CN116623266A

CN116623266A - Electroplating mold, electroplating module, electroplating device and electroplating method

Info

Publication number: CN116623266A
Application number: CN202310703535.4A
Authority: CN
Inventors: 门松明珠; 周爱和
Original assignee: Kunshan A Tripod Plating Equipment Co ltd
Current assignee: Kunshan A Tripod Plating Equipment Co ltd
Priority date: 2023-06-14
Filing date: 2023-06-14
Publication date: 2023-08-22

Abstract

The application relates to the technical field of electroplating, in particular to an electroplating mould, an electroplating module, an electroplating device and an electroplating method, wherein the electroplating mould comprises a shell, an electroplating area is arranged in the shell, a filter tank for passing electroplating solution is arranged on the shell, and a plating part inserting opening for placing a plating part is arranged on the top surface of the shell; the deoxidizing filtering film is arranged in the filtering tank and is used for filtering oxygen in the electroplating solution passing through the filtering tank. According to the electroplating mould disclosed by the application, the electroplating solution enters the electroplating area through the filter tank, and the plating piece is also inserted into the electroplating area through the plating piece inserting opening, so that the plating piece is conveniently electroplated. Meanwhile, the deoxidizing filtering membrane filters oxygen in the electroplating solution, so that the binding force between a plating piece and a plating layer due to oxide interference is reduced, and the peeling phenomenon of the plating piece and the possibility of reducing the corrosion resistance of the plating layer of the plating piece are further caused.

Description

Electroplating mold, electroplating module, electroplating device and electroplating method

Technical Field

The application relates to the technical field of electroplating, in particular to an electroplating mold, an electroplating module, an electroplating device and an electroplating method.

Background

The local electrolysis caused by the too high concentration of dissolved oxygen in the electroplating solution can lead to corrosion of the metal on the surface of the plated part, and influence the product quality of the metal surface of the plated part. Meanwhile, due to the fact that oxides formed by corrosion interfere the binding force between a plating piece and a plating layer, the electroplated product has the risks of peeling phenomenon and reduced corrosion resistance.

Disclosure of Invention

The application aims to solve the technical problems that: in order to solve the technical problem that the blade is easy to damage during disassembly in the prior art, the application provides an electroplating mold, an electroplating module, an electroplating device and an electroplating method.

In a first aspect, the present application discloses an electroplating mold

The electroplating mould comprises a shell, wherein an electroplating area is arranged in the shell, a filter tank for passing electroplating solution is arranged on the shell, and a plating part inserting opening for placing a plating part is arranged on the top surface of the shell; the deoxidizing filtering film is arranged in the filtering tank and is used for filtering oxygen in the electroplating solution passing through the filtering tank.

According to the electroplating mould disclosed by the application, the electroplating solution enters the electroplating area through the filter tank, and the plating piece is also inserted into the electroplating area through the plating piece inserting opening, so that the plating piece is conveniently electroplated. Meanwhile, the deoxidizing filtering membrane filters oxygen in the electroplating solution, so that the binding force between a plating piece and a plating layer due to oxide interference is reduced, and the peeling phenomenon of the plating piece and the possibility of reducing the corrosion resistance of the plating layer of the plating piece are further caused.

Further, an overflow groove is arranged at the top of the shell.

Further, the filter tanks are arranged on the side surface and the bottom surface of the shell.

Further, a filter plate is further arranged on the filter tank, and the filter plate is arranged on one side of the deoxidizing filter membrane, which faces the electroplating area.

Further, through holes are formed in the filter plates, and one end, away from the electroplating area, of each through hole is larger than one end, close to the electroplating area, of each through hole.

Further, a reinforcing plate is fixedly connected in the filter tank and is connected with the deoxidizing filtering membrane.

In a second aspect, an electroplating module is disclosed.

The utility model provides an electroplating module, includes the plating bath, electroplating mould locates in the plating bath, be equipped with the positive pole in the plating bath, be formed with the feed liquor chamber between the bottom surface of electroplating mould and plating bath, electroplating mould's bottom is equipped with the inlet, inlet and feed liquor chamber intercommunication, be equipped with the electroplating fixture that is used for pressing from both sides tight piece of plating in the electroplating region, be equipped with the negative pole on the electroplating fixture.

