CN116646255B - Wafer level packaging technology meeting electromagnetic compatibility requirement - Google Patents

Wafer level packaging technology meeting electromagnetic compatibility requirement Download PDF

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Publication number
CN116646255B
CN116646255B CN202310604912.9A CN202310604912A CN116646255B CN 116646255 B CN116646255 B CN 116646255B CN 202310604912 A CN202310604912 A CN 202310604912A CN 116646255 B CN116646255 B CN 116646255B
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China
Prior art keywords
fixedly connected
mounting
wafer
motor
transmission
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CN202310604912.9A
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Chinese (zh)
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CN116646255A (en
Inventor
任飞
刘建平
张敏强
林龙
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Zhejiang Jiachen Semiconductor Co ltd
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Zhejiang Jiachen Semiconductor Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/552Protection against radiation, e.g. light or electromagnetic waves
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to the technical field of semiconductor packaging and discloses a wafer level packaging process meeting the electromagnetic compatibility requirement, wherein a film-sticking cutting and electroplating integrated machine comprises a mounting frame, one side of the mounting frame is fixedly connected with a first motor, the output end of the first motor is fixedly connected with a first mounting shaft which is rotationally connected with the mounting frame through a coupler.

Description

Wafer level packaging technology meeting electromagnetic compatibility requirement
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a wafer level packaging process meeting electromagnetic compatibility requirements.
Background
With the development of semiconductor technology and the driving of consumer electronics market, packaging technology is advancing toward lighter, thinner, smaller, and better electrothermal performance. The chip packaging process is also changed from chip-by-chip packaging to wafer-level packaging, and the wafer-level packaging is simply referred to as wafer-level chip packaging, and gradually becomes one of the most advanced and important packaging forms at present due to the advantages of high density, small volume, high reliability, excellent electrothermal performance and the like and the development requirements of the packaging process, compared with the traditional packaging process, the wafer-level packaging process takes a wafer (each wafer is provided with a plurality of chips in a matrix) as a unit in the packaging process, and the wafer is wholly packaged and then cut by the chip as a unit.
In the existing wafer level packaging process, when a chip is cut after packaging, the packaged whole wafer is required to be manually placed on a film sticking machine for film sticking, then the wafer is required to be placed in a film expanding machine for film expanding after being cut in a cutting machine, then metal electroplating is carried out, finally the wafer is manually taken out, so that the steps after the chip packaging are complicated, the labor intensity of workers is increased, and meanwhile, the bonding effect of the whole wafer and a DAF film is poor, so that the problem that the packaging efficiency of the wafer chip is low and the packaging effect is poor is caused.
Disclosure of Invention
The invention aims to provide a wafer level packaging process meeting electromagnetic compatibility requirements, which is provided with a full-automatic stable and firm film pasting for wafer chips in the packaging process, and then cutting is carried out, and the DAF film can be automatically expanded after cutting is finished, so that the gap between chips after cutting is increased, the subsequent processing and taking out are facilitated, and the packaging efficiency for the wafer chips is greatly improved.
The aim of the invention can be achieved by the following technical scheme:
a wafer level packaging process meeting electromagnetic compatibility requirements, comprising the steps of:
firstly, placing a wafer into a circuit manufacturing device, then manufacturing a circuit on the surface of the wafer by the circuit manufacturing device, and arranging the circuit at the edge of a chip;
step two, using a photosensitive dry film, and manufacturing a cavity through a film pasting and exposure developing mode;
step three, preparing a seed layer on the surface of the dry film in a sputtering mode, electroplating metal, leading out I/O, and planting tin balls on the I/O bonding pads;
and step four, placing the wafer chips packaged in the step three into a film pasting, cutting and electroplating integrated machine, and performing automatic cutting and electroplating to obtain the wafer-level packaged chips meeting the electromagnetic compatibility requirement.
As a further scheme of the invention: the integrated machine for film cutting and electroplating comprises a mounting frame, a first motor is fixedly connected to one side of the mounting frame, a first mounting shaft is fixedly connected to the output end of the first motor and is rotationally connected with the mounting frame through a coupling, a mounting box is fixedly connected to one end of the first mounting shaft and is rotationally connected with the mounting frame, a clamping mechanism is arranged in the mounting box, a feeding mechanism connected with the mounting box is arranged below the clamping mechanism, an extruding and picking and placing mechanism is arranged on one side of the mounting frame, a cutting mechanism is arranged in the mounting frame, and an electroplating mechanism is arranged at the top of the mounting frame.
