CN116569326A - 电路组件和电力转换装置 - Google Patents
电路组件和电力转换装置 Download PDFInfo
- Publication number
- CN116569326A CN116569326A CN202180083622.3A CN202180083622A CN116569326A CN 116569326 A CN116569326 A CN 116569326A CN 202180083622 A CN202180083622 A CN 202180083622A CN 116569326 A CN116569326 A CN 116569326A
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- Prior art keywords
- heat conductive
- conductor plate
- circuit assembly
- bonded
- circuit
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
本发明提供一种电路组件,其包括:与导体板的一个面接合的功率半导体元件;与上述导体板的另一个面接合的包含绝缘层的片部件;以上述片部件的与上述导体板接合的面的相反侧的面露出的状态将上述片部件、上述导体板和上述功率半导体元件一体地密封的密封部件;冷却上述功率半导体元件的热的冷却部件;和设置在上述片部件的上述相反侧的面与上述冷却部件之间的导热部件,上述导热部件跨与上述导体板相对的第一投影区域和与上述密封部件相对的第二投影区域地设置,上述导热部件的厚度在上述第二投影区域比在上述第一投影区域厚。
Description
技术领域
本发明涉及电路组件和电力转换装置。
背景技术
使用了功率半导体元件的开关的电力转换装置,由于转换效率高,因此在民生领域、车载领域、铁道领域、变电设备等中被广泛利用。该装置在接合于功率半导体元件的导体板密接含有绝缘层的片部件,并且经由导热部件设置有冷却部件。并且,利用冷却部件将因通电而发热的功率半导体元件冷却。
专利文献1中公开有一种半导体装置,其具有:在安装有半导体元件的金属部件上经由绝缘片设置金属片,并使金属片露出于一个侧面地将半导体元件和金属部件用树脂密封而制作的半导体组件;和经由钎焊接合于金属片,使半导体元件产生的热散热的冷却装置。
现有技术文献
专利文献
专利文献1:日本国特开2011-134949号公报
发明内容
发明要解决的技术问题
专利文献1中记载的装置,由于功率半导体元件的通电/非通电导致的热循环而被作用应力,片部件发生剥离。
用于解决课题的技术方案
本发明的电路组件,包括:与导体板的一个面接合的功率半导体元件;与所述导体板的另一个面接合的包含绝缘层的片部件;以所述片部件的与所述导体板接合的面的相反侧的面露出的状态将所述片部件、所述导体板和所述功率半导体元件一体地密封的密封部件;冷却所述功率半导体元件的热的冷却部件;和设置在所述片部件的所述相反侧的面与所述冷却部件之间的导热部件,所述导热部件跨与所述导体板相对的第一投影区域和与所述密封部件相对的第二投影区域地设置,所述导热部件的厚度在所述第二投影区域比在所述第一投影区域厚。
发明效果
依据本发明,能够抑制片部件的剥离。
附图说明
图1是电路组件的平面图。
图2是电路组件的X-X线的截面图。
图3是电路组件的Y-Y线的截面图。
图4是在X-X线的功率组件的截面立体图。
图5的(a)~(c)是表示电路组件的制造方法的截面图。
图6的(d)~(f)是表示电路组件的制造方法的截面图。
图7是变形例1的电路组件的X-X线的截面图。
图8是变形例2的电路组件的X-X线的截面图。
图9是变形例3的电路组件的X-X线的截面图。
图10是表示没有应用本实施方式的比较例1的主要部分截面图。
图11是表示没有应用本实施方式的比较例2的主要部分截面图。
图12是本实施方式的功率组件的半透视平面图。
图13是本实施方式的功率组件的电路图。
图14是使用了电路组件的电力转换装置的电路图。
