CN116043025B - 一种钠盐浸泡剥离腔体部件表面贵金属的回收贵金属方法 - Google Patents
一种钠盐浸泡剥离腔体部件表面贵金属的回收贵金属方法 Download PDFInfo
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Abstract
一种钠盐浸泡剥离腔体部件表面贵金属的回收贵金属方法,它包括以下步骤:1)剥离溶液配制;2)腔体部件浸泡;3)腔体部件取出;4)贵液处理和5)溴气回收处理。本回收贵金属方法设计理想,采用氢氧化钠溶液在钠盐催化剂的催化作用下,对腔体部件表面贵金属(如Au和Pt)的剥离溶解快,而且更加的彻底,贵金属的回收率高,不会对环境造成污染,安全风险小,并且生产周期短,贵金属回收成本低,同时不损伤腔体部件,代替现有氰化钠溶解回收贵金属方式而存在诸多问题。
Description
技术领域
本发明涉及贵金属二次资源回收技术领域,具体地说是指一种钠盐浸泡剥离腔体部件表面贵金属的回收贵金属方法。
背景技术
随着人们对电子产品越来越依赖,半导体行业如火如荼地发展起来。如LED芯片,它是一种固态的半导体电子器件,是LED灯的核心组件,即是P-N结,主要功能是直接把电能转化为光能。目前LED芯片一般采用铝反射层金电极结构的LED芯片,其电极中主要含有Pt、Au、Al三层金属。我国LED芯片产业的不断发展,LED芯片生产设备在加工LED芯片(即金电极)过程中,生产设备(如半导体蒸发台)用的腔体部件表面不可避免地会附着有较多的贵金属(主要为Au和Pt),形成镀金层,一般会占贵金属投入量90%,这样对于腔体部件表面的镀金层回收再利用就显得非常迫切需要。
目前回收商将腔体部件进行回收后,腔体部件多数是采用不锈钢为主体,大部分采用氰化钠对其表面进行溶解贵金属,然后再锌粉置换,最后对腔体部件清洗回用,采用氰化钠溶解回收贵金属,不但污染环境,同时腔体部件若清洗不彻底,影响其回收贵金属的效率,同时将其重新安装上机台(如半导体蒸发台)使用时,会影响其再次使用的效果及使用寿命;而且采用氰化钠对腔体部件的表面贵金属进行溶解回收,得到的腔体部件倘若再将其重新安装上机台使用时,会有残留物氰CNˉ会挥发出来,氰化物作为剧毒物质存在严重的关系到人的生命安全,特别在高温作业情况。
发明内容
本发明提供一种钠盐浸泡剥离腔体部件表面贵金属的回收贵金属方法,以克服现有回收商将腔体部件进行回收后,回收贵金属方法不够理想,不但污染环境,而且也影响其回收贵金属的效率等缺点。
为解决上述技术问题,本发明所采用的技术方案是:
一种钠盐浸泡剥离腔体部件表面贵金属的回收贵金属方法,它包括以下步骤:1)剥离溶液配制,将氢氧化钠溶液置于反应槽中,然后再加入钠盐催化剂进行混合制得剥离溶液;2)腔体部件浸泡,将腔体部件置于反应槽内,通过剥离溶液对其进行浸泡剥离处理,直到腔体部件表面基本无残留贵金属为止,得到贵液、剥离后的腔体部件和溴气;3)腔体部件取出,将腔体部件取出,并对其进行洗涤处理,得到第一废液和表面干净的腔体部件,然后腔体部件进行干燥处理后备用;4)贵液处理,向反应槽内添加还原剂进行还原处理,然后再对其进行固液分离处理,得到贵金属、金属渣和第二废液; 5)溴气回收处理,将溴气通入回收器内进行收集处理得到第三废液。
进一步地说,所述步骤1)中所述钠盐催化剂为溴化钠溶液;所述氢氧化钠溶液按质量比NaOH:H20=2:(8~10)配置;所述溴化钠溶液为含有3%溴化钠溶液。
进一步地说,所述步骤3)中具体处理方式为:将腔体部件取出,然后对腔体部件采用流动的清水进行浸泡冲洗40分钟以上,然后再用超纯水用枪冲洗处理,最后将清洗后的腔体部件放在干燥炉上进行干燥处理,并且干燥温度控制在200-240℃。
