CN115938960A - Method and device for repairing BGA product solder ball - Google Patents
Method and device for repairing BGA product solder ball Download PDFInfo
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- CN115938960A CN115938960A CN202310038173.1A CN202310038173A CN115938960A CN 115938960 A CN115938960 A CN 115938960A CN 202310038173 A CN202310038173 A CN 202310038173A CN 115938960 A CN115938960 A CN 115938960A
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Abstract
The invention discloses a method and a device for repairing a BGA product solder ball, wherein the method comprises the following steps: adhering cutting gummed paper on the bottom surface of the jig, and putting the IC particles into the jig; removing the solder balls on the IC particles by using a cutting machine; replacing the cutting gummed paper on the jig with high-temperature gummed paper; placing the jig into a ball planting machine to plant the IC particles; and (4) carrying out furnace processing, cleaning and drying treatment on the planted ball IC particles. According to the invention, the automatic removal of the solder balls is realized by combining the jig and the cutting machine, the occurrence of bad products such as insufficient tin removal, copper exposure, rosin residue and the like on the IC particles is avoided, the success rate of IC particle repair is improved, the batch repair of the IC particles is realized, and the repair efficiency of the IC particles is improved.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a method and a device for repairing a BGA product solder ball.
Background
Ball Grid Array (BGABall Grid Array) is a packaging method for integrated circuits. The ball grid array has the advantages of good coplanarity, a large number of I/O (input/output) performance, high assembly density, good electrical performance and thermal performance, self-calibration function during welding and the like, and is more and more widely used.
The BGA chip has array solder balls arranged on its bottom surface, and during ball-planting, transportation and storage, individual solder balls are missing, so that it is necessary to perform detinning treatment on the BGA chip with missing solder balls. There are two existing methods of tin removal, as follows:
1. the method for removing the tin balls by the electric soldering iron mainly comprises the following steps: heating the solder balls by using an electric iron, stirring off the molten tin by using the electric iron in a molten state, cleaning and drying the BGA chip, and finally completing ball mounting again by using a manual steel mesh solder ball leakage method;
2. the vacuum tube tin-absorbing method mainly comprises the following processes: heating the solder ball with a hot air gun, and removing the solder ball with a vacuum suction pen in a molten state.
The electric soldering iron tin ball removing method has the following problems:
1) The solder balls are insufficiently removed, so that the height of the solder ball surface is uneven, the solder ball is not beneficial to replanting the solder balls, and the problems of overlarge solder balls or overhigh solder balls and the like are caused after replanting the solder balls;
2) The product is scratched when the electric soldering iron is used for removing the molten tin, and even a green oil layer of the product is damaged, so that copper is exposed in the product;
3) During the process of removing tin by the electric soldering iron, rosin is easy to carbonize and remains on the product, and is extremely difficult to remove;
4) The repair speed is slow, and the requirement of batch repair cannot be met.
The vacuum tube tin-absorbing method has low tin-removing efficiency and cannot meet the requirement of batch repair.
Disclosure of Invention
The invention aims to provide a method and a device for repairing a BGA product solder ball, and aims to solve the problems that in the prior art, the tin removing efficiency is low, the requirement of batch repair cannot be met, and the like.
The embodiment of the invention provides a method for repairing a BGA product solder ball, which comprises the following steps:
adhering cutting gummed paper on the bottom surface of the jig, and putting the IC particles into the jig;
removing the solder balls on the IC particles by using a cutting machine;
replacing the cutting gummed paper on the jig with high-temperature gummed paper;
placing the jig into a ball planting machine to plant the IC particles;
and (4) carrying out furnace processing, cleaning and drying treatment on the planted ball IC particles.
Further, it includes before the tool bottom surface glues cutting adhesive tape:
and arranging isolation rods in the jig to separate the IC particles, and arranging cutting mark points at two ends of the top surface of the jig at intervals.
Further, said disposing an isolation bar within said jig to isolate said IC particles comprises:
and arranging isolating rods with the cutting width of 0.25 +/-0.05 mm in the jig so as to isolate the IC particles.
Further, the interval setting cutting mark points at the two ends of the jig comprises:
the cutting mark points are arranged at intervals in a mode that the cutting width of the overlapped part of the cutting of the second knife and the cutting of the first knife accounts for 15% -25% of the cutting width of the first knife.
