CN110497054B

CN110497054B - Tin melting treatment device for repairing and desoldering integrated circuit board

Info

Publication number: CN110497054B
Application number: CN201910819544.3A
Authority: CN
Inventors: 姚秀梅; 陈刚
Original assignee: Shenzhen Huachenxin Technology Co ltd
Current assignee: SHENZHEN HUACHENXIN TECHNOLOGY Co.,Ltd.
Priority date: 2019-08-31
Filing date: 2019-08-31
Publication date: 2021-06-11
Anticipated expiration: 2039-08-31
Also published as: CN110497054A

Abstract

The utility model provides a tin processing apparatus melts when integrated circuit board reprocesses and separates welding, includes the fixed plate, the middle part sliding connection of fixed plate has the card strip, the bottom fixed mounting at the middle part of fixed plate has the piece of taking, the last fixed surface of fixed plate installs two symmetrical draw runners, and the spout department sliding mounting of draw runner has the dead lever, and the spout department fixed mounting at dead lever middle part has the traveller. Through the cooperation use of carousel, bull stick, bracing piece, fixed block and processing axle, can guarantee, when the soldered part of the needle help integrated circuit board of unsoldering, effectually can give to push to both sides molten tin, guaranteed the liquid tin under the melting, can not be in original position, even will unsoldering the needle at the staff and take off, when liquid tin becomes the solid, can not influence the maintenance in the staff yet, think about ingeniously, made things convenient for staff's use.

Description

Tin melting treatment device for repairing and desoldering integrated circuit board

Technical Field

The invention relates to the technical field of integrated circuits, in particular to a tin melting processing device for repairing, desoldering and welding an integrated circuit board.

Background

The integrated circuit board is a carrier for loading the integrated circuit, the material for manufacturing the integrated circuit board is mainly composed of silica gel, so the integrated circuit board is green and generally more, wherein the integrated circuit board and each circuit are generally formed by welding tin, which is a metal with a lower melting point, so the integrated circuit board is easier to cool and desolder, and is convenient to operate.

The integrated circuit board is damaged, in the repair process, a place which needs to be soldered by tin is melted, then a circuit which is connected with a contact in the circuit board is taken out for replacement or repair, however, the tin is likely to be changed into liquid metal tin at the original position in the process that the tin is melted by the desoldering pin because the melting point of the tin is low and the specific heat capacity is large, and after the desoldering pin is taken out, if the external temperature is low, the tin is rapidly re-solidified, the damaged circuit is likely to be repaired by no means, and inconvenience is brought to workers who repair the integrated circuit board.

Disclosure of Invention

Technical scheme (I)

In order to achieve the purpose of convenient maintenance, the invention provides the following technical scheme: the utility model provides a tin processing apparatus melts when integrated circuit board reprocesses and separates welding, includes the fixed plate, the middle part sliding connection of fixed plate has the card strip, the bottom fixed mounting at the middle part of fixed plate has the piece of taking, the last fixed surface of fixed plate installs two symmetrical draw runners, and the spout department sliding mounting of draw runner has the dead lever, and the spout department fixed mounting at dead lever middle part has the traveller.

The lower extreme of traveller runs through and extends to the lower fixed surface of dead lever and installs the set casing, and the equal movable mounting in both sides at set casing middle part has two symmetrical carousels, and fixed mounting has the bull stick between two symmetrical carousels, and the department of buckling sliding connection of bull stick has the bracing piece, the lower extreme fixed mounting of set casing has the fixed block, the lower extreme of bracing piece runs through set casing and fixed block in proper order and extends to the lower extreme movable mounting of set casing and handles the axle, the middle part fixed mounting of set casing lower surface has the seam breaking needle.

Furthermore, the middle part of bull stick is the bending bulge form, and the protrusion of buckling has two, the upper end of bracing piece is connected with the bending bulge form on the bull stick.

Furthermore, the desoldering needle is composed of an upper end and a lower end which are elastically connected through a pressure spring, and the desoldering needle is mainly used for ensuring the comfort level of people due to the elastic stress when a circuit board is desoldered.