图15是电力转换装置的外观立体图。
图16是电力转换装置的XV-XV线的截面立体图。
具体实施方式
以下,参照附图对本发明的实施方式进行说明。以下的记载和附图是用于说明本发明的例示,为了说明的明确化,适当地进行了省略和简化。本发明也能够以其它各种方式实施。除非另有规定,各构成要素可以是单数也可以是复数。
附图所示的各构成要素的位置、大小、形状、范围等,为了使发明容易理解,存在没有表示实际的位置、大小、形状、范围等的情况。因此,本发明不一定限定于附图中公开的位置、大小、形状、范围等。
在具有同一或者相同的功能的构成要素有多个的情况下,存在对同一附图标记附加不同的下标来说明的情况。但是,在不需要对这些多个构成要素加以区别的情况下,有时省略下标进行说明。
图1是电路组件400的平面图,图2是电路组件400的图1所示的X-X线的截面图。图3是电路组件400的图1所示的Y-Y线的截面图。
如图1所示,电路组件400包括3个功率组件300和冷却部件340。功率组件300使用功率半导体元件,具有对直流电流和交流电流进行转换的功能,因通电而发热。因此,构成为在冷却部件340中流通冷却剂进行冷却的构造。冷却剂中使用水或在水中混入有乙二醇的防冻液等。此外,冷却部件340也可以是销状的翅片立设在冷却部件340的基板的结构。冷却部件340优选导热率高的轻量的铝类。冷却部件340通过挤出成型或锻造、钎焊等制作。
功率组件300在一侧具有与直流电路的电容器组件500(参照后述的图14)连结的正极侧端子315B和负极侧端子319B。在正极侧端子315B和负极侧端子319B的另一侧,具有与交流电路的电动发电机组192、194(参照后述的图14)连结的交流侧端子320B等的流通大电流的功率端子。另外,在另一侧,具有下臂栅极信号端子325L、镜像发射极信号端子325M、开尔文发射极信号端子325K、上臂栅极信号端子325U等的用于功率组件300的控制的信号端子等。
如图2所示,作为形成上臂电路的第一功率半导体元件,具有有源元件155、二极管156。作为构成有源元件155的半导体材料,例如能够使用Si、SiC、GaN、GaO、C等。使用有源元件155的体二极管的情况下,也可以省略二极管156。有源元件155的集电极侧和二极管156的阴极侧接合于第二导体板431。在有源元件155的发射极侧和二极管156的阳极侧接合有第一导体板430。在这些接合中可以使用钎焊,也可以使用烧结金属。另外,第一导体板430、第二导体板431只要是导电性和导热率高的材料,就没有特别限定,优选是铜类或者铝类材料。它们可以单独使用,但为了提高与钎焊、或烧结金属的接合性,也可以实施Ni或Ag等的镀覆。
在第一导体板430经由第一片部件440、进而经由导热部件453密接有冷却部件340。第一片部件440通过将第一树脂绝缘层442和金属箔444层叠而构成,金属箔444侧密接导热部件453。
在第二导体板431经由第二片部件441、进而经由导热部件453密接有冷却部件340。第二片部件441通过将第二树脂绝缘层443与金属箔444层叠而构成,金属箔444侧密接有导热部件453。此外,从散热性的观点考虑,优选冷却部件340的宽度比片部件440、441的宽度宽。
如图3所示,作为形成下臂电路的第二功率半导体元件,具有有源元件157、二极管158(参照后述的图13)。此外,在图3中,二极管158在X轴方向上配置在有源元件157的进深侧。有源元件157的集电极侧和二极管158的阴极侧接合于第四导体板433。在有源元件157的发射极侧和二极管158的阳极侧接合有第三导体板432。
如图3所示,第一导体板430、第二导体板431、第三导体板432、第四导体板433除了具有使电流通电的作用以外,还发挥作为将第一功率半导体元件155、156、第二功率半导体元件157、158产生的热向冷却部件340导热的导热部件的作用。导体板430、431、432、433优选导电性、导热率高的材料,也能够使用铜或铝等的金属类材料、或金属类材料和高导热率的钻石、碳、陶瓷等的复合材料等。由于各导体板430、431、432、433与冷却部件340的电位不同,如图2所示,在各导体板430、431、432、433与冷却部件340之间插设具有第一树脂绝缘层442的第一片部件440,另外插设有具有第二树脂绝缘层443的第二片部件441。在各片部件440、441与冷却部件340之间,为了降低接触热阻而具有导热部件453。