Further, the removing the solder balls on the IC particles by using a dicing machine includes:
and adjusting the height of the cutting machine to be in the same horizontal plane with the cutting surface of the jig.
Further, will cut the gummed paper replacement on the tool and include for high temperature gummed paper:
and replacing the cutting gummed paper on the jig with high-temperature gummed paper by using a vacuum jig.
Further, it includes before utilizing vacuum tool to replace the cutting adhesive tape on the tool for high temperature adhesive tape:
and carrying out ultraviolet irradiation on the jig to remove the viscosity of the cut gummed paper.
The embodiment of the invention also provides a device for repairing the BGA product solder balls, which comprises: the device comprises a jig, cutting gummed paper, a cutting machine, high-temperature gummed paper and a ball planting machine;
the jig is used for mounting IC particles;
the cutting gummed paper is used for fixing the IC particles in the jig;
the cutting machine is used for removing the solder balls on the IC particles;
the high-temperature gummed paper is used for fixing the IC particles in the jig;
the ball-planting machine is used for planting solder balls on the IC particles.
Further, the method also comprises the following steps: and the vacuum jig is used for replacing the cutting gummed paper with the high-temperature gummed paper.
Further, the cutting machine is a tape saw cutting machine.
The embodiment of the invention provides a method for repairing a BGA product solder ball, which comprises the following steps: adhering cutting gummed paper on the bottom surface of the jig, and putting the IC particles into the jig; removing the solder balls on the IC particles by using a cutting machine; replacing the cutting gummed paper on the jig with high-temperature gummed paper; placing the jig into a ball planting machine to plant the IC particles; and (4) carrying out furnace processing, cleaning and drying treatment on the planted ball IC particles. The invention realizes automatic removal of the solder balls by combining the jig and the cutting machine, avoids the occurrence of bad products such as insufficient tin removal, copper exposure, rosin residue and the like on the IC particles, improves the success rate of repairing the IC particles, improves the repairing efficiency of the IC particles, realizes ball replanting by adopting full-automatic ball replanting equipment, and realizes batch repairing of the IC particles from manual to automatic. The embodiment of the invention also provides a device for repairing the BGA product solder balls, which has the same effect as the method and is not repeated herein.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart of a method for repairing a solder ball of a BGA product of the present embodiment;
FIG. 2 is a schematic structural view of the jig;
FIG. 3 is a schematic diagram of the cutting mark point arrangement;
FIG. 4 is a schematic block diagram of a solder ball repairing apparatus for BGA products of the present embodiment;
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
Referring to fig. 1, the present invention provides a method for repairing a solder ball of a BGA product, comprising:
s101: adhering cutting gummed paper on the bottom surface of the jig, and putting the IC particles into the jig;
referring to fig. 2, a jig needs to be designed and manufactured before IC particles are placed in the jig, in this embodiment, a plurality of isolation rods 1 are arranged inside the jig in a staggered manner to form IC particle bins 2 for placing the IC particles, the size of the IC particle bins 2 is the same as that of the IC particles, and cutting Mark (Mark) points 3 are arranged at intervals at two ends of the top surface of the jig for cutting calibration, then, the distance between the cutting Mark points 3 of the jig is set according to the size of the IC particles, the distribution of the solder balls 4 and the pitch (ball pitch) of the solder balls 4, the thickness of the jig is the same as that of the IC particles to be repaired, and the jig can process a plurality of IC particles simultaneously, thereby realizing batch processing of the IC particles.
In one embodiment, a plurality of isolating rods 1 with the cutting width of 0.25 +/-0.05 mm are arranged inside the jig to form IC particle bins 2 in a staggered mode, and cutting mark points 3 are arranged at two ends of the top surface of the jig at intervals in a mode that the cutting width of the overlapped part of the cutting of the second knife and the cutting of the first knife accounts for 15% -25% of the cutting width of the first knife, so that the solder balls 4 can be removed sufficiently.
