TW202236926A

TW202236926A - 半加成工法用積層體及使用其之印刷配線板

半加成工法用積層體及使用其之印刷配線板 Download PDF

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Publication number: TW202236926A
Authority: TW; Taiwan
Prior art keywords: layer; mentioned; silver; silver particle; conductive
Prior art date: 2020-11-05

Application number

TW110140951A

Other languages

English (en)

Chinese (zh)

Inventor

深澤憲正

冨士川亘

村川昭

白髪潤

Original Assignee

日商Ｄｉｃ股份有限公司

Priority date

2020-11-05

Filing date

2021-11-03

Publication date

2022-09-16

2021-11-03 Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司

2022-09-16 Publication of TW202236926A publication Critical patent/TW202236926A/zh

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239000000654 additive Substances 0.000 title claims abstract description 90
238000004519 manufacturing process Methods 0.000 title claims abstract description 73
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 335
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239000004332 silver Substances 0.000 claims abstract description 335
239000002245 particle Substances 0.000 claims abstract description 242
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238000000034 method Methods 0.000 claims description 209
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