一种钠盐浸泡剥离腔体部件表面贵金属的回收贵金属方法,还包括步骤6)废液处理,将第一废液、第二废液和第三废液汇集到再生槽中,然后向再生槽内加入再生剂进行处理,得到溴化钠滤液备用。
通过采用上述技术方案,本发明的有益效果是:本回收贵金属方法设计理想,采用氢氧化钠溶液在钠盐催化剂(即溴化钠溶液)的催化作用下,对腔体部件表面贵金属(如Au和Pt)的剥离溶解快,而且更加的彻底,贵金属的回收率高,同时不损伤腔体部件,是一种回收贵金属的节能清洁新方法,代替现有氰化钠溶解回收贵金属方式而存在诸多问题。本回收贵金属方法对腔体部件表面贵金属(如Au和Pt)的剥离溶解方式,不会对环境造成污染,安全风险小,并且生产周期短,所产生的废液和废气得到有效地处理,通过再生剂再生处理后的溴化钠滤液可再次循环使用,贵金属回收成本低。
附图说明
图1为本发明工艺流程的示意图。
图2为本发明中对腔体部件进行浸泡剥离处理前的效果图。
图3为本发明中对腔体部件进行浸泡剥离处理后的效果图。
具体实施方式
下面参照附图1-图3说明本发明的具体实施方式。
参考附图1、图2和图3。一种钠盐浸泡剥离腔体部件表面贵金属的回收贵金属方法,它包括以下步骤:1)剥离溶液配制,将氢氧化钠溶液置于反应槽中,然后再加入钠盐催化剂进行混合制得剥离溶液;所述钠盐催化剂为溴化钠溶液;所述氢氧化钠溶液按质量比NaOH:H20=2:(8~10)(最佳质量比NaOH:H20=2:9)配置。所述反应槽为PP反应槽。所述钠盐催化剂为溴化钠溶液,该溴化钠溶液为含有3%溴化钠溶液。
2)腔体部件浸泡,将腔体部件置于反应槽内,通过剥离溶液对其进行浸泡剥离处理,剥离铝、溶解贵金属(即Au和Pt),直到腔体部件表面基本无残留贵金属为止,得到贵液、剥离后的腔体部件和溴气;常温下浸泡剥离处理时间控制在55分钟-65分钟(最佳时间在60分钟)。具体可参考说明书附图2和图3的腔体部件浸泡剥离处理前、后的效果图。
3)腔体部件取出,将腔体部件取出,并对其进行洗涤处理,得到第一废液和表面干净的腔体部件,然后腔体部件进行干燥处理后备用。具体处理方式为:所述腔体部件取出,然后对腔体部件采用流动的清水进行浸泡冲洗40分钟以上,然后再用超纯水用枪冲洗处理,然后将清洗后的腔体部件放在干燥炉上进行干燥处理,所述干燥温度控制在200-240℃(最佳温度为230℃);然后对腔体部件进行降温冷却处理,最后将其包装,可返回至LED芯片生产设备(如半导体蒸发机台)上循环使用。
4)贵液处理,向PP反应槽内添加还原剂进行还原处理,沉淀出铂金和黄金,然后再对其进行固液分离处理,得到贵金属(即Au和Pt)、金属渣(即海绵金)和第二废液;将所述贵金属(即Au和Pt)取出后晾干后进行收集。所述还原剂为水合肼还原剂。
5)海绵金处理,将金属渣(即海绵金)送至精炼设备进行精炼工序进行精炼处理,得到贵金属(即Au和Pt),并将该贵金属(即Au和Pt)取出后晾干后进行收集。
6)溴气回收处理,将上述溴气通入回收器(如PP回收器)内进行收集处理得到第三废液。所述回收器为气体捕集器。另外,所述气体捕集器也可以用真空过滤罐代替。
7)废液处理,将第一废液、第二废液和第三废液汇集到再生槽(如PP反应槽)中,然后向再生槽内加入再生剂(如次氯酸钠水溶液)进行再生处理,得到氢氧化钠和废液中溴离子氧化后的溴单质,再将再生完毕后剩余的溴化钠滤液备用,使用时,可将溴化钠滤液作为所述钠盐催化剂直接返回上述反应槽内循环使用。
另外,所述PP反应槽内的剥离溶液可为流动式的剥离溶液(即对PP反应槽内的剥离溶液进行搅拌作业),提高腔体部件浸泡效率,加速其表面贵金属剥离进程,进一步地缩短浸泡剥离的时间;所述PP反应槽内也可以安装有超声波发生器,在产生超声波的作用下,加速剥离腔体部件表面贵金属的进程,进一步地缩短浸泡剥离的时间,同时也提高贵金属在溶液中的溶解率,从而进一步地提高贵金属的回收率。