As a further scheme of the invention: the utility model provides a clamping mechanism, including the second motor of mounting box fixed connection, the output of second motor passes through shaft coupling fixedly connected with and the second installation axle of mounting box rotation connection, the one end fixedly connected with of second installation axle rotates the first mounting collar of being connected with the mounting box, two fixedly connected with install the dish in the first mounting collar, two pass through spliced pole fixed connection between the install the dish, two a plurality of spouts have all been seted up to one side that install the dish kept away from each other, sliding connection has the centre gripping frame in the spout, fixedly connected with first electric telescopic handle in the centre gripping frame, the one end fixedly connected with grip block of first electric telescopic handle, the top fixedly connected with grip block of centre gripping frame, through connecting frame fixed connection between grip block and the centre gripping frame, one side of connecting frame is through connecting rod fixedly connected with install the drive plate of dish sliding connection, one side transmission of drive plate is connected with the first drive mechanism that is connected with the install the dish, install the intracavity fixedly connected with heater strip.
As a further scheme of the invention: the first transmission mechanism comprises a gear ring which is rotationally connected with the mounting plate, a plurality of first gears are connected with the inner surface of the gear ring in a meshed mode, a transmission shaft which is rotationally connected with the mounting plate is fixedly sleeved in the middle of each first gear, a second gear is fixedly sleeved on the outer surface of each transmission shaft, a first rack which is fixedly connected with the transmission plate is connected with the outer surface of each second gear in a meshed mode, and a driving machine which is connected with the mounting plate is connected with the outer surface of the gear ring in a transmission mode.
As a further scheme of the invention: the driving mechanism comprises a third motor fixedly connected with the mounting plate, the output end of the third motor is fixedly connected with a driving shaft through a coupler, the outer surface of the driving shaft is fixedly sleeved with a driving gear, and the outer surface of the driving gear is in meshed connection with a second rack fixedly connected with the gear ring.
As a further scheme of the invention: the feeding mechanism comprises a plurality of threaded rods which are rotationally connected with the installation box, lifting plates are in threaded fit with the outer surfaces of the threaded rods, the top fixedly connected with of the lifting plates is provided with a placing plate, the top of each lifting plate is fixedly connected with a second electric telescopic rod, the top of each second electric telescopic rod is fixedly connected with an installation plate, one side of each installation plate is fixedly connected with a third electric telescopic rod, one end of each third electric telescopic rod is fixedly connected with a fixing block, the outer surfaces of the threaded rods are in transmission connection with a second transmission mechanism, and the outer surfaces of the installation box are rotationally connected with a placing door.
As a further scheme of the invention: the second transmission mechanism comprises a fourth motor fixedly connected with the installation box, the output end of the fourth motor is fixedly connected with a rotating shaft through a coupler, a first transmission gear is fixedly sleeved on the outer surface of the rotating shaft, and a second transmission gear fixedly sleeved on the threaded rod is connected to the outer surface of the first transmission gear in a meshed mode.
As a further scheme of the invention: the extrusion is got and is put mechanism includes the connecting plate with mounting bracket fixed connection, one side fixedly connected with fifth motor of connecting plate, the one end fixedly connected with third installation axle of fifth motor, the one end fixedly connected with of third installation axle rotates the second installation circle of being connected with the connecting plate, fixedly connected with fourth electric telescopic handle in the second installation circle, the one end fixedly connected with of fourth electric telescopic handle pushes away the case with second installation circle sliding connection, one side fixedly connected with rubber vacuum chuck who pushes away the case, one side fixedly connected with intake pipe that pushes away the case.
As a further scheme of the invention: the cutting mechanism comprises a first electric hydraulic rod fixedly connected with the mounting frame, a chip cutting machine is fixedly connected to the top end of the first electric hydraulic rod, the electroplating mechanism comprises a second electric hydraulic rod fixedly connected with the mounting frame, and a chip electroplating machine is fixedly connected to the top of the second electric hydraulic rod.
The invention has the beneficial effects that:
(1) Through the cooperation of clamp material mechanism and feeding mechanism, the flexible extrusion of mechanism is put to the rethread extrusion to realize carrying out the stable firm subsides of DAF membrane to the one side of not equidimension wafer chip, be convenient for subsequent processing, realize carrying out automatic the expanding to the DAF membrane after the wafer chip cuts simultaneously, improve the clearance between the chip, be convenient for follow-up metal electroplating to the chip surface, greatly reduced wafer chip encapsulation in-process cutting's step, thereby improved the encapsulation efficiency to the wafer chip greatly, carry out the metal plating technology through this technology at the chip surface after the encapsulation simultaneously, thereby the electromagnetic shield performance of chip has been improved, satisfy the electromagnetic compatibility requirement of chip.
