprises a placing table 41 for placing the iron ring and a first clamping component for moving the iron ring, and the first clamping component can be lifted; put and placed many hoops 42 on the thing platform 41, first clamp is got the first linear module 45 that the subassembly includes mounting bracket 43, sucking disc 44 and vertical setting, and mounting bracket 43 is fixed on first linear module 45, can go up and down along with the linear module, and mounting bracket 43 below is equipped with sucking disc 44, can adsorb hoops 42, takes out the hoops from putting the thing bench.
The film ring film sticking mechanism 5 comprises a movable film sticking table-board 51, a first driving component 52 driving the film sticking table-board to move and a rolling film sticking component, wherein the first driving component comprises a second linear module, a guide rail and the like which are horizontally arranged and can drive the film sticking table-board 51 to move horizontally along the guide rail; the rolling film pasting assembly comprises a feeding roller 53, a guide roller 54, a tension roller 55, a waste recovery roller 56, a film pressing assembly 57, a cutting assembly 58 and the like, one end of a cutting film is wound on the feeding roller, the other end of the cutting film penetrates through the guide roller and the tension roller to be fixed on the waste recovery roller, the film pressing assembly is used for pressing the film to a film pasting table board, and a rotatable cutting blade is arranged on the cutting assembly. The film ring sticking mechanism is the existing rolling film sticking technology, which is a mature technology, and the specific structure is not described any more.
The sheet ring transfer mechanism 6 comprises a second clamping component 61 and a second moving track 62, the second clamping component is provided with a second suction nozzle 63, the second suction nozzle 63 can be used for sucking the wafer and the iron ring, driving the wafer and the iron ring to move horizontally along the second moving track 62, and transferring the wafer among the film pasting table-board 51, the wafer sucking table-board 73 and the overturning table-board
The vacuum film sticking mechanism 7 comprises a vacuum cavity 71 and a sealing cover 72 capable of lifting, and a wafer adsorption table surface 73 is arranged in the vacuum cavity 71; an annular table board 74 is further arranged in the vacuum cavity, a wafer ring placing groove is formed in the annular table board, the wafer adsorption table board 73 is placed in the middle of the annular table board, and the wafer adsorption table board 73 can be lifted; the sealing cover is provided with a first lifting component 75 for driving the sealing cover 72 to move, the sealing cover can be tightly fixed with the vacuum cavity, an annular table top is taken as a boundary, one side facing the sealing cover is an upper cavity, and the other side of the annular table top is a lower cavity; the upper cavity and the lower cavity are respectively connected with a vacuum device, and the pressure of the upper cavity is smaller than that of the lower cavity.
The sheet-ring turnover mechanism 8 comprises a turnover table board 81 and a rotating assembly 82 for driving the turnover table board to rotate 180 degrees, and the turnover table board 81 is provided with a pneumatic clamp 83 and a negative pressure adsorption hole. The wafer from the pad pasting station is placed on the overturning station with the wafer down and the film up, and is overturned by 180 degrees, so that the wafer is convenient for subsequent marking work with the wafer up and the film down.
The marking mechanism 9 comprises a marking table surface 91, a third driving mechanism for driving the marking table surface to move and a marking machine 92, the third driving mechanism is a third linear module and a third moving rail, the marking table surface can move below the turnover table surface 81 along the third moving rail, and after the pneumatic clamp 83 on the turnover table surface 81 is loosened, the wafer falls into the marking table surface 91; the marking table then drives the wafer back to the marking machine 92 for marking.
The discharging mechanism 10 comprises a discharging box, and the wafer with the film adhered and the mark printed thereon is sent into the discharging box for storage.
The material loading manipulator of this embodiment takes off the back with the wafer from last charging tray, selects to send to on the pad pasting mesa of piece ring pad pasting mechanism according to the demand, or on the wafer absorption mesa of vacuum pad pasting mechanism: the film on the film sticking mechanism of the film ring can be changed into a precut film, and the film sticking operation can be realized.
