CN116364619B - Chip wafer pad pasting cuts device - Google Patents

Chip wafer pad pasting cuts device Download PDF

Info

Publication number
CN116364619B
CN116364619B CN202310301651.3A CN202310301651A CN116364619B CN 116364619 B CN116364619 B CN 116364619B CN 202310301651 A CN202310301651 A CN 202310301651A CN 116364619 B CN116364619 B CN 116364619B
Authority
CN
China
Prior art keywords
film
frame
slitting
wafer
pasting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202310301651.3A
Other languages
Chinese (zh)
Other versions
CN116364619A (en
Inventor
刘玉德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xinxiang Microelectronics Nantong Co ltd
Original Assignee
Xinxiang Microelectronics Nantong Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xinxiang Microelectronics Nantong Co ltd filed Critical Xinxiang Microelectronics Nantong Co ltd
Priority to CN202310301651.3A priority Critical patent/CN116364619B/en
Publication of CN116364619A publication Critical patent/CN116364619A/en
Application granted granted Critical
Publication of CN116364619B publication Critical patent/CN116364619B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/001—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to the technical field of chip processing, in particular to a chip wafer film pasting and slitting device, which is characterized in that film pasting and synchronous slitting of wafers on primary and secondary rings are realized through a film pasting and slitting mechanism, sequential feeding of the primary and secondary rings and the wafers is realized through a feeding mechanism, film pasting and slitting are realized under the assistance of a centering mechanism, the processed wafers and the primary and secondary rings are combined and transferred to a discharging mechanism by utilizing a material transferring mechanism to stack and transfer, automatic winding and unwinding of a film are realized by utilizing a film material winding and unwinding mechanism, the whole operation is realized by adopting automatic equipment, the film pasting and slitting device is efficient and orderly, the closing degree of the film pasting can be effectively ensured, the film material slitting is orderly, and the complete separation of cut edge materials and main materials can be realized.