(2) The fourth electric telescopic rod on the extrusion picking and placing mechanism drives the pushing box to move, the pushing box drives the rubber positive sucker to be matched, flexible extrusion of the wafer chip and the DAF film before cutting is achieved, precise lamination is achieved, automatic blanking is conducted on the wafer chip after cutting and metal plating, automatic efficiency after the wafer chip is packaged is achieved, and packaging efficiency of the wafer chip is greatly improved.
(3) Through the cooperation of the clamping mechanism, the feeding mechanism, the extrusion picking and placing mechanism, the cutting mechanism and the electroplating mechanism, the integrated film pasting, cutting and electroplating processing of the wafer chip are realized, the labor procedures of workers are greatly reduced, the labor intensity of the workers is reduced, and the packaging efficiency of the wafer chip is improved.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a first perspective view of the external structure of the present invention;
FIG. 2 is a second perspective view of the external structure of the present invention;
FIG. 3 is a front view of the internal structure of the mounting case of the present invention;
FIG. 4 is a perspective view of the external mechanism of the clamping mechanism of the present invention;
FIG. 5 is a perspective view of the internal structure of the clamping mechanism of the present invention;
FIG. 6 is a top view of the internal structure of the mounting plate of the present invention;
fig. 7 is an enlarged view of fig. 5 a in accordance with the present invention.
In the figure: 1. a mounting frame; 2. a first motor; 3. a first mounting shaft; 4. a mounting box; 11. a second motor; 12. a second mounting shaft; 13. a first mounting ring; 14. a mounting plate; 15. a connecting column; 16. a chute; 17. a clamping frame; 18. a first electric telescopic rod; 19. a clamping block; 190. a clamping plate; 191. a drive plate; 192. a mounting cavity; 193. an electric heating wire; 21. a gear ring; 22. a first gear; 23. a transmission shaft; 24. a second gear; 25. a first rack; 31. a third motor; 32. a drive shaft; 33. a drive gear; 34. a second rack; 41. a threaded rod; 42. a lifting plate; 43. placing a plate; 44. a second electric telescopic rod; 45. a mounting plate; 46. a third electric telescopic rod; 47. a fixed block; 51. a fourth motor; 52. a rotating shaft; 53. a first transmission gear; 54. a second transmission gear; 61. a connecting plate; 62. a fifth motor; 63. a third mounting shaft; 64. a second mounting ring; 65. a fourth electric telescopic rod; 66. pushing the box; 67. rubber vacuum chuck; 68. an air inlet pipe; 71. a first electric hydraulic lever; 72. a chip cutter; 73. a second electric hydraulic lever; 74. a chip electroplating machine.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1-7, the present invention is a wafer level packaging process for satisfying electromagnetic compatibility requirements, and the wafer level packaging process for satisfying electromagnetic compatibility requirements includes the following steps:
firstly, placing a wafer into a circuit manufacturing device, then manufacturing a circuit on the surface of the wafer by the circuit manufacturing device, and arranging the circuit at the edge of a chip;
step two, using a photosensitive dry film, and manufacturing a cavity through a film pasting and exposure developing mode;
step three, preparing a seed layer on the surface of the dry film in a sputtering mode, electroplating metal, leading out I/O, and planting tin balls on the I/O bonding pads;
and step four, placing the wafer chips packaged in the step three into a film pasting, cutting and electroplating integrated machine, and performing automatic cutting and electroplating to obtain the wafer-level packaged chips meeting the electromagnetic compatibility requirement.