When rolling the film, the method comprises the following steps:
1) The wafer without film is placed in a feeding box of the feeding mechanism 1, and the feeding manipulator 2 takes the wafer out of the feeding box and sends the wafer into the positioning mechanism 3;
2) The wafer is placed on the positioning table 31, the image of the wafer can be shot by the camera assembly 32, the image is compared with the pre-stored image, and the position difference between the shot image and the V-shaped notch on the pre-stored image is confirmed, so that the manipulator can grab the same position of the wafer, namely the wafers entering the film sticking process are all kept consistent;
3) At this time, the film pasting table surface 51 is located above the object placing table 41 of the sheet ring stacking mechanism 4, namely, at a position between the object placing table 41 and the first clamping assembly, so that the feeding manipulator 2 can conveniently place the wafer; after the wafer is placed on the film sticking table-board 51 by the feeding manipulator 2, the film sticking table-board 51 moves along the guide rail and leaves the object placing table;
4) The first clamping component descends, and the iron ring 42 is taken down from the object placing table 41 by using the sucking disc 44 and is driven to move upwards;
5) The film pasting table-board 51 is reset and moved back to the position below the first clamping assembly, and then the first clamping assembly places the iron ring 42 on the film pasting table-board and is positioned on the outer side of the wafer;
6) The film sticking table board 51 drives the wafer and the iron ring to move to the position below the cutting assembly 58, the feeding roller 53 sends out the cutting film, the cutting film is stuck on the wafer under the action of the guide roller 54 and the tension roller 55, the cutting piece on the cutting assembly 58 cuts off the redundant cutting film, and the film pressing assembly enables the cutting film to be closer to the wafer;
7) The wafer after film pasting is taken down from the film pasting table board 51 by the ring transfer mechanism 6, then the wafer is moved to the turning station and passes through the vacuum film pasting mechanism 7 on the way, and at the moment, the vacuum cavity 71 and the sealing cover 72 are in an open state, so that the wafer can conveniently pass through the vacuum film pasting mechanism and the sealing cover;
8) The wafer is placed on an overturning table surface 81 of an overturning station and fixed by a pneumatic clamp 83, and then the overturning table surface 81 drives the wafer to overturn by 180 degrees;
9) After the wafer is turned over, a marking table surface of the marking mechanism moves to the position below a turnover table surface, the turnover table surface moves downwards, and the wafer is placed on the marking table surface;
10 Marking table 91 drives the wafer back to marking machine 92 for marking;
11 The marked wafers are sent into a blanking box for storage, thereby completing the rolling and film-pasting operation.
When the film is pasted in vacuum, the method comprises the following steps:
s1) placing a wafer without a film in a feeding box of a feeding mechanism 1, taking the wafer out of the feeding box by a feeding manipulator 2, and sending the wafer into a positioning mechanism 3;
s2) the wafer is placed on the positioning table board 31, the image of the wafer can be shot by the camera assembly 32, the shot image and the pre-stored image are compared, and the position difference of the V-shaped notch on the shot image and the pre-stored image is confirmed, so that the manipulator can grab the same position of the wafer, namely the wafers entering the film sticking process are all kept consistent;
s3) in an initial state, the vacuum cavity 71 and the sealing cover 72 are in a separated state, the wafer is placed on the wafer adsorption table surface 73 by the feeding mechanical arm 2, and the wafer is fixed by using negative pressure;
s4) at the moment, the film pasting table-board 51 is positioned above the object placing table of the sheet ring stacking mechanism 4, namely the position between the object placing table and the first clamping assembly, and then the film pasting table-board moves along the guide rail and leaves the object placing table;
s5) the first clamping assembly descends, the iron ring 42 is taken down from the object placing table by using the sucker 44, and the iron ring is driven to move upwards;
s6) resetting the film sticking table-board 51, moving the film sticking table-board back to the position below the first clamping assembly, and then placing the iron ring on the film sticking table-board by the first clamping assembly;
s7) the film sticking table board 51 drives the iron ring to move to the position below the cutting assembly 58, the feeding roller 53 sends out the cutting film, the cutting film is stuck to the iron ring under the action of the guide roller 54 and the tension roller 55, and the cutting piece on the cutting assembly cuts off the redundant cutting film;
s8) the sheet ring transfer mechanism 6 takes the cutting film and the iron ring off the film pasting table board 51, sends the cutting film and the iron ring into the vacuum cavity 71 and places the cutting film and the iron ring in a sheet ring placement groove of the annular table board 74;
