CN105834543A - Tin removing device and method for LED module - Google Patents
Tin removing device and method for LED module Download PDFInfo
- Publication number
- CN105834543A CN105834543A CN201610345479.1A CN201610345479A CN105834543A CN 105834543 A CN105834543 A CN 105834543A CN 201610345479 A CN201610345479 A CN 201610345479A CN 105834543 A CN105834543 A CN 105834543A
- Authority
- CN
- China
- Prior art keywords
- led module
- tin
- scraper
- scolding tin
- lamp bead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a tin removing device for an LED module. The tin removing device comprises a work platform, and sliding rails fixed to the work platform. The LED module comprises a first face where tin removing needs to be conducted and a second face where tin removing does not need to be conducted, wherein the first face is provided with an LED lamp bead. The tin removing device for the LED module further comprises a preheating device used for preheating soldering tin on the first face, a tin scraping device used for scraping the soldering tin on the first face and recycling the LED lamp bead, and a cooling device used for cooling the LED module where the soldering tin is scraped. By means of the tin removing device for the LED module, high-temperature-resistant silica gel is used for wiping off the tin melted on a bonding pad, the tin removing efficiency is high, and flatness is good after cleaning; efficiency is high, the consistency of the tin removing effect is good, and the tin removing device can be used for batched operation; and a support is used for fixing the LED module, elements and a PCB on the second face can be prevented from deforming, and the subsequent machining quality is ensured. The invention further provides a tin removing method for the LED module.
Description
Technical field
The present invention relates to LED display industry, particularly relate to detinning apparatus and the method for a kind of LED module.
Background technology
Current LED display is fast-developing, in two adjacent LED lamp bead towards closely spaced direction
Close together in the case of, in the case of wherein LED lamp bead lost efficacy or needed to safeguard, change LED
Lamp bead compares the consuming time, is usually and uses the mode of electric cautery or hair-dryer heating by components and parts solder joint
On scolding tin melt after, then remove components and parts, and by tin sucking gun by scolding tin sucking-off, but want right
The solder joint of the specific LED lamp bead in Small Distance heats, and by this LED lamp bead sucking-off, the most less
Reality, inevitably heats other solder joints around this LED lamp bead, may result in other solder joints
On the coming off of LED lamp bead, even if in the case of scolding tin is removed, want specific LED lamp bead
Take out, be also very difficult；If needing to change multiple LED lamp bead on a piece of LED display, then
The most more expend the time, and the circuit board of LED lamp bead of dismantling can not meet the automatization of SMT processing
Requirement.
In addition, the heating of pcb board local and unshielded PCB are yielding, affect follow-up SMT machine patch
Dress precision, easy sticker is inclined.
Summary of the invention
The technical problem to be solved in the present invention is: provides a kind of quickly except stannum, and prevents pcb board from deforming
LED module detinning apparatus and method.
For achieving the above object, a kind of LED module detinning apparatus disclosed by the invention includes work platforms, Gu
The slide rail being scheduled on work platforms, described LED module includes needing, except stannum, have first of LED lamp bead
And need not second except stannum, it is characterised in that described LED detinning apparatus also includes:
Preheating device, for fixing described LED module and preheating the scolding tin on described first；
Tin scraping device, is fixed on work platforms, for striking off the scolding tin on described first and reclaiming LED
Lamp bead；
Chiller, cools down the LED module striking off scolding tin；
After described LED module is fixed and preheated to described preheating device, slide into described tin scraping dress along described slide rail
Putting top, described tin scraping device utilizes scraper to strike off scolding tin, and reclaims LED lamp bead；At described tin scraping device
After striking off scolding tin, described preheating device slides into above described chiller along slide rail, so that described LED
First cooling of module.
Further, described preheating device includes:
Guide rail slide block, is installed on described slide rail, slides along described slide rail；
Preheating support, is installed on described guide rail slide block, for described first heating；
First cooling fan, is installed on described preheating support, is used for described second cooling, thus prevents
Components and parts on described second come off；
Described preheating support is additionally operable to fixing described LED module, described preheating support make described first in institute
State during preheating bracket slide tangent with described scraper.