Description

Chip wafer pad pasting cuts device
Technical Field
The invention relates to the technical field of chip processing, in particular to a chip wafer film pasting and cutting device.
Background
A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape; various circuit element structures can be fabricated on silicon wafers to become integrated circuit products with specific electrical functions.
In the wafer production process, the finished product is required to be pasted to be protected, the manual pasting is generally adopted in the prior art, the pasting speed is low, the labor cost is high, deviation, damage, unevenness and bubbles are easy to occur in the pasting process, the pasting effect is affected, particularly in the existing pasting technology, the film material is scraped to be flat after being scraped with the surface of the wafer, the film material is pasted on the wafer, the wafer is easy to damage due to the fact that the wafer is extremely thin, the pasting degree of the film material and the wafer is poor, and bubbles are easy to generate.
Therefore, the invention provides a chip wafer film pasting and slitting device, which realizes automatic feeding and combined film pasting on a wafer and a primary ring and adopts an gradual-open type blowing and pasting mode to realize film pasting and ensure the tightness between a film material and the wafer.
Disclosure of Invention
To solve the technical problems.
The application provides a device is cut to chip wafer pad pasting, include: the film laminating and slitting machine comprises a frame, a feeding mechanism, a film laminating and slitting mechanism, a centering mechanism, a material moving mechanism, a blanking mechanism and a film laminating and slitting mechanism, wherein the feeding mechanism, the film laminating and slitting mechanism, the material moving mechanism and the blanking mechanism are sequentially arranged on the frame along the length direction of the frame;
The feed mechanism includes: the device comprises a primary-secondary ring feeding assembly, a wafer feeding assembly and a carrying manipulator, wherein the primary-secondary ring feeding assembly and the wafer feeding assembly are respectively arranged at one end of a frame through a base, the base is arranged at one end of the frame far away from a blanking mechanism, a first lifting sliding rail set is vertically arranged on the base, two ends of the first lifting sliding rail set are respectively provided with two material conveying plates in a sliding manner, the two material conveying plates are fixedly connected, the material conveying plates at the lower end are driven through a first push rod, the first push rod is arranged on the base, the output end of the first push rod is fixedly connected with the material conveying plates at the lower end, the carrying manipulator can be rotatably arranged on the base, and the carrying manipulator can be right against the material conveying plates and a similar centering mechanism;
the film material winding and unwinding mechanism comprises: a film releasing roller group for releasing the film material and a film winding roller group for winding the film material margin after film pasting and slitting.
Preferably, the primary and secondary ring material loading subassembly includes holds in the palm work or material rest and two branch flitch, holds in the palm work or material rest horizontal fixed mounting at the top of first lift slide rail group, and two branch flitch respectively through a first cylinder symmetry install in the both sides of holding in the palm the work or material rest, every branch flitch and the output fixed connection of corresponding first cylinder, holds in the palm the center of work or material rest and is provided with the feed opening, and two branch flitch are located the both sides of feed opening respectively and just to the feed opening.
Preferably, the film pasting slitting mechanism is arranged on the upper half part of the frame through a supporting plate, an gradually-opened blowing and pasting component is arranged below the supporting plate through a lifting frame, the lifting frame is slidably arranged on the supporting plate, the lifting frame is connected with the supporting plate through a second push rod in a transmission manner, the second push rod is fixedly arranged on the supporting plate, the output end of the second push rod penetrates through the supporting plate and is fixedly connected with the top of the lifting frame, the gradually-opened blowing and pasting component is arranged on the lifting frame through an air pipe, the air pipe is fixedly arranged at the center of the lifting frame, and the gradually-opened blowing and pasting component is fixedly arranged at the lower end of the air pipe and is opposite to an air port of the air pipe.
Preferably, the involute type blowing and pasting component comprises an iris opening and closing module and a driving toothed ring, the iris opening and closing module is fixedly arranged at the lower end of the air pipe, the driving toothed ring is sleeved on the outer side of the iris opening and closing module through an annular mounting plate and is connected with the driving end of the iris opening and closing module through a transmission toothed head, the annular mounting plate is fixedly arranged at the bottom of the iris opening and closing module, the driving toothed ring is in sliding connection with the annular mounting plate, the transmission toothed head is fixedly connected with each driving end of the iris opening and closing module, the driving toothed ring is in transmission connection with the transmission toothed head, two arc-shaped guide sliding plates are symmetrically arranged at the upper end of the driving toothed ring, each arc-shaped guide sliding plate is in sliding connection with a supporting plate through an arc-shaped sliding way, the arc-shaped guide sliding plates are arranged on two sides of the supporting plate, the top of each arc-shaped guide sliding plate is fixedly provided with a spiral arc rod, the spiral arc rod can be in sliding connection with the corresponding arc-shaped sliding way, the top of the spiral arc rod is provided with a transition head, the transition head is connected with a close guide rod of a lifting frame through a reset spring, the reset spring is in sliding connection with the guide rod, the guide rod is in a spring rotating connection, and each reset spring is in sliding connection with the corresponding guide rod, and the guide rod is in sliding connection through a hook.
Preferably, the lower extreme of annular mounting panel is installed and is cut the subassembly, cuts the subassembly and includes annular cutter and annular guard blade, and annular cutter installs the intra-annular wall at annular mounting panel, and annular guard blade is connected with annular mounting panel through a plurality of first spring, and a plurality of flexible post is evenly installed to the upper surface of annular guard blade, and every flexible post is all pegged graft on annular mounting panel through the expansion hole, and the bottom surface at annular mounting panel is offered to the expansion hole, and every first spring all overlaps to be established outside corresponding flexible post, and the both ends of every first spring are respectively with annular guard blade and annular mounting panel fixed connection.
Preferably, the lower extreme of crane is provided with two sets of film pressing roller sets, two film pressing roller sets are installed at the lower extreme of crane along the length direction symmetry of frame respectively through two hack levers, film pressing roller sets include film pressing roller axle and articulated spindle nose, film pressing roller axle is installed between two hack lever ends through two articulated spindle nose, film pressing roller axle can pivoted install between two articulated spindle nose, the upper end of articulated spindle nose is articulated with the end of hack lever, the lower extreme of articulated spindle nose is connected with the hack lever through the second spring, the both ends of hack lever all are provided with can only let the outwards rotation of articulated spindle nose and can not inwards pivoted limiting plate.
Preferably, the material moving mechanism comprises a material moving assembly and a material guide rail group, the material moving assembly and the material guide rail group are all installed on a workbench surface of a machine frame, the material moving assembly comprises an electric sliding table module and a material moving clamp, the electric sliding table module is installed on one side of the workbench surface along the length direction of the machine frame, the material moving clamp is installed on a sliding table of the electric sliding table module through a connecting plate, a rotary cylinder is installed at the upper end of the connecting plate, the output end of the rotary cylinder is fixedly connected with the material moving clamp, and the material moving clamp can be opposite to the centering mechanism and the blanking mechanism.
Preferably, the guide rail group comprises a bidirectional sliding table module and two guide rail frames, wherein the two guide rail frames are symmetrically arranged at two ends of the bidirectional sliding table module, the guide rail frames are slidably connected with the working table surface of the frame through movable grooves, and the guide rail frames are flush with the working table surface of the centering mechanism and the feeding opening of the blanking mechanism.
Preferably, the discharging mechanism comprises a receiving box and a box clamping assembly, the receiving box is arranged at one end of the frame far away from the feeding mechanism through a box supporting plate and a second lifting sliding rail set, the box clamping assembly is arranged on the box supporting plate, the box supporting plate is in sliding connection with the second lifting sliding rail set, the lower end of the box supporting plate is connected with a third push rod, the output end of the third push rod is fixedly connected with the box supporting plate, and the third push rod is vertically arranged on the frame.
Preferably, a method for dicing a film of a chip wafer is provided:
s1: feeding material
The method comprises the steps that primary and secondary rings and wafers are fed through a primary and secondary ring feeding assembly and a wafer feeding assembly, the primary and secondary rings are sequentially fed to upper-end material conveying plates through the primary and secondary ring feeding assembly, the wafers are sequentially fed to lower-end material conveying plates through the wafer feeding assembly, when the primary and secondary rings are fed and placed on the upper-end material conveying plates, a first push rod drives two material conveying plates to move downwards, a carrying manipulator rotates to the upper-end material conveying plates and clamps the primary and secondary rings to a similar centering mechanism, the wafer feeding assembly pushes the wafers to the lower-end material conveying plates, then the first push rod pushes the lower-end material conveying plates upwards, the carrying manipulator rotates to the corresponding centering mechanism again after placing the primary and secondary rings on the corresponding centering mechanism, and the wafers are clamped and placed on the centering mechanism and the corresponding primary and secondary rings;
