CN112296473A - High-efficient clearance controlling means is used to computer motherboard - Google Patents
High-efficient clearance controlling means is used to computer motherboard Download PDFInfo
- Publication number
- CN112296473A CN112296473A CN202011330270.0A CN202011330270A CN112296473A CN 112296473 A CN112296473 A CN 112296473A CN 202011330270 A CN202011330270 A CN 202011330270A CN 112296473 A CN112296473 A CN 112296473A
- Authority
- CN
- China
- Prior art keywords
- plate
- frame
- supporting
- computer motherboard
- supporting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 19
- 238000005476 soldering Methods 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 4
- 238000003466 welding Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cleaning In General (AREA)
Abstract
The invention aims to solve the problem that the existing computer mainboard is difficult to be cleaned efficiently, and discloses an efficient cleaning control device for the computer mainboard. The invention reasonably utilizes the control of the soldering tin on the mainboard to control the pins of the components, thereby being convenient for improving the cleaning effect of the mainboard.
Description
Technical Field
The invention relates to the field of computers, in particular to a high-efficiency cleaning control device for a computer mainboard.
Background
A motherboard, also called a motherboard, a system board or a motherboard; it is installed in the cabinet, and is one of the most basic and important parts of the microcomputer. The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally includes elements such as a BIOS chip, an I/O control chip, a keyboard and a panel control switch interface, an indicator light plug-in, an expansion slot, a main board, and a direct current power supply plug-in of a plug-in card.
However, when the mainboard is clean, because the back uses soldering tin to weld, can expose the stitch of components and parts, it is very inconvenient when cleaning, clean not thorough, long-time use, can make the clean not thorough of mainboard back and cause the damage of components and parts, simultaneously because the reason of the stitch that exposes, also can damage burnishers such as clear sponge, if the stitch that will expose cuts, probably can influence the connectivity of components and parts and circuit board, therefore, the not enough of prior art is solved with high-efficient clearance controlling means to the urgent need design computer mainboard.
Disclosure of Invention
The invention aims to solve the defects of the prior art and provides an efficient cleaning control device for a computer mainboard.
The invention is realized by the following technical scheme:
a high-efficiency cleaning control device for a computer mainboard comprises a supporting plate, supporting plates are symmetrically and fixedly arranged on the left side surface and the right side surface of the supporting plate, a base is fixedly arranged at the bottom end of each supporting plate, an air pump is fixedly arranged on the upper side of the outer surface of each supporting plate, an air outlet end of the air pump is communicated with an air pipe, inserting rods are uniformly inserted into the supporting plates, a spiral spring is sleeved on the lower side of the surface of each inserting rod, an elastic band is fixedly connected to the middle of the upper surface of each supporting plate, a guide frame is welded on the side surface of each supporting plate, a sliding block is sleeved on the surface of each guide frame, a fastening screw is arranged between each sliding block and each guide frame, a first supporting frame and a second supporting frame are respectively and fixedly arranged on the upper surface and the lower surface of each sliding block, the utility model discloses a solar water heater, including first support frame, second push rod, first rack, first push plate, second rack, second push plate upper end fixed mounting, first push plate lower extreme fixed mounting has first push pedal, fixed mounting has the hot plate under the first push pedal, second support frame lower extreme fixed mounting has the second motor, second motor mid-mounting has the second gear, the inside downside cover of second support frame has the second slide bar, second slide bar left surface welding has the second rack, second slide bar upper end fixed mounting has the second push pedal, fixed surface installs the suction disc in the second push pedal.
Preferably, the inserted bar is of a T-shaped structure and is in sliding fit with the supporting plate, and the inserted bar is made of an iron material.
Preferably, the first support frame and the second support frame are both of an L-shaped structure.
Preferably, the first sliding rod is in sliding fit with the first support frame, and the second sliding rod is in sliding fit with the second support frame.
Preferably, the heating plate is made of copper materials and is internally wound with a resistance wire.
Preferably, the guide frame is of a U-shaped structure, the sliding block is of an annular structure, and the sliding block is in sliding fit with the guide frame.
Preferably, the suction plate is made of a magnet.