Further, described tin scraping device includes:
Tin scraping platform, is used for supporting described LED module, and after preventing melts soldering tin, LED lamp bead comes off；
First scraper, acts on described LED lamp bead, and makes described LED lamp bead come off；
Second scraper, for scraping off the scolding tin melted on described LED module；
3rd scraper, for clearing up described LED module；
Described first scraper, the second scraper and the 3rd scraper are arranged along the described preheating device direction of motion successively.
Further, described tin scraping device also includes receiving stannum box, and described receipts stannum box is arranged on described second scraper
Lower section, for receiving the scolding tin that described second scraper scrapes off.
Further, described second scraper being provided with the silica gel of heatproof, the second scraper will be melted by silica gel
Scolding tin scrape off.
Further, Lou lamp passage, described leakage lamp passage it are provided with between described first scraper and tin scraping platform
It is arranged on the lower section of described first scraper, through described leakage lamp after described first scraper scrapes described LED lamp bead
Passage is discharged.
Further, described chiller includes:
Second cooling fan, for cooling down described first face after preheating；
Cooling holder, is used for fixing described second cooling fan；
Described second cooling fan is arranged on the side of described cooling holder.
Further, described cooling holder is provided with multiple air vent, the position of described air vent and described the
The position welding LED lamp bead in one side is corresponding.
The LED module detinning apparatus of the present invention uses high temperature resistant silica gel to carry out wiping the stannum melted on pad, removes
After stannum efficiency height, removing, flatness is more excellent；Interest rate is high, except stannum same effect is good, can be used for batch jobs；
Use support to fix LED module, be possible to prevent second upper components and parts and pcb board deformation, it is ensured that follow-up
The quality of processing.
The LED module detinning method that the present invention provides comprises the following steps:
Step 1: described LED module is fixed on the heating, it is ensured that described LED module needs except stannum
The first face heated, it is not necessary to except the scolding tin of second of stannum is in the state of cooling；
Step 2: drive described LED module to move, scrape off under scolding tin melting state and be positioned on first
LED lamp bead；
Step 3: drive described LED module to continue motion, scrape off under scolding tin melting state and be positioned at first
On scolding tin；
Step 4: drive described LED module to continue motion, the first face is cleared up；
Step 5: the first face of described LED module is cooled down by chiller.
Further, the scraper scraping off first upper scolding tin in step 3 includes resistant to elevated temperatures silica gel, silica gel pressure
Tight on described first.
Scolding tin on LED module can quickly be removed by the method utilizing the present invention, and elimination effect is relatively
Good.
Accompanying drawing explanation
Below in conjunction with the accompanying drawings, by the detailed description of the invention of the present invention is described in detail, the skill of the present invention will be made
Art scheme and other beneficial effect are apparent.
In accompanying drawing,
Fig. 1 is LED module detinning apparatus structural representation of the present invention；
Fig. 2 is the side structure schematic diagram of LED module detinning apparatus of the present invention；
Fig. 3 is the magnified partial view of the LED module detinning apparatus of the present invention of Fig. 2；
Fig. 4, Fig. 5 are the working state schematic representation of LED module detinning apparatus of the present invention.
Drawing reference numeral illustrates:
100, work platforms；11, slide rail；200, leakage lamp passage；300, preheating device；31, first
Cooling fan；32, preheating support；33, guide rail slide block；400, tin scraping device；41, the first scraper；
42, the second scraper；43, the 3rd scraper；44, stannum box is received；500, chiller；51, the second cooling
Fan；52, cooling holder.
Detailed description of the invention
By further illustrating the technological means and effect thereof that the present invention taked, below in conjunction with the present invention's
Preferred embodiment and accompanying drawing thereof are described in detail.