导热部件453只要是导热率高的材料,就没有特别的限定,优选使用将钎焊等的金属、陶瓷、碳类材料等的高导热材料与树脂材料组合而成的材料。作为钎焊的例子,能够举例Sn3Ag0.5Cu或Sn58Bi等。作为将陶瓷、碳类材料等的高导热材料与树脂材料相组合的材料的例子,能够举例在硅树脂中组合氧化铝的材料等。
第一功率半导体元件155、156、第二功率半导体元件157、158、各导体板430、431、432、433、各片部件440、441通过传递模塑成型被密封部件360密封。各片部件440、441的第一树脂绝缘层442、第二树脂绝缘层443只要具有与各导体板430、431、432、433的粘接性,就没有特别的限定,优选分散有粉末状的无机填充剂的环氧树脂类树脂绝缘层。这是为了粘接性与散热性的平衡良好。各片部件440、441可以是树脂绝缘层单体,但优选在与导热部件453接触侧设置金属箔444。
在传递模塑成型步骤中,在将各片部件440、441搭载到模具时,为了防止与模具的粘接,在各片部件440、441与模具的接触面设置有脱模片或金属箔444。脱模片由于导热率差,因此在传递模塑后需要剥离的步骤,在金属箔444的情况下,选择铜类或铝类的导热率高的金属,在传递模塑后能够不进行剥离地使用。通过包括各片部件440、441进行传递模塑,各片部件440、441的端部被密封部件360覆盖,具有提高产品可靠性的效果。
电路组件400如图2所示,在片部件440、441与冷却部件340之间具有导热部件453。该导热部件453跨与导体板430、431相对的第一投影区域P1和与上述密封部件相对的第二投影区域P2地设置,导热部件453的厚度在第二投影区域P2比在第一投影区域P1厚。在图2所示的例子中,在第二投影区域P2涉及的冷却部件340设置有凹部341,通过导热部件453进入凹部341中,导热部件453的厚度变得比第一投影区域P1厚。此外,在图2中基于X-X线的截面进行了说明,在Y-Y线的截面中也可以同样地构成。
电路组件400中,由于功率半导体元件155、156的通电/非通电形成的热循环而反复膨胀和收缩,因此被作用应力。该应力为拉伸应力和剪切应力这2个力的合计值,集中在导热部件453的端部。在导热部件453的端部,拉伸应力朝向电路组件400外在水平方向(X-Y方向)上作用,剪切应力朝向电路组件400外在垂直方向(Z方向)上作用。剪切应力与导热部件453的厚度成反比,越薄剪切应力的影响变得越大,越厚剪切应力的影响变得越小。如果剪切应力的影响大,则片部件440、441发生剥离的可能性变高。因此,通过使应力最集中的端部的导热部件453的厚度在第二投影区域P2中形成得较厚,能够使产生的剪切应力的影响减小。由此,能够抑制片部件440、441的剥离,防止电路组件400的绝缘性/散热性的降低。
并且,导热部件453与片部件440、441粘接或者接合的接合区域的外边缘Q位于比第一投影区域P1靠外周侧。由此,能够使接合区域的外边缘Q与导体板430、431离开、即隔开距离,即使片部件440、441发生了剥离,也能够防止电路组件400的绝缘性/散热性的降低。
另外,冷却部件340设置成包含与导体板430、431相对的第一投影区域P1,并且,设置成包含导热部件453与片部件440、441粘接或者接合的接合区域的外边缘Q。外边缘Q位于第二投影区域P2。并且,冷却部件340的端部位于第二投影区域P2。由此,能够不损失冷却部件340的散热性地、防止电路组件400的绝缘性/散热性的降低。
图4是表示在图1所示的X-X线的功率组件300的截面立体图,表示从电路组件400拆除了冷却部件340和导热部件453的状态。如图4所示,第一片部件440的端部由密封部件360覆盖。与第一导体板430的表面重叠的第一片部件440成为散热面。在第一片部件440的散热面上密接冷却部件340,使得散热性不损失。