the stacked primary and secondary rings are placed above the material supporting frame and are supported and clamped by two material distributing clamping plates, when the material is required to be discharged, the first air cylinder drives the two material distributing clamping plates to retract, so that the stacked primary and secondary rings fall onto the lower material conveying plate from the material discharging opening, then the first air cylinder stretches out again, the two material distributing clamping plates separate the lowest primary and secondary ring from other primary and secondary rings, and the other primary and secondary rings are supported, so that the primary and secondary rings are fed one by one. The wafer feeding assembly is similar to the wafer feeding assembly, and the principle of the wafer feeding assembly is that stacking and one-by-one material distribution of wafers are realized;
S2: centering blowing patch
After the primary and secondary rings and the wafer are centered and clamped through the centering mechanism, the film pasting and cutting mechanism works, the film pasting and cutting mechanism is matched with the film placing roller group and the film rolling roller group to realize film material transmission, unused film materials are transmitted to the upper part of the centering mechanism, then the wafer and the primary and secondary rings are combined and subjected to film pasting and cutting to realize separation of the film materials and the wafer, and then the film pasting and cutting mechanism is reset; the second push rod and the lifting frame are matched to realize the up-and-down movement of the gradually-opened type blowing and pasting component and the air pipe, so that the gradually-opened type blowing and pasting component and the air pipe can approach to the centering mechanism and the wafer below the gradually-opened type blowing and pasting component, and after the gradually-opened type blowing and pasting component descends to a certain position, the gradually-opened type blowing and pasting component is opened to blow and paste the film material on the surfaces of the wafer and the primary ring and the secondary ring;
the size of the air pipe orifice is adjusted through the iris opening and closing module, and the iris opening and closing module is opened and closed by driving the driving gear and the transmission gear head. When the device works, the second push rod pushes the lifting frame to move downwards, the centering mechanism and the wafer are close to the lower part, meanwhile, the air pipe, the driving toothed ring and the iris opening and closing module move downwards along with the centering mechanism and the wafer, the arc-shaped guide sliding plate on the driving toothed ring is clung to one end of the arc-shaped sliding rail and slides downwards, when the top of the arc-shaped guide sliding plate completely slides into the arc-shaped sliding rail, the bottom of the spiral arc rod starts to be in abutting sliding with one end of the arc-shaped sliding rail, the spiral arc rod is further driven to move downwards and simultaneously drives the arc-shaped guide sliding plate and the driving toothed ring to rotate, the driving toothed ring drives the transmission toothed head and the iris opening and closing module to gradually open an air port of the air pipe, and the iris opening and closing module is gradually close to the wafer and the membrane material while opening, so that the wind force is maintained, the membrane material and the wafer are attached from inside to outside can be effectively avoided, after membrane pasting cutting is finished, the second push rod drives the lifting frame to reset, and the driving toothed ring to rise simultaneously under the action of the reset spring, and the arc-shaped guide sliding plate and the spiral arc rod rotate to reset the air port to drive the air port to close the air port;
S3: prepressing
Through the cooperation between the film pressing roller groups, the film material is pressed to the surface of the wafer, and the film material is prevented from wrinkling and loosening. The membrane material is discharged from the membrane discharging roller group, the membrane material is rolled by the membrane rolling roller group after passing through the lower parts of the two membrane pressing roller groups in sequence, firstly, the membrane discharging roller group is started to discharge membranes, meanwhile, the second push rod pushes the lifting frame to move downwards, the frame rod of the lifting frame and the membrane pressing roller group push the membrane material downwards to be close to a wafer, after the membrane material is attached to the wafer, the lifting frame continues to move downwards, the hinge shaft head and the membrane pressing roller shaft rotate outwards under the action of force between the membrane material and the working table, and then the membrane pressing roller shaft further tightens the membrane material, so that the membrane material is prevented from wrinkling on the surface of the wafer, dislocation and bubbles in the follow-up slitting and membrane pasting processes are also prevented, and after slitting, the membrane pressing roller shaft slowly resets due to the fact that the slitting assembly leaves the wafer and the membrane material firstly, so that the laminated membrane material and the residual membrane material are separated
S4: cutting: the slitting assembly is arranged at the lower end of the involute type blowing and pasting assembly, so that the slitting assembly can ascend and descend along with the lifting frame, the slitting assembly and the film material are jointed, the film material is slit through the annular cutter, when the film material is blown and pasted, the gradually-opened blowing and pasting assembly and the slitting assembly are gradually close to the film material to be slit, when the iris opening and closing module is completely opened, the slitting assembly just fits the film material to be slit at the moment, after the film material is blown and pasted, the lifting frame is continuously pushed downwards by the second push rod, the annular cutter protection plate upwards compresses the first spring, the annular cutter is exposed and cuts the film material, and after the film material is cut, the annular cutter protection plate is reset under the action of the first spring, and the annular cutter is blocked;
S5: material moving
The material transferring assembly and the material guiding rail set are used for transferring materials, the sliding table module is driven to drive the connecting plate and the material transferring clamp to move to the centering mechanism of the film pasting and cutting station, the material transferring clamp clamps the wafer and the primary and secondary ring combination, the rotary cylinder drives the material transferring clamp and the wafer to rotate, the wafer and the primary and secondary ring combination can be placed on the material guiding rail set, the electric sliding table module reversely moves to transfer the materials to the other centering mechanism, and after further processing is completed, the material transferring clamp clamps the materials again, and the electric sliding table module continues to transfer the materials to the blanking mechanism to complete the processing;
the two-way sliding table module drives the material guide rail frames to be close to or far away from each other, when the material guide is required to be transferred, the two material guide frames are close to each other, the material transfer clamp places the material on the two material guide rail frames and pushes the material along the length direction of the material guide rail frames, and the material guide rail frames are aligned with the material inlet of the blanking mechanism and then pushed into the blanking mechanism;
s6: discharging
Realize wafer and primary and secondary ring combination unloading through unloading mechanism, realize the progressively lift of magazine layer board by second lift slide rail group and third push rod cooperation, during the unloading, the material is upwards piled up from receiving the magazine lower floor layer by layer, and when empty receiving magazine placed on the magazine layer board after, the magazine clamping assembly is fixed the magazine centre gripping, realizes with moving the alignment of material mechanism, places simultaneously and receives the friction of magazine in-process material and the dislocation of material box removal that causes.
The beneficial effects are that:
1. the film pasting and synchronous cutting of the wafer on the primary and secondary rings are realized through the film pasting and cutting mechanism, the primary and secondary rings and the wafer are sequentially fed through the feeding mechanism, then the film pasting and cutting are realized under the assistance of the centering mechanism, the processed wafer and primary and secondary rings are combined and transferred to the discharging mechanism by the material moving mechanism to be stacked and transported, the film material winding and unwinding mechanism is utilized to realize automatic winding and unwinding of the film, the whole operation is realized by adopting automatic equipment, the film pasting and cutting mechanism is efficient and orderly, the closing degree of the film pasting can be effectively guaranteed, the film material cutting is neat, and the complete separation of the cut edge material and the main material can be realized.
2. According to the film pressing roller set, the film material is pressed to the surface of the wafer through the cooperation between the film pressing roller set, and the film material is prevented from wrinkling and loosening. Utilize articulated spindle nose and press the membrane roller to outwards rotate under the effect between membrane material and table surface, and then make the press the membrane roller with the further tensioning of membrane material, prevent that the membrane material from wrinkling at the wafer surface, also prevent follow-up cutting and the appearance of pad pasting in-process dislocation and bubble, owing to cut the subassembly and leave wafer and membrane material first after cutting moreover, press the membrane roller then can slowly reset to the membrane material of laminating and surplus membrane material separation of being convenient for.
3. The utility model discloses an iris switching module realizes the regulation to the orificial size of tuber pipe, and the drive ring gear drives the transmission tooth head and iris switching module opens the wind gap of tuber pipe gradually, when opening, iris switching module is close to wafer and membrane material gradually, maintains wind-force size.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic diagram of a second perspective structure of the present invention;
FIG. 3 is a schematic perspective view of a third embodiment of the present invention;
FIG. 4 is a schematic perspective view of a fourth embodiment of the present invention;
FIG. 5 is a front view of the present invention;
FIG. 6 is a schematic diagram of a three-dimensional structure of a film slitting mechanism according to the present invention;
FIG. 7 is a schematic diagram of a second perspective structure of the film slitting mechanism of the present invention;
fig. 8 is a schematic three-dimensional structure of the film slitting mechanism of the present invention;
FIG. 9 is a cross-sectional view of the film slitting mechanism of the present invention;
fig. 10 is an enlarged view at a in fig. 9;
FIG. 11 is an exploded view of the film slitting mechanism of the present invention;
FIG. 12 is an exploded view of a film slitting mechanism according to the present invention;
fig. 13 is a schematic perspective view of a feeding mechanism according to the present invention;