Referring to Fig. 1 or Fig. 2, the LED module detinning apparatus that the present invention provides includes: include work platforms
100, the slide rail 11 being fixed on work platforms 100, described LED module includes needing, except stannum, have LED
First of lamp bead and need not second except stannum.In the present embodiment, first is passed through scolding tin
Being welded with LED lamp bead, second is the pcb board providing LED lamp bead to light, or other circuit parts,
It is not required to except stannum on second.
As it is shown in figure 1, described LED detinning apparatus also includes: preheating device 300, tin scraping device 400 and
Chiller 500.Wherein, described preheating device 300 is used for fixing described LED module and to described first
On scolding tin preheating；Described tin scraping device 400 is fixed on work platforms 100, is used for striking off described first
On scolding tin and reclaim LED lamp bead；The LED module striking off scolding tin is cooled down by described chiller 500.
After described LED module is fixed and preheated to described preheating device 300, slide into described along described slide rail 11
Above tin scraping device 400, described tin scraping device 400 utilizes scraper to strike off scolding tin, and reclaims LED lamp bead；?
After described tin scraping device 400 strikes off scolding tin, described preheating device 300 slides into described chiller along slide rail 11
Above in the of 500, so that first cooling of described LED module.
In the present embodiment, to first upper weldering after the described fixing number described LED module of preheating device 300
Stannum heats, and then slides into described tin scraping device 400 by slide rail 11, now the lower surface of LED module with
The lower surface of described tin scraping device 400 is concordant, and tin scraping device 400 strikes off scolding tin by scraper and reclaims LED
Pearl, the most described preheating device 300 continues on described slide rail 11 and slides into chiller 500, chiller
500, by described first cooling, the most just can take off described LED module, and the most described LED module is complete
Become except stannum and the purpose of going LED lamp bead.
LED lamp bead can be removed by the LED module detinning apparatus of the present invention in batches, and strikes off scolding tin, raw
Produce efficiency higher, remove the cleanest relative to traditional mode；Simultaneously because LED module is fixed on pre-
In thermal 300, it is ensured that LED module is indeformable, beneficially other production technologies in later stage.
Further, such as Fig. 1 or Fig. 2, described preheating device 300 includes: guide rail slide block 33, preheating support
32 and first cool down fan 31, and described guide rail slide block 33 is installed on described slide rail 11, along described slide rail 11
Slide；Described preheating support 32 is installed on described guide rail slide block 33, for described first heating；Institute
State the first cooling fan 31 and be installed on described preheating support 32, be used for described second cooling, thus prevent
Components and parts on described second come off.
Described preheating support 32 is additionally operable to fixing described LED module, and described preheating support 32 makes described first
Described preheating support 32 slide during tangent with described scraper.
In the present embodiment, the fixed position to LED module of described preheating support 32 and fixing height
Spend in the case of ensure described LED module first is tangent with described scraper, it is possible to clear up as far as possible
Scolding tin on clean first, is conducive to improving the installation accuracy of LED module next one operation, such as SMT
Paster processing procedure.
Further, such as Fig. 1 or Fig. 3, described tin scraping device 400 includes: tin scraping platform, the first scraper 41,
Second scraper 42 and the 3rd scraper 43.Described tin scraping platform is used for supporting described LED module, prevents scolding tin from melting
After change, LED lamp bead comes off；Described first scraper 41 acts on described LED lamp bead, and makes described LED
Pearl comes off；Described second scraper 42 is for scraping off the scolding tin melted on described LED module；Described 3rd scraper
43 for clearing up described LED module.
Described first scraper the 41, second scraper 42 and the 3rd scraper 43 move along described preheating device 300 successively
Direction is arranged.
Such as Fig. 4 and Fig. 5, in the present embodiment, when LED module is after the preheating of preheating support 32,
Scolding tin on first is in molten condition, and the LED lamp bead that scolding tin is fixed is easy to trickle down cutting at machine
Cutter front end, thus affect the operation of machine, also affecting the cleaning of machine, described tin scraping platform can support pre-
The LED lamp bead that may drop after heat, thus prevent LED lamp bead to be scattered.When described preheating device 300 drives
When LED module contacts with described first scraper 41, described first scraper 41 acts in described LED lamp bead,
Now LED lamp bead comes off, in that context it may be convenient to by the cleaning of described LED lamp bead or storage.Further, when in advance
When thermal 300 drives the position that the motion of LED module contacts as described second scraper 42, described second scrapes
Cutter 42 is pressed on described first, is scraped off by the scolding tin on first.After scraping off scolding tin, the 3rd scraper
43 continue to clear up the first face, thus reach the requirement that subsequent technique produces, and improve the precision of automatization.