在图4中,省略了导热部件453的图示,导热部件453与从密封部件360露出的第一片部件440的表面粘接或者接合的面积S2,比与导体板430相对的第一投影区域P1的面积S1大。由此,能够将第一片部件440与导体板430离开、即隔开距离,即使片部件440、441发生了剥离,也能够防止电路组件400的绝缘性/散热性的降低。
图5的(a)~(c)、图6的(d)~(f)是表示电路组件400的制造方法的截面图。在各图的左侧表示图1所示的X-X线的对应1功率组件的截面图,右侧表示在图1所示的Y-Y线的对应1功率组件的截面图。
图5的(a)是表示钎焊连接步骤和导线接合步骤的图。在第二导体板431连接作为第一功率半导体元件的有源元件155的集电极侧和二极管156的阴极侧,将有源元件155的栅极电极通过导线键合连接。在第一导体板430连接有源元件155的发射极侧和二极管156的阳极侧。同样地,在第四导体板433连接作为第二功率半导体元件的有源元件157的集电极侧和二极管158的阴极侧,将有源元件157的栅极电极通过导线键合连接。在第三导体板432连接有源元件157的发射极侧和二极管158的阳极侧。像这样形成电路组件310。
图5的(b)是表示模具设置步骤的图。在传递模塑装置601内的模具设置电路组件310和片部件440、441。传递模塑装置601包括将弹簧602和片部件440、441真空吸附在模具中的机构以及真空脱气机构。传递模塑装置601在预先加热到175℃的恒温状态的模具内通过真空吸附保持片部件440、441。并且,将预先预热到175℃的电路组件310配置在与片部件440、441离开的位置。
图5的(c)是表示加压步骤的图。在该步骤中,从片部件440、441与电路组件310离开的状态将上下的模具靠近,仅使未图示的设置在上下模具的周围的密封圈接触。接着,将模具空腔进行真空排气。到成为规定的气压以下,真空排气完成,将密封圈进一步压变形,将上下的模具完全地夹紧。这时,片部件440、441与电路组件310接触。在真空状态下,片部件440、441与电路组件310接触,利用弹簧602产生的加压力密接,因此能够不留空隙地密接。并且,将密封部件360注入模具空腔中。
图6的(d)是表示固化步骤的图。从传递模塑装置601取出由密封部件360密封了的功率组件300,在常温下冷却,并进行2小时以上的固化。
图6的(e)是表示冷却部件340的配置步骤的图。在该步骤中配置冷却部件340,其设置在由导热部件453覆盖从密封部件360的表面露出的片部件440、441的位置,并且,在覆盖导热部件453的位置形成有凹部341。
图6的(f)是表示冷却部件340的设置步骤的图。在该步骤中,将导热部件453和冷却部件340粘接。
因为在冷却部件340形成有凹部341,所以在将导热部件453与冷却部件340粘接时,导热部件453被按压,从而导热部件453进入形成在密封部件360的凹部454中。在导热部件453为金属类的情况下,该步骤在加热环境下进行。加热温度根据使用的金属的熔点而不同。并且,冷却部件340经由导热部件453与第一片部件440、第二片部件441密接。
通过以上的步骤制造的电路组件400中,导热部件453被按压,在水平方向上突出的部分进入凹部341中,关于导热部件453的厚度,第二投影区域P2变得比第一投影区域P1厚。
图7是变形例1中的电路组件400的图1所示的X-X线的截面图。对于与图2所示的电路组件400相同的部分标注相同的附图标记而省略其说明。此外,在以下说明的结构,基于X-X线的截面进行说明,在Y-Y线的截面也可以同样地构成。
图7中表示的变形例1中,片部件440的端部陷落在密封部件360中,形成有凹部342。并且,导热部件453的端部R1位于凹陷的片部件440的凹部342。并且,因为导热部件453进入到片部件440的凹部342和冷却部件340的凹部341中,所以在第二投影区域P2中能够使导热部件453增厚。像这样,第二投影区域P2中的导热部件453的厚度,不仅在冷却部件340的凹部341的方向、即Z方向上延伸,而且在片部件440的凹部342的方向、即Z方向的反方向上延伸。此外,凹部341、342的截面形状无论是梯形形状、三角形形状等何种形状,只要比第一投影区域P1中的导热部件453厚即可。并且,进入到凹部341、342中的导热部件453的形状也没有限定。另外,不必一定设置凹部341、342的双方,至少设置一者即可。设置凹部341、342的位置只要在第二投影区域P2内就可以是任意位置,也可以设置多个部位。
