CN1163340C - 注射模制用模具 - Google Patents

注射模制用模具 Download PDF

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Publication number
CN1163340C
CN1163340C CNB981154859A CN98115485A CN1163340C CN 1163340 C CN1163340 C CN 1163340C CN B981154859 A CNB981154859 A CN B981154859A CN 98115485 A CN98115485 A CN 98115485A CN 1163340 C CN1163340 C CN 1163340C
Authority
CN
China
Prior art keywords
mould
profile
mold
locating surface
injection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB981154859A
Other languages
English (en)
Chinese (zh)
Other versions
CN1210062A (zh
Inventor
加藤德雄
野口元弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Aiwa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aiwa Co Ltd filed Critical Aiwa Co Ltd
Publication of CN1210062A publication Critical patent/CN1210062A/zh
Application granted granted Critical
Publication of CN1163340C publication Critical patent/CN1163340C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/36Moulds having means for locating or centering cores
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/2681Moulds with rotatable mould parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/34Moulds having venting means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/36Moulds having means for locating or centering cores
    • B29C2045/363Moulds having means for locating or centering cores using a movable core or core part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Pulleys (AREA)
CNB981154859A 1997-07-11 1998-07-08 注射模制用模具 Expired - Fee Related CN1163340C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP186959/1997 1997-07-11
JP186959/97 1997-07-11
JP18695997 1997-07-11

Publications (2)

Publication Number Publication Date
CN1210062A CN1210062A (zh) 1999-03-10
CN1163340C true CN1163340C (zh) 2004-08-25

Family

ID=16197728

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB981154859A Expired - Fee Related CN1163340C (zh) 1997-07-11 1998-07-08 注射模制用模具

Country Status (4)

Country Link
KR (1) KR100286595B1 (ko)
CN (1) CN1163340C (ko)
ID (1) ID21247A (ko)
TW (1) TW429212B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060198974A1 (en) * 2003-01-24 2006-09-07 Miller William E Apparatus and method for removing a molded article from a mold, and a molded article
JP4380629B2 (ja) * 2005-12-28 2009-12-09 トヨタ自動車株式会社 成形品の金型
KR200457693Y1 (ko) 2009-05-19 2011-12-29 (주)굿센스 진공흡착구의 폴리우레탄 진공벽 성형틀
CN109465453A (zh) * 2018-12-29 2019-03-15 上海三环磁性材料有限公司 一种粘结稀土永磁体压射成型方法

Also Published As

Publication number Publication date
KR100286595B1 (ko) 2001-04-16
KR19990013766A (ko) 1999-02-25
ID21247A (id) 1999-05-12
CN1210062A (zh) 1999-03-10
TW429212B (en) 2001-04-11

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Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SONY CORP.

Free format text: FORMER OWNER: AIWA CO., LTD.

Effective date: 20041022

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20041022

Address after: Tokyo, Japan

Patentee after: Sony Corporation

Address before: Tokyo, Japan

Patentee before: Aiwa Co., Ltd.

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