Further, such as Fig. 1, described tin scraping device 400 also includes receiving stannum box 44, and described receipts stannum box 44 is arranged
In the lower section of described second scraper 42, for receiving the scolding tin that described second scraper 42 scrapes off.
In the present embodiment, receive stannum box 44 and the scolding tin scraped off concentrated storage, reduce the cleaning difficulty of device,
The most also scolding tin can be reused.
Further, described second scraper 42 being provided with the silica gel of heatproof, the second scraper 42 will by silica gel
The scolding tin melted scrapes off.
Utilize silica gel to be pressed on first of LED module, scrape off scolding tin, scrape compared to by hard material
The mode removing scolding tin can preferably protect first upper solder joint, wiring, thus reduces what LED module damaged
Probability.
Further, it is provided with Lou lamp passage 200, described leakage between described first scraper 41 and tin scraping platform
Lamp passage 200 is arranged on the lower section of described first scraper 41, when described first scraper 41 scrapes described LED
Discharge through described leakage lamp passage 200 after pearl.
In the present embodiment, LED lamp bead can leak to except the lower section of stannum equipment by leakage lamp passage 200,
It is easy to cleaning and the utilization concentrated, reduces the disposal costs except stannum equipment.
Further, described chiller 500 includes: the second cooling fan 51 and cooling holder 52.Described
Second cooling fan 51 is for cooling down described first face after preheating；Described cooling holder 52 is for solid
Fixed described second cooling fan 51；Described second cooling fan 51 is arranged on the side of described cooling holder 52.
In the present embodiment, after LED module completes except stannum, LED module is being carried or is storing it
Before need by LED module cool down, now before LED module heating the first face be placed on described cooling holder
On 52, the second cooling fan 51 side blow from described cooling holder 52, make the first face be cooled down；Whole
Individual chiller 500 equipment is simple, and convenient operation, in actual applications, described preheating device 300 slides into
Above described chiller 500, fixed structure opened by preheating device 300, can be placed by described LED module
On described cooling holder 52, the most described preheating device 300 slides back to initial position again, under carrying out
Work once.
Further, described cooling holder 52 being provided with multiple air vent, the position of described air vent is with described
The position of first upper welding LED lamp bead is corresponding.
In order to preferably reach cooling effect, cooling holder 52 can be offered air vent, the position of air vent
And number is corresponding with the model of LED module, such as LED module is 20 row * 40 row LED lamp bead arrangements
, then should offer 20*40 air vent on cooling holder 52, each air vent welds with LED lamp bead
Position corresponding.
The LED module detinning apparatus of the present invention uses high temperature resistant silica gel to carry out wiping the stannum melted on pad, removes
After stannum efficiency height, removing, flatness is more excellent；Interest rate is high, except stannum same effect is good, can be used for batch jobs；
Use support to fix LED module, be possible to prevent second upper components and parts and pcb board deformation, it is ensured that follow-up
The quality of processing.
The LED module detinning method that the present invention provides comprises the following steps:
Step 1: described LED module is fixed on the heating, it is ensured that described LED module needs except stannum
The first face heated, it is not necessary to except the scolding tin of second of stannum is in the state of cooling.
In present embodiment, second mainly includes pcb board, this pcb board is provided with LED module
Drive circuit, these drive circuits are not required to except stannum, if as the scolding tin of second heated be in molten
If melting state, then may result in the deviation of the components and parts on second or come off, so that circuit is not
Can normally work.
In the present embodiment, described first is welded with LED lamp bead by scolding tin, the first face is being entered
After row heating, scolding tin could be struck off, or LED lamp bead is removed.
