CN105834543B - LED module detinning apparatus and method - Google Patents
LED module detinning apparatus and method Download PDFInfo
- Publication number
- CN105834543B CN105834543B CN201610345479.1A CN201610345479A CN105834543B CN 105834543 B CN105834543 B CN 105834543B CN 201610345479 A CN201610345479 A CN 201610345479A CN 105834543 B CN105834543 B CN 105834543B
- Authority
- CN
- China
- Prior art keywords
- led module
- tin
- face
- scraper
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
Abstract
LED module detinning apparatus provided by the invention, including workbench, the sliding rail being fixed on workbench, the LED module includes needing except tin, the first face with LED lamp bead and the second face except tin is not needed, the LED detinning apparatus further include: to the preheating device of the scolding tin preheating on the first face；It strikes off the scolding tin on first face and recycles the tin scraping device of LED lamp bead；The cooling device cooling to the LED module for striking off scolding tin；LED module detinning apparatus of the invention carries out the tin melted on erasing pad using high temperature resistant silica gel, except tin is high-efficient, flatness is more excellent after removing；Interest rate is high, it is good to remove tin same effect, can be used for batch jobs；Using the fixed LED module of bracket, component and pcb board deformation on the second face can be prevented, guarantees the quality of following process.The present invention additionally provides a kind of LED module detinning method simultaneously.
Description
Technical field
The present invention relates to the detinning apparatus and method of LED display industry more particularly to a kind of LED module.
Background technique
Current LED display is fast-developing towards the direction of small spacing, in being closer for two adjacent LED lamp beads
In the case where, in the case that wherein LED lamp bead failure or needs are safeguarded, replacement LED lamp bead, which compares, expends the time, usually
After melting the scolding tin on component solder joint by the way of electric iron or hair dryer heating, then component is removed, and pass through
Scolding tin is sucked out tin sucking gun, but heats to the solder joint to the specific LED lamp bead in small spacing, and by the LED
Lamp bead is sucked out, just unrealistic, inevitably heats other solder joints around the LED lamp bead, may result in other welderings
LED lamp bead on point falls off, even if to take out specific LED lamp bead, and not allowing in the case where scolding tin is removed
Easy；If needing replacing multiple LED lamp beads on a piece of LED display, then just more expending the time, and LED light of dismantling
The circuit board of pearl is not able to satisfy the automation requirement of SMT processing.
In addition to this, pcb board local heating and unshielded PCB is easily-deformable, influences subsequent SMT machine placement accuracy, easy sticker
Partially.
Summary of the invention
The technical problem to be solved by the present invention is providing one kind quickly except tin, and the LED module for preventing pcb board from deforming is removed
Tin device and method.
To achieve the above object, a kind of LED module detinning apparatus disclosed by the invention includes workbench, is fixed on work
Sliding rail on platform, the LED module include needing first face except tin with LED lamp bead and not needing to remove the second of tin
Face, which is characterized in that the LED detinning apparatus further include:
Preheating device, for fixing the LED module and being preheated to the scolding tin on first face；
Tin scraping device, is fixed on workbench, for striking off the scolding tin on first face and recycling LED lamp bead；
Cooling device, it is cooling to the LED module for striking off scolding tin；
After the preheating device is fixed and preheats the LED module, slid into above the tin scraping device along the sliding rail,
The tin scraping device strikes off scolding tin using scraper, and recycles LED lamp bead；After the tin scraping device strikes off scolding tin, the preheating
Device slides into above the cooling device along sliding rail, to keep the first face of the LED module cooling.
Further, the preheating device includes:
Guide rail slide block is installed on the sliding rail, is slided along the sliding rail；
Bracket is preheated, is installed on the guide rail slide block, for being heated to first face；
First cooling fan is installed on the preheating bracket, for cooling to second face, to prevent described second
Component on face falls off；
The preheating bracket is also used to fix the LED module, and the preheating bracket makes first face in the preheating
It is tangent with the scraper during bracket slide.
Further, the tin scraping device includes:
Tin scraping platform is used to support the LED module, prevents falling off for LED lamp bead after melts soldering tin；
First scraper acts on the LED lamp bead, and the LED lamp bead is made to fall off；
Second scraper, for scraping off the scolding tin melted in the LED module；
Third scraper, for clearing up the LED module；
First scraper, the second scraper and third scraper are successively arranged along the preheating device direction of motion.
Further, the tin scraping device further includes receiving tin box, the lower section received tin box and second scraper is arranged in,
The scolding tin scraped off for storing second scraper.
