CN116508400A - 半加成法用层叠体及使用其的印刷配线板 - Google Patents

半加成法用层叠体及使用其的印刷配线板 Download PDF

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Publication number
CN116508400A
CN116508400A CN202180074841.5A CN202180074841A CN116508400A CN 116508400 A CN116508400 A CN 116508400A CN 202180074841 A CN202180074841 A CN 202180074841A CN 116508400 A CN116508400 A CN 116508400A
Authority
CN
China
Prior art keywords
layer
silver
silver particle
mentioned
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180074841.5A
Other languages
English (en)
Chinese (zh)
Inventor
深泽宪正
富士川亘
村川昭
白发润
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp filed Critical DIC Corp
Publication of CN116508400A publication Critical patent/CN116508400A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
CN202180074841.5A 2020-11-05 2021-10-21 半加成法用层叠体及使用其的印刷配线板 Pending CN116508400A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-184973 2020-11-05
JP2020184973 2020-11-05
PCT/JP2021/038868 WO2022097480A1 (ja) 2020-11-05 2021-10-21 セミアディティブ工法用積層体及びそれを用いたプリント配線板

Publications (1)

Publication Number Publication Date
CN116508400A true CN116508400A (zh) 2023-07-28

Family

ID=81457247

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180074841.5A Pending CN116508400A (zh) 2020-11-05 2021-10-21 半加成法用层叠体及使用其的印刷配线板

Country Status (5)

Country Link
JP (1) JP7288230B2 (enrdf_load_stackoverflow)
KR (1) KR20230098195A (enrdf_load_stackoverflow)
CN (1) CN116508400A (enrdf_load_stackoverflow)
TW (1) TW202236926A (enrdf_load_stackoverflow)
WO (1) WO2022097480A1 (enrdf_load_stackoverflow)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3570802B2 (ja) 1995-11-14 2004-09-29 三井化学株式会社 銅薄膜基板及びプリント配線板
JP4011968B2 (ja) 2002-05-14 2007-11-21 富士通株式会社 配線基板およびその製造方法ならびに導体張板
KR20100027228A (ko) 2007-07-02 2010-03-10 파나소닉 주식회사 금속 적층 폴리이미드 기판 및 그 제조 방법
JP2009239238A (ja) 2008-03-28 2009-10-15 Fujifilm Corp 電子回路基板の製造方法
JP2010272837A (ja) 2009-04-24 2010-12-02 Sumitomo Electric Ind Ltd プリント配線板用基板、プリント配線板、及びプリント配線板用基板の製造方法
JP6274609B2 (ja) 2012-04-19 2018-02-07 アキレス株式会社 両面回路基板の製造方法
KR102707316B1 (ko) 2018-06-26 2024-09-19 디아이씨 가부시끼가이샤 금속 패턴을 갖는 성형체의 제조 방법

Also Published As

Publication number Publication date
TW202236926A (zh) 2022-09-16
JP7288230B2 (ja) 2023-06-07
JPWO2022097480A1 (enrdf_load_stackoverflow) 2022-05-12
WO2022097480A1 (ja) 2022-05-12
KR20230098195A (ko) 2023-07-03

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