The film pasting, cutting and electroplating integrated machine comprises a mounting frame 1, one side of the mounting frame 1 is fixedly connected with a first motor 2, the output end of the first motor 2 is fixedly connected with a first mounting shaft 3 rotationally connected with the mounting frame 1 through a coupling, one end of the first mounting shaft 3 is fixedly connected with a mounting box 4 rotationally connected with the mounting frame 1, a clamping mechanism is arranged in the mounting box 4, a feeding mechanism connected with the mounting box 4 is arranged below the clamping mechanism, one side of the mounting frame 1 is provided with an extrusion, taking and placing mechanism, a cutting mechanism is arranged in the mounting frame 1, the top of the mounting frame 1 is provided with an electroplating mechanism, a DAF film is fed into the clamping mechanism through the feeding mechanism, then the clamping mechanism clamps and fixes the DAF film, one surface of the DAF film is brushed with adhesive, then the first motor 2 drives the first mounting shaft 3 to rotate, the first mounting shaft 3 drives the mounting box 4 to turn over 180 degrees, then the clamping mechanism moves outwards, then the packaged wafer chips are put on the DAF film for bonding, then the clamping mechanism moves inwards to limit and fix the wafer chips, the other surface of the clamping mechanism clamps the DAF film in a feeding way through the cooperation of the feeding mechanism, then the first motor 2 drives the first mounting shaft 3 to rotate 90 degrees, the packaged wafer chips are tightly attached to the DAF film through the extrusion picking and placing mechanism, then the mounting box 4 is driven to turn over 90 degrees to enable the clamping mechanism to rotate to the position right above the cutting mechanism, then the cutting mechanism cuts the wafer chips in the clamping mechanism, after cutting is finished, the mounting box 4 is driven to turn over 180 degrees to enable the clamping mechanism to rotate to the position right below the electroplating mechanism, and then the clamping mechanism pulls the DAF film outwards, the DAF film is stretched, gaps between wafer chips cut on the DAF film are enlarged, then the electroplating mechanism electroplates metal on the surfaces of the wafer chips after packaging and cutting, an electromagnetic shielding layer is formed, then the mounting box 4 is driven to rotate 90 degrees, each chip after metal electroplating is removed through the extrusion taking and placing mechanism, then the chips are reversely rotated 90 degrees, the DAF film is not clamped by the clamping mechanism, a worker takes out the DAF film, the DAF film clamped on the other side is overturned by the clamping mechanism, then the packaged wafer chips are placed into the machine for processing, and the processes are sequentially and reciprocally conducted, so that automatic film pasting cutting after packaging of the wafers is achieved, automatic feeding is carried out on the DAF film, intermittent automatic expansion is carried out on each wafer chip after cutting, a film expanding process is not needed to be carried out on a film expander, the processes are reduced, production efficiency is improved, an electromagnetic shielding performance of the wafer chip after cutting is simultaneously carried out on the outer surface of the wafer chip through the extrusion taking and placing mechanism, and automatic discharging of the chip after processing is carried out.
Example two
Referring to fig. 2, 3, 4, 5 and 7, the material clamping mechanism includes a second motor 11 fixedly connected with the mounting box 4, an output end of the second motor 11 is fixedly connected with a second mounting shaft 12 rotatably connected with the mounting box 4 through a coupling, one end of the second mounting shaft 12 is fixedly connected with a first mounting ring 13 rotatably connected with the mounting box 4, two mounting plates 14 are fixedly connected in the first mounting ring 13, two mounting plates 14 are fixedly connected through a connecting column 15, a plurality of sliding grooves 16 are formed on one sides, far away from each other, of the two mounting plates 14, a clamping frame 17 is slidably connected in the sliding grooves 16, a first electric telescopic rod 18 is fixedly connected in the clamping frame 17, one end of the first electric telescopic rod 18 is fixedly connected with a clamping block 19, a clamping plate 190 is fixedly connected at the top of the clamping frame 17, the clamping plate 190 is fixedly connected with the clamping frame 17 through the connecting frame, one side of the connecting frame is fixedly connected with a transmission plate 191 which is in sliding connection with the mounting plate 14 through a connecting rod, one side of the transmission plate 191 is in transmission connection with a first transmission mechanism which is connected with the mounting plate 14, a mounting cavity 192 is formed in the mounting plate 14, an electric heating wire 193 is fixedly connected in the mounting cavity 192, firstly, after a DAF film is fed into the bottom of the mounting plate 14 by a feeding mechanism, the transmission plate 191 is driven to move inwards through the first transmission mechanism, the transmission plate 191 drives the clamping frame 17 to move inwards in the sliding groove 16 through the connecting rod and the connecting frame, then the clamping block 19 is inserted between the DAF film at the top of the feeding mechanism and the DAF film at the secondary top, then the clamping block 19 is driven by the first electric telescopic rod 18 to clamp and fix the DAF film, then the mounting box 4 is turned over 180 degrees, the first transmission mechanism drives the transmission plate 191 to move outwards to straighten the DAF film, then the packaged wafer chips are placed on the mounting plate 14 to be attached to the DAF film, so that the DAF film is completely and flatly attached to the packaged wafer chips, then the first transmission mechanism drives the transmission plate 191 to move inwards to drive the clamping frame 17 and the clamping plate 190 to move inwards to attach the packaged wafer chips to limit, meanwhile, in the attaching limit process, the feeding mechanism in the mounting box 4 is used for feeding the DAF film to the mounting plate 14 at the bottom and clamping and fixing the fed DAF film, automatic feeding of the DAF film is realized, then the mounting box 4 is driven to turn over 90 degrees, and then the extruding and taking mechanism is used for extruding the packaged wafer chips, so that the packaged wafer chips are subjected to flexible extrusion attachment again, and the automatic attachment of the packaged wafer chips with different sizes is realized, and meanwhile, the attaching firmness of the packaged wafer chips and the DAF film is improved.
