CN116017844B - 一种具有背钻孔的电路板及背钻孔深度检测方法 - Google Patents
一种具有背钻孔的电路板及背钻孔深度检测方法 Download PDFInfo
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- CN116017844B CN116017844B CN202310037625.4A CN202310037625A CN116017844B CN 116017844 B CN116017844 B CN 116017844B CN 202310037625 A CN202310037625 A CN 202310037625A CN 116017844 B CN116017844 B CN 116017844B
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- 238000005553 drilling Methods 0.000 title claims abstract description 229
- 238000001514 detection method Methods 0.000 title claims abstract description 13
- 239000010410 layer Substances 0.000 claims abstract description 162
- 239000003292 glue Substances 0.000 claims abstract description 56
- 239000002184 metal Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000011247 coating layer Substances 0.000 claims abstract description 14
- 238000004891 communication Methods 0.000 claims abstract description 7
- 125000006850 spacer group Chemical group 0.000 claims description 14
- 239000012792 core layer Substances 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims 1
- 238000012360 testing method Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
Description
Claims (10)
Priority Applications (1)
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CN202310037625.4A CN116017844B (zh) | 2023-01-10 | 2023-01-10 | 一种具有背钻孔的电路板及背钻孔深度检测方法 |
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CN202310037625.4A CN116017844B (zh) | 2023-01-10 | 2023-01-10 | 一种具有背钻孔的电路板及背钻孔深度检测方法 |
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CN116017844A CN116017844A (zh) | 2023-04-25 |
CN116017844B true CN116017844B (zh) | 2023-06-27 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104640354A (zh) * | 2013-11-11 | 2015-05-20 | 珠海方正科技多层电路板有限公司 | 一种印制电路板及其背钻孔形成方法 |
CN111356290A (zh) * | 2018-12-24 | 2020-06-30 | 胜宏科技(惠州)股份有限公司 | 一种能够检测背钻孔深度的pcb板以及检测方法 |
WO2022262588A1 (zh) * | 2021-06-17 | 2022-12-22 | 中兴通讯股份有限公司 | 具有信号传输过孔的印制电路板及其制作方法 |
CN115589674A (zh) * | 2022-10-14 | 2023-01-10 | 深圳崇达多层线路板有限公司 | 一种实现高精度背钻及短桩的制作方法 |
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2023
- 2023-01-10 CN CN202310037625.4A patent/CN116017844B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104640354A (zh) * | 2013-11-11 | 2015-05-20 | 珠海方正科技多层电路板有限公司 | 一种印制电路板及其背钻孔形成方法 |
CN111356290A (zh) * | 2018-12-24 | 2020-06-30 | 胜宏科技(惠州)股份有限公司 | 一种能够检测背钻孔深度的pcb板以及检测方法 |
WO2022262588A1 (zh) * | 2021-06-17 | 2022-12-22 | 中兴通讯股份有限公司 | 具有信号传输过孔的印制电路板及其制作方法 |
CN115589674A (zh) * | 2022-10-14 | 2023-01-10 | 深圳崇达多层线路板有限公司 | 一种实现高精度背钻及短桩的制作方法 |
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GR01 | Patent grant | ||
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A circuit board with back drilling and a method for detecting the depth of back drilling Effective date of registration: 20231007 Granted publication date: 20230627 Pledgee: Agricultural Bank of China Limited by Share Ltd. Chizhou branch Pledgor: Anhui Baiqiang Technology Co.,Ltd. Registration number: Y2023980060087 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20230627 Pledgee: Agricultural Bank of China Limited by Share Ltd. Chizhou branch Pledgor: Anhui Baiqiang Technology Co.,Ltd. Registration number: Y2023980060087 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A circuit board with back drilling holes and a method for detecting the depth of back drilling holes Granted publication date: 20230627 Pledgee: Agricultural Bank of China Limited by Share Ltd. Chizhou branch Pledgor: Anhui Baiqiang Technology Co.,Ltd. Registration number: Y2024980041036 |