Further, the silica gel of heatproof is provided on second scraper, the second scraper passes through silica gel for the scolding tin of thawing
It scrapes off.
Further, leakage lamp channel is provided between first scraper and tin scraping platform, the leakage lamp channel setting exists
The lower section of first scraper is discharged after first scraper scrapes the LED lamp bead through the leakage lamp channel.
Further, the cooling device includes:
Second cooling fan, for being cooled down to first face after preheating；
Cooling holder, for fixing second cooling fan；
The side of the cooling holder is arranged in second cooling fan.
Further, multiple ventilation holes are provided on the cooling holder, on the position of the ventilation hole and first face
The position for welding LED lamp bead is corresponding.
LED module detinning apparatus of the invention carries out the tin melted on erasing pad using high temperature resistant silica gel, removes tin efficiency
Flatness is more excellent after high, removing；Interest rate is high, it is good to remove tin same effect, can be used for batch jobs；Using the fixed LED mould of bracket
Group can prevent component and pcb board deformation on the second face, guarantee the quality of following process.
LED module detinning method provided by the invention the following steps are included:
Step 1: the LED module is fixed on the heating, guarantee that the LED module needs the first face except tin to obtain
To heating, the scolding tin for not needing the second face except tin is in the state of cooling；
Step 2: driving the LED module to move, the LED lamp bead on the first face is scraped off under scolding tin melting state；
Step 3: driving the LED module to continue to move, the scolding tin on the first face is scraped off under scolding tin melting state；
Step 4: driving the LED module to continue to move, the first face is cleared up；
Step 5: being cooled down by first face of the cooling device to the LED module.
Further, the scraper that scolding tin on the first face is scraped off in step 3 includes silica gel resistant to high temperature, and silica gel is pressed on described
On first face.
Quickly the scolding tin in LED module can be removed using method of the invention, and elimination effect is preferable.
Detailed description of the invention
With reference to the accompanying drawing, by the way that detailed description of specific embodiments of the present invention, technical solution of the present invention will be made
And other beneficial effects are apparent.
In attached drawing,
Fig. 1 is LED module detinning apparatus structural schematic diagram of the present invention；
Fig. 2 is the side structure schematic diagram of LED module detinning apparatus of the present invention；
Fig. 3 is the magnified partial view of the LED module detinning apparatus of the present invention of Fig. 2；
Fig. 4, Fig. 5 are the working state schematic representation of LED module detinning apparatus of the present invention.
Drawing reference numeral explanation:
100, workbench；11, sliding rail；200, lamp channel is leaked；300, preheating device；31, the first cooling fan；32, pre-
Hot bracket；33, guide rail slide block；400, tin scraping device；41, the first scraper；42, the second scraper；43, third scraper；44, tin is received
Box；500, cooling device；51, the second cooling fan；52, cooling holder.
Specific embodiment
Further to illustrate technological means and its effect adopted by the present invention, below in conjunction with preferred implementation of the invention
Example and its attached drawing are described in detail.
Fig. 1 or Fig. 2 is please referred to, LED module detinning apparatus provided by the invention includes: to be fixed on including workbench 100
Sliding rail 11 on workbench 100, the LED module include needing first face except tin with LED lamp bead and not needing to remove
Second face of tin.In the present embodiment, LED lamp bead is welded with by scolding tin on the first face, the second face is to provide LED lamp bead point
Bright pcb board or other circuit parts do not need on the second face except tin.
As shown in Figure 1, the LED detinning apparatus further include: preheating device 300, tin scraping device 400 and cooling device
500.Wherein, the preheating device 300 is used to fix the LED module and preheats to the scolding tin on first face；It is described to scrape
Tin device 400 is fixed on workbench 100, for striking off the scolding tin on first face and recycling LED lamp bead；The cooling
Device 500 is cooling to the LED module for striking off scolding tin.
After the preheating device 300 is fixed and preheats the LED module, the tin scraping device is slid into along the sliding rail 11
400 tops, the tin scraping device 400 strikes off scolding tin using scraper, and recycles LED lamp bead；Weldering is struck off in the tin scraping device 400
After tin, the preheating device 300 slides into above the cooling device 500 along sliding rail 11, to make the first of the LED module
Face is cooling.