Furthermore, the processing blocks which are obliquely arranged are fixedly arranged on the outer surface of the processing shaft, the processing block of the processing shaft on the right side is inclined clockwise, and the processing block of the processing shaft on the left side is inclined anticlockwise, so that molten tin is pushed away towards two sides when the tin on the circuit board is desoldered. Avoiding recondensation at the weld.

Furthermore, through holes matched with the supporting rod and the desoldering needle are formed in the fixing block respectively.

(II) advantageous effects

Compared with the prior art, the invention provides a tin melting processing device for repairing, removing and welding an integrated circuit board, which has the following beneficial effects:

1. this integrated circuit board reprocesses and dissolves tin processing apparatus when welding, through the carousel, the bull stick, the bracing piece, the fixed block is used with the cooperation of handling the axle, can guarantee, when the splice on the split-welding needle help integrated circuit board is split-welded, effectually can give to push to both sides with melting tin, liquid tin under having guaranteed melting, can not be in original position, even will split-welding the needle at the staff and take off, when liquid tin becomes the solid, also can not influence the maintenance in the staff, think about ingeniously, staff's use has been made things convenient for.

2. This integrated circuit board reprocesses and melts tin processing apparatus when separating welding uses through the cooperation of card strip, piece, draw runner, dead lever and traveller, can effectual regulation and the fixed integrated circuit board that needs reprocessed, simultaneously, has guaranteed integrated circuit board at the in-process of reprocessing, has avoided because maintenance personal's rocking to the needle that separates that has a high temperature that leads to, the mistake touches other places of integrated circuit board, causes the condition of secondary damage.

Drawings

FIG. 1 is a schematic top view of the structure of the present invention;

FIG. 2 is a schematic side view of the structure of the present invention;

fig. 3 is an enlarged schematic view of the related detailed structure of the lower end of the sliding column of the invention.

In the figure: the device comprises a fixing plate 1, a clamping strip 2, a lapping block 3, a sliding strip 4, a fixing rod 5, a sliding column 6, a fixing shell 7, a rotating disc 8, a rotating rod 9, a supporting rod 10, a fixing block 11, a processing shaft 12, a welding releasing pin 13 and a pressure spring 14.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, a tin melting processing device for repairing and desoldering an integrated circuit board comprises a fixing plate 1, a clamping strip 2 is slidably connected to the middle of the fixing plate 1, a lapping block 3 is fixedly installed at the bottom end of the middle of the fixing plate 1, two symmetrical sliding strips 4 are fixedly installed on the upper surface of the fixing plate 1, a fixing rod 5 is slidably installed at a sliding groove of each sliding strip 4, and a sliding column 6 is fixedly installed at a sliding groove of the middle of each fixing rod 5.

Through card strip 2, take piece 3, draw runner 4, dead lever 5 and traveller 6 cooperation use, can effectual regulation and the fixed integrated circuit board that needs reprocess, simultaneously, guaranteed integrated circuit board at the in-process of reprocess, avoided because maintenance personal's rocking to the desoldering needle 13 that has a high temperature that leads to, the mistake touches other places of integrated circuit board, causes the condition of secondary damage.

The lower end of the sliding column 6 penetrates through and extends to the lower surface of the fixed rod 5 and is fixedly provided with a fixed shell 7, two symmetrical turntables 8 are movably arranged on two sides of the middle part of the fixed shell 7, a rotating rod 9 is fixedly arranged between the two symmetrical turntables 8, the middle part of the rotating rod 9 is in a bending convex shape, two bending convex shapes are arranged, the upper end of a supporting rod 10 is connected with the bending convex shape on the rotating rod 9, mainly for driving the supporting rod 10 to move up and down, the bending part of the rotating rod 9 is connected with the supporting rod 10 in a sliding way, the lower end of the fixed shell 7 is fixedly provided with a fixed block 11, through holes matched with the supporting rod 10 and an unsoldering needle 13 are respectively arranged in the fixed block 11, the lower end of the supporting rod 10 sequentially penetrates through the fixed shell 7 and the fixed block 11 and extends to the lower end of the fixed shell 7 and is, the processing blocks of the right processing shaft 12 are inclined clockwise, and the processing blocks of the left processing shaft 12 are inclined counterclockwise, mainly for pushing the molten tin to both sides when the tin on the circuit board is desoldered. Avoid condensing again in the welding department, the middle part fixed mounting of set casing 7 lower surface has the desoldering needle 13, and the desoldering needle 13 comprises upper end and the lower extreme through pressure spring 14 elastic connection, mainly is in order to have an elastic stress when the desoldering circuit board, guarantees the comfort level that people used.