图8是表示变形例2的电路组件400的图1所示的X-X线的截面图。对与图2所示的电路组件400相同的部位标注相同的附图标记而省略其说明。此外,作以下说明的结构基于X-X线的截面进行说明,但在Y-Y线的截面也可以同样地构成。
在图8所示的变形例2中,冷却部件340比第一投影区域P1长,冷却部件340的端部位于第二投影区域P2内。并且,导热部件453与冷却部件340的端部的侧面粘接或者接合。由此,第二投影区域P2内的导热部件453的厚度t2比第一投影区域P1的厚度t1厚。
图9是变形例3的电路组件400的图1所示的X-X线的截面图。对与图2所示的电路组件400相同的部位标注相同的附图标记而省略其说明。此外,在以下所说明的结构基于X-X线的截面进行说明,在Y-Y线的截面也可以同样地构成。
图9中所示的变形例3中,冷却部件340位于与第一投影区域P1相同的区域,冷却部件340的端部位于第一投影区域P1与第二投影区域P2的边界。并且,导热部件453与冷却部件340的端部的侧面粘接或者接合。与冷却部件340的端部的侧面粘接的导热部件453,可以不必与冷却部件340的侧面的整面粘接,至导热部件453的顶点的厚度t2也可以左右是不同厚度。在该变形例3的情况下,第二投影区域P2内的导热部件453的厚度t2也比第一投影区域P1的厚度t1厚。
图10是表示没有应用本实施方式的情况下的比较例1的主要部分截面图。
在比较例1中,在导体板430与冷却部件340之间设置有具有树脂绝缘层442和金属箔444的片部件440以及导热部件453,片部件440的端部被密封部件360覆盖。并且,片部件440的端部的位置与导热部件453的端部的位置一致。
在电路组件400中,由于功率半导体元件159的通电/非通电导致的热循环而反复进行膨胀和收缩,因此被作用应力。该应力是拉伸应力和剪切应力这2个力的合计值,集中在导热部件453的端部。其结果是,在树脂绝缘层442与导体板430之间产生剥离部700,含有导电性物质的导热部件453进入其中,电路组件400的绝缘性/散热性降低。
图11是表示没有应用本实施方式的情况的比较例2的主要部分截面图。对于与比较例1相同的部位标注相同的附图标记而省略其说明。
在比较例2中,与密封部件360相对的第二投影区域P2中的导热部件453的厚度,相比于与导体板430相对的第一投影区域P1的厚度是相同的或者较薄。因此,不能避免在导热部件453的端部集中的应力,在片部件440与导体板430之间产生剥离,电路组件400的绝缘性/散热性降低。
依据本实施方式,因为能够降低施加于片部件的应力的影响,所以能够抑制片部件的剥离,并且防止电路组件400的绝缘性/散热性的降低。
图12是本实施方式的功率组件300的半透视平面图。图13是本实施方式的功率组件300的电路图。
如图12、图13所示,正极侧端子315B从上臂电路的集电极侧输出,连接于电池或者电容器的正极侧。上臂栅极信号端子325U从上臂电路的有源元件155的栅极和发射极检测(Emitter Sense)输出。负极侧端子319B从下臂电路的发射极侧输出,连接于电池或者电容器的负极侧、或者与GND连接。下臂栅极信号端子325L从下臂电路的有源元件157的栅极和发射极检测输出。交流侧端子320B从下臂电路的集电极侧输出,连接于电动机。构成中性点接地的情况下,下臂电路不连接于GND而连接于电容器的负极侧。
另外,在第一功率半导体元件(上臂电路)的有源元件155和二极管156的上下配置有第一导体板(上臂电路发射极侧)430、第二导体板(上臂电路集电极侧)431。在第二功率半导体元件(下臂电路)的有源元件157和二极管158的上下配置有第三导体板(下臂电路发射极侧)432、第四导体板(下臂电路集电极侧)433。
