CN116583562B - 热固化性树脂组合物的相容性评价方法、热固化性树脂组合物、预浸料、树脂膜、层叠板、多层印刷线路板和半导体封装体 - Google Patents

热固化性树脂组合物的相容性评价方法、热固化性树脂组合物、预浸料、树脂膜、层叠板、多层印刷线路板和半导体封装体

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CN116583562B
CN116583562B CN202180083991.2A CN202180083991A CN116583562B CN 116583562 B CN116583562 B CN 116583562B CN 202180083991 A CN202180083991 A CN 202180083991A CN 116583562 B CN116583562 B CN 116583562B
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resin composition
component
compatibility
thermosetting resin
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CN116583562A (zh
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石桥秀一
藤本大辅
小竹智彦
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Resonac Corp
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
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    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
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CN202180083991.2A 2020-12-14 2021-12-10 热固化性树脂组合物的相容性评价方法、热固化性树脂组合物、预浸料、树脂膜、层叠板、多层印刷线路板和半导体封装体 Active CN116583562B (zh)

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JP2020-206800 2020-12-14
JP2020206800 2020-12-14
PCT/JP2021/045494 WO2022131151A1 (ja) 2020-12-14 2021-12-10 熱硬化性樹脂組成物の相容性評価方法、熱硬化性樹脂組成物、プリプレグ、樹脂フィルム、積層板、多層プリント配線板及び半導体パッケージ

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KR20250085752A (ko) * 2022-10-19 2025-06-12 가부시끼가이샤 레조낙 수지 조성물, 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지
CN120600395B (zh) * 2025-08-04 2026-01-30 锐洋集团东北电缆有限公司 一种抗冻防开裂耐寒电缆

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CN109462991A (zh) * 2016-06-24 2019-03-12 日东电工株式会社 加热接合用片及带有切割带的加热接合用片

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JP2002226832A (ja) * 2001-02-02 2002-08-14 Akebono Brake Res & Dev Center Ltd 摩擦材材料攪拌物の混合状態評価方法
JP2004002837A (ja) * 2002-04-26 2004-01-08 Sumitomo Chem Co Ltd 疲労特性の改良された長繊維強化ポリプロピレン系樹脂組成物成形品
US9079376B2 (en) * 2011-01-18 2015-07-14 Hitachi Chemical Company, Ltd. Prepreg, laminate obtained with the same and printed-wiring board
JP2019014888A (ja) * 2017-07-06 2019-01-31 三菱ケミカル株式会社 樹脂組成物、シート、それを用いた積層体、画像表示装置
JP7051333B2 (ja) * 2017-08-25 2022-04-11 日鉄ケミカル＆マテリアル株式会社 硬化性樹脂組成物、その硬化物、硬化性複合材料、樹脂付き金属箔、及び回路基板材料用ワニス
JP2019184349A (ja) * 2018-04-06 2019-10-24 日本製紙株式会社 ゴム成分とセルロースナノファイバーの混合液の評価方法
CN119181905A (zh) * 2019-07-17 2024-12-24 大日本印刷株式会社 蓄电装置用外包装材料、其制造方法和蓄电装置
JP2025049784A (ja) * 2023-09-22 2025-04-04 日鉄ケミカル＆マテリアル株式会社 金属張積層板及びその製造方法

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CN109462991A (zh) * 2016-06-24 2019-03-12 日东电工株式会社 加热接合用片及带有切割带的加热接合用片

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US20230392002A1 (en) 2023-12-07
CN116583562A (zh) 2023-08-11
WO2022131151A1 (ja) 2022-06-23
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