In the present embodiment, scolding tin on first face is heated after the fixed number LED module of the preheating device 300,
Then the tin scraping device 400 is slid by sliding rail 11, at this time under the lower surface of LED module and the tin scraping device 400
Flush, tin scraping device 400 strike off scolding tin by scraper and recycle LED lamp bead, and the preheating device 300 continues on later
The sliding rail 11 slides into cooling device 500, and cooling device 500 is cooling by first face, then can remove the LED
Mould group, so far the LED module completes except tin and goes the purpose of LED lamp bead.
LED module detinning apparatus of the invention can batch LED lamp bead is removed, and strike off scolding tin, production efficiency compared with
Height is removed more clean relative to traditional mode；Simultaneously because LED module is fixed on preheating device 300, it is ensured that
LED module is indeformable, is conducive to other production technologies in later period.
Further, such as Fig. 1 or Fig. 2, the preheating device 300 includes: guide rail slide block 33, preheating bracket 32 and first
Cooling fan 31, the guide rail slide block 33 are installed on the sliding rail 11, are slided along the sliding rail 11；The preheating bracket 32 is pacified
Loaded on the guide rail slide block 33, for being heated to first face；First cooling fan 31 is installed on the preheating branch
Frame 32, for cooling to second face, to prevent the component on second face from falling off.
The preheating bracket 32 is also used to fix the LED module, and the preheating bracket 32 makes first face described
It preheats tangent with the scraper during bracket 32 slides.
In the present embodiment, described to preheat protecting to the fixation position of LED module and the height of fixation for bracket 32
Demonstrate,prove the LED module the first face and the scraper it is tangent in the case where, the weldering on the first face can be cleaned out as far as possible
Tin is conducive to the installation accuracy for improving the next process of LED module, such as SMT patch processing procedure.
Further, such as Fig. 1 or Fig. 3, the tin scraping device 400 includes: tin scraping platform, the first scraper 41, the second scraper
42 and third scraper 43.The tin scraping platform is used to support the LED module, prevents falling off for LED lamp bead after melts soldering tin；Institute
It states the first scraper 41 and acts on the LED lamp bead, and the LED lamp bead is made to fall off；Second scraper 42 is described for scraping off
The scolding tin melted in LED module；The third scraper 43 is for clearing up the LED module.
First scraper 41, the second scraper 42 and third scraper 43 are successively set along 300 direction of motion of preheating device
It sets.
Such as Fig. 4 and Fig. 5, in the present embodiment, when LED module is after preheating the preheating of bracket 32, on the first face
Scolding tin it is in a molten state, the LED lamp bead that scolding tin is fixed is easy to trickle down in the cutter front end of machine, to influence machine
Operation, also influence the cleaning of machine, the tin scraping platform can support the LED lamp bead that may fall after preheating, to prevent
LED lamp bead is scattered.When the preheating device 300 drives LED module and first scraper 41 to contact, first scraper 41
It acts in the LED lamp bead, LED lamp bead falls off at this time, it may be convenient to which the LED lamp bead is cleared up or stored.Further
, when the position that preheating device 300 drives LED module movement to contact as second scraper 42, second scraper 42
It is pressed on first face, the scolding tin on the first face is scraped off.After scraping off scolding tin, third scraper 43 continue to the first face into
Row cleaning improves the precision of automation to reach the requirement of subsequent technique production.
Further, such as Fig. 1, the tin scraping device 400 further includes receiving tin box 44, and the receipts tin box 44 is arranged described the
The lower section of two scrapers 42, the scolding tin scraped off for storing second scraper 42.
In the present embodiment, it receives tin box 44 and the scolding tin scraped off is concentrated into storage, reduce the cleaning difficulty of device, simultaneously also
Scolding tin can be reused by having.
Further, the silica gel of heatproof is provided on second scraper 42, the second scraper 42 passes through silica gel for thawing
Scolding tin scrapes off.
It is pressed on the first face of LED module using silica gel, scrapes off scolding tin, scrape off scolding tin compared to by hard material
Mode can preferably protect solder joint on the first face, wiring, thus a possibility that reducing LED module damage.
Further, leakage lamp channel 200, the leakage lamp channel are provided between first scraper 41 and tin scraping platform
200 are arranged in the lower section of first scraper 41, through the leakage lamp channel after first scraper 41 scrapes the LED lamp bead
200 discharges.
In the present embodiment, LED lamp bead can leak to the lower section except tin equipment by leaking lamp channel 200, convenient for collection
In cleaning and utilization, reduce remove tin equipment disposal costs.