Further, an overflow cavity is formed between the top of the shell and the electroplating bath, an overflow steady flow fixing plate is arranged in the overflow cavity, and a steady flow hole is arranged on the overflow steady flow fixing plate.

In a third aspect, the present application discloses an electroplating apparatus.

The electroplating device comprises a feeding module, an ultrasonic degreasing module, an electrolytic degreasing module, an acid pickling module, a post-processing module, a discharging module and a control module which are sequentially arranged, wherein an electroplating module is arranged between the acid pickling module and the post-processing module; the feeding module is used for transferring the plated part to the ultrasonic degreasing module, and conveying the plated part to the post-treatment module after sequentially passing through the electrolytic degreasing module, the acid pickling module and the electroplating module; the blanking module is used for taking out the plated part from the post-processing module and placing the plated part in a designated storage box; the control module is used for controlling the electroplating module, the feeding module, the ultrasonic degreasing module, the electrolytic degreasing module, the pickling module, the post-processing module and the discharging module to work.

In a fourth aspect, the present application discloses a plating method.

A plating method comprising the steps of:

s1, transferring a plated part to an ultrasonic degreasing module through a feeding module, and placing the plated part into an electroplating module after sequentially passing through an electrolytic degreasing module and an acid pickling module;

s2, electroplating the plated piece through an electroplating module;

s3, placing the plating piece in a designated storage box through a blanking module.

The application has the advantages that,

1. the electroplating solution enters the electroplating area through the filter tank, and the plating piece is also inserted into the electroplating area through the plating piece inserting opening, so that the plating piece is conveniently electroplated. Meanwhile, the deoxidizing filtering membrane filters oxygen in the electroplating solution, so that the binding force between a plating piece and a plating layer due to oxide interference is reduced, and the peeling phenomenon of the plating piece and the possibility of reducing the corrosion resistance of the plating layer of the plating piece are further caused;

2. through the arrangement of the overflow groove, the electroplating solution is convenient to overflow, so that the circulation of the electroplating solution is convenient to realize, and the electroplating effect is ensured;

3. through overflow chamber, overflow stationary flow fixed plate and stationary flow hole's setting, electroplating solution need pass the stationary flow hole and just can fall, and electroplating solution is when passing the stationary flow hole, and electroplating solution is dispersed, can reduce bubble and the foam that electroplating solution falls down and produce, and electroplating solution forms one deck liquid film on overflow stationary flow fixed plate simultaneously, can reduce the possibility that air mixed in electroplating solution, guarantees that electroplating solution does not receive the influence of various harmful gases such as oxygen in the air.

Drawings

The application will be further described with reference to the drawings and examples.

FIG. 1 is a schematic view of a structure of an electroplating mold according to the present application.

FIG. 2 is a schematic diagram of the structure of an oxygen scavenging filtration membrane embodying the present application.

Fig. 3 is a schematic view of a filter plate embodying the present application.

Fig. 4 is a schematic view of a structure of a reinforcing plate embodied in the present application.

FIG. 5 is a schematic view of the structure of the plating module of the present application.

FIG. 6 is a schematic structural view of an overflow stabilizing plate embodying the present application.

Fig. 7 is a schematic diagram of a rectifier embodying the present application.

FIG. 8 is a schematic view of the structure of the plating apparatus of the present application.

FIG. 9 is a schematic top view of the plating apparatus of the present application.

11, a shell; 12. a filter tank; 13. a reinforcing plate; 100. a feeding module; 200. an ultrasonic degreasing module; 300. an electrolytic degreasing module; 400. a pickling module; 500. an electroplating module; 600. a post-processing module; 700. a blanking module; 800. a control module; 510. an electroplating clamp; 530. electroplating a mould; 30. an anode; 31. a liquid inlet cavity; 32. an overflow trough; 33. a plating area; 34. a plating insertion port; 35. deoxidizing the filtering membrane; 36. a filter plate; 361. a through hole; 37. an overflow steady flow fixing plate; 38. a storage chamber; 381. a precipitation zone; 50. plating bath; 60. a rectifier power supply; ps, plating solution height; ep, electroplating device.

Detailed Description

The application will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the application and therefore show only the structures which are relevant to the application.

