KR20230118575A - 열경화성 수지 조성물의 상용성 평가 방법, 열경화성 수지 조성물, 프리프레그, 수지 필름, 적층판, 다층 프린트 배선판 및 반도체 패키지 - Google Patents

열경화성 수지 조성물의 상용성 평가 방법, 열경화성 수지 조성물, 프리프레그, 수지 필름, 적층판, 다층 프린트 배선판 및 반도체 패키지 Download PDF

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KR20230118575A
KR20230118575A KR1020237019829A KR20237019829A KR20230118575A KR 20230118575 A KR20230118575 A KR 20230118575A KR 1020237019829 A KR1020237019829 A KR 1020237019829A KR 20237019829 A KR20237019829 A KR 20237019829A KR 20230118575 A KR20230118575 A KR 20230118575A
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group
resin composition
thermosetting resin
component
compatibility
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슈이치 이시바시
다이스케 후지모토
도모히코 고타케
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가부시끼가이샤 레조낙
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    • G01N23/22Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
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    • C08L35/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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    • C08L53/00Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
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    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
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    • GPHYSICS
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02Details
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
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    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68Shapes or dispositions thereof
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    • C08J2335/00Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Derivatives of such polymers
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    • C08J2453/00Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
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    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
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  • Crystallography & Structural Chemistry (AREA)
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  • Reinforced Plastic Materials (AREA)
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KR1020237019829A 2020-12-14 2021-12-10 열경화성 수지 조성물의 상용성 평가 방법, 열경화성 수지 조성물, 프리프레그, 수지 필름, 적층판, 다층 프린트 배선판 및 반도체 패키지 Pending KR20230118575A (ko)

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JPJP-P-2020-206800 2020-12-14
JP2020206800 2020-12-14
PCT/JP2021/045494 WO2022131151A1 (ja) 2020-12-14 2021-12-10 熱硬化性樹脂組成物の相容性評価方法、熱硬化性樹脂組成物、プリプレグ、樹脂フィルム、積層板、多層プリント配線板及び半導体パッケージ

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US (1) US20230392002A1 (https=)
JP (1) JPWO2022131151A1 (https=)
KR (1) KR20230118575A (https=)
CN (1) CN116583562B (https=)
TW (1) TWI894408B (https=)
WO (1) WO2022131151A1 (https=)

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KR20250085752A (ko) * 2022-10-19 2025-06-12 가부시끼가이샤 레조낙 수지 조성물, 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지
CN120600395B (zh) * 2025-08-04 2026-01-30 锐洋集团东北电缆有限公司 一种抗冻防开裂耐寒电缆

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JP2018168347A (ja) 2017-08-25 2018-11-01 新日鉄住金化学株式会社 硬化性樹脂組成物、その硬化物、硬化性複合材料、樹脂付き金属箔、及び回路基板材料用ワニス

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JPH10182984A (ja) * 1996-12-20 1998-07-07 Hodogaya Chem Co Ltd 多成分混合硬化用樹脂の混合評価方法
JP2002226832A (ja) * 2001-02-02 2002-08-14 Akebono Brake Res & Dev Center Ltd 摩擦材材料攪拌物の混合状態評価方法
JP2004002837A (ja) * 2002-04-26 2004-01-08 Sumitomo Chem Co Ltd 疲労特性の改良された長繊維強化ポリプロピレン系樹脂組成物成形品
US9079376B2 (en) * 2011-01-18 2015-07-14 Hitachi Chemical Company, Ltd. Prepreg, laminate obtained with the same and printed-wiring board
JP2013200298A (ja) * 2012-02-23 2013-10-03 Toray Ind Inc 樹脂組成物中の島部の分散性評価方法および樹脂組成物中の島部の分散性評価装置
JP6864505B2 (ja) * 2016-06-24 2021-04-28 日東電工株式会社 加熱接合用シート及びダイシングテープ付き加熱接合用シート
JP2019014888A (ja) * 2017-07-06 2019-01-31 三菱ケミカル株式会社 樹脂組成物、シート、それを用いた積層体、画像表示装置
JP2019184349A (ja) * 2018-04-06 2019-10-24 日本製紙株式会社 ゴム成分とセルロースナノファイバーの混合液の評価方法
CN119181905A (zh) * 2019-07-17 2024-12-24 大日本印刷株式会社 蓄电装置用外包装材料、其制造方法和蓄电装置
JP2025049784A (ja) * 2023-09-22 2025-04-04 日鉄ケミカル&マテリアル株式会社 金属張積層板及びその製造方法

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JP2018168347A (ja) 2017-08-25 2018-11-01 新日鉄住金化学株式会社 硬化性樹脂組成物、その硬化物、硬化性複合材料、樹脂付き金属箔、及び回路基板材料用ワニス

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JPWO2022131151A1 (https=) 2022-06-23
TWI894408B (zh) 2025-08-21
US20230392002A1 (en) 2023-12-07
CN116583562A (zh) 2023-08-11
WO2022131151A1 (ja) 2022-06-23
TW202244183A (zh) 2022-11-16

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