Further, the cooling device 500 includes: the second cooling fan 51 and cooling holder 52.Described second is cooling
Fan 51 is for cooling down first face after preheating；The cooling holder 52 is for fixing second cooling fan
51；The side of the cooling holder 52 is arranged in second cooling fan 51.
In the present embodiment, LED module except tin complete after, to LED module carry or store before need by
LED module is cooling, and the first face heated before LED module at this time is placed on the cooling holder 52, the second cooling fan 51
From the side blow of the cooling holder 52, cool down the first face；500 equipment of entire cooling device is simple, facilitates operation,
In practical applications, the preheating device 300 slides into 500 top of cooling device, and preheating device 300 opens fixed knot
The LED module can be placed on the cooling holder 52 by structure, and then the preheating device 300 is slid back again to first
Beginning position carries out work next time.
Further, multiple ventilation holes, the position of the ventilation hole and first face are provided on the cooling holder 52
The position of upper welding LED lamp bead is corresponding.
In order to preferably reach cooling effect, ventilation hole, the position of ventilation hole and number can be opened up on cooling holder 52
It is corresponding with the model of LED module, such as LED module is the arrangement of 20 row *, 40 column LED lamp bead, then on cooling holder 52
20*40 ventilation hole should be opened up, each ventilation hole is corresponding with the position that LED lamp bead is welded.
LED module detinning apparatus of the invention carries out the tin melted on erasing pad using high temperature resistant silica gel, removes tin efficiency
Flatness is more excellent after high, removing；Interest rate is high, it is good to remove tin same effect, can be used for batch jobs；Using the fixed LED mould of bracket
Group can prevent component and pcb board deformation on the second face, guarantee the quality of following process.
LED module detinning method provided by the invention the following steps are included:
Step 1: the LED module is fixed on the heating, guarantee that the LED module needs the first face except tin to obtain
To heating, the scolding tin for not needing the second face except tin is in the state of cooling.
In present embodiment, mainly includes pcb board on the second face, the driving circuit of LED module is provided on the pcb board,
These driving circuits are not needed except tin, if because the scolding tin in the second face be heated it is in a molten state if, it would be possible that
It will lead to the deviation of the component on the second face or fall off, to make circuit cisco unity malfunction.
In the present embodiment, LED lamp bead is welded with by scolding tin on first face, to the first face heated with
Afterwards, scolding tin could be struck off, or LED lamp bead is removed.
Step 2: driving the LED module to move, the LED lamp bead on the first face is scraped off under scolding tin melting state.
In the present embodiment, it before the scolding tin on the first face needed LED module strikes off, needs to have fallen off
LED lamp bead removal, not so LED lamp bead will have a direct impact on striking off for scolding tin.
Step 3: driving the LED module to continue to move, the scolding tin on the first face is scraped off under scolding tin melting state.
In the present embodiment, when striking off scolding tin on the first face, in order to prevent the scraper on the first face wiring or
Solder joint causes to damage, and silica gel resistant to high temperature is arranged on first scraper, which is pressed on first face, thus will
Scolding tin strikes off.
Step 4: driving the LED module to continue to move, the first face is cleared up.In the present embodiment, for
Further cleaning on one side, be in order to reach the LED module and carry out reaching requirement required for subsequent automated assembling, such as: the
There cannot be scolding tin on one side, cleaning there cannot be sundries on the first face.
Step 5: being cooled down by first face of the cooling device to the LED module.To LED module cooled down with
After could by LED module transport or store, compare with for natural cooling, efficiency can be improved.
The above for those of ordinary skill in the art can according to the technique and scheme of the present invention and technology
Other various corresponding changes and modifications are made in design, and all these change and modification all should belong to the claims in the present invention
Protection scope.
Claims (9)
1. a kind of LED module detinning apparatus, including workbench, the sliding rail being fixed on workbench, the LED module include
It needs the first face except tin, with LED lamp bead and does not need the second face except tin, which is characterized in that the LED detinning apparatus
Further include:
Preheating device, for fixing the LED module and being preheated to the scolding tin on first face；
Tin scraping device, is fixed on workbench, for striking off the scolding tin on first face and recycling LED lamp bead；
Cooling device, it is cooling to the LED module for striking off scolding tin；
After the preheating device is fixed and preheats the LED module, slid into above the tin scraping device along the sliding rail, it is described
Tin scraping device strikes off scolding tin using scraper, and recycles LED lamp bead；After the tin scraping device strikes off scolding tin, the preheating device
It is slid into above the cooling device along sliding rail, to keep the first face of the LED module cooling；
The preheating device includes:
Guide rail slide block is installed on the sliding rail, is slided along the sliding rail；
Bracket is preheated, is installed on the guide rail slide block, for being heated to first face；
First cooling fan is installed on the preheating bracket, for cooling to second face, to prevent on second face
Component fall off；
The preheating bracket is also used to fix the LED module, and the preheating bracket makes first face in the preheating bracket
It is tangent with the scraper during sliding.