Specifically, referring to fig. 3, a shaded portion is an overlapped portion of the cutting of the first knife and the cutting of the second knife, wherein L1 represents a cutting width of the shaded portion; l2 denotes a cutting width of the second blade cutting portion; l3 represents the cutting width of the cutting part of the first knife, the cutting mark points 3 are arranged in a way that the cutting mark points 3 are arranged at intervals in a way that the value of L1/L3 is in the range of 15% -25%, and the value of L1/L3 can be represented by Overlap.
In a specific application scenario, the diameter (ball size) of the solder balls 4 is 0.4mm, the distance between the solder balls 4 is 1mm, the cutting width of the cutting machine is 0.3mm, the distance between the cutting mark points 3 is set to be 0.24mm, namely, the cutting mark points 3 are arranged at intervals in a mode that the overlay is 20%, and each row of solder balls 4 on the jig can be removed by only setting two pairs of cutting mark points 3.
After the jig is designed and manufactured, cutting adhesive paper needs to be adhered to the bottom surface of the jig, the IC particles are placed into the jig in a mode that the top surface faces upwards, namely, the cutting adhesive paper is adhered to the bottom surface of the IC particles and is fixed in the jig by the cutting adhesive paper, after the IC particles are fixed, the top surface of the IC particles and the top surface of the jig are located on the same horizontal plane, and the solder balls 4 on the top surface of the IC particles are higher than the top surface of the jig.
S102: removing the solder balls on the IC particles by using a cutting machine;
before the solder balls 4 on the IC particles are removed by the cutting machine, the height of the cutting machine needs to be adjusted to be in the same horizontal plane with the cutting surface of the jig, and then the solder balls 4 on the IC particles are cut off according to the distance between the cutting mark points 3.
S103: replacing the cutting gummed paper on the jig with high-temperature gummed paper;
the IC particles are also subjected to furnace treatment in the operation after the solder balls 4 are removed, so that the cutting adhesive tape on the jig needs to be replaced by high-temperature adhesive tape first, and the vacuum jig is used to replace the cutting adhesive tape on the jig with high-temperature adhesive tape in this embodiment.
The alternative workflow is: and carrying out ultraviolet irradiation (namely UV irradiation) on the IC particles to remove the viscosity of the cut gummed paper, so as to facilitate the switching between the cut gummed paper and the high-temperature gummed paper, during replacement, closing the jig and the vacuum jig, sucking the IC particles by using the suction force of the vacuum jig, tearing off the cut gummed paper, and sticking the high-temperature gummed paper again.
In a specific scene, ultraviolet irradiation is carried out on the IC particles for 60 seconds, then the jig and the vacuum jig are combined, the IC particles are sucked by utilizing the suction force of the vacuum jig, then the cutting gummed paper is torn off, and then the high-temperature gummed paper is pasted.
Wherein the high-temperature adhesive tape can be selected from polyimide adhesive tape, teflon pure film adhesive tape, imine high-temperature double-sided adhesive tape, glass cloth double-sided adhesive tape, masking tape, composite red and white masking tape and the like.
S104: placing the jig into a ball planting machine to plant the IC particles;
s105: and (4) carrying out furnace treatment, cleaning and drying treatment on the IC particles with the planted balls.
Tin ball 4 on the mode that this embodiment combines through cutting machine and tool is got rid of the IC granule, can a plurality of IC granules of simultaneous processing, has realized getting rid of in batches the IC granule, and gets rid of the in-process and need not carry out high temperature handle to the IC granule, has reduced the defective rate, and the detinning of this embodiment, adhesive tape replacement, ball planting, cross the stove, wash and drying process all can accomplish voluntarily, have promoted rework efficiency, have realized cost reduction and efficiency improvement.
Referring to fig. 4, the present embodiment further provides a device 400 for repairing a solder ball of a BGA product, including: a jig 401, a cutting adhesive tape 402, a cutting machine 403, a high-temperature adhesive tape 405 and a ball-planting machine 406;
the jig 401 is used for mounting IC particles;
the cutting adhesive tape 402 is used for fixing the IC particles in the jig;
the dicing machine 403 is used to remove the solder balls on the IC particles;
the high-temperature adhesive paper 405 is used for fixing the IC particles in the jig;
the ball-mounting machine 406 is used to implant solder balls on the IC particles.
Further, the jig 401 is also used for setting isolation rods to separate the IC particles, and setting cutting points at two ends.