The first transmission mechanism comprises a gear ring 21 rotationally connected with the mounting plate 14, a plurality of first gears 22 are connected to the inner surface of the gear ring 21 in a meshed manner, a transmission shaft 23 rotationally connected with the mounting plate 14 is fixedly sleeved in the middle of the first gears 22, a second gear 24 is fixedly sleeved on the outer surface of the transmission shaft 23, a first rack 25 fixedly connected with the transmission plate 191 is connected to the outer surface of the second gear 24 in a meshed manner, a driving mechanism connected with the mounting plate 14 is connected to the outer surface of the gear ring 21 in a transmission manner, the gear ring 21 is driven to rotate positively and negatively through the driving mechanism, the gear ring 21 drives the transmission shaft 23 to rotate through the first gears 22, the transmission shaft 23 drives the first rack 25 to reciprocate through the second gear 24, and the first rack 25 drives the transmission plate 191 to reciprocate.
The driving mechanism comprises a third motor 31 fixedly connected with the mounting plate 14, the output end of the third motor 31 is fixedly connected with a driving shaft 32 through a coupler, a driving gear 33 is fixedly sleeved on the outer surface of the driving shaft 32, a second rack 34 fixedly connected with the gear ring 21 is meshed and connected on the outer surface of the driving gear 33, the third motor 31 is controlled by a PLC programming program and can control the third motor 31 to perform forward and backward reciprocating rotation, the driving shaft 32 is driven to rotate through the third motor 31, and the driving shaft 32 drives the gear ring 21 to rotate through the driving gear 33 and the second rack 34.
Example III
Referring to fig. 2 and 3, the feeding mechanism includes a plurality of threaded rods 41 rotatably connected with the mounting box 4, a lifting plate 42 is screwed on the outer surface of the threaded rods 41, a placing plate 43 is fixedly connected to the top of the lifting plate 42, a second electric telescopic rod 44 is fixedly connected to the top of the lifting plate 42, a mounting plate 45 is fixedly connected to the top of the second electric telescopic rod 44, a third electric telescopic rod 46 is fixedly connected to one side of the mounting plate 45, a fixing block 47 is fixedly connected to one end of the third electric telescopic rod 46, a second transmission mechanism is connected to the outer surface of the threaded rods 41 in a transmission manner, a placing door is rotatably connected to the outer surface of the mounting box 4, the threaded rods 41 are driven to rotate positively and negatively by the second transmission mechanism, the lifting plate 42 is driven to move up and down by the lifting plate 42, a DAF film on the placing plate 43 is fed to the bottom of the mounting plate 14, meanwhile the second electric telescopic rod 44 drives the mounting plate 45 to move upwards, the DAF film on the mounting plate 45 is enabled to be clamped by the third electric telescopic rod 46, and then the DAF film 46 is clamped by the fixing block 47 on the top of the mounting plate 45.
The second transmission mechanism comprises a fourth motor 51 fixedly connected with the installation box 4, the output end of the fourth motor 51 is fixedly connected with a rotating shaft 52 through a coupler, the outer surface of the rotating shaft 52 is fixedly sleeved with a first transmission gear 53, the outer surface of the first transmission gear 53 is in meshed connection with a second transmission gear 54 fixedly sleeved with the threaded rod 41, the fourth motor 51 is controlled by a PLC programming program and can control the fourth motor 51 to rotate positively and negatively, the rotating shaft 52 is driven to rotate through the fourth motor 51, and the rotating shaft 52 drives the threaded rod 41 to rotate positively and negatively through the first transmission gear 53 and the second transmission gear 54.