在密封部件360的表面,在比省略了图示的第一片部件440靠外周侧,沿着第一片部件440的外边缘形成有一周的凹部454。
本实施方式的功率组件300是将上臂电路和下臂电路这2个臂电路一体化在1个组件中的构造即2in1构造。此外,也可以使用将多个上臂电路和下臂电路一体化在1个组件中的构造。在该情况下,能够降低从功率组件300的输出端子的数量并且小型化。
图14是使用了电路组件400的电力转换装置200的电路图。
电力转换装置200具有逆变器电路140、142、辅机用的逆变器电路43和电容器组件500。逆变器电路140和142由具有多个功率组件300的电路组件400(图示省略)构成,通过将它们连接构成三相桥式电路。在电流容量较大的情况下,进一步将功率组件300并联连接,并且将这些并联连接与三相逆变器电路的各相对应地进行,由此能够应对电流容量的增大。另外,通过将内置于功率组件300的功率半导体元件即有源元件155、157和/或二极管156、158并联连接也能够应对电流容量的增大。
逆变器电路140与逆变器电路142基本的电路结构相同,控制方法和动作也基本相同。因为逆变器电路140等的电路的动作的概要是周知的,在此详细的说明省略。
如上所述,上臂电路作为开关用的功率半导体元件具有上臂用的有源元件155和上臂用的二极管156,下臂电路作为开关用的功率半导体元件具有下臂用的有源元件157和下臂用的二极管158。有源元件155、157接收从构成驱动电路174的2个驱动电路的一个或者另一个输出的驱动信号进行开关动作,将从电池136供给的直流电功率转换位三相交流电功率。
如上所述,上臂用的有源元件155和下臂用的有源元件157具有集电极电极、发射极电极、栅极电极。上臂用的二极管156和下臂用的二极管158具有阴极电极和阳极电极这2个电极。如图13所示,二极管156、158的阴极电极电连接于有源元件155、157的集电极电极,阳极电极电连接于有源元件155、157的发射极电极。由此,从上臂用的有源元件155和下臂用的有源元件157的发射极电极向集电极电极去的电流的流动成为顺方向。
此外,作为有源元件可以使用MOSFET(金属氧化物半导体场效应晶体管),在该情况下,不需要上臂用的二极管156、下臂用的二极管158。
各上/下臂串联电路的正极侧端子315B和负极侧端子319B分别连接于电容器组件500的电容器连接用的直流端子362A、362B。在上臂电路与下臂电路的连接部分别产生交流电功率,各上/下臂串联电路的上臂电路与下臂电路的连接部连接于各功率组件300的交流侧端子320B。各相的各功率组件300的交流侧端子320B分别连接于电力转换装置200的交流输出端子,所产生的交流电功率供给到电动发电机组192或194的定子绕组。
控制电路172基于来自车辆侧的控制装置或传感器(例如电流传感器180)等的输入信息,生成用于控制上臂用的有源元件155、下臂的有源元件157的开关定时的定时信号。驱动电路174基于从控制电路172输出的定时信号,生成用于使上臂用的有源元件155、下臂用的有源元件157进行开关动作的驱动信号。此外,181、182、188为连接器。
上/下臂串联电路包括未图示的温度传感器,上/下臂串联电路的温度信息输入到控制电路172。另外,对控制电路172输入上/下臂串联电路的直流正极侧的电压信息。控制电路172基于这些信息进行过温度检测和过电压检测,在检测到过温度或者过电压的情况下,使全部的上臂用的有源元件155、下臂用的有源元件157的开关动作停止,保护上/下臂串联电路不受过温度或者过电压影响。
图15是图14所示的电力转换装置200的外观立体图,图16是图15所示的电力转换装置200的XV-XV线的截面立体图。
如图15所示,电力转换装置200具有由下部壳体11和上部壳体10构成的、形成为大致长方体形状的外壳12。在外壳12的内部收容有电路组件400、电容器组件500等。电路组件400具有冷却流路,与冷却流路连通的冷却水流入管13和冷却水流出管14从外壳12的一侧面突出。下部壳体11的上部侧(Z方向)开口,上部壳体10封闭下部壳体11的开口地安装于下部壳体11。上部壳体10和下部壳体11由铝合金等形成,相对于外部密封地固定。上部壳体10与下部壳体11也可以一体化地构成。通过将外壳12形成为简单的长方体形状,向车辆等的安装变得容易,另外,生产率也提高。