Step 2: drive described LED module to move, scrape off under scolding tin melting state and be positioned on first
LED lamp bead.
In the present embodiment, before needing to strike off the scolding tin on first of LED module, need by
The LED lamp bead come off is removed, and not so LED lamp bead can directly affect striking off of scolding tin.
Step 3: drive described LED module to continue motion, scrape off under scolding tin melting state and be positioned at first
On scolding tin.
In the present embodiment, when striking off first upper scolding tin, in order to prevent described scraper on first
Wiring or solder joint cause damage, arrange resistant to elevated temperatures silica gel on described first scraper, and this silica gel is pressed on institute
State on first, thus scolding tin is struck off.
Step 4: drive described LED module to continue motion, the first face is cleared up.In present embodiment
In, for first further cleaning, it is to carry out subsequent automated assembling institute to reach this LED module
Need to reach requirement, such as: scolding tin, first upper cleaning on first, can not be had can not to have foreign material.
Step 5: the first face of described LED module is cooled down by chiller.To LED module
After carrying out cooling down could by LED module transhipment or storage, compare with natural cooling for, can improve
Efficiency.
The above, for the person of ordinary skill of the art, can be according to technical scheme
Make other various corresponding changes and deformation with technology design, and all these change and deformation all should belong to
The protection domain of the claims in the present invention.
Claims (10)
1. a LED module detinning apparatus, including work platforms, the slide rail being fixed on work platforms,
Described LED module includes needing, except stannum, having first of LED lamp bead and need not second except stannum
Face, it is characterised in that described LED detinning apparatus also includes:
Preheating device, for fixing described LED module and preheating the scolding tin on described first；
Tin scraping device, is fixed on work platforms, for striking off the scolding tin on described first and reclaiming LED
Lamp bead；
Chiller, cools down the LED module striking off scolding tin；
After described LED module is fixed and preheated to described preheating device, slide into described tin scraping dress along described slide rail
Putting top, described tin scraping device utilizes scraper to strike off scolding tin, and reclaims LED lamp bead；At described tin scraping device
After striking off scolding tin, described preheating device slides into above described chiller along slide rail, so that described LED
First cooling of module.
LED module detinning apparatus the most according to claim 1, it is characterised in that described preheating device
Including:
Guide rail slide block, is installed on described slide rail, slides along described slide rail；
Preheating support, is installed on described guide rail slide block, for described first heating；
First cooling fan, is installed on described preheating support, is used for described second cooling, thus prevents
Components and parts on described second come off；
Described preheating support is additionally operable to fixing described LED module, described preheating support make described first in institute
State during preheating bracket slide tangent with described scraper.
LED module detinning apparatus the most according to claim 1 and 2, it is characterised in that described tin scraping
Device includes:
Tin scraping platform, is used for supporting described LED module, and after preventing melts soldering tin, LED lamp bead comes off；
First scraper, acts on described LED lamp bead, and makes described LED lamp bead come off；
Second scraper, for scraping off the scolding tin melted on described LED module；
3rd scraper, for clearing up described LED module；
Described first scraper, the second scraper and the 3rd scraper are arranged along the described preheating device direction of motion successively.
LED module detinning apparatus the most according to claim 3, it is characterised in that described tin scraping device
Also including receiving stannum box, described receipts stannum box is arranged on the lower section of described second scraper, is used for receiving described second and scrapes
The scolding tin that cutter scrapes off.
LED module detinning apparatus the most according to claim 3, it is characterised in that described second scraper
On be provided with the silica gel of heatproof, the scolding tin of thawing is scraped off by the second scraper by silica gel.
LED module detinning apparatus the most according to claim 3, it is characterised in that described first scraper
And being provided with Lou lamp passage between tin scraping platform, described leakage lamp passage is arranged on the lower section of described first scraper,
Discharge through described leakage lamp passage after described first scraper scrapes described LED lamp bead.