Example IV
Referring to fig. 1, 3 and 6, the extruding, taking and placing mechanism comprises a connecting plate 61 fixedly connected with a mounting frame 1, a fifth motor 62 is fixedly connected to one side of the connecting plate 61, one end of the fifth motor 62 is fixedly connected with a third mounting shaft 63, one end of the third mounting shaft 63 is fixedly connected with a second mounting ring 64 rotatably connected with the connecting plate 61, a fourth electric telescopic rod 65 is fixedly connected in the second mounting ring 64, one end of the fourth electric telescopic rod 65 is fixedly connected with a pushing box 66 slidably connected with the second mounting ring 64, one side of the pushing box 66 is fixedly connected with a rubber vacuum sucker 67, one side of the pushing box 66 is fixedly connected with an air inlet pipe 68, a belt conveyor is mounted below the extruding, taking and placing mechanism by rotating the mounting box 4 by 90 degrees, and meanwhile, the belt conveyor is connected with the air inlet pipe 68 through an air compressor, the clamping mechanism is aligned with the pushing box 66, then the fourth electric telescopic rod 65 drives the pushing box 66 to move, the pushing box 66 drives the rubber vacuum chuck 67 to move so as to squeeze the wafer chips, so that the wafer chips are tightly attached, after the cut wafer chips are electroplated, the mounting box 4 is rotated onto the squeezing mechanism, then the electric heating wire 193 in the mounting cavity 192 of the mounting plate 14 is heated, the glue on the surface of the DAF film is thermally melted, the adhesive force of the glue is reduced, the chips are conveniently removed from the DAF film, the air compressor is used for vacuumizing the pushing box 66, the rubber vacuum chuck 67 is used for sucking the cut wafer chips, the fourth electric telescopic rod 65 is used for driving the pushing box 66 to move so as to take out the wafer chips cut on the DAF film, then the fifth motor 62 drives the third mounting shaft 63 to rotate, the third installation axle 63 drives the second installation circle 64 to rotate, makes the second installation circle 64 rotate horizontal position, and the air compressor machine is not working simultaneously, and the chip on the rubber vacuum chuck 67 falls into on the band conveyer and carries out to realize carrying out automatic unloading to the chip after the processing, improved chip production efficiency greatly.
The cutting mechanism comprises a first electric hydraulic rod 71 fixedly connected with a mounting frame 1, a chip cutting machine 72 is fixedly connected to the top end of the first electric hydraulic rod 71, the electroplating mechanism comprises a second electric hydraulic rod 73 fixedly connected with the mounting frame 1, a chip electroplating machine 74 is fixedly connected to the top end of the second electric hydraulic rod 73, after a wafer chip is rotated to the upper part of the chip cutting machine 7272 by the clamping mechanism, the first electric hydraulic rod 71 drives the chip cutting machine 72 to move upwards, the wafer chip is inserted into the chip cutting machine, then the chip cutting machine 72 is used for cutting, automatic cutting of the packaged wafer chip is achieved, the mounting box 4 is driven to rotate after cutting is finished, the clamping mechanism is rotated to the lower part of the chip electroplating machine 74, then the second electric hydraulic rod 73 drives the chip electroplating machine 74 to move downwards, metal electroplating is carried out on the surface of the cut chip, automatic metal electroplating is carried out on the surface of the cut chip, and the electromagnetic interference resistance of the chip is improved.
The working principle of the invention is as follows: the DAF film is sent to a clamping mechanism through a feeding mechanism, then the clamping mechanism clamps and fixes the DAF film, one surface of the DAF film is brushed with adhesive, then a first motor 2 drives a first installation shaft 3 to rotate, the first installation shaft 3 drives a mounting box 4 to turn 180 degrees, then the clamping mechanism moves outwards, packaged wafer chips are placed on the DAF film to be glued, then the clamping mechanism moves inwards to limit and fix the wafer chips, the other surface of the clamping mechanism clamps the DAF film through the matching of the feeding mechanism, then the first motor 2 drives the first installation shaft 3 to rotate 90 degrees, the packaged wafer chips are tightly attached to the DAF film through an extrusion picking and placing mechanism, then the mounting box 4 is driven to turn 90 degrees to enable the clamping mechanism to rotate to the position right above a cutting mechanism, then the cutting mechanism cuts the wafer chips in the clamping mechanism, after cutting, the mounting box 4 is driven to turn 180 degrees, the clamping mechanism is rotated to the position right below the electroplating mechanism, then the clamping mechanism pulls the DAF film outwards, the DAF film stretches, gaps between wafer chips cut on the DAF film are enlarged, then the electroplating mechanism electroplates the surfaces of the wafer chips after encapsulation and cutting, an electromagnetic shielding layer is formed, then the mounting box 4 is driven to rotate 90 degrees, each chip after electroplated with metal is taken down by the extrusion taking-out and placing mechanism, then the clamping mechanism rotates reversely by 90 degrees, the DAF film is not clamped by the clamping mechanism, a worker takes out the DAF film, then the clamping mechanism turns over the DAF film clamped on the other side, then the encapsulated wafer chips are put into processing, and the wafer chips are sequentially reciprocated, so that automatic film pasting cutting after encapsulation of the wafer is realized, automatic feeding of the DAF film is realized, meanwhile, each cut wafer chip is intermittently and automatically enlarged, a film expansion process is not required to be carried out by a film expansion machine, the process is reduced, the production efficiency is improved, and meanwhile, the outer surface of the cut wafer chip is plated with a metal layer, so that the electromagnetic shielding performance of the wafer chip is improved, and meanwhile, the machined chip is automatically fed through an extrusion pick-and-place mechanism. .