In a first aspect, the present application discloses an electroplating mold

Referring to fig. 1 to 4, an electroplating mold includes a housing 11, a plating area 33 is provided in the housing 11, and a filter tank 12 through which a plating solution passes is provided in the housing 11 so that the plating solution enters the plating area 33. The filter tank 12 is fixedly connected with a deoxidizing filter membrane 35, the deoxidizing filter membrane 35 is used for filtering oxygen in the electroplating solution passing through the filter tank 12, the top of the shell 11 is provided with an overflow tank 14, the electroplating solution in the electroplating area 33 is convenient to overflow, and then the electroplating solution entering the filter tank 12 forms a circulation, so that substances in the electroplating solution in the electroplating area 33 are relatively uniform, the electroplating solution in the electroplating area 33 is ensured to contain no oxygen, and the quality of a plated part is further ensured. The top surface of the housing 11 is provided with a plating insertion port 34 into which a plating member is placed, facilitating placement of the plating member into the plating area 33. During operation, the electroplating solution is pumped into the electroplating area 33 from the filter tank 12 through the pump, the oxygen is removed by the deoxidizing filter membrane 35 when passing through the filter tank 12, so that the possibility of corrosion to metal on the surface of a plated part is reduced, and in the process that the electroplating solution continuously enters the electroplating area 33, part of the electroplating solution overflows from the overflow tank 14, so that the electroplating solution in the electroplating area 33 is in a circulating state, the concentration of the to-be-plated metal in the electroplating solution is ensured, and the electroplating effect is further ensured.

The filter tanks 12 are disposed on the side and bottom surfaces of the housing 11, in this embodiment, two filter tanks 12 are disposed on the bottom surface of the housing 11, four filter tanks 12 are disposed on the side surface of the housing 11, and this arrangement can improve the efficiency of the electroplating solution entering the electroplating region 33, and further improve the circulation speed of the electroplating solution in the electroplating region 33.

The filter tank 12 is also fixedly connected with a filter plate 36, and the filter plate 36 is arranged on one side of the deoxidizing filtering membrane 35 facing the electroplating region 33. The through holes 361 are formed in the filter plate 36, electroplating solution is conveniently filtered, one end of the through holes 361 away from the electroplating area 33 is larger than one end of the through holes 361 close to the electroplating area 33, the cross sections of the through holes 361 are conical, the possibility that the electroplating solution in the electroplating area 33 passes through the filter plate 36 is reduced, and meanwhile the speed that the electroplating solution enters the electroplating area 33 can be improved. Still fixedly connected with reinforcing plate 13 in the filter vat 12, reinforcing plate 13 and deoxidization filtration membrane 35 fixed connection are convenient for fix and strengthen deoxidization filtration membrane 35, also are equipped with the through-hole on the reinforcing plate 13, are convenient for electroplating solution to pass.

Working principle: during operation, electroplating solution is pumped into the electroplating area 33 from the filter tank 12 through the pump, and oxygen is removed by the deoxidizing filtering membrane 35 when the electroplating solution passes through the filter tank 12, so that the possibility of corrosion to metal on the surface of a plated part is reduced, the binding force between the plated part and a plating layer due to oxide interference is further reduced, and the plated part is further peeled and the corrosion resistance of the plating layer of the plated part is reduced. In the process that the electroplating solution continuously enters the electroplating area 33, the electroplating solution overflows from the overflow groove 14, so that the electroplating solution in the electroplating area 33 is in a circulating state, and the concentration of the electroplating solution is ensured.

In a second aspect, the application discloses an electroplating module.