s9) moving the sealing cover 72 downwards to be tightly fixed with the vacuum cavity 71, and separating the upper cavity from the lower cavity by the cutting film;
s10) starting vacuum equipment respectively connected with the upper cavity and the lower cavity to work, and sucking gas in the cavities to enable the pressure of the upper cavity to be smaller than that of the lower cavity; at the moment, the air pressure at the two sides of the cutting film is different, and the cutting film is in a concave arc state;
s11) the wafer adsorption table surface 73 moves upwards, the center of the wafer is firstly contacted with the cutting film, and along with the rising of the wafer, the contact surface of the wafer and the cutting film slowly diffuses outwards until the wafer and the cutting film are completely attached;
s12) simultaneously releasing the atmospheric pressure from the upper cavity and the lower cavity, and exhausting bubbles between the wafer and the cutting film by using the atmospheric pressure, so that the cutting film at the edge of the wafer is more conformable;
s13) the sealing cover 72 moves upwards to be separated from the vacuum cavity 71, and the wafer adhered with the cutting film can be taken down from the wafer adsorption table surface 73 by the ring transfer mechanism 6 and is sent to a turnover station;
s14) placing the wafer on an overturning table surface 81 of an overturning station, fixing the wafer by a pneumatic clamp 83, and driving the wafer to overturn by 180 degrees by the overturning table surface;
s15) after the wafer is turned over, moving a marking table surface 91 of the marking mechanism to be below the turnover table surface 81, moving the turnover table surface downwards, and placing the wafer on the marking table surface;
s16) the marking table 91 drives the wafer to return to the marking machine 92 for marking operation;
and S17) the marked wafer is sent into a blanking box to be stored, so that the vacuum film pasting operation is completed.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (10)
1. The utility model provides a multi-functional pad pasting device which characterized in that: the automatic film laminating machine comprises a feeding manipulator, a film ring stacking mechanism, a film ring film laminating mechanism, a vacuum film laminating mechanism and a film ring transmission mechanism;
the feeding manipulator is used for feeding the wafer into the wafer ring film sticking mechanism or the vacuum film sticking mechanism;
the sheet ring stacking mechanism comprises a placing table for placing the iron ring and a first clamping assembly for moving the iron ring, and the first clamping assembly can be lifted;
the film ring film sticking mechanism comprises a movable film sticking table top and a rolling film sticking assembly, and the film sticking table top can move to the position below the first clamping assembly;
the vacuum film sticking mechanism comprises a vacuum cavity and a sealing cover capable of lifting, and a wafer adsorption table board is arranged in the vacuum cavity;
the sheet ring transfer mechanism comprises a second clamping component and a moving track, wherein the second clamping component is provided with a suction nozzle, and can translate along the moving track.
2. The multifunctional film sticking device as claimed in claim 1, wherein: the camera shooting device is characterized by further comprising a positioning mechanism, wherein a positioning table board is arranged on the positioning mechanism, and a camera shooting assembly is arranged above the positioning table board.
3. The multi-functional film sticking device as claimed in claim 1, wherein: the piece ring pad pasting mechanism is including ordering about the first drive assembly that the pad pasting mesa removed, and roll extrusion pad pasting subassembly includes feed roll, guide roll, tension roll, waste recovery roller, press mold subassembly and cutting assembly, and membrane one end is convoluteed on the feed roll, and the other end passes guide roll, tension roll and fixes on the waste recovery roller, and the press mold subassembly is used for pressing the membrane to the pad pasting mesa, is equipped with rotatable cutting piece on the cutting assembly.
4. The multi-functional film sticking device as claimed in claim 1, wherein: an annular table board is further arranged in a vacuum cavity of the vacuum film sticking mechanism, a film ring placing groove is formed in the annular table board, a wafer adsorption table board is arranged in the middle of the annular table board, and the wafer adsorption table board can be lifted; the sealing cover is provided with a first lifting component for driving the sealing cover to move, the sealing cover can be tightly fixed with the vacuum cavity, the annular table top is used as a boundary, one side facing the sealing cover is an upper cavity, and the other side of the annular table top is a lower cavity; the upper cavity and the lower cavity are respectively connected with a vacuum device, and the pressure of the upper cavity is smaller than that of the lower cavity.