Through carousel 8, bull stick 9, bracing piece 10, fixed block 11 and the cooperation of handling axle 12 are used, can guarantee, when the soldered connection that unsoldering needle 13 helps integrated circuit board unsolders, effectually can give to push to both sides molten tin, liquid tin under having guaranteed to melt, can not be in original position, even will unsoldering needle 13 at the staff and take off, when liquid tin becomes the solid, also can not influence the maintenance in the staff, think about ingeniously, the use of staff has been made things convenient for.

When in use, the integrated circuit board is placed on the lapping blocks 3, namely between the inner parts of the fixed plates 1, then the clamping strip 2 is moved downwards in the fixed plates 1 to clamp the integrated circuit board, then the fixed rod 5 is moved to slide on the sliding strip 4, the fixed rod 5 is moved to the position of the integrated circuit board to be maintained, the sliding column 6 is pulled downwards to electrify the desoldering needle 13 to increase the temperature of the integrated circuit board, then the desoldering needle 13 is placed at the position to be desoldered to solder the integrated circuit board, then a starting button on the device is started to start a motor on the turntable 8 to drive the turntable 8 to rotate, after the turntable 8 rotates, the rotating rod 9 drives the supporting rod 10 to move up and down, and as the processing blocks on the processing shaft 12 are arranged in reverse directions, the processing shaft 12 on the right side can be driven to rotate anticlockwise in the process of moving up and down of the supporting rod 10, the left treatment shaft 12 rotates clockwise, pushing the molten tin away to both sides.

The device needs to be connected with an external power supply through a plug, so that the structure of the device which needs power consumption is ensured.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a tin processing apparatus melts when integrated circuit board reprocesses and separates welding, includes fixed plate (1), its characterized in that: the middle part of the fixed plate (1) is connected with a clamping strip (2) in a sliding manner, the bottom end of the middle part of the fixed plate (1) is fixedly provided with a lapping block (3), the upper surface of the fixed plate (1) is fixedly provided with two symmetrical sliding strips (4), a fixed rod (5) is arranged at a sliding groove of each sliding strip (4) in a sliding manner, and a sliding column (6) is fixedly arranged at a sliding groove of the middle part of each fixed rod (5);

the lower end of the sliding column (6) penetrates through and extends to the lower surface of the fixed rod (5) and is fixedly provided with a fixed shell (7), two symmetrical turntables (8) are movably arranged on two sides of the middle of the fixed shell (7), a rotating rod (9) is fixedly arranged between the two symmetrical turntables (8), a supporting rod (10) is connected to the bending part of the rotating rod (9) in a sliding mode, a fixed block (11) is fixedly arranged at the lower end of the fixed shell (7), the lower end of the supporting rod (10) penetrates through the fixed shell (7) and the fixed block (11) in sequence and extends to the lower end of the fixed shell (7) and is movably provided with a processing shaft (12), and a defluxing needle (13) is fixedly arranged in the middle of the lower surface of;

the outer surface of the processing shaft (12) is fixedly provided with obliquely arranged processing blocks, the processing block of the right processing shaft (12) is clockwise inclined, and the processing block of the left processing shaft (12) is anticlockwise inclined.

2. The integrated circuit board repair de-soldering tin melting processing device according to claim 1, wherein: the middle part of bull stick (9) is the bending bulge form, and the protrusion of buckling has two, the upper end and the bending bulge form on the bull stick (9) of bracing piece (10) are connected.

3. The integrated circuit board repair de-soldering tin melting processing device according to claim 1, wherein: the desoldering needle (13) is composed of an upper end and a lower end which are elastically connected through a pressure spring (14).

4. The integrated circuit board repair de-soldering tin melting processing device according to claim 1, wherein: and through holes matched with the supporting rod (10) and the desoldering needle (13) are respectively formed in the fixing block (11).