fig. 14 is a schematic diagram of a three-dimensional structure of a feeding mechanism according to the present invention;
FIG. 15 is a schematic perspective view of a material transferring mechanism and a material discharging mechanism according to the present invention;
Fig. 16 is a schematic diagram showing a three-dimensional structure of a material transferring mechanism and a material discharging mechanism according to the present invention.
The reference numerals in the figures are:
1-a frame;
2-a feeding mechanism; 2 a-primary and secondary ring feeding components; 2a 1-a material supporting frame; 2a 2-a material distributing clamping plate; 2a 3-a first cylinder; 2a 4-a feed opening; 2 b-wafer loading assembly; 2 c-a handling manipulator; 2 d-a base; 2 e-a first lifting slide rail group; 2 f-a first push rod; 2 g-a material conveying plate;
3-film pasting and cutting mechanism; 3 a-a support plate; 3a 1-an arc-shaped slideway; 3 b-involute type blowing and pasting component; 3b 1-iris opening and closing module; 3b 2-driving a toothed ring; 3b 3-arc-shaped guide sliding plates; 3b 4-helical arc rod; 3b 5-a drive tooth head; 3b 6-a ring-shaped mounting plate; 3b 7-return spring; 3b 8-spring swivel hook; 3 c-a slitting assembly; 3c 1-a ring cutter; 3c 2-annular knife protection plates; 3c 3-telescoping column; 3c 4-a first spring; 3c 5-telescopic holes; 3 d-an air pipe; 3 e-lifting frames; 3e 1-hack lever; 3e 2-limiting plates; 3 f-a second pushrod; 3 g-film pressing roller group; 3g 1-film pressing roll shaft; 3g of 2-hinge shaft heads; 3g 3-second spring;
4-centering mechanism;
5-a material moving mechanism; 5 a-a material moving assembly; 5a 1-an electric slipway module; 5a 2-connecting plate; 5a 3-rotary cylinder; 5a 4-material moving clamping hand; 5 b-a stock guide set; 5b 1-a bidirectional sliding table module; 5b 2-a guide rail frame; 5b 3-a movable trough;
6-a blanking mechanism; 6 a-receiving box; 6 b-a material box supporting plate; 6 c-a cartridge clamping assembly; 6 d-a second lifting slide rail group; 6 e-a third pushrod;
7-a film material winding and unwinding mechanism; 7a, film placing roller group; 7 b-film winding roller group.
Detailed Description
The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art.
As shown in fig. 1 to 4, the following preferred technical solutions are provided:
a die wafer film slitting device comprising: the film laminating and slitting machine comprises a frame 1, a feeding mechanism 2, a film laminating and slitting mechanism 3, a centering mechanism 4, a material moving mechanism 5, a blanking mechanism 6 and a film laminating and slitting mechanism 7, wherein the feeding mechanism 2, the film laminating and slitting mechanism 3, the material moving mechanism 5 and the blanking mechanism 6 are sequentially arranged on the frame 1 along the length direction of the frame 1, the film laminating and slitting mechanism 7 is arranged at the top of the frame 1, the centering mechanisms 4 are two and respectively face to the film laminating and slitting mechanism 3 and other wafer processing stations used for laminating, and the film laminating and slitting mechanism 3 is arranged between the film laminating and slitting mechanism 7 and the centering mechanism 4;
the feeding mechanism 2 includes: the primary-secondary ring feeding assembly 2a, the wafer feeding assembly 2b and the carrying manipulator 2c are respectively arranged at one end of the frame 1 through a base 2d, the base 2d is arranged at one end of the frame 1 far away from the blanking mechanism 6, a first lifting sliding rail set 2e is vertically arranged on the base 2d, two material conveying plates 2g are respectively and slidably arranged at two ends of the first lifting sliding rail set 2e, the two material conveying plates 2g are fixedly connected, the material conveying plate 2g at the lower end is driven by a first push rod 2f, the first push rod 2f is arranged on the base 2d, the output end of the first push rod 2f is fixedly connected with the material conveying plate 2g at the lower end, the carrying manipulator 2c can be rotatably arranged on the base 2d, and the carrying manipulator 2c can be opposite to the material conveying plates 2g and the similar centering mechanism 4;
The film material winding and unwinding mechanism 7 comprises: a film discharging roller group 7a for discharging the film material and a film rolling roller group 7b for film material surplus edges after film pasting and slitting.
Specifically, in order to solve the technical problems of film pasting and slitting of chip wafers in the processing process, film pasting and synchronous slitting of the wafers on the primary and secondary rings are realized through the film pasting slitting mechanism 3, sequential feeding of the primary and secondary rings and the wafers is realized through the feeding mechanism 2, film pasting and slitting are realized under the assistance of the centering mechanism 4, the processed wafers and the primary and secondary rings are combined and transferred to the blanking mechanism 6 by the material transferring mechanism 5 for stacking and transferring, automatic film winding and unwinding is realized by the film material winding and unwinding mechanism 7, and the whole operation is realized by adopting automatic equipment.
As shown in fig. 13 and 14, the following preferred technical solutions are provided:
the primary and secondary ring material loading subassembly 2a includes holds in the palm work or material rest 2a1 and two branch flitch 2a, holds in the palm work or material rest 2a1 horizontal fixed mounting at the top of first lift slide rail group 2e, and two branch flitch 2a2 are respectively through a first cylinder 2a3 symmetry installation in the both sides of holding in the palm work or material rest 2a1, and every branch flitch 2a2 is fixed connection with the output of corresponding first cylinder 2a3, and the center of holding in the palm work or material rest 2a1 is provided with feed opening 2a4, and two branch flitch 2a2 are located the both sides of feed opening 2a4 respectively and just to feed opening 2a4.
Specifically, in order to solve the technical problem of feeding of the primary-secondary ring and the wafer, feeding is achieved through the cooperation of the primary-secondary ring feeding component 2a and the wafer feeding component 2b, the primary-secondary ring feeding component 2a is disclosed, the stacked primary-secondary rings are placed above the material supporting frame 2a1 and are supported and clamped by the two material distributing clamping plates 2a2, when discharging is needed, the first cylinder 2a3 drives the two material distributing clamping plates 2a2 to retract, the stacked primary-secondary rings fall onto the lower material conveying plate 2g from the discharging opening 2a4, then the first cylinder 2a3 stretches out again, the two material distributing clamping plates 2a2 separate the primary-secondary ring at the lowest position from other primary-secondary rings, the other primary-secondary rings are supported, and the primary-secondary rings are fed one by one. Similarly, the wafer loading assembly 2b is also based on the principle of stacking and individually dividing the wafers.
As shown in fig. 1 to 4, the following preferred technical solutions are provided:
the film pasting and slitting mechanism 3 is arranged on the upper half part of the frame 1 through a supporting plate 3a, an gradually-opened type blowing and pasting component 3b is arranged below the supporting plate 3a through a lifting frame 3e, the lifting frame 3e is slidably arranged on the supporting plate 3a, the lifting frame 3e and the supporting plate 3a are in transmission connection through a second push rod 3f, the second push rod 3f is fixedly arranged on the supporting plate 3a, the output end of the second push rod 3f penetrates through the supporting plate 3a and is fixedly connected with the top of the lifting frame 3e, the gradually-opened type blowing and pasting component 3b is arranged on the lifting frame 3e through an air pipe 3d, the air pipe 3d is fixedly arranged at the center of the lifting frame 3e, and the gradually-opened type blowing and pasting component 3b is fixedly arranged at the lower end of the air pipe 3d and is opposite to an air port of the air pipe 3 d.
Specifically, in order to solve the technical problems of fast film pasting and slitting of a wafer and ensuring the tightness of film pasting, the invention realizes the up-and-down movement of the gradually-opened type blowing and pasting component 3b and the air pipe 3d through the cooperation of the second push rod 3f and the lifting frame 3e, so that the gradually-opened type blowing and pasting component 3b and the air pipe 3d can approach to the centering mechanism 4 and the wafer positioned below the gradually-opened type blowing and pasting component 3b to blow and paste a film material on the surfaces of the wafer and the primary and secondary rings after the gradually-opened type blowing and pasting component 3b descends to a certain position.
As shown in fig. 6 to 12, the following preferred technical solutions are provided:
the gradually-opened blowing and pasting component 3b comprises an iris opening and closing module 3b1 and a driving toothed ring 3b2, the iris opening and closing module 3b1 is fixedly arranged at the lower end of an air pipe 3d, the driving toothed ring 3b2 is sleeved outside the iris opening and closing module 3b1 through an annular mounting plate 3b6 and is connected with the driving end of the iris opening and closing module 3b1 through a driving toothed head 3b5, the annular mounting plate 3b6 is fixedly arranged at the bottom of the iris opening and closing module 3b1, the driving toothed ring 3b2 is slidingly connected with the annular mounting plate 3b6, the driving toothed head 3b5 is fixedly connected with each driving end of the iris opening and closing module 3b1, the driving toothed ring 3b2 is in transmission connection with the driving toothed head 3b5, two arc-shaped guide sliding plates 3b3 are symmetrically arranged at the upper end of the driving toothed ring 3b2, every arc direction slide 3b3 all passes through arc slide 3a1 and backup pad 3a sliding connection, arc direction slide 3b3 and arc slide 3a1 sliding connection, the both sides at backup pad 3a are seted up to arc slide 3a1, the fixed spiral arc pole 3b4 that is provided with in top of every arc direction slide 3b3, spiral arc pole 3b4 can with corresponding arc slide 3a1 sliding connection, the top of spiral arc pole 3b4 is provided with the transition head, the transition head is connected through reset spring 3b7 with the guide bar that is close to of crane 3e, be connected through spring swivel hook 3b8 between reset spring 3b7 and the guide bar, the cover of spring swivel hook 3b8 is established on the guide bar that corresponds.