2. LED module detinning apparatus according to claim 1, which is characterized in that the tin scraping device includes:
Tin scraping platform is used to support the LED module, prevents falling off for LED lamp bead after melts soldering tin；
First scraper acts on the LED lamp bead, and the LED lamp bead is made to fall off；
Second scraper, for scraping off the scolding tin melted in the LED module；
Third scraper, for clearing up the LED module；
First scraper, the second scraper and third scraper are successively arranged along the preheating device direction of motion.
3. LED module detinning apparatus according to claim 2, which is characterized in that the tin scraping device further includes receiving tin box,
The lower section received tin box and second scraper is set, the scolding tin scraped off for storing second scraper.
4. LED module detinning apparatus according to claim 2, which is characterized in that be provided with heatproof on second scraper
Silica gel, the second scraper scraped off the scolding tin of thawing by silica gel.
5. LED module detinning apparatus according to claim 2, which is characterized in that first scraper and tin scraping platform it
Between be provided with leakage lamp channel, the lower section of first scraper is arranged in the leakage lamp channel, when first scraper scrape it is described
It is discharged after LED lamp bead through the leakage lamp channel.
6. LED module detinning apparatus according to claim 1, which is characterized in that the cooling device includes: second cooling
Fan, for being cooled down to first face after preheating；Cooling holder, for fixing second cooling fan；It is described
The side of the cooling holder is arranged in second cooling fan.
7. LED module detinning apparatus according to claim 6, which is characterized in that be provided on the cooling holder multiple
Ventilation hole, the position of the ventilation hole are corresponding with the position of LED lamp bead is welded on first face.
8.LED mould group detinning method, which comprises the following steps:
Step 1: the LED module is fixed on the heating, guarantee that the LED module needs the first face except tin to be added
Heat, the scolding tin for not needing the second face except tin are in the state of cooling；
Step 2: driving the LED module to move, the LED lamp bead on the first face is scraped off under scolding tin melting state；
Step 3: driving the LED module to continue to move, the scolding tin on the first face is scraped off under scolding tin melting state；
Step 4: driving the LED module to continue to move, the first face is cleared up；
Step 5: being cooled down by first face of the cooling device to the LED module.
9. LED module detinning method according to claim 8, which is characterized in that scrape off scolding tin on the first face in step 3
Scraper includes silica gel resistant to high temperature, and silica gel is pressed on first face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610345479.1A CN105834543B (en) | 2016-05-20 | 2016-05-20 | LED module detinning apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610345479.1A CN105834543B (en) | 2016-05-20 | 2016-05-20 | LED module detinning apparatus and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105834543A CN105834543A (en) | 2016-08-10 |
| CN105834543B true CN105834543B (en) | 2019-11-26 |
Family
ID=56594072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610345479.1A Active CN105834543B (en) | 2016-05-20 | 2016-05-20 | LED module detinning apparatus and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105834543B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270901A (en) * | 2016-09-30 | 2017-01-04 | 山东理工大学 | A kind of Multifunctional electric soldering iron head |
| CN106695045B (en) * | 2017-01-11 | 2024-04-26 | 东莞市崴泰电子有限公司 | Automatic unpick and weld detinning equipment |
| CN111644444B (en) * | 2020-05-27 | 2021-07-06 | 孙苗 | Recovery plant of abandonment LED module lamp pearl |
| CN112296473B (en) * | 2020-11-24 | 2021-11-30 | 滨州学院 | High-efficient clearance controlling means is used to computer motherboard |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US836028A (en) * | 1905-12-20 | 1906-11-13 | Karl Goldschmidt | Method of detinning. |
| CN102126059A (en) * | 2010-12-23 | 2011-07-20 | 何光宁 | Detinning processing method of chip and chip detinning machine applying method |