Referring to fig. 5 to 6, an electroplating module includes an electroplating tank 50, an electroplating mold 530 disposed in the electroplating tank 50, a liquid inlet chamber 31 formed between the electroplating mold 530 and the bottom surface of the electroplating tank 50, a storage chamber 38 disposed between the side surface of the electroplating mold 530 and the tank wall of the electroplating tank 50, and an anode 30 disposed in the storage chamber 38. The bottom of the electroplating mold 530 is provided with a liquid inlet which is communicated with the liquid inlet cavity 31, the electroplating region 33 is internally provided with an electroplating clamp 510 for clamping a plating piece, and the electroplating clamp 510 is inserted into the electroplating region 33 from the plating piece inserting opening 34. The electroplating fixture 510 is provided with a cathode, and the cathode is contacted with the plating piece so as to be matched with the anode 30 conveniently to realize electroplating. An overflow cavity is formed between the top of the shell 11 and the electroplating bath 50, an overflow steady flow fixing plate 37 is arranged in the overflow cavity, steady flow holes are arranged on the overflow steady flow fixing plate 37, and the steady flow holes are uniformly distributed on the overflow steady flow fixing plate 37. When the device works, by controlling the power of the pump, the overflow flow of the shell 11 and the flow passing through the overflow steady flow fixing plate 37 can be kept in relative balance, so that a layer of liquid film is formed on the surface of the overflow steady flow fixing plate 37, and the air mixing into the storage cavity 38 can be effectively reduced.

The plating solution may be an aqueous solution containing ions of a metal element constituting the plating film, and specific examples thereof are not particularly limited. As an example of the plating solution in this embodiment, a potassium aurous cyanide solution is used. Further, in this embodiment, the plating solution includes an additive. However, without limitation to this formulation, the plating solution may also be free of additives. The specific type of anode is not particularly limited, and either a dissolved anode 30 or an insoluble anode 30 may be used. In the present embodiment, an insoluble anode 30 is used. The specific type of the insoluble anode 30 is not particularly limited, and metallic titanium, platinized, or the like may be used. A rectifier is electrically connected to the cathode and anode 30 in common.

In operation, electroplating solution is pumped into the liquid inlet cavity 31 by the pump, then the electroplating solution passes through the filter tank 12 at the bottom of the shell 11 and enters the electroplating area 33, along with the increase of the electroplating solution in the electroplating area 33, part of the electroplating solution overflows from the overflow tank 14 and passes through the overflow steady flow fixing plate 37 to enter the storage cavity 38, and the electroplating solution in the storage cavity 38 enters the electroplating area 33 from the filter tank 12 at the side surface of the shell 11, so that the circulation of the electroplating solution in the electroplating area 33 is accelerated. The arrangement of the liquid inlet chamber 31 also makes the filter tank 12 at the side of the housing 11 be higher than one end of the bottom surface of the electroplating tank 50 by a distance, and this area is a precipitation area 381, which is convenient for precipitating impurities in the electroplating solution, and further reduces impurities in the electroplating solution entering the electroplating area 33.

Referring to fig. 7 and 9, an electroplating apparatus includes a loading module 100, an ultrasonic degreasing module 200, an electrolytic degreasing module 300, an acid cleaning module 400, an electroplating module 500, a post-processing module 600, a discharging module 700, and a control module 800, which are sequentially disposed. The feeding module 100 is used for transferring the plating piece to the ultrasonic degreasing module 200, and conveying the plating piece to the post-treatment module 600 after passing through the electrolytic degreasing module 300, the pickling module 400 and the electroplating module 500 in sequence; the blanking module 700 is used for taking out the plating piece from the post-processing module 600 and placing the plating piece in a specified storage box; the control module 800 is used for controlling the electroplating module 500, the feeding module 100, the ultrasonic degreasing module 200, the electrolytic degreasing module 300, the pickling module 400, the post-processing module 600 and the discharging module 700 to work. The rectifier is electrically connected to the control module 800.

The operation of the plating module 500 of the present application is controlled by a control module 800, the control module 800 including a microcomputer including a CPU (central processing unit) as a processor, a storage unit as a non-transitory storage medium, and the like. The control module 800, the cpu operates according to the program command stored in the storage unit, and the control unit of the plating module 500. Programs such as conveyance control of the conveyance device, process control of each process module, plating process control in the plating module 500, program of water washing process control, program of detecting equipment abnormality, and alarm. Storage includes non-volatile and/or volatile storage media. As the storage medium, for example, a computer readable ROM, RAM, memory and flash memory, a hard disk, a CD-ROM, a known magnetic disk storage medium such as DVD-ROM, USB, and a floppy disk can be used. The control module 800 is configured to communicate with the upper controller, as shown, for unified control of the electroplating apparatus and other related devices, and can exchange data between databases provided with the upper controller. Some or all of the functionality of the control module 800 may be comprised of hardware such as an ASIC. Some or all of the functions of the control module 800 may be comprised of a PLC, a programmable controller, or the like. Some or all of the control module 800 may be placed inside or outside the plating apparatus housing. Some or all of the control module 800 communicates with each portion of the electroplating apparatus by wire and/or wirelessly.