Specifically, in order to solve the technical problem that the air pipe 3d can be opened from inside to outside, the invention realizes the adjustment of the size of the pipe orifice of the air pipe 3d through the iris opening and closing module 3b1, and the iris opening and closing module 3b1 is opened and closed by driving the driving gear and the transmission gear head 3b 5. When in work, the second push rod 3f pushes the lifting frame 3e to move downwards, the centering mechanism 4 and the wafer close to the lower part are moved downwards, meanwhile, the air pipe 3d, the driving toothed ring 3b2 and the iris opening and closing module 3b1 move downwards along with the lifting frame, at the moment, the arc-shaped guide sliding plate 3b3 on the driving toothed ring 3b2 is clung to one end of the arc-shaped sliding way 3a1 and slides downwards, when the top of the arc-shaped guide sliding plate 3b3 completely slides into the arc-shaped sliding way 3a1, the bottom of the spiral arc rod 3b4 starts to slide in abutting connection with one end of the arc-shaped sliding way 3a1, so that the spiral arc rod 3b4 moves downwards and simultaneously drives the arc-shaped guide sliding plate 3b3 and the driving toothed ring 3b2 to rotate, the driving toothed ring 3b2 drives the transmission toothed head 3b5 and the iris opening and closing module 3b1 to gradually open the air inlet of the air pipe 3d, and when the iris opening and closing module 3b1 is gradually close to the wafer and the film material, the wind power is maintained, so that the film material and the wafer are attached from inside to outside, the occurrence of bubbles can be effectively avoided, when the film pasting is cut, the second push rod 3f drives the lifting frame 3e to reset, the driving toothed ring 3b2 also ascends along with the lifting frame, and the arc-shaped guide sliding plate 3b3 and the spiral arc rod 3b4 drive the driving toothed ring 3b2 to rotate and reset under the action of the reset spring 3b7, so that the iris opening and closing module 3b1 closes the air inlet of the air pipe 3 d.
As shown in fig. 6 to 12, the following preferred technical solutions are provided:
the lower extreme of annular mounting panel 3b6 is installed and is cut subassembly 3c, cut subassembly 3c includes annular cutter 3c1 and annular guard plate 3c2, annular cutter 3c1 installs the intra-annular wall at annular mounting panel 3b6, annular guard plate 3c2 is connected with annular mounting panel 3b6 through a plurality of first spring 3c4, a plurality of telescopic column 3c3 are evenly installed to the upper surface of annular guard plate 3c2, every telescopic column 3c3 is all pegged graft on annular mounting panel 3b6 through telescopic hole 3c5, telescopic hole 3c5 is seted up at annular mounting panel 3b 6's bottom surface, every first spring 3c4 all overlaps and is established outside corresponding telescopic column 3c3, the both ends of every first spring 3c4 are respectively with annular guard plate 3c2 and annular mounting panel 3b6 fixed connection.
Specifically, in order to solve the technical problem of slitting between the film material which is already laminated and the residual film material on the outer side of the wafer, the slitting assembly 3c is arranged at the lower end of the involute type blowing and pasting assembly 3b, so that the slitting assembly 3c can ascend and descend along with the lifting frame 3e, the lamination of the slitting assembly 3c and the film material is realized, the film material is slit through the annular cutter 3c1, when the film material is blown and pasted, the gradually-opened blowing and pasting assembly 3b and the slitting assembly 3c are gradually close to the film material to be cut, after the iris opening and closing module 3b1 is completely opened, the slitting assembly 3c is just laminated with the film material to be cut at the moment, after the blowing and pasting is completed, the lifting frame 3e is continuously pushed downwards by the second push rod 3f, the annular cutter 3c2 compresses the first spring 3c4 upwards, the annular cutter 3c1 is exposed at the same time, the annular cutter 3c2 is reset under the action of the first spring 3c4 after the slitting is completed, and the annular cutter 3c1 is blocked.
As shown in fig. 6 to 12, the following preferred technical solutions are provided:
the lower extreme of crane 3e is provided with two sets of film pressing roller group 3g, two film pressing roller group 3g is installed at the lower extreme of crane 3e along the length direction symmetry of frame 1 respectively through two hack lever 3e1, film pressing roller group 3g includes film pressing roller axle 3g1 and articulated spindle nose 3g2, film pressing roller axle 3g1 is installed between two hack lever 3e1 ends through two articulated spindle nose 3g2, film pressing roller axle 3g1 rotatable install between two articulated spindle nose 3g2, the upper end of articulated spindle nose 3g2 is articulated with the end of hack lever 3e1, the lower extreme of articulated spindle nose 3g2 is connected with hack lever 3e1 through second spring 3g3, the both ends of hack lever 3e1 all are provided with can only let articulated spindle nose 3g2 outwards rotate and can not inwards pivoted limiting plate 3e2.
Specifically, in order to solve the technical problem of pre-lamination before lamination of the film materials, the film materials are pressed to the surface of the wafer through the cooperation between the film pressing roller sets 3g, so that the film materials are prevented from wrinkling and loosening. The film material is discharged from the film discharging roller group 7a, is rolled by the film rolling roller group 7b after passing through the lower parts of the two film pressing roller groups 3g in sequence, firstly, the film discharging roller group 7a is started to discharge films, meanwhile, the second push rod 3f pushes the lifting frame 3e to move downwards, the hack lever 3e1 of the lifting frame 3e and the film pressing roller group 3g push the film material downwards to be close to a wafer, after the film material is attached to the wafer, the lifting frame 3e continues to move downwards, the hinge shaft head 3g2 and the film pressing roller shaft 3g1 rotate outwards under the action of the force between the film material and the working table, the film pressing roller shaft 3g1 further tightens the film material further, the film material is prevented from wrinkling on the surface of the wafer, dislocation and bubble occurrence in the follow-up slitting and film pasting processes are also prevented, and after slitting, the slitting assembly 3c leaves the wafer and the film material firstly, and the film pressing roller shaft 3g1 slowly resets so that the attached film material and the residual film material are separated.
As shown in fig. 15 and 16, the following preferred technical solutions are provided:
the material moving mechanism 5 comprises a material moving assembly 5a and a material guide rail group 5b, the material moving assembly 5a and the material guide rail group 5b are both arranged on a workbench surface of the machine frame 1, the material moving assembly 5a comprises an electric sliding table module 5a1 and a material moving clamp 5a4, the electric sliding table module 5a1 is arranged on one side of the workbench surface of the machine frame 1 along the length direction, the material moving clamp 5a4 is arranged on a sliding table of the electric sliding table module 5a1 through a connecting plate 5a2, a rotary cylinder 5a3 is arranged at the upper end of the connecting plate 5a2, the output end of the rotary cylinder 5a3 is fixedly connected with the material moving clamp 5a4, and the material moving clamp 5a4 can be opposite to the centering mechanism 4 and the blanking mechanism 6.
Specifically, in order to solve the technical problem of material transferring of a wafer and primary-secondary ring combination after film pasting and cutting, the material transferring is realized through the material transferring component 5a and the material guiding rail group 5b, firstly, a sliding table module is driven to drive a connecting plate 5a2 and a material transferring clamp 5a4 to move to a centering mechanism 4 of a film pasting and cutting station, the material transferring clamp 5a4 clamps the wafer and the primary-secondary ring combination, a rotary cylinder 5a3 drives the material transferring clamp 5a4 and the wafer to rotate, the wafer and primary-secondary ring combination can be placed on the material guiding rail group 5b, the material is reversely moved by an electric sliding table module 5a1 to be transferred to another centering mechanism 4, after further processing is finished, the material transferring clamp 5a4 clamps the material again, and the electric sliding table module 5a1 continues to transfer the material to a blanking mechanism 6 to finish processing.
As shown in fig. 15 and 16, the following preferred technical solutions are provided:
the guide rail group 5b comprises a bidirectional sliding table module 5b1 and two guide rail frames 5b2, wherein the two guide rail frames 5b2 are symmetrically arranged at two ends of the bidirectional sliding table module 5b1, the guide rail frames 5b2 are slidably connected with the working table surface of the frame 1 through movable grooves 5b3, and the guide rail frames 5b2 are flush with the working table surface of the centering mechanism 4 and the feeding opening of the blanking mechanism 6.
Specifically, in order to solve the technical problem of material transferring and guiding, the two-way sliding table module 5b1 drives the material guiding rail frames 5b2 to be close to or far away from each other, when material transferring and guiding is needed, the two material guiding frames are close to each other, the material transferring clamp 5a4 places the material on the two material guiding rail frames 5b2 and pushes the material along the length direction of the material guiding rail frames 5b2, and the material guiding rail frames 5b2 are aligned with a material inlet of the discharging mechanism 6 and then push the material into the discharging mechanism 6.
As shown in fig. 1 to 4 and fig. 15 and 16, the following preferred technical solutions are provided:
the discharging mechanism 6 comprises a receiving box 6a and a box clamping assembly 6c, the receiving box 6a is arranged at one end of the frame 1 far away from the feeding mechanism 2 through a box supporting plate 6b and a second lifting sliding rail set 6d, the box clamping assembly 6c is arranged on the box supporting plate 6b, the box supporting plate 6b is slidably connected with the second lifting sliding rail set 6d, the lower end of the box supporting plate 6b is connected with a third push rod 6e, the output end of the third push rod 6e is fixedly connected with the box supporting plate 6b, and the third push rod 6e is vertically arranged on the frame 1.
Specifically, in order to solve the technical problem of blanking after material processing, the invention realizes the combined blanking of the wafer and the primary and secondary rings through the blanking mechanism 6, the second lifting slide rail group 6d and the third push rod 6e are matched to realize the gradual lifting of the material box supporting plate 6b, when the material is blanked, the material is piled up layer by layer from the lower layer of the material box 6a, when the empty material box 6a is placed on the material box supporting plate 6b, the material box clamping assembly 6c clamps and fixes the material box, the alignment with the material moving mechanism 5 is realized, and meanwhile, the material and the material box 6a are rubbed in the blanking process to cause the movement dislocation of the material box 6 a.
The method for cutting the chip wafer film is as follows:
s1: feeding material
The method comprises the steps that primary and secondary rings and wafers are fed through a primary and secondary ring feeding assembly 2a and a wafer feeding assembly 2b, the primary and secondary rings are sequentially distributed to upper-end material conveying plates 2g through the primary and secondary ring feeding assembly 2a, the wafers are sequentially distributed to lower-end material conveying plates 2g through the wafer feeding assembly 2b, when the primary and secondary rings are distributed to the upper-end material conveying plates 2g, a first push rod 2f drives two material conveying plates 2g to move downwards, a carrying manipulator 2c rotates to the upper-end material conveying plates 2g and clamps the primary and secondary rings to a similar centering mechanism 4, meanwhile, the wafer feeding assembly 2b pushes the wafers to the lower-end material conveying plates 2g in a separated mode, then the first push rod 2f pushes the lower-end material conveying plates 2g to the area where the carrying manipulator 2c is located, the carrying manipulator 2c transfers the primary and secondary rings to the material conveying plates 2g again after being placed on the corresponding centering mechanism 4, clamps the wafers to the centering mechanism 4 and the corresponding primary and secondary rings;