Compared with the prior art, the invention has the beneficial effects that:
the invention can realize the support of the components on the mainboard and control the pin sliding distance of the components by arranging the inserted bar, can melt the soldering tin on the back of the mainboard by utilizing the heating of the heating plate by arranging the heating plate, the melted soldering tin can reduce the connection with the pins of the components, so that the pins can be conveniently sunken into welding spots formed by the soldering tin, the pins are prevented from being exposed, and the cleaning is more convenient when the cleaning is carried out, the cooling and shaping of the soldering tin can be accelerated by arranging the air pump, meanwhile, the dust on the mainboard can be conveniently blown away, the pins on the back of the mainboard are all controlled into the soldering tin, thus, a cleaning tool can not be damaged when the cleaning is carried out, the cleaning effect is better, the inserted bar can be controlled by the suction plate by arranging the suction plate, and the components on the mainboard can be conveniently controlled, thereby through the control of the device to components and parts stitch on the mainboard, be convenient for improve clean effect, carry out safety protection to the mainboard. The invention reasonably utilizes the control of the soldering tin on the mainboard to control the pins of the components, thereby being convenient for improving the cleaning effect of the mainboard.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
FIG. 2 is a schematic diagram of the present invention cooperating with a motherboard.
Description of reference numerals: 1. the base, 2, the backup pad, 3, the leading truck, 4, the layer board, 5, the inserted bar, 6, the elastic cord, 7, fastening screw, 8, the slider, 9, first support frame, 10, the hot plate, 11, first push pedal, 12, first slide bar, 13, first rack, 14, first gear, 15, first motor, 16, first frame, 17, the breather pipe, 18, the air pump, 19, the second frame, 20, the second gear, 21, the second rack, 22, the second slide bar, 23, the second support frame, 24, the second push pedal, 25, the suction disc, 26, coil spring, 27, the second motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution:
a high-efficiency cleaning control device for a computer mainboard comprises a supporting plate 4, supporting plates 2 are symmetrically and fixedly arranged on the left side surface and the right side surface of the supporting plate 4, a base 1 is fixedly arranged at the bottom end of each supporting plate 2, an air pump 18 is fixedly arranged on the upper side of the outer surface of each supporting plate 2, an air outlet end of the air pump 18 is communicated with an air pipe 17, inserting rods 5 are uniformly inserted into the supporting plates 4, spiral springs 26 are sleeved on the lower side of the surface of each inserting rod 5, elastic bands 6 are fixedly connected to the middle of the upper surface of each supporting plate 4, a guide frame 3 is welded on the side surface of each supporting plate 4, a sliding block 8 is sleeved on the surface of each guide frame 3, fastening screws 7 are arranged between each sliding block 8 and each guide frame 3, a first supporting frame 9 and a second supporting frame 23 are respectively and fixedly arranged on the upper surface and the lower surface of each sliding block, first motor 15 mid-mounting has first gear 14, the inside upside cover of first support frame 9 has first slide bar 12, first slide bar 12 left side welding has first rack 13, first slide bar 12 lower extreme fixed mounting has first push pedal 11, fixed surface installs hot plate 10 under first push pedal 11, second support frame 23 left side lower extreme fixed mounting has second frame 19, 19 lower extreme fixed mounting of second frame has second motor 27, second motor 27 mid-mounting has second gear 20, the inside downside cover of second support frame 23 has second slide bar 22, the welding of second slide bar 22 left side has second rack 21, second slide bar 22 upper end fixed mounting has second push pedal 24, fixed surface installs suction disc 25 on second push pedal 22.
The inserted bar 5 is of a T-shaped structure and is in sliding fit with the supporting plate 4, and the inserted bar 5 is made of an iron material.
The first support frame 9 and the second support frame 23 are both of an L-shaped structure.
The first slide bar 12 is in sliding fit with the first support frame 9, and the second slide bar 22 is in sliding fit with the second support frame 23.
The heating plate 10 is made of copper material and is internally wound with a resistance wire.
The guide frame 3 is U type structure, and slider 8 is the loop configuration, slider 8 and guide frame 3 sliding fit.
