JP7602553B2 - 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法 - Google Patents

硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法 Download PDF

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JP7602553B2
JP7602553B2 JP2022553563A JP2022553563A JP7602553B2 JP 7602553 B2 JP7602553 B2 JP 7602553B2 JP 2022553563 A JP2022553563 A JP 2022553563A JP 2022553563 A JP2022553563 A JP 2022553563A JP 7602553 B2 JP7602553 B2 JP 7602553B2
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carbon atoms
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acid
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美沙樹 ▲高▼嶋
和人 嶋田
敦靖 野崎
直樹 佐藤
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Fujifilm Corp
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    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
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    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
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    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
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  • Physics & Mathematics (AREA)
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  • Organic Chemistry (AREA)
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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  • Materials For Photolithography (AREA)
JP2022553563A 2020-09-29 2021-08-31 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法 Active JP7602553B2 (ja)

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JP2020164048 2020-09-29
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JP2020217905 2020-12-25
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JP2021119709 2021-07-20
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PCT/JP2021/031879 WO2022070730A1 (ja) 2020-09-29 2021-08-31 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法

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TWI824586B (zh) * 2022-06-28 2023-12-01 達興材料股份有限公司 顯影劑組成物、圖案形成方法及半導體裝置的製造方法
WO2024024820A1 (ja) * 2022-07-29 2024-02-01 富士フイルム株式会社 感光性組成物、転写フィルム、積層体の製造方法、積層体、半導体パッケージ
CN117467218B (zh) * 2023-12-28 2024-03-12 南方珠江科技有限公司 一种抗拉抗压的光电复合电缆

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JPH03194559A (ja) * 1989-12-25 1991-08-26 Hitachi Chem Co Ltd 感光性ポリイミド前駆体用現像液
JP2924109B2 (ja) * 1990-07-04 1999-07-26 東レ株式会社 選択的にポリイミド表面を処理する方法
JP2635901B2 (ja) * 1992-03-13 1997-07-30 インターナショナル・ビジネス・マシーンズ・コーポレイション ポリイミドのネガティブ像形成方法
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JP6087655B2 (ja) * 2013-02-18 2017-03-01 東京応化工業株式会社 現像液、及び感光性樹脂組成物の現像処理方法
TWI728137B (zh) * 2016-06-29 2021-05-21 日商富士軟片股份有限公司 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體裝置、積層體的製造方法、半導體裝置的製造方法及聚醯亞胺前驅物
CN112368641B (zh) * 2018-08-09 2025-05-02 东丽株式会社 感光性树脂组合物、感光性片材、以及它们的固化膜及其制造方法、电子部件

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