Further, the jig 401 is also used for setting a spacer bar with a cutting width of 0.25 ± 0.05mm to separate the IC particles.
Further, the jig 401 is further configured to set cutting points at intervals in such a manner that an overlapping portion of the cutting width of the second knife and the cutting width of the first knife occupies 15% -25% of the cutting width of the first knife.
Further, the cutting machine 403 is also used for adjusting the height to be in the same horizontal plane with the cutting surface of the jig 401.
Further, the method also comprises the following steps: and the vacuum jig 404 is used for replacing the cut gummed paper 402 with high-temperature gummed paper 405.
Further, the jig 401 is also used for performing ultraviolet irradiation to remove the stickiness of the cut gummed paper 402.
Further, the cutting machine is tape saw cutting machine, and wherein, tape saw cutting machine is for small-size product volume production.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, it is possible to make various improvements and modifications to the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
It should also be noted that, in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion.
It should be noted that the present invention is not limited to the particular embodiments described herein, and that the present invention includes all embodiments that are within the scope of the present invention. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Claims (10)
1. A method for repairing a solder ball of a BGA product is characterized by comprising the following steps:
adhering cutting gummed paper on the bottom surface of the jig, and putting the IC particles into the jig;
removing the solder balls on the IC particles by using a cutting machine;
replacing the cutting gummed paper on the jig with high-temperature gummed paper;
placing the jig into a ball planting machine to plant the IC particles;
and (4) carrying out furnace treatment, cleaning and drying treatment on the IC particles with the planted balls.
2. The method of claim 1, wherein before the adhesive tape is applied to the bottom surface of the jig, the method comprises:
and arranging isolation rods in the jig to separate the IC particles, and arranging cutting mark points at two ends of the top surface of the jig at intervals.
3. The method of claim 2, wherein the disposing a spacer bar in the jig to space the IC particles comprises:
and arranging isolating rods with the cutting width of 0.25 +/-0.05 mm in the jig to separate the IC particles.
4. The method of claim 2, wherein the disposing of cutting marks at intervals at two ends of the jig comprises:
the cutting mark points are arranged at intervals in a mode that the cutting width of the overlapped part of the cutting of the second knife and the cutting of the first knife accounts for 15% -25% of the cutting width of the first knife.
5. The method of claim 1, wherein the removing the solder balls from the IC particles by a dicing machine comprises:
and adjusting the height of the cutting machine to be in the same horizontal plane with the cutting surface of the jig.
6. The method of claim 1, wherein the replacing the cutting adhesive tape on the jig with a high temperature adhesive tape comprises:
and replacing the cutting gummed paper on the jig with high-temperature gummed paper by using a vacuum jig.
7. The method of claim 6, wherein the replacing the dicing tape with a high temperature tape on the jig with a vacuum jig comprises:
and carrying out ultraviolet irradiation on the jig to remove the viscosity of the cut gummed paper.
8. A BGA product tin ball repairing device is characterized by comprising: the device comprises a jig, cutting gummed paper, a cutting machine, high-temperature gummed paper and a ball planting machine;
the jig is used for mounting IC particles;
the cutting gummed paper is used for fixing the IC particles in the jig;
the cutting machine is used for removing the solder balls on the IC particles;
the high-temperature gummed paper is used for fixing the IC particles in the jig;
the ball-planting machine is used for planting solder balls on the IC particles.
9. The apparatus of claim 8, further comprising: and the vacuum jig is used for replacing the cutting gummed paper with the high-temperature gummed paper.
10. The BGA product solder ball repairing apparatus of claim 8, wherein the cutter is a tape saw cutter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310038173.1A CN115938960A (en) | 2023-01-10 | 2023-01-10 | Method and device for repairing BGA product solder ball |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310038173.1A CN115938960A (en) | 2023-01-10 | 2023-01-10 | Method and device for repairing BGA product solder ball |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115938960A true CN115938960A (en) | 2023-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310038173.1A Pending CN115938960A (en) | 2023-01-10 | 2023-01-10 | Method and device for repairing BGA product solder ball |
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| Country | Link |
|---|---|
| CN (1) | CN115938960A (en) |
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- 2023-01-10 CN CN202310038173.1A patent/CN115938960A/en active Pending
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