In a fourth aspect, the present application discloses a plating method.

A plating method comprising the steps of:

s1, transferring a plated part to an ultrasonic degreasing module 200 through a feeding module 100, and placing the plated part into an electroplating module 500 after sequentially passing through an electrolytic degreasing module 300 and an acid pickling module 400;

s2, electroplating the plated piece through the electroplating module 500;

s3, placing the plating piece in a designated storage box through the blanking module 700.

With the above-described preferred embodiments according to the present application as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the description, but must be determined according to the scope of claims.

Claims

1. An electroplating mold, which is characterized by comprising

A shell (11), wherein an electroplating area (33) is arranged in the shell (11), a filter tank (12) for passing through electroplating solution is arranged on the shell (11), and a plating piece inserting port (34) for placing plating pieces is arranged on the top surface of the shell (11);

and the deoxidizing filtering film (35) is arranged in the filtering tank (12) and is used for filtering oxygen in the electroplating solution passing through the filtering tank (12).

2. Electroplating mould according to claim 1, characterized in that the top of the housing (11) is provided with an overflow trough (32).

3. Electroplating mould according to claim 1, wherein the filter slots (12) are provided on the sides and bottom of the housing (11).

4. A plating mould according to claim 3, characterized in that the filter tank (12) is further provided with a filter plate (36), the filter plate (36) being provided on the side of the deoxygenated filter membrane (35) facing the plating zone (33).

5. The electroplating module (500) of claim 4, wherein the filter plate (36) is provided with a through hole (361), and an end of the through hole (361) away from the electroplating region (33) is larger than an end of the through hole (361) close to the electroplating region (33).

6. The electroplating mold as claimed in claim 1, wherein a reinforcing plate (13) is fixedly connected in the filter tank (12), and the reinforcing plate (13) is connected with the deoxidizing filtering membrane (35).

7. The utility model provides an electroplating module, its characterized in that, includes plating bath (50), electroplating mould (530) are located in plating bath (50), be equipped with positive pole (30) in plating bath (50), be formed with feed liquor chamber (31) between the bottom surface of electroplating mould (530) and plating bath (50), the bottom of electroplating mould (530) is equipped with the inlet, inlet and feed liquor chamber (31) intercommunication, be equipped with in electroplating area (33) and be used for pressing from both sides tight plating piece's electroplating anchor clamps (510), be equipped with the negative pole on electroplating anchor clamps (510).

8. The electroplating module of claim 7, wherein an overflow cavity is formed between the top of the housing (11) and the electroplating tank (50), an overflow steady flow fixing plate (37) is arranged in the overflow cavity, and a steady flow hole is arranged on the overflow steady flow fixing plate (37).

9. An electroplating device is characterized by comprising a feeding module (100), an ultrasonic degreasing module (200), an electrolytic degreasing module (300), a pickling module (400), a post-processing module (600), a blanking module (700) and a control module (800) which are sequentially arranged, wherein the electroplating module (500) as claimed in claim 7 or 8 is further arranged between the pickling module (400) and the post-processing module (600);

the feeding module (100) is used for transferring the plated part to the ultrasonic degreasing module (200), and conveying the plated part to the post-treatment module (600) after sequentially passing through the electrolytic degreasing module (300), the pickling module (400) and the electroplating module (500);

the blanking module (700) is used for taking out the plating piece from the post-processing module (600) and placing the plating piece in a designated storage box;

the control module (800) is used for controlling the electroplating module (500), the feeding module (100), the ultrasonic degreasing module (200), the electrolytic degreasing module (300), the pickling module (400), the post-processing module (600) and the blanking module (700) to work.

10. An electroplating method, characterized by comprising the steps of:

s1, transferring a plated part to an ultrasonic degreasing module (200) through a feeding module (100), and placing the plated part into an electroplating module (500) after sequentially passing through an electrolytic degreasing module (300) and an acid washing module (400);

s2, electroplating the plated piece through an electroplating module (500);

s3, placing the plating piece in a designated storage box through a blanking module (700).