The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.

Claims (9)

1. A wafer level packaging process meeting electromagnetic compatibility requirements, comprising the steps of:
firstly, placing a wafer into a circuit manufacturing device, then manufacturing a circuit on the surface of the wafer by the circuit manufacturing device, and arranging the circuit at the edge of a chip;
step two, using a photosensitive dry film, and manufacturing a cavity through a film pasting and exposure developing mode;
step three, preparing a seed layer on the surface of the dry film in a sputtering mode, electroplating metal, leading out I/O, and planting tin balls on the I/O bonding pads;
and step four, placing the wafer chips packaged in the step three into a film pasting, cutting and electroplating integrated machine, and performing automatic cutting and electroplating to obtain the wafer-level packaged chips meeting the electromagnetic compatibility requirement.
2. The wafer level packaging process meeting electromagnetic compatibility requirements according to claim 1, wherein the film-sticking cutting and electroplating integrated machine comprises a mounting frame (1), one side of the mounting frame (1) is fixedly connected with a first motor (2), the output end of the first motor (2) is fixedly connected with a first mounting shaft (3) rotationally connected with the mounting frame (1) through a coupling, one end of the first mounting shaft (3) is fixedly connected with a mounting box (4) rotationally connected with the mounting frame (1), a clamping mechanism is arranged in the mounting box (4), a feeding mechanism connected with the mounting box (4) is arranged below the clamping mechanism, one side of the mounting frame (1) is provided with an extrusion picking and placing mechanism, a cutting mechanism is arranged in the mounting frame (1), and the top of the mounting frame (1) is provided with an electroplating mechanism.
3. The wafer level packaging process according to claim 2, wherein the material clamping mechanism comprises a second motor (11) fixedly connected with a mounting box (4), an output end of the second motor (11) is fixedly connected with a second mounting shaft (12) rotationally connected with the mounting box (4) through a coupling, one end of the second mounting shaft (12) is fixedly connected with a first mounting ring (13) rotationally connected with the mounting box (4), two mounting plates (14) are fixedly connected in the first mounting ring (13), two mounting plates (14) are fixedly connected through a connecting column (15), one sides, far away from each other, of the two mounting plates (14) are provided with a plurality of sliding grooves (16), a clamping frame (17) is slidingly connected with the sliding grooves (16), one end of the first electric telescopic rod (18) is fixedly connected with a clamping block (19), a clamping plate (17) is fixedly connected with one side of the clamping frame (17), the clamping plate (190) is fixedly connected with one side of the clamping plate (190) through a connecting rod (190), one side transmission of drive plate (191) is connected with the first drive mechanism who is connected with mounting disc (14), install cavity (192) have been seted up in mounting disc (14), fixedly connected with electric heating wire (193) in installation cavity (192).
4. A wafer level packaging process according to claim 3, wherein the first transmission mechanism comprises a gear ring (21) rotationally connected with the mounting plate (14), a plurality of first gears (22) are connected to the inner surface of the gear ring (21) in a meshed manner, a transmission shaft (23) rotationally connected with the mounting plate (14) is fixedly sleeved in the middle of the first gears (22), a second gear (24) is fixedly sleeved on the outer surface of the transmission shaft (23), a first rack (25) fixedly connected with the transmission plate (191) is connected to the outer surface of the second gear (24) in a meshed manner, and a driving mechanism connected with the mounting plate (14) is connected to the outer surface of the gear ring (21) in a transmission manner.
5. The wafer level packaging process for meeting electromagnetic compatibility requirements according to claim 4, wherein the driving mechanism comprises a third motor (31) fixedly connected with the mounting plate (14), an output end of the third motor (31) is fixedly connected with a driving shaft (32) through a coupling, an outer surface of the driving shaft (32) is fixedly sleeved with a driving gear (33), and an outer surface of the driving gear (33) is in meshed connection with a second rack (34) fixedly connected with the gear ring (21).
