CN116234845A - 固化物的制造方法、层叠体的制造方法及半导体器件的制造方法 - Google Patents

固化物的制造方法、层叠体的制造方法及半导体器件的制造方法 Download PDF

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CN116234845A
CN116234845A CN202180064487.8A CN202180064487A CN116234845A CN 116234845 A CN116234845 A CN 116234845A CN 202180064487 A CN202180064487 A CN 202180064487A CN 116234845 A CN116234845 A CN 116234845A
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group
carbon atoms
compound
cured product
producing
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高岛美沙树
岛田和人
野崎敦靖
佐藤直树
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Fujifilm Corp
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Fujifilm Corp
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
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    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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  • Architecture (AREA)
  • Inorganic Chemistry (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
CN202180064487.8A 2020-09-29 2021-08-31 固化物的制造方法、层叠体的制造方法及半导体器件的制造方法 Pending CN116234845A (zh)

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Application Number Priority Date Filing Date Title
JP2020-164048 2020-09-29
JP2020164048 2020-09-29
JP2020217905 2020-12-25
JP2020-217905 2020-12-25
JP2021119709 2021-07-20
JP2021-119709 2021-07-20
PCT/JP2021/031879 WO2022070730A1 (ja) 2020-09-29 2021-08-31 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法

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KR (1) KR102848086B1 (https=)
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TW (1) TWI898039B (https=)
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CN118946611A (zh) * 2022-03-29 2024-11-12 富士胶片株式会社 固化物的制造方法、半导体器件的制造方法、处理液及树脂组合物
TWI824586B (zh) * 2022-06-28 2023-12-01 達興材料股份有限公司 顯影劑組成物、圖案形成方法及半導體裝置的製造方法
WO2024024820A1 (ja) * 2022-07-29 2024-02-01 富士フイルム株式会社 感光性組成物、転写フィルム、積層体の製造方法、積層体、半導体パッケージ
CN117467218B (zh) * 2023-12-28 2024-03-12 南方珠江科技有限公司 一种抗拉抗压的光电复合电缆

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JPH03194559A (ja) * 1989-12-25 1991-08-26 Hitachi Chem Co Ltd 感光性ポリイミド前駆体用現像液
US5310625A (en) * 1992-03-13 1994-05-10 International Business Machines Corporation Process for forming negative tone images of polyimides using base treatment of crosslinked polyamic ester
WO2018003725A1 (ja) * 2016-06-29 2018-01-04 富士フイルム株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜の製造方法、半導体デバイス、積層体の製造方法、半導体デバイスの製造方法およびポリイミド前駆体
TW202018411A (zh) * 2018-08-09 2020-05-16 日商東麗股份有限公司 感光性樹脂組成物、感光性薄片、以及彼等之硬化膜及其製造方法、電子零件

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JP2924109B2 (ja) * 1990-07-04 1999-07-26 東レ株式会社 選択的にポリイミド表面を処理する方法
JP4752902B2 (ja) * 2008-12-01 2011-08-17 住友ベークライト株式会社 絶縁膜または保護膜の不純物低減方法
JP6087655B2 (ja) * 2013-02-18 2017-03-01 東京応化工業株式会社 現像液、及び感光性樹脂組成物の現像処理方法

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JPH03194559A (ja) * 1989-12-25 1991-08-26 Hitachi Chem Co Ltd 感光性ポリイミド前駆体用現像液
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WO2018003725A1 (ja) * 2016-06-29 2018-01-04 富士フイルム株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜の製造方法、半導体デバイス、積層体の製造方法、半導体デバイスの製造方法およびポリイミド前駆体
TW202018411A (zh) * 2018-08-09 2020-05-16 日商東麗股份有限公司 感光性樹脂組成物、感光性薄片、以及彼等之硬化膜及其製造方法、電子零件

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