在外壳12的长边方向的一侧面安装有连接器17,在该连接器17连接有交换终端18。另外,在冷却水流入管13和冷却水流出管14导出的面设置由连接器21。
如图16所示,在外壳12内收容有电路组件400。在电路组件400的上方配置控制电路172和驱动电路174,在电路组件400的直流端子侧收容有电容器组件500。通过将电容器组件配置在与电路组件400相同的高度,能够使电力转换装置200薄型化,向车辆的设置自由度提高。电路组件400的交流侧端子320B贯通电流传感器180而与母线接合。另外,作为电路组件400的直流端子的正极侧端子315B和负极侧端子319B分别接合于电容器组件500的正/负极端子(图14的直流端子362A、362B)。
基于以上所说明的实施方式,能够获得以下的作用效果。
(1)电路组件400包括:与导体板430、431、432、433的一个面接合的功率半导体元件159;与导体板430、431、432、433的另一个面接合的包含绝缘层的片部件440、441;以片部件440、441的与导体板430、431、432、433接合的面的相反侧的面露出的状态将片部件440、441和导体板430、431、432、433以及功率半导体元件159一体地密封的密封部件360;冷却功率半导体元件159的热的冷却部件340;和设置在片部件440、441的相反侧的面与冷却部件340之间的导热部件453,导热部件453跨与导体板430、431、432、433相对的第一投影区域P1和与密封部件360相对的第二投影区域P2地设置,导热部件453的厚度在第二投影区域P2比在第一投影区域P1厚。由此,能够抑制片部件的剥离。
本发明不限于上述的实施方式,只要不损害本发明的特征,在本发明的技术思想的范围内能够想到的其它的方式也包括在本发明的范围内。另外,也可以形成将上述的实施方式与多个变形例相组合的结构。
附图标记的说明
10…上部壳体、11…下部壳体、13…冷却水流入管、14…冷却水流出管、17、21…连接器、18…交换终端、43、140、142…逆变器电路、155…第一功率半导体元件(上臂电路有源元件)、156…第一功率半导体元件(上臂电路二极管)、157…第二功率半导体元件(下臂电路有源元件)、158…第二功率半导体元件(下臂电路二极管)、172…控制电路、174…驱动电路、180…电流传感器、181、182、188…连接器、192、194…电动发电机组、200…电力转换装置、300…功率组件、310…电路组件、315B…正极侧端子、319B…负极侧端子、320B…交流侧端子、325…信号端子、325K…开尔文发射极信号端子、325L…下臂栅极信号端子、325M…镜像发射极信号端子、325U…上臂栅极信号端子、340…冷却部件、341…冷却部件的凹部、342…片部件的凹部、360…密封部件、400…电路组件、430…第一导体板(上臂电路发射极侧)、431…第二导体板(上臂电路集电极侧)、432…第三导体板(下臂电路发射极侧)、433…第四导体板(下臂电路集电极侧)、440…第一片状部件(发射极侧)、441…第二片状部件(集电极侧)、442…第一树脂绝缘层(发射极侧)、443…第二树脂绝缘层(集电极侧)、444…金属箔、453…导热部件、500…电容器组件、601…传递模塑装置、602…弹簧、700…剥离部、P1…第一投影区域、P2…第二投影区域。
Claims (10)
1.一种电路组件,其特征在于,包括:
与导体板的一个面接合的功率半导体元件;
与所述导体板的另一个面接合的包含绝缘层的片部件;
以所述片部件的与所述导体板接合的面的相反侧的面露出的状态将所述片部件、所述导体板和所述功率半导体元件一体地密封的密封部件;
冷却所述功率半导体元件的热的冷却部件;和
设置在所述片部件的所述相反侧的面与所述冷却部件之间的导热部件,
