CN218388169U

CN218388169U - BGA (ball grid array) repair hot air hood capable of automatically exhausting air

Info

Publication number: CN218388169U
Application number: CN202222663303.4U
Authority: CN
Inventors: 杜中一
Original assignee: Dalian Vocational and Technical College
Current assignee: Dalian Vocational and Technical College
Priority date: 2022-10-11
Filing date: 2022-10-11
Publication date: 2023-01-24
Anticipated expiration: 2032-10-11

Abstract

The utility model provides an automatic BGA of airing exhaust reprocesses hot-blast cover, comprises hot-blast nozzle and dustcoat, and the hot-blast nozzle links to each other from the top with the dustcoat, constitutes the heat dissipation chamber between dustcoat and the hot-blast nozzle to be equipped with a plurality of air exit of evenly distributed at the top of dustcoat, the fan of upwards airing exhaust is installed to the air exit. The utility model has the advantages that: both can satisfy the requirement of electronic product maintenance personnel to the maintenance of BGA device, can not cause the solder joint of hot-blast nozzle peripheral components and parts to remelt yet, cause the heat damage of peripheral components and parts, prolonged electronic components's life, also strengthened the stability of components and parts, and required heat when can guarantee the maintenance of BGA device, avoid thermal loss, satisfy people's use needs.

Description

BGA (ball grid array) reworking hot air hood capable of automatically exhausting air

Technical Field

The utility model relates to an electronic product repair tools specifically is an automatic hot-blast cover of repairing of BGA of airing exhaust.

Background

BGA rework stations are specialized tools used to repair BGA device failures in electronic products. In the process of maintaining the BGA device, the BGA device which breaks down needs to be detached and welded firstly, the hot air nozzle of the BGA repair platform is used for heating the BGA device correspondingly, the hot air nozzle is usually positioned right above the BGA device and 2-3mm higher than the BGA device, the hot air nozzle melts a welding point at the bottom of the BGA device through blown hot air, the BGA device is detached from the PCB, the BGA device with normal function needs to be welded on the PCB again after detachment and welding, in the welding process, the hot air nozzle melts a spherical pin at the bottom of the BGA device through the blown hot air, and the BGA device is welded on the PCB after cooling.

In the process of unsoldering and re-soldering, hot airflow can flow from the bottom of the hot air nozzle and along the surface of the PCB, and can form secondary heating on component welding spots on the periphery of the BGA device being maintained, so that the problem that some component welding spots which are close to the hot air nozzle are remelted is caused, and the reliability of the whole product is influenced; in order to avoid the problem, a BGA repair table hot air cover with a heat dissipation cavity is designed, for example: patent CN 214544966U, a heat dissipation cover with meshes is arranged outside a hot air nozzle, hot air blown by the hot air nozzle flows out of the meshes of the heat dissipation cover, the distance between the mesh at the bottommost end of the heat dissipation cover and the bottom surface of the heat dissipation cover is greater than 2-3mm, so that the problem of remelting welding points of peripheral components is avoided, but in the specific application process, because the volume of the peripheral components cannot be determined, if the mesh at the bottommost end of the heat dissipation cover is closer to the peripheral components, the influence is still caused on the peripheral components, hot air coming out from the side surface not only possibly causes remelting of the peripheral components, but also possibly causes thermal damage to the peripheral components, because some components are packaged by plastics, the hot air is very easy to damage the components, and the damage is difficult to be found by naked eyes; in addition, when the component to be maintained is disassembled and assembled, the ambient temperature is raised through hot air of the hot air cover, the solder is melted, and the maintenance is completed.

Disclosure of Invention

To the problem that exists among the prior art, the utility model aims at providing an automatic air exhaust's BGA reprocesses hot-blast cover, changes heat dissipation way and radiating mode to avoid BGA to reprocess when heating and cause the problem of remelting to components and parts solder joint on every side.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:

the utility model provides an automatic BGA of airing exhaust reprocesses hot-blast cover comprises hot-blast nozzle and dustcoat, the hot-blast nozzle with the dustcoat links to each other from the top, the dustcoat with constitute the heat dissipation chamber between the hot-blast nozzle, and the top of dustcoat is equipped with evenly distributed's a plurality of air exit, the fan of upwards airing exhaust is installed to the air exit.

Furthermore, the bottom end face of the outer cover is 2-3mm longer than the bottom end face of the hot air nozzle.

Advantageous effects

Compared with the prior art, the beneficial effects of the utility model are that: both can satisfy the requirement of electronic product maintenance personnel to the maintenance of BGA device, can not cause the solder joint of hot-blast nozzle peripheral components and parts to remelt yet, cause the heat damage of peripheral components and parts, prolonged electronic components's life, also strengthened the stability of components and parts, and required heat when can guarantee the maintenance of BGA device, avoid thermal loss, satisfy people's use needs.

Drawings

FIG. 1 is a schematic view showing the operation state of a hot air hood of a BGA rework station with a heat dissipation cavity in the prior art.

Fig. 2 is a schematic view of the working state of the present invention.

Fig. 3 is a top view of the present invention.

Description of reference numerals: 1. hot air nozzle, 2, outer cover, 3, heat dissipation cavity, 301, mesh, 4, air outlet, 5, air exhaust fan, 6, BGA device, 7, PCB,8, hot air, 9 and peripheral components.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 2 and 3, the BGA repair hot air hood capable of automatically exhausting air comprises a hot air nozzle 1 and an outer cover 2, wherein the hot air nozzle 1 is connected with the outer cover 2 from the top, a heat dissipation cavity 3 is formed between the outer cover 2 and the hot air nozzle 1, a plurality of air outlets 4 are uniformly distributed on the top of the outer cover 2, an upward exhaust fan 5 is installed on each air outlet 4, and the bottom end face of the outer cover 2 is 2-3mm longer than the bottom end face of the hot air nozzle 1.

In a particular application, the present invention is housed over a BGA device 6 that requires servicing, with the housing 2 in direct contact with the PCB 7. In the maintenance process, the hot air nozzle 1 blows hot air 8, the hot air flow can flow in the heat dissipation cavity 3, the exhaust fan 5 rotates to drive air to flow upwards, the hot air flow flows out from the air outlet 4 of the outer cover 2, the problem of remelting of welding points of peripheral components 9 is avoided, and the problems mentioned in the background art are effectively solved; 2. when the components to be maintained are disassembled and assembled, the ambient temperature is raised through hot air of the hot air cover, the solder is melted, the maintenance is completed, the air outlet is arranged on the side surface and is very close to the components to be maintained, the heat is dissipated too early, the ambient temperature cannot be reached easily, and the effect of melting the solder is influenced. And set up the air exit at the top of dustcoat to set up the fan in air exit department, can avoid the steam that the hot-blast mouth blew off to sweep peripheral components and parts, and steam upflow makes more smooth of airing exhaust.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an automatic BGA of airing exhaust reprocesses hot-blast cover, comprises hot-blast nozzle (1) and dustcoat (2), its characterized in that: hot-blast nozzle (1) with dustcoat (2) link to each other from the top, dustcoat (2) with constitute heat dissipation chamber (3) between hot-blast nozzle (1), and the top of dustcoat (2) is equipped with a plurality of air exit (4) of evenly distributed, fan (5) upwards airs exhaust are installed to air exit (4).

2. The automatic-exhausting BGA rework hot air hood of claim 1, wherein: the bottom end face of the outer cover (2) is 2-3mm longer than the bottom end face of the hot air nozzle (1).