LED module detinning apparatus the most according to claim 1, it is characterised in that described chiller
Including:
Second cooling fan, for cooling down described first face after preheating；
Cooling holder, is used for fixing described second cooling fan；
Described second cooling fan is arranged on the side of described cooling holder.
LED module detinning apparatus the most according to claim 7, it is characterised in that described cooling is propped up
Multiple air vent, the position of described air vent and the position welding LED lamp bead on described first it is provided with on frame
Put corresponding.
9.LED module detinning method, it is characterised in that comprise the following steps:
Step 1: described LED module is fixed on the heating, it is ensured that described LED module needs except stannum
The first face heated, it is not necessary to except the scolding tin of second of stannum is in the state of cooling；
Step 2: drive described LED module to move, scrape off under scolding tin melting state and be positioned on first
LED lamp bead；
Step 3: drive described LED module to continue motion, scrape off under scolding tin melting state and be positioned at first
On scolding tin；
Step 4: drive described LED module to continue motion, the first face is cleared up；
Step 5: the first face of described LED module is cooled down by chiller.
LED module detinning method the most according to claim 9, it is characterised in that scrape off in step 3
The scraper of first upper scolding tin includes resistant to elevated temperatures silica gel, and silica gel is pressed on described first.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610345479.1A CN105834543B (en) | 2016-05-20 | 2016-05-20 | LED module detinning apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610345479.1A CN105834543B (en) | 2016-05-20 | 2016-05-20 | LED module detinning apparatus and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105834543A true CN105834543A (en) | 2016-08-10 |
| CN105834543B CN105834543B (en) | 2019-11-26 |
Family
ID=56594072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610345479.1A Active CN105834543B (en) | 2016-05-20 | 2016-05-20 | LED module detinning apparatus and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105834543B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270901A (en) * | 2016-09-30 | 2017-01-04 | 山东理工大学 | A kind of Multifunctional electric soldering iron head |
| CN106695045A (en) * | 2017-01-11 | 2017-05-24 | 东莞市崴泰电子有限公司 | Automatic desoldering and detinning equipment |
| CN111644444A (en) * | 2020-05-27 | 2020-09-11 | 孙苗 | Recovery plant of abandonment LED module lamp pearl |
| CN112296473A (en) * | 2020-11-24 | 2021-02-02 | 滨州学院 | High-efficient clearance controlling means is used to computer motherboard |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US836028A (en) * | 1905-12-20 | 1906-11-13 | Karl Goldschmidt | Method of detinning. |
| CN102126059A (en) * | 2010-12-23 | 2011-07-20 | 何光宁 | Detinning processing method of chip and chip detinning machine applying method |
| CN203109401U (en) * | 2013-03-08 | 2013-08-07 | 林培林 | Heating device of directly welded type light-emitting diode (LED) lamp |
| CN104690387A (en) * | 2013-12-10 | 2015-06-10 | 深圳市新迪精密科技有限公司 | Detinning and degumming equipment for printed circuit boards and electronic elements and method of detinning and degumming equipment |
| CN104959696A (en) * | 2015-07-13 | 2015-10-07 | 深圳市卓茂科技有限公司 | Semi-automatic tin removing machine |
| CN105345197A (en) * | 2015-11-14 | 2016-02-24 | 苏州光韵达光电科技有限公司 | Tin removing device for BGA |
| CN205764317U (en) * | 2016-05-20 | 2016-12-07 | 广东德豪锐拓显示技术有限公司 | LED module detinning apparatus |
-
2016
- 2016-05-20 CN CN201610345479.1A patent/CN105834543B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US836028A (en) * | 1905-12-20 | 1906-11-13 | Karl Goldschmidt | Method of detinning. |
| CN102126059A (en) * | 2010-12-23 | 2011-07-20 | 何光宁 | Detinning processing method of chip and chip detinning machine applying method |
