CN116195012A - 芯片电阻器及其制造方法 - Google Patents

芯片电阻器及其制造方法 Download PDF

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Publication number
CN116195012A
CN116195012A CN202180065194.1A CN202180065194A CN116195012A CN 116195012 A CN116195012 A CN 116195012A CN 202180065194 A CN202180065194 A CN 202180065194A CN 116195012 A CN116195012 A CN 116195012A
Authority
CN
China
Prior art keywords
resistance element
equal
chip resistor
atomic
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180065194.1A
Other languages
English (en)
Chinese (zh)
Inventor
末次大辅
野口宪路
浦川达也
小田裕贵
上山大辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN116195012A publication Critical patent/CN116195012A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/142—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06553—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of a combination of metals and oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin-film techniques
    • H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin-film techniques by sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/288—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/006—Thin film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/0656—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of silicides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
CN202180065194.1A 2020-10-06 2021-10-04 芯片电阻器及其制造方法 Pending CN116195012A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-169323 2020-10-06
JP2020169323 2020-10-06
PCT/JP2021/036549 WO2022075238A1 (ja) 2020-10-06 2021-10-04 チップ抵抗器、及び製造方法

Publications (1)

Publication Number Publication Date
CN116195012A true CN116195012A (zh) 2023-05-30

Family

ID=81126897

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180065194.1A Pending CN116195012A (zh) 2020-10-06 2021-10-04 芯片电阻器及其制造方法

Country Status (4)

Country Link
US (1) US12537119B2 (https=)
JP (1) JPWO2022075238A1 (https=)
CN (1) CN116195012A (https=)
WO (1) WO2022075238A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI909992B (zh) * 2025-03-14 2025-12-21 國巨股份有限公司 薄膜電阻及其製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025053030A1 (ja) * 2023-09-04 2025-03-13 パナソニックＩｐマネジメント株式会社 抵抗器及び抵抗器の製造方法
WO2025164036A1 (ja) * 2024-01-30 2025-08-07 パナソニックＩｐマネジメント株式会社 チップ抵抗器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05347202A (ja) * 1992-06-15 1993-12-27 Tdk Corp 電子部品及び電子部品の抵抗値調整方法
DE59605278D1 (de) * 1995-03-09 2000-06-29 Philips Corp Intellectual Pty Elektrisches Widerstandsbauelement mit CrSi-Widerstandsschicht
US5907274A (en) * 1996-09-11 1999-05-25 Matsushita Electric Industrial Co., Ltd. Chip resistor
JP3915188B2 (ja) * 1996-09-11 2007-05-16 松下電器産業株式会社 チップ抵抗器及びその製造方法
JP3738313B2 (ja) 1999-05-13 2006-01-25 カシオ計算機株式会社 発熱抵抗体とその製造方法
JP2000340413A (ja) * 1999-05-26 2000-12-08 Matsushita Electric Ind Co Ltd 多連チップ抵抗器およびその製造方法
JP3664655B2 (ja) 2000-03-13 2005-06-29 進工業株式会社 高比抵抗材料とその製造方法
WO2017047512A1 (ja) * 2015-09-16 2017-03-23 Ｓｅｍｉｔｅｃ株式会社 抵抗器及び温度センサ
JP6572143B2 (ja) * 2016-01-27 2019-09-04 Koa株式会社 チップ抵抗器およびその製造方法
US11765824B2 (en) * 2020-07-21 2023-09-19 Panasonic Intellectual Property Management Co., Ltd. Laminated ceramic sintered body board for electronic device, electronic device, chip resistor, and method for manufacturing chip resistor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI909992B (zh) * 2025-03-14 2025-12-21 國巨股份有限公司 薄膜電阻及其製造方法

Also Published As

Publication number Publication date
US20230411051A1 (en) 2023-12-21
WO2022075238A1 (ja) 2022-04-14
US12537119B2 (en) 2026-01-27
JPWO2022075238A1 (https=) 2022-04-14

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