5. The multifunctional film sticking device as claimed in claim 1, wherein: the sheet ring turnover mechanism comprises a turnover table board and a rotary motor driving the turnover table board to rotate 180 degrees, and pneumatic fixtures and negative-pressure adsorption holes are arranged on the turnover table board.
6. A multifunctional film pasting method is characterized in that: the method comprises the following steps:
1) taking the wafer from the feeding tray by the feeding mechanical arm, and executing the step 2) if the wafer is placed on the film pasting table top of the film ring film pasting mechanism, and executing the step 3) if the wafer is placed on the wafer adsorption table top of the vacuum film pasting mechanism;
2) The first clamping assembly places the iron ring on the film pasting table board and is positioned on the outer side of the wafer; moving the film pasting table top to the rolling film pasting assembly to finish rolling film pasting;
3) The first clamping assembly places the iron ring on the film pasting table top, the film pasting table top moves to the film rolling and pasting assembly, and the cutting film is pasted with the iron ring; the film ring transfer mechanism takes the cutting film and the iron ring off the film sticking table board and sends the cutting film and the iron ring into a vacuum cavity to finish vacuum film sticking;
4) In the step 2) or the step 3), the wafer after the film pasting is sent to other stations by the wafer ring transfer mechanism to carry out the next working procedure.
7. The multifunctional film pasting method as claimed in claim 6, wherein: in the step 1), after taking the wafer off the feeding tray, the feeding manipulator clamps the wafer to the positioning mechanism for positioning; the camera on the positioning mechanism shoots the image of the wafer, compares the image with the pre-stored image, confirms the position difference of the V-shaped notch on the shot image and the pre-stored image, and adjusts the grabbing position of the feeding manipulator.
8. The multifunctional film pasting method as claimed in claim 6, wherein: the rolling and film sticking in the step 2) comprises the following specific steps:
i) In an initial state, the film pasting table top is positioned above the object placing table of the sheet ring stacking mechanism, the wafer is placed on the film pasting table top by the feeding manipulator, and the film pasting table top is separated from the object placing table and moves to the side face;
II) the first clamping assembly clamps the iron ring from the object placing table and drives the iron ring to move upwards;
III) resetting the film sticking table board, moving the film sticking table board to a position below the object placing table, namely a position below the first clamping assembly, and placing the iron ring on the film sticking table board by the first clamping assembly and locating the iron ring outside the wafer;
IV) the film pasting table board drives the wafer and the iron ring to move to the position below the cutting assembly, the feeding roller sends out the cutting film, the cutting film is pasted on the wafer under the action of the guide roller and the tension roller, the cutting piece on the cutting assembly cuts off the redundant cutting film, and the film pressing assembly enables the cutting film to be more closely attached to the wafer;
v) the wafer ring transfer mechanism takes the wafer after the film pasting from the film pasting table surface and sends the wafer to the next station.