所述导热部件跨与所述导体板相对的第一投影区域和与所述密封部件相对的第二投影区域地设置,所述导热部件的厚度在所述第二投影区域比在所述第一投影区域厚。
2.如权利要求1所述的电路组件,其特征在于:
所述导热部件与所述片部件粘接或接合的接合区域的外边缘位于比所述第一投影区域靠外周侧。
3.如权利要求2所述的电路组件,其特征在于:
所述冷却部件设置成包含与所述导体板相对的所述第一投影区域,所述第一投影区域位于所述接合区域的所述外边缘以内的内周侧。
4.如权利要求1所述的电路组件,其特征在于:
所述冷却部件形成有所述导热部件能够进入的凹部。
5.如权利要求1所述的电路组件,其特征在于:
所述片部件凹陷到所述密封部件而形成凹部,所述导热部件进入所述凹部中。
6.如权利要求1所述的电路组件,其特征在于:
所述冷却部件的端部位于所述第二投影区域中,或者位于所述第一投影区域与所述第二投影区域的边界。
7.如权利要求6所述的电路组件,其特征在于:
所述导热部件与所述冷却部件的端部的侧面粘接或接合。
8.如权利要求1所述的电路组件,其特征在于:
所述导热部件与从所述密封部件露出的所述片部件的表面粘接或接合的面积,大于与所述导体板相对的所述第一投影区域的面积。
9.如权利要求1~8中任一项所述的电路组件,其特征在于:
所述导体板配置在所述功率半导体元件的两面,所述配置的各所述导体板的一个面与所述功率半导体元件接合,
所述片部件与各所述导体板的另一个面分别接合,
所述冷却部件与所述各片部件经由所述导热部件分别粘接。
10.一种电力转换装置,其特征在于:
具有权利要求1~8中任一项所述的电路组件,将直流电功率转换为交流电功率。
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JP6767898B2 (ja) * | 2017-02-28 | 2020-10-14 | 日立オートモティブシステムズ株式会社 | パワー半導体装置 |
US20210206906A1 (en) * | 2018-05-31 | 2021-07-08 | Showa Denko Materials Co., Ltd. | Resin composition, resin member, resin sheet, b-stage sheet, c-stage sheet, metal foil with resin, metal substrate, and power semiconductor device |
JP7141316B2 (ja) * | 2018-11-21 | 2022-09-22 | 日立Astemo株式会社 | パワー半導体装置 |
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2021
- 2021-09-29 CN CN202180083622.3A patent/CN116569326A/zh active Pending
- 2021-09-29 WO PCT/JP2021/035850 patent/WO2022137701A1/ja active Application Filing
- 2021-09-29 US US18/266,405 patent/US20240047231A1/en active Pending
- 2021-09-29 DE DE112021005402.3T patent/DE112021005402T5/de active Pending
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JP2022098587A (ja) | 2022-07-04 |
US20240047231A1 (en) | 2024-02-08 |
DE112021005402T5 (de) | 2023-07-27 |
WO2022137701A1 (ja) | 2022-06-30 |
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