| CN203109401U (en) * | 2013-03-08 | 2013-08-07 | 林培林 | Heating device of directly welded type light-emitting diode (LED) lamp |
| CN104690387A (en) * | 2013-12-10 | 2015-06-10 | 深圳市新迪精密科技有限公司 | Detinning and degumming equipment for printed circuit boards and electronic elements and method of detinning and degumming equipment |
| CN104959696A (en) * | 2015-07-13 | 2015-10-07 | 深圳市卓茂科技有限公司 | Semi-automatic tin removing machine |
| CN105345197A (en) * | 2015-11-14 | 2016-02-24 | 苏州光韵达光电科技有限公司 | Tin removing device for BGA |
| CN205764317U (en) * | 2016-05-20 | 2016-12-07 | 广东德豪锐拓显示技术有限公司 | LED module detinning apparatus |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270901A (en) * | 2016-09-30 | 2017-01-04 | 山东理工大学 | A kind of Multifunctional electric soldering iron head |
| CN106695045A (en) * | 2017-01-11 | 2017-05-24 | 东莞市崴泰电子有限公司 | Automatic desoldering and detinning equipment |
| CN106695045B (en) * | 2017-01-11 | 2024-04-26 | 东莞市崴泰电子有限公司 | Automatic unpick and weld detinning equipment |
| CN111644444A (en) * | 2020-05-27 | 2020-09-11 | 孙苗 | Recovery plant of abandonment LED module lamp pearl |
| CN111644444B (en) * | 2020-05-27 | 2021-07-06 | 孙苗 | Recovery plant of abandonment LED module lamp pearl |
| CN112296473A (en) * | 2020-11-24 | 2021-02-02 | 滨州学院 | High-efficient clearance controlling means is used to computer motherboard |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105834543B (en) | 2019-11-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105834543A (en) | Tin removing device and method for LED module | |
| CN106695045B (en) | Automatic unpick and weld detinning equipment | |
| CN205764317U (en) | LED module detinning apparatus | |
| CN104690387A (en) | Detinning and degumming equipment for printed circuit boards and electronic elements and method of detinning and degumming equipment | |
| CN211991314U (en) | Automatic tin removing device for circuit board | |
| KR101993025B1 (en) | Reflow oven and methods of treating surfaces of the reflow oven | |
| CN103658903A (en) | System for continuously disassembling and recovering electronic component and solder based on waste circuit board | |
| CN106098575B (en) | A kind of chip repairing batch ball-establishing method | |
| CN115870575A (en) | Online accurate single-point detinning plant ball welding curing equipment | |
| US6349871B1 (en) | Process for reworking circuit boards | |
| CN211028626U (en) | Automatic change laser cutting equipment | |
| CN107911955B (en) | Chip replacement method | |
| US10160053B1 (en) | Cold gas blast jet for micro-electronic solder repair | |
| CN104741866A (en) | Method for repairing casting | |
| CN112191814A (en) | Management method based on steelmaking continuous casting production management optimization | |
| CN105274464B (en) | Core wires tinning stack and tin plating method | |
| KR20080019087A (en) | Reflow soldering machine | |
| CN103495783A (en) | Disassembly device for reusable surface-mounted components of waste circuit board | |
| CN109511229A (en) | A kind of explosion-proof gluing method of cell phone mainboard maintenance | |
| KR20080017914A (en) | Heating apparatus of a reflow soldering machine | |
| CN107197620A (en) | One kind removes adhesive dispenser except tin | |
| CN218388169U (en) | BGA (ball grid array) repair hot air hood capable of automatically exhausting air | |
| CN113645830B (en) | SMT paster visual detection equipment | |
| US8016180B2 (en) | Thermode cleaning method | |
| CN215734840U (en) | Easy-to-clean tin furnace for earphone processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210311 Address after: No.302, no.2-1 workshop, No.1, Zhongzhu South Road, high tech Zone, Zhuhai, Guangdong 519000 Patentee after: Zhuhai ruituo Display Technology Co.,Ltd. Address before: 519000 phase 1 plant, No.1, Zhongzhu South Road, science and Technology Innovation Coast, high tech Zone, Zhuhai City, Guangdong Province Patentee before: GUANGDONG RETOP LED DISPLAY Co.,Ltd. |