| CN203109401U (en) * | 2013-03-08 | 2013-08-07 | 林培林 | Heating device of directly welded type light-emitting diode (LED) lamp |
| CN104690387A (en) * | 2013-12-10 | 2015-06-10 | 深圳市新迪精密科技有限公司 | Detinning and degumming equipment for printed circuit boards and electronic elements and method of detinning and degumming equipment |
| CN104959696A (en) * | 2015-07-13 | 2015-10-07 | 深圳市卓茂科技有限公司 | Semi-automatic tin removing machine |
| CN105345197A (en) * | 2015-11-14 | 2016-02-24 | 苏州光韵达光电科技有限公司 | Tin removing device for BGA |
| CN205764317U (en) * | 2016-05-20 | 2016-12-07 | 广东德豪锐拓显示技术有限公司 | LED module detinning apparatus |
-
2016
- 2016-05-20 CN CN201610345479.1A patent/CN105834543B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US836028A (en) * | 1905-12-20 | 1906-11-13 | Karl Goldschmidt | Method of detinning. |
| CN102126059A (en) * | 2010-12-23 | 2011-07-20 | 何光宁 | Detinning processing method of chip and chip detinning machine applying method |
| CN203109401U (en) * | 2013-03-08 | 2013-08-07 | 林培林 | Heating device of directly welded type light-emitting diode (LED) lamp |
| CN104690387A (en) * | 2013-12-10 | 2015-06-10 | 深圳市新迪精密科技有限公司 | Detinning and degumming equipment for printed circuit boards and electronic elements and method of detinning and degumming equipment |
| CN104959696A (en) * | 2015-07-13 | 2015-10-07 | 深圳市卓茂科技有限公司 | Semi-automatic tin removing machine |
| CN105345197A (en) * | 2015-11-14 | 2016-02-24 | 苏州光韵达光电科技有限公司 | Tin removing device for BGA |
| CN205764317U (en) * | 2016-05-20 | 2016-12-07 | 广东德豪锐拓显示技术有限公司 | LED module detinning apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105834543A (en) | 2016-08-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105834543B (en) | LED module detinning apparatus and method | |
| CN106695045B (en) | Automatic unpick and weld detinning equipment | |
| CN205764317U (en) | LED module detinning apparatus | |
| CN109411566B (en) | Battery string component repairing device and method | |
| CN104690387A (en) | Detinning and degumming equipment for printed circuit boards and electronic elements and method of detinning and degumming equipment | |
| US20150129641A1 (en) | Screen printing machine, electronic component mounting system, and screen printing method | |
| CN101014227A (en) | Method and equipment for disassembling circuit board using contacted impact | |
| JP6835878B2 (en) | Production control equipment | |
| CN103658903A (en) | System for continuously disassembling and recovering electronic component and solder based on waste circuit board | |
| KR20140121250A (en) | Replace the printed circuit board according to the screen printer backup zig-mask automatic replacement device and automatic backup using this jig-mask how to replace | |
| CN103717005A (en) | Eight-shaft-moving chip repairing and attaching device and method with visual positioning function | |
| EP1623778A1 (en) | Automatic deslagging apparatus, particularly for plants for processing nonferrous metals | |
| US6216938B1 (en) | Machine and process for reworking circuit boards | |
| CN103495783A (en) | Disassembly device for reusable surface-mounted components of waste circuit board | |
| KR20080019087A (en) | Reflow soldering machine | |
| CN206237691U (en) | Bga chip maintenance unit | |
| KR100647880B1 (en) | Method of installing injection connectors to a pcb | |
| CN104168723A (en) | Repair method of LGA device | |
| CN202162472U (en) | Equipment for separating electronic components of circuit board | |
| CN113523481A (en) | Automatic disassembling system and method for waste circuit board | |
| CN110497054B (en) | Tin melting treatment device for repairing and desoldering integrated circuit board | |
| CN211438497U (en) | Detachable workbench of flame cutting machine for machining scraper machine middle plate | |
| CN209517674U (en) | A kind of automatic wicking cutter of pcb board | |
| CN204524476U (en) | Full-automatic tin soldering equipment | |
| CN206585176U (en) | Connecting element maintenance of equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210311 Address after: No.302, no.2-1 workshop, No.1, Zhongzhu South Road, high tech Zone, Zhuhai, Guangdong 519000 Patentee after: Zhuhai ruituo Display Technology Co.,Ltd. Address before: 519000 phase 1 plant, No.1, Zhongzhu South Road, science and Technology Innovation Coast, high tech Zone, Zhuhai City, Guangdong Province Patentee before: GUANGDONG RETOP LED DISPLAY Co.,Ltd. |