上述仅为本发明的具体实施方式,但本发明的设计构思并不局限于此,凡利用此构思对本发明进行非实质性的改动,均应属于侵犯本发明保护范围的行为。
Claims (1)
1.一种钠盐浸泡剥离腔体部件表面贵金属的回收贵金属方法,其特征在于:它包括以下步骤:1)剥离溶液配制,将氢氧化钠溶液置于反应槽中,然后再加入钠盐催化剂进行混合制得剥离溶液;所述钠盐催化剂为溴化钠溶液;所述氢氧化钠溶液按质量比NaOH:H20=2:(8~10)配置;所述溴化钠溶液为含有3%溴化钠溶液;2)腔体部件浸泡,将腔体部件置于反应槽内,通过剥离溶液对其进行浸泡剥离处理,直到腔体部件表面无残留贵金属为止,得到贵液、剥离后的腔体部件和溴气;3)腔体部件取出,将腔体部件取出,并对其进行洗涤处理,得到第一废液和表面干净的腔体部件,然后腔体部件进行干燥处理后备用;具体处理方式为:将腔体部件取出,然后对腔体部件采用流动的清水进行浸泡冲洗40分钟以上,然后再用超纯水用枪冲洗处理,最后将清洗后的腔体部件放在干燥炉上进行干燥处理,并且干燥温度控制在200-240℃;4)贵液处理,向反应槽内添加还原剂进行还原处理,然后再对其进行固液分离处理,得到贵金属、金属渣和第二废液;5)溴气回收处理,将溴气通入回收器内进行收集处理得到第三废液;6)废液处理,将第一废液、第二废液和第三废液汇集到再生槽中,然后向再生槽内加入再生剂进行处理,得到溴化钠滤液备用。
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US4375984A (en) * | 1980-08-14 | 1983-03-08 | Bahl Surinder K | Recovery of gold from bromide etchants |
CA1340169C (en) * | 1989-08-31 | 1998-12-08 | Ahmad Dadgar | Hydrometallurgical process for extracting gold and silver ores with bromate/perbromide solutions and compositions therefor |
CN115323173A (zh) * | 2022-07-06 | 2022-11-11 | 福建有道贵金属材料科技有限公司 | 一种含贵金属固体废物的无氰回收方法 |
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US4375984A (en) * | 1980-08-14 | 1983-03-08 | Bahl Surinder K | Recovery of gold from bromide etchants |
CA1340169C (en) * | 1989-08-31 | 1998-12-08 | Ahmad Dadgar | Hydrometallurgical process for extracting gold and silver ores with bromate/perbromide solutions and compositions therefor |
CN115323173A (zh) * | 2022-07-06 | 2022-11-11 | 福建有道贵金属材料科技有限公司 | 一种含贵金属固体废物的无氰回收方法 |
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