The suction plate 25 is made of a magnet.
The method comprises the following operation steps: in order to clean the back of the mainboard completely, during the specific operation, the mainboard is horizontally placed on the supporting plate 4, the back is upward, the mainboard can be positioned by binding the elastic band 6, firstly, an operator switches on the electric appliances of the device to a nearby power supply, switches on the heating plate 10, then switches on the first motor 15, controls the first motor 15, and through the meshing of the first gear 14 and the first rack 13, the first push plate 11 is pushed, so that the heating plate 10 is in close contact with the soldering tin on the back of the circuit board, and through heating the soldering tin, the soldering tin is melted, meanwhile, the second motor 27 is controlled in advance, so that the second push plate 24 is lifted, the inserting rod 5 is sucked by the sucking plate 25, the inserting rod 5 is supported by the second push plate 24, meanwhile, components on the mainboard are supported, when the soldering tin is melted, the pins of the components are separated from the soldering tin, at this time, the operator controls the second motor 27 to rotate the second motor 27 reversely, and then the second slide bar 22 descends through the engagement of the second gear 20 and the second rack 21 to drive the second push plate 24 to descend, and the descending height is only that the pins of the components on the mainboard do not expose the soldering tin, and the pins are still inserted into the jacks of the mainboard, at this time, the switch of the air pump 18 is opened, the air pipe 17 is used for blowing the soldering tin towards the soldering tin position to accelerate the cooling forming of the soldering tin, the pins are hidden in the soldering tin by repeating the above operations, so that the back is smoother when being cleaned, the cleaning of the mainboard is not influenced, after the cleaning is finished, the heating plate 10 is used for heating the soldering tin, then the second motor 27 is controlled, the pushing of the plug rod 5 through the second push plate 24 can realize the pushing of the components on the mainboard, so that the components are restored again and the efficient cleaning of the mainboard is completed.
The present embodiment is only for explaining the present invention, and not for limiting the present invention, and those skilled in the art can make modifications without inventive contribution to the present embodiment as needed after reading the present specification, but all of which are protected by patent law within the scope of the claims of the present invention.
Claims (7)
1. The utility model provides a computer motherboard is with high-efficient clearance controlling means, includes layer board (4), its characterized in that: the supporting plate (2) is symmetrically and fixedly arranged on the left side surface and the right side surface of the supporting plate (4), a base (1) is fixedly arranged at the bottom end of the supporting plate (2), an air pump (18) is fixedly arranged on the upper side of the outer surface of the supporting plate (2), an air outlet end of the air pump (18) is communicated with an air pipe (17), an inserted bar (5) is uniformly inserted into the supporting plate (4), a spiral spring (26) is sleeved on the lower side of the surface of the inserted bar (5), an elastic band (6) is fixedly connected to the middle of the upper surface of the supporting plate (4), a guide frame (3) is welded on the side surface of the supporting plate (4), a sliding block (8) is sleeved on the surface of the guide frame (3), a fastening screw (7) is arranged between the sliding block (8) and the guide frame (3), a first supporting frame (9) and a second supporting frame (23) are fixedly arranged, the automatic feeding device is characterized in that a first motor (15) is fixedly mounted at the top end of the first rack (16), a first gear (14) is mounted in the middle of the first motor (15), a first sliding rod (12) is sleeved on the inner side of the first supporting frame (9), a first rack (13) is welded on the left side face of the first sliding rod (12), a first push plate (11) is fixedly mounted at the lower end of the first sliding rod (12), a heating plate (10) is fixedly mounted on the lower surface of the first push plate (11), a second rack (19) is fixedly mounted on the lower end of the left side face of the second supporting frame (23), a second motor (27) is fixedly mounted at the lower end of the second rack (19), a second gear (20) is mounted in the middle of the second motor (27), a second sliding rod (22) is sleeved on the inner side face of the second supporting frame (23), and a second rack (21) is, a second push plate (24) is fixedly mounted at the upper end of the second sliding rod (22), and a suction plate (25) is fixedly mounted on the upper surface of the second push plate (22).