The stacked primary and secondary rings are placed above the material supporting frame 2a1, two material distributing clamping plates 2a2 are supported and clamped, when the material is required to be discharged, the first air cylinder 2a3 drives the two material distributing clamping plates 2a2 to retract, so that the stacked primary and secondary rings fall onto the lower material conveying plate 2g from the material discharging opening 2a4, then the first air cylinder 2a3 stretches out again, the two material distributing clamping plates 2a2 separate the lowest primary and secondary rings from other primary and secondary rings, and the other primary and secondary rings are supported, so that the primary and secondary rings are fed one by one. Similarly, the wafer loading assembly 2b is also based on the principle of stacking and separating wafers one by one;
s2: centering blowing patch
After the primary and secondary rings and the wafer are centered and clamped through the centering mechanism 4, the film pasting and cutting mechanism 3 works, the film pasting and cutting mechanism 3 is matched with the film placing roller group 7a and the film rolling roller group 7b to realize film material transmission, unused film materials are transmitted to the upper part of the centering mechanism 4, then the wafer and the primary and secondary rings are subjected to combined film pasting and cutting to realize separation of the film materials and the wafer, and then the film pasting and cutting mechanism 3 resets; the second push rod 3f and the lifting frame 3e are matched to realize the up-and-down movement of the gradually-opened blowing and pasting component 3b and the air pipe 3d, so that the gradually-opened blowing and pasting component 3b and the air pipe 3d can approach to the centering mechanism 4 and the wafer below the gradually-opened blowing and pasting component, and after the gradually-opened blowing and pasting component falls to a certain position, the gradually-opened blowing and pasting component 3b is opened to blow and paste the film material on the surfaces of the wafer and the primary ring and the secondary ring;
The size of the orifice of the air pipe 3d is adjusted through the iris opening and closing module 3b1, and the iris opening and closing module 3b1 is opened and closed by driving the driving gear and the transmission gear head 3b 5. When the device works, firstly, the second push rod 3f pushes the lifting frame 3e to move downwards, the centering mechanism 4 and the wafer close to the lower part are moved downwards, meanwhile, the air pipe 3d, the driving toothed ring 3b2 and the iris opening and closing module 3b1 move downwards along with the downward movement, at the moment, the arc-shaped guide sliding plate 3b3 on the driving toothed ring 3b2 is tightly attached to one end of the arc-shaped sliding rail 3a1 and slides downwards, when the top of the arc-shaped guide sliding plate 3b3 completely slides into the arc-shaped sliding rail 3a1, the bottom of the spiral arc rod 3b4 starts to be abutted to slide with one end of the arc-shaped sliding rail 3a1, the spiral arc rod 3b4 is further moved downwards, meanwhile, the arc-shaped guide sliding plate 3b3 and the driving toothed ring 3b2 are driven to rotate, the driving toothed ring 3b2 drives the transmission toothed head 3b5 and the iris opening and closing module 3b1 to gradually open an air inlet of the air pipe 3d, and at the same time, the iris opening and closing module 3b1 gradually approaches to the wafer and the membrane material, the size of wind is maintained, so that the membrane material and the wafer can be effectively prevented from being attached inwards and outwards, and when the membrane pasting is finished, the second push rod 3f drives the lifting frame 3b to reset, and the air pipe 3b is driven to rotate along with the movement of the annular ring 3b to be reset, and the air inlet 3d is closed;
S3: prepressing
Through the cooperation between the film pressing roller groups 3g, the film material is pressed to the surface of the wafer, and the film material is prevented from wrinkling and loosening. The film material is discharged from the film discharging roller group 7a and is wound by the film winding roller group 7b after passing through the lower parts of the two film pressing roller groups 3g in sequence, firstly, the film discharging roller group 7a is started to discharge film, meanwhile, the second push rod 3f pushes the lifting frame 3e to move downwards, the hack lever 3e1 of the lifting frame 3e and the film pressing roller group 3g push the film material downwards to be close to a wafer, after the film material is attached to the wafer, the lifting frame 3e continues to move downwards, the hinged shaft head 3g2 and the film pressing roller shaft 3g1 rotate outwards under the action of the force between the film material and the working table, the film pressing roller shaft 3g1 further tightens the film material further, the film material is prevented from wrinkling on the surface of the wafer, dislocation and bubble occurrence in the follow-up slitting and film attaching process are also prevented, and after slitting, the slitting assembly 3c leaves the wafer and the film material firstly, the film pressing roller shaft 3g1 slowly resets, so that the attached film material and the residual film material are separated
S4: cutting: the slitting assembly 3c is arranged at the lower end of the involute type film blowing and pasting assembly 3b, so that the slitting assembly 3c can ascend and descend along with the lifting frame 3e, the slitting assembly 3c and the film material are jointed, the film material is slit through the annular cutter 3c1, when the film material is blown and pasted, the involute type film blowing and pasting assembly 3b and the slitting assembly 3c are gradually close to the film material to be slit, when the iris opening and closing assembly 3b1 is completely opened, the slitting assembly 3c just laminates the film material to be slit at the moment, after the film material blowing and pasting is completed, the lifting frame 3e is continuously pushed downwards by the second push rod 3f, the annular cutter 3c2 is enabled to upwards compress the first spring 3c4, meanwhile, the annular cutter 3c1 is exposed and slits the film material, and after the film material is slit, the annular cutter 3c2 is reset under the action of the first spring 3c4, and the annular cutter 3c1 is blocked;
S5: material moving
The transfer of materials is realized through the transfer component 5a and the guide rail group 5b, firstly, a sliding table module is driven to drive a connecting plate 5a2 and a transfer clamp 5a4 to move to a centering mechanism 4 of a film pasting and cutting station, the transfer clamp 5a4 clamps and takes a wafer and a primary ring combination, a rotary cylinder 5a3 drives the transfer clamp 5a4 and the wafer to rotate, so that the wafer and the primary ring combination can be placed on the guide rail group 5b, the electric sliding table module 5a1 moves reversely to transfer the materials to the other centering mechanism 4, after further processing is completed, the transfer clamp 5a4 clamps the materials again, and the electric sliding table module 5a1 continues to transfer the materials to a blanking mechanism 6 to complete the processing;
the two-way sliding table module 5b1 drives the material guide rail frames 5b2 to be close to or far away from each other, when the material guide is required to be transferred, the two material guide frames are close to each other, the material transfer clamp 5a4 places the material on the two material guide rail frames 5b2 and pushes the material along the length direction of the material guide rail frames 5b2, and the material guide rail frames 5b2 are aligned with a material inlet of the blanking mechanism 6 and then push the material into the blanking mechanism 6;
s6: discharging
The wafer and the primary and secondary ring are combined and discharged through the discharging mechanism 6, the material box supporting plate 6b is gradually lifted by the cooperation of the second lifting sliding rail set 6d and the third pushing rod 6e, during discharging, materials are stacked upwards layer by layer from the lower layer of the material box 6a, after the empty material box 6a is placed on the material box supporting plate 6b, the material box is clamped and fixed by the material box clamping assembly 6c, alignment with the material moving mechanism 5 is achieved, and meanwhile, the material box 6a is moved and misplaced due to friction between the material and the material box 6a in the discharging process.
Compared with the prior art, the invention has the following beneficial effects:
1. the film pasting and synchronous cutting of the wafer on the primary ring and the secondary ring are realized through the film pasting and cutting mechanism 3, the primary ring and the wafer are sequentially fed through the feeding mechanism 2, then the film pasting and cutting are realized under the assistance of the centering mechanism 4, the processed wafer and the primary ring are combined and transferred to the discharging mechanism 6 by the material transferring mechanism 5 to be stacked and transported, the film material winding and unwinding mechanism 7 is utilized to realize automatic winding and unwinding of the film, the whole operation is realized by adopting automatic equipment, the film pasting and cutting mechanism is efficient and orderly, the tightness of the film pasting can be effectively ensured when the film pasting is realized, the film material cutting is neat, and the complete separation of the edge materials and the main materials after the cutting can be realized.
2. According to the film pressing roller set, the film material is pressed to the surface of the wafer through the cooperation between the film pressing roller sets 3g, and the film material is prevented from wrinkling and loosening. Utilize articulated spindle nose 3g2 and press membrane roller 3g1 to outwards rotate under the effect between membrane material and table surface, and then make press membrane roller 3g1 with the membrane material further tensioning, prevent that the membrane material from wrinkling at the wafer surface, also prevent follow-up cutting and the appearance of pad pasting in-process dislocation and bubble, owing to cut subassembly 3c leave wafer and membrane material first after cutting moreover, press membrane roller 3g1 then can slowly reset to the membrane material of laminating and the separation of surplus membrane material.
3. According to the wind pipe opening and closing device, the size of the pipe opening of the wind pipe 3d is adjusted through the iris opening and closing module 3b1, the driving toothed ring 3b2 drives the driving toothed head 3b5 and the iris opening and closing module 3b1 to gradually open the wind opening of the wind pipe 3d, and when the wind opening and closing device is opened, the iris opening and closing module 3b1 is gradually close to a wafer and a film material, so that the wind power is maintained
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention, which is defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (7)