6. The wafer level packaging process according to claim 2, wherein the feeding mechanism comprises a plurality of threaded rods (41) rotationally connected with the mounting box (4), lifting plates (42) are in threaded fit with the outer surfaces of the threaded rods (41), placing plates (43) are fixedly connected to the tops of the lifting plates (42), second electric telescopic rods (44) are fixedly connected to the tops of the lifting plates (42), mounting plates (45) are fixedly connected to the tops of the second electric telescopic rods (44), a third electric telescopic rod (46) is fixedly connected to one side of the mounting plates (45), fixing blocks (47) are fixedly connected to one ends of the third electric telescopic rods (46), second transmission mechanisms are in transmission connection with the outer surfaces of the threaded rods (41), and placing doors are rotationally connected to the outer surfaces of the mounting box (4).
7. The wafer level packaging process according to claim 6, wherein the second transmission mechanism comprises a fourth motor (51) fixedly connected with the mounting box (4), an output end of the fourth motor (51) is fixedly connected with a rotating shaft (52) through a coupling, a first transmission gear (53) is fixedly sleeved on the outer surface of the rotating shaft (52), and a second transmission gear (54) fixedly sleeved with the threaded rod (41) is connected on the outer surface of the first transmission gear (53) in a meshed mode.
8. The wafer level packaging process according to claim 2, wherein the extruding, taking and placing mechanism comprises a connecting plate (61) fixedly connected with a mounting frame (1), one side of the connecting plate (61) is fixedly connected with a fifth motor (62), one end of the fifth motor (62) is fixedly connected with a third mounting shaft (63), one end of the third mounting shaft (63) is fixedly connected with a second mounting ring (64) rotatably connected with the connecting plate (61), a fourth electric telescopic rod (65) is fixedly connected in the second mounting ring (64), one end of the fourth electric telescopic rod (65) is fixedly connected with a pushing box (66) slidably connected with the second mounting ring (64), one side of the pushing box (66) is fixedly connected with a rubber vacuum chuck (67), and one side of the pushing box (66) is fixedly connected with an air inlet pipe (68).
9. The wafer level packaging process according to claim 2, wherein the cutting mechanism comprises a first electric hydraulic rod (71) fixedly connected with the mounting frame (1), a chip cutter (72) is fixedly connected to the top end of the first electric hydraulic rod (71), the electroplating mechanism comprises a second electric hydraulic rod (73) fixedly connected with the mounting frame (1), and a chip electroplating machine (74) is fixedly connected to the top of the second electric hydraulic rod (73).
CN202310604912.9A 2023-05-24 2023-05-24 Wafer level packaging technology meeting electromagnetic compatibility requirement Active CN116646255B (en)

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Publication number Priority date Publication date Assignee Title
KR20090094629A (en) * 2008-03-03 2009-09-08 씨 선 엠에프지 리미티드 Wafer membrane cutter
CN102168293A (en) * 2011-01-20 2011-08-31 宁波华龙电子股份有限公司 Membrane sticking electroplating process for lead frame and special device thereof
JP2019110188A (en) * 2017-12-18 2019-07-04 株式会社ディスコ Extension device
CN209747465U (en) * 2019-03-18 2019-12-06 广东思沃精密机械有限公司 Film sticking machine
CN113299594A (en) * 2021-05-25 2021-08-24 江西信芯半导体有限公司 Post-processing method for blue film pasting of TVS chip
CN115527895A (en) * 2022-09-23 2022-12-27 广州兴森快捷电路科技有限公司 Wafer film pasting equipment and wafer film pasting method
CN115799119A (en) * 2022-12-09 2023-03-14 允哲半导体科技(浙江)有限公司 Multifunctional film pasting device and method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090094629A (en) * 2008-03-03 2009-09-08 씨 선 엠에프지 리미티드 Wafer membrane cutter
CN102168293A (en) * 2011-01-20 2011-08-31 宁波华龙电子股份有限公司 Membrane sticking electroplating process for lead frame and special device thereof
JP2019110188A (en) * 2017-12-18 2019-07-04 株式会社ディスコ Extension device
CN209747465U (en) * 2019-03-18 2019-12-06 广东思沃精密机械有限公司 Film sticking machine
CN113299594A (en) * 2021-05-25 2021-08-24 江西信芯半导体有限公司 Post-processing method for blue film pasting of TVS chip
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CN115799119A (en) * 2022-12-09 2023-03-14 允哲半导体科技(浙江)有限公司 Multifunctional film pasting device and method

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