2. The efficient cleaning control device for the computer motherboard according to claim 1, characterized in that: the inserted bar (5) is of a T-shaped structure and is in sliding fit with the supporting plate (4), and the inserted bar (5) is made of an iron material.
3. The efficient cleaning control device for the computer motherboard according to claim 1, characterized in that: the first support frame (9) and the second support frame (23) are both L-shaped structures.
4. The efficient cleaning control device for the computer motherboard according to claim 1, characterized in that: the first sliding rod (12) is in sliding fit with the first supporting frame (9), and the second sliding rod (22) is in sliding fit with the second supporting frame (23).
5. The efficient cleaning control device for the computer motherboard according to claim 1, characterized in that: the heating plate (10) is made of copper materials, and resistance wires are wound inside the heating plate.
6. The efficient cleaning control device for the computer motherboard according to claim 1, characterized in that: the guide frame (3) is of a U-shaped structure, the sliding block (8) is of an annular structure, and the sliding block (8) is in sliding fit with the guide frame (3).
7. The efficient cleaning control device for the computer motherboard according to claim 1, characterized in that: the suction plate (25) is made of a magnet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011330270.0A CN112296473B (en) | 2020-11-24 | 2020-11-24 | High-efficient clearance controlling means is used to computer motherboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011330270.0A CN112296473B (en) | 2020-11-24 | 2020-11-24 | High-efficient clearance controlling means is used to computer motherboard |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112296473A true CN112296473A (en) | 2021-02-02 |
| CN112296473B CN112296473B (en) | 2021-11-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011330270.0A Active CN112296473B (en) | 2020-11-24 | 2020-11-24 | High-efficient clearance controlling means is used to computer motherboard |
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| Country | Link |
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| CN (1) | CN112296473B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114012380A (en) * | 2021-11-03 | 2022-02-08 | 西华大学 | Mainboard installation device for computer |
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| CN205660262U (en) * | 2016-03-28 | 2016-10-26 | 富士电机（中国）有限公司 | Semiconductor module dismantles tool |
| CN208623991U (en) * | 2018-06-25 | 2019-03-19 | 信丰达诚科技有限公司 | Production device for screen printing electronic circuit board |
| CN209062316U (en) * | 2018-11-28 | 2019-07-05 | 连元新 | A kind of component auxiliary welding device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60301904D1 (en) * | 2002-04-17 | 2005-11-24 | Tyco Electronics Amp Gmbh | Method and arrangement for welding contacts to optical fibers |
| CN101362239A (en) * | 2008-09-18 | 2009-02-11 | 中国人民解放军后勤工程学院 | Automatic disassembling device of circuit board device |
| CN101961825A (en) * | 2009-07-23 | 2011-02-02 | 鸿富锦精密工业（深圳）有限公司 | Method for maintaining mainboard |
| CN102881600A (en) * | 2012-09-18 | 2013-01-16 | 奈电软性科技电子(珠海)有限公司 | Quad flat no-lead (QFN) packaging, repairing and dismantling process |
| DE202013001284U1 (en) * | 2013-02-08 | 2013-03-04 | Rewatronik Gmbh | Device combination for soldering and desoldering surface-mounted components on a printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114012380A (en) * | 2021-11-03 | 2022-02-08 | 西华大学 | Mainboard installation device for computer |
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| Publication number | Publication date |
|---|---|
| CN112296473B (en) | 2021-11-30 |
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Address after: 256600 No. five, No. 391, the Yellow River Road, Shandong, Binzhou Patentee after: Shandong University of Aeronautics and Astronautics Country or region after: China Address before: 256600 No. five, No. 391, the Yellow River Road, Shandong, Binzhou Patentee before: BINZHOU University Country or region before: China |
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Effective date of registration: 20240612 Address after: No. 1 Xihuan Road, Lizhuang Town, Huimin County, Binzhou City, Shandong Province, 251700 Patentee after: Shandong Yidong Information Service Co.,Ltd. Country or region after: China Address before: 256600 No. five, No. 391, the Yellow River Road, Shandong, Binzhou Patentee before: Shandong University of Aeronautics and Astronautics Country or region before: China |