9. The multifunctional film pasting method as claimed in claim 6, wherein: the vacuum film pasting in the step 3) comprises the following specific steps:
s1) in an initial state, the vacuum cavity and the sealing cover are in a separated state, the wafer is placed on the wafer adsorption table board by the feeding mechanical arm, and the wafer is fixed by using negative pressure;
s2) moving the film pasting table top away from the object placing table to the side;
s3) the first clamping assembly clamps the iron ring from the object placing table and drives the iron ring to move upwards;
s4) resetting the film pasting table board, moving the film pasting table board to a position below the object placing table, namely below the first clamping assembly, and placing the iron ring on the film pasting table board by the first clamping assembly;
s5) driving the iron ring to move below the cutting assembly by the film pasting table board, sending out the cutting film by the feeding roller, pasting the cutting film on the iron ring under the action of the guide roller and the tension roller, and cutting redundant cutting film by the cutting piece on the cutting assembly;
s6) taking down the cutting film and the iron ring from the film pasting table board by the film ring transfer mechanism, conveying the cutting film and the iron ring into a vacuum cavity, and placing the vacuum cavity into a film ring placing groove of an annular table board;
s7) moving the sealing cover downwards to be tightly fixed with the vacuum cavity, and separating the upper cavity from the lower cavity by the cutting film;
s8) starting vacuum equipment respectively connected with the upper cavity and the lower cavity to work, and sucking gas in the cavities to enable the pressure of the upper cavity to be smaller than that of the lower cavity; at the moment, the air pressure at the two sides of the cutting film is different, and the cutting film is in a concave arc state;
s9) moving the wafer adsorption table upwards, wherein the center of the wafer is firstly contacted with the cutting film, and along with the rising of the wafer, the contact surface of the wafer and the cutting film slowly diffuses outwards until the wafer and the cutting film are completely attached;
s10) simultaneously releasing atmospheric pressure from the upper cavity and the lower cavity, and exhausting bubbles between the wafer and the cutting film by using the atmospheric pressure, so that the cutting film at the edge of the wafer is more conformable;
s11) the sealing cover moves upwards to be separated from the vacuum cavity, and the wafer adhered with the cutting film can be taken down from the wafer adsorption table board by the ring conveying mechanism and is sent to the next station.
10. The multifunctional film pasting method of claim 6, wherein: in the step 4), the wafer after being pasted with the film is sent to a turning station by the film ring transfer mechanism, the wafer falls into a marking station after being turned for 180 degrees, and the wafer is sent into a discharging box after marking is completed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211584144.7A CN115799119A (en) | 2022-12-09 | 2022-12-09 | Multifunctional film pasting device and method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211584144.7A CN115799119A (en) | 2022-12-09 | 2022-12-09 | Multifunctional film pasting device and method |
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| CN115799119A true CN115799119A (en) | 2023-03-14 |
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| CN202211584144.7A Pending CN115799119A (en) | 2022-12-09 | 2022-12-09 | Multifunctional film pasting device and method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116364619A (en) * | 2023-03-22 | 2023-06-30 | 鑫祥微电子(南通)有限公司 | Chip wafer pad pasting cuts device |
| CN116631906A (en) * | 2023-05-06 | 2023-08-22 | 深圳市利和兴股份有限公司 | Integrated wafer blue film laminating machine and control system thereof |
| CN116646255A (en) * | 2023-05-24 | 2023-08-25 | 浙江嘉辰半导体有限公司 | Wafer level packaging technology meeting electromagnetic compatibility requirement |
| CN117594514A (en) * | 2024-01-18 | 2024-02-23 | 天津中科晶禾电子科技有限责任公司 | Wafer clamp, wafer clamping method and wafer cleaning equipment |
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- 2022-12-09 CN CN202211584144.7A patent/CN115799119A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116364619A (en) * | 2023-03-22 | 2023-06-30 | 鑫祥微电子(南通)有限公司 | Chip wafer pad pasting cuts device |
| CN116364619B (en) * | 2023-03-22 | 2023-12-19 | 鑫祥微电子(南通)有限公司 | Chip wafer pad pasting cuts device |
| CN116631906A (en) * | 2023-05-06 | 2023-08-22 | 深圳市利和兴股份有限公司 | Integrated wafer blue film laminating machine and control system thereof |
| CN116631906B (en) * | 2023-05-06 | 2024-03-26 | 深圳市利和兴股份有限公司 | Integrated wafer blue film laminating machine and control system thereof |
| CN116646255A (en) * | 2023-05-24 | 2023-08-25 | 浙江嘉辰半导体有限公司 | Wafer level packaging technology meeting electromagnetic compatibility requirement |
| CN116646255B (en) * | 2023-05-24 | 2024-03-22 | 浙江嘉辰半导体有限公司 | Wafer level packaging technology meeting electromagnetic compatibility requirement |
| CN117594514A (en) * | 2024-01-18 | 2024-02-23 | 天津中科晶禾电子科技有限责任公司 | Wafer clamp, wafer clamping method and wafer cleaning equipment |
| CN117594514B (en) * | 2024-01-18 | 2024-04-30 | 天津中科晶禾电子科技有限责任公司 | Wafer clamp, wafer clamping method and wafer cleaning equipment |
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