1. The utility model provides a chip wafer pad pasting cuts device which characterized in that includes: the film laminating and slitting machine comprises a frame (1), a feeding mechanism (2), a film laminating and slitting mechanism (3), a centering mechanism (4), a material shifting mechanism (5), a blanking mechanism (6) and a film material rolling and unwinding mechanism (7), wherein the feeding mechanism (2), the film laminating and slitting mechanism (3), the material shifting mechanism (5) and the blanking mechanism (6) are sequentially arranged on the frame (1) along the length direction of the frame (1), the film material rolling and unwinding mechanism (7) is arranged at the top of the frame (1), the centering mechanism (4) is two and respectively opposite to the film laminating and slitting mechanism (3) and other wafer processing stations used for laminating, and the film laminating and slitting mechanism (3) is arranged between the film material rolling and unwinding mechanism (7) and the centering mechanism (4);
The feed mechanism (2) comprises: the wafer feeding device comprises a primary ring feeding assembly (2 a), a wafer feeding assembly (2 b) and a carrying manipulator (2 c), wherein the primary ring feeding assembly (2 a) and the wafer feeding assembly (2 b) are arranged at one end of a frame (1) through a base (2 d), the base (2 d) is arranged at one end of the frame (1) far away from a discharging mechanism (6), a first lifting sliding rail set (2 e) is vertically arranged on the base (2 d), two material conveying plates (2 g) are respectively and slidably arranged at two ends of the first lifting sliding rail set (2 e), the two material conveying plates (2 g) are fixedly connected, the material conveying plates (2 g) at the lower end are driven through a first push rod (2 f), the output end of the first push rod (2 f) is fixedly connected with the material conveying plates (2 g) at the lower end, the carrying manipulator (2 c) can be rotatably arranged on the base (2 d), and the carrying manipulator (2 c) can face to the material conveying mechanism (4) in a centering mode;
the film material winding and unwinding mechanism (7) comprises: a film discharging roller set (7 a) for discharging the film material and a film rolling roller set (7 b) for laminating the film material surplus edges after slitting;
the primary and secondary ring feeding assembly (2 a) comprises a material supporting frame (2 a 1) and two material distributing clamping plates (2 a 2), wherein the material supporting frame (2 a 1) is horizontally and fixedly arranged at the top of a first lifting sliding rail group (2 e), the two material distributing clamping plates (2 a 2) are symmetrically arranged at two sides of the material supporting frame (2 a 1) through a first air cylinder (2 a 3), each material distributing clamping plate (2 a 2) is fixedly connected with the output end of the corresponding first air cylinder (2 a 3), a discharging opening (2 a 4) is formed in the center of the material supporting frame (2 a 1), and the two material distributing clamping plates (2 a 2) are respectively arranged at two sides of the discharging opening (2 a 4) and are opposite to the discharging opening (2 a 4);
The film pasting slitting mechanism (3) is arranged on the upper half part of the frame (1) through a supporting plate (3 a), an involute type blowing and pasting component (3 b) is arranged below the supporting plate (3 a) through a lifting frame (3 e), the lifting frame (3 e) is slidably arranged on the supporting plate (3 a), the lifting frame (3 e) and the supporting plate (3 a) are in transmission connection through a second push rod (3 f), the second push rod (3 f) is fixedly arranged on the supporting plate (3 a), the output end of the second push rod (3 f) penetrates through the supporting plate (3 a) and the top of the lifting frame (3 e) to be fixedly connected, the involute type blowing and pasting component (3 b) is arranged on the lifting frame (3 e) through an air pipe (3 d), and the air pipe (3 d) is fixedly arranged at the center of the lifting frame (3 e), and the involute type blowing and pasting component (3 b) is fixedly arranged at the lower end of the air pipe (3 d) and just faces the air port of the air pipe (3 d).
2. The die wafer film slitting device according to claim 1, wherein the involute type blowing and pasting component (3 b) comprises an iris opening and closing module (3 b 1) and a driving toothed ring (3 b 2), the iris opening and closing module (3 b 1) is fixedly arranged at the lower end of the air pipe (3 d), the driving toothed ring (3 b 2) is sleeved outside the iris opening and closing module (3 b 1) through an annular mounting plate (3 b 6) and is connected with the driving end of the iris opening and closing module (3 b 1) through a driving toothed head (3 b 5), the annular mounting plate (3 b 6) is fixedly arranged at the bottom of the iris opening and closing module (3 b 1), the driving toothed ring (3 b 2) is in sliding connection with the annular mounting plate (3 b 6), the transmission gear head (3 b 5) is fixedly connected with each driving end of the iris opening and closing module (3 b 1), the driving gear ring (3 b 2) is in transmission connection with the transmission gear head (3 b 5), two arc-shaped guide sliding plates (3 b 3) are symmetrically arranged at the upper end of the driving gear ring (3 b 2), each arc-shaped guide sliding plate (3 b 3) is in sliding connection with the supporting plate (3 a) through an arc-shaped slide way (3 a 1), the arc-shaped guide sliding plates (3 b 3) are in sliding connection with the arc-shaped slide way (3 a 1), the arc-shaped slide ways (3 a 1) are arranged on two sides of the supporting plate (3 a), a spiral arc rod (3 b 4) is fixedly arranged at the top of each arc-shaped guide sliding plate (3 b 4) and can be in sliding connection with the corresponding arc-shaped slide way (3 a 1), the top of spiral arc pole (3 b 4) is provided with the transition head, and the guide bar that is close to of transition head and crane (3 e) is connected through reset spring (3 b 7), is connected through spring swivel hook (3 b 8) between reset spring (3 b 7) and the guide bar, and spring swivel hook (3 b 8) cover is established on corresponding guide bar.
3. The die wafer film slitting device according to claim 2, wherein the lower end of the annular mounting plate (3 b 6) is provided with a slitting assembly (3 c), the slitting assembly (3 c) comprises an annular cutter (3 c 1) and an annular cutter protection plate (3 c 2), the annular cutter (3 c 1) is arranged on the inner wall of the annular mounting plate (3 b 6), the annular cutter protection plate (3 c 2) is connected with the annular mounting plate (3 b 6) through a plurality of first springs (3 c 4), a plurality of telescopic columns (3 c 3) are uniformly arranged on the upper surface of the annular cutter protection plate (3 c 2), each telescopic column (3 c 3) is inserted on the annular mounting plate (3 b 6) through a telescopic hole (3 c 5), the telescopic hole (3 c 5) is arranged on the bottom surface of the annular mounting plate (3 b 6), each first spring (3 c 4) is sleeved outside the corresponding telescopic column (3 c 3), and two ends of each first spring (3 c 4) are fixedly connected with the annular cutter protection plate (3 c 2) and the annular mounting plate (3 b 6).
4. The die wafer film slitting device according to claim 2, wherein two film pressing roller sets (3 g) are arranged at the lower end of the lifting frame (3 e), the two film pressing roller sets (3 g) are symmetrically arranged at the lower end of the lifting frame (3 e) along the length direction of the frame (1) respectively through two frame rods (3 e 1), the film pressing roller sets (3 g) comprise film pressing roller shafts (3 g 1) and hinge shaft heads (3 g 2), the film pressing roller shafts (3 g 1) are arranged between the ends of the two frame rods (3 e 1) through the two hinge shaft heads (3 g 2), the film pressing roller shafts (3 g 1) are rotatably arranged between the ends of the two hinge shaft heads (3 g 2), the upper ends of the hinge shaft heads (3 g 2) are hinged with the ends of the frame rods (3 e 1), the lower ends of the hinge shaft heads (3 g 2) are connected with the frame rods (3 e 1) through second springs (3 g 3), and the two ends of the frame rods (3 e 1) are provided with hinge shaft heads (3 g 2) which can not rotate outwards but can rotate the frame rods (3 e 2).
5. The die wafer film slitting device according to claim 1, wherein the material moving mechanism (5) comprises a material moving component (5 a) and a material guide rail group (5 b), the material moving component (5 a) and the material guide rail group (5 b) are mounted on a workbench surface of the frame (1), the material moving component (5 a) comprises an electric sliding table module (5 a 1) and a material moving clamp (5 a 4), the electric sliding table module (5 a 1) is mounted on one side of the workbench surface of the frame (1) along the length direction, the material moving clamp (5 a 4) is mounted on a sliding table of the electric sliding table module (5 a 1) through a connecting plate (5 a 2), a rotary cylinder (5 a 3) is mounted at the upper end of the connecting plate (5 a 2), the output end of the rotary cylinder (5 a 3) is fixedly connected with the material moving clamp (5 a 4), and the material moving clamp (5 a 4) can face a centering mechanism (4) and a blanking mechanism (6).
6. The die wafer film slitting device according to claim 5, wherein the material guide rail group (5 b) comprises a bidirectional sliding table module (5 b 1) and two material guide rail frames (5 b 2), the two material guide rail frames (5 b 2) are symmetrically arranged at two ends of the bidirectional sliding table module (5 b 1), the material guide rail frames (5 b 2) are slidably connected with a working table surface of the frame (1) through movable grooves (5 b 3), and the material guide rail frames (5 b 2) are flush with the working table surface of the centering mechanism (4) and a feeding hole of the blanking mechanism (6).
7. The die wafer film slitting device according to claim 1, wherein the blanking mechanism (6) comprises a receiving box (6 a) and a box clamping assembly (6 c), the receiving box (6 a) is installed at one end of the frame (1) far away from the feeding mechanism (2) through a box supporting plate (6 b) and a second lifting sliding rail set (6 d), the box clamping assembly (6 c) is installed on the box supporting plate (6 b), the box supporting plate (6 b) is in sliding connection with the second lifting sliding rail set (6 d), the lower end of the box supporting plate (6 b) is connected with a third pushing rod (6 e), the output end of the third pushing rod (6 e) is fixedly connected with the box supporting plate (6 b), and the third pushing rod (6 e) is vertically installed on the frame (1).
CN202310301651.3A 2023-03-22 2023-03-22 Chip wafer pad pasting cuts device Active CN116364619B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310301651.3A CN116364619B (en) 2023-03-22 2023-03-22 Chip wafer pad pasting cuts device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310301651.3A CN116364619B (en) 2023-03-22 2023-03-22 Chip wafer pad pasting cuts device

Publications (2)

Publication Number Publication Date
CN116364619A CN116364619A (en) 2023-06-30
CN116364619B true CN116364619B (en) 2023-12-19

Family

ID=86916013

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310301651.3A Active CN116364619B (en) 2023-03-22 2023-03-22 Chip wafer pad pasting cuts device

Country Status (1)

Country Link
CN (1) CN116364619B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117855103A (en) * 2024-01-26 2024-04-09 山东万鱼智能科技有限公司 Automatic film-coating packaging equipment and packaging method for chip processing

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111739821A (en) * 2020-06-24 2020-10-02 东莞思沃智能装备有限公司 Wafer film sticking machine
CN112864056A (en) * 2021-02-23 2021-05-28 厦门市弘瀚电子科技有限公司 Full-automatic film expanding machine
CN213304084U (en) * 2020-12-09 2021-05-28 厦门市弘瀚电子科技有限公司 Full-automatic primary and secondary ring stripping machine
CN217626294U (en) * 2022-07-27 2022-10-21 江苏创源电子有限公司 Material circulation device and sheet expanding equipment
CN115241092A (en) * 2022-07-27 2022-10-25 江苏创源电子有限公司 Crystal expanding production line
CN115799119A (en) * 2022-12-09 2023-03-14 允哲半导体科技(浙江)有限公司 Multifunctional film pasting device and method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111739821A (en) * 2020-06-24 2020-10-02 东莞思沃智能装备有限公司 Wafer film sticking machine
CN213304084U (en) * 2020-12-09 2021-05-28 厦门市弘瀚电子科技有限公司 Full-automatic primary and secondary ring stripping machine
CN112864056A (en) * 2021-02-23 2021-05-28 厦门市弘瀚电子科技有限公司 Full-automatic film expanding machine
CN217626294U (en) * 2022-07-27 2022-10-21 江苏创源电子有限公司 Material circulation device and sheet expanding equipment
CN115241092A (en) * 2022-07-27 2022-10-25 江苏创源电子有限公司 Crystal expanding production line
CN115799119A (en) * 2022-12-09 2023-03-14 允哲半导体科技(浙江)有限公司 Multifunctional film pasting device and method

Also Published As

Publication number Publication date
CN116364619A (en) 2023-06-30

Similar Documents

Publication Publication Date Title
CN116364619B (en) Chip wafer pad pasting cuts device
CN209466734U (en) A kind of carton automatic moulding machine
CN107521207B (en) Glass swing piece film sticking machine and swing piece film sticking method thereof
CN110336061B (en) Automatic assembly system for CCM membrane electrode assembly or CCM membrane electrode assembly of hydrogen fuel cell
CN111564655A (en) Battery cell production equipment and battery cell preparation method
CN101572222A (en) Protective tape joining apparatus
CN112713312A (en) Lamination equipment
CN110676516A (en) Lithium battery lamination equipment
CN112768744A (en) Battery manufacturing apparatus
CN111312610A (en) Wafer film sticking machine, film pulling device and wafer film sticking method
CN115448085A (en) Adhesive tape pasting machine for chip capacitor
CN113276483B (en) Packaging carton secondary recycling treatment method
CN112687943A (en) Lamination rubberizing equipment
CN213036948U (en) Interval adjustable electricity core pole piece lift conveying mechanism
CN211591306U (en) From type membrane separation and tectorial membrane mechanism
CN212831385U (en) Electricity core take out mechanism
CN212113915U (en) Lamination mechanism for battery core pole piece
CN113682876A (en) Film making equipment and processing technology using same
CN212113914U (en) Battery cell pole piece positioning mechanism
CN212113916U (en) Electricity core production facility
CN116053560B (en) Battery cell rubberizing and pairing equipment
CN213936305U (en) Lamination rubberizing equipment
CN214569634U (en) Coiled material pulling mechanism and coiled material processing module
CN219832751U (en) Waterwheel type lithium ion battery lamination machine
CN212580259U (en) Automatic binding equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant