CN208478304U - The detaching equipment of SOP encapsulation IC chip - Google Patents
The detaching equipment of SOP encapsulation IC chip Download PDFInfo
- Publication number
- CN208478304U CN208478304U CN201821262891.8U CN201821262891U CN208478304U CN 208478304 U CN208478304 U CN 208478304U CN 201821262891 U CN201821262891 U CN 201821262891U CN 208478304 U CN208478304 U CN 208478304U
- Authority
- CN
- China
- Prior art keywords
- chip
- sop
- pedestal
- encapsulation
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a kind of detaching equipment of SOP encapsulation IC chip, belong to technical field of integrated circuits, solve the problems, such as that SOP is being encapsulated IC chip when disassembling from pcb board with time-consuming and laborious by maintenance personal, the detaching equipment of the SOP encapsulation IC chip of this case includes pedestal, the heating system of the scolding tin between the pin and the pcb board of IC chip and the chip detachment apparatus for separating SOP encapsulation IC chip from the pcb board are encapsulated for melting SOP, this case by being arranged heating blower and hot-blast outlet on the base, scolding tin between the pin and the pcb board of SOP encapsulation IC chip is rapidly and uniformly melted, not only save the take-down time, and avoid the operation error of maintenance personal；By the way that lift lever and separation unit are arranged on the base, realizing can quickly and easily separate SOP encapsulation IC chip from the pcb board, to improve the removal efficiency of SOP encapsulation IC chip.
Description
Technical field
It is the utility model relates to technical field of integrated circuits, in particular to a kind of for dismantling SOP encapsulation ic core
The equipment of piece.
Background technique
SOP encapsulation IC chip is widely used in people's production and life, and maintenance personal is to the integrated electricity of SOP
In the maintenance and recycling link on road, always encounters and need to dismantle SOP encapsulation IC chip from the pcb board of integrated circuit
The case where getting off.Wherein, how in the case where not damaging SOP encapsulation chip pin, chip is completely dismantled from pcb board
Get off, guarantee that SOP encapsulation chip is intact, secondary can use, is maintenance personal in disassembly SOP encapsulation IC chip
The maximum problem faced.Under normal conditions, maintenance personal, which generally requires, first encapsulates ic core for SOP by heating tool
Melts soldering tin between the pin and pcb board of piece is fallen, then cautious again that SOP is encapsulated IC chip from pcb board
On disassemble.Since the pin of SOP encapsulation IC chip is at least two rows of, and every row has dozens of pin, repairs people
Member needs one by one to fall the melts soldering tin between the pin of chip and pcb board, will necessarily take a substantial amount of time in this way, cause work
Make inefficiency；And the dismantlement work of this chip is more demanding to the technical quality of maintenance personal, loses once there is operation
Accidentally the case where, leads to some or certain pin breakages of chip, then chip is also eliminated, and can only bring to dismantlement work need not
The trouble wanted increases maintenance cost.
Utility model content
In order to solve the above-mentioned technical problem, the purpose of the utility model is to provide one kind, and SOP can be made to encapsulate integrated circuit
The detaching equipment that chip is readily disassembled, personnel easy to repair operate.
In order to realize the purpose of above-mentioned utility model, the utility model adopts the following technical solution:
A kind of detaching equipment of SOP encapsulation IC chip, comprising:
Pedestal is provided with the claw for blocking pcb board on the pedestal；
Heating system, the scolding tin between pin and the pcb board for melting SOP encapsulation IC chip are described
Heating system include the heating blower being arranged on the pedestal upper surface, on the lower surface that the pedestal is set and with institute
The hot-blast outlet that the heating blower stated is connected；
Chip detachment apparatus, for SOP encapsulation IC chip to be separated from the pcb board, the core
Piece separator includes the lift lever that can be movably arranged at along the vertical direction on the pedestal, is fixed at the promotion
The lower end of bar and the separation unit that IC chip is encapsulated for clamping/adsorbing the SOP.
In above-mentioned technical proposal, it is preferred that the chip detachment apparatus includes reset spring, and the reset spring is logical
Initial tension of spring is crossed to be arranged between the lift lever and the pedestal.
In above-mentioned technical proposal, it is preferred that the chip detachment apparatus include be fixed on the pedestal and
Driving cylinder for driving the lift lever mobile.
In above-mentioned technical proposal, it is preferred that the separation unit is clamping jaw or vacuum chuck.
In above-mentioned technical proposal, it is preferred that the heating system include be arranged on the pedestal and be connected to described in
The hot-air channel of heating blower and the hot-blast outlet.
In above-mentioned technical proposal, it is preferred that the hot-blast outlet has two rows, and hot-blast outlet described in two rows is distributed in institute
State the two sides of pedestal lower surface.
In above-mentioned technical proposal, it is preferred that the separation unit is located between hot-blast outlet described in two rows.
The utility model obtains compared with prior art following the utility model has the advantages that this case by being arranged heating blower on the base
And hot-blast outlet, the scolding tin between the pin and the pcb board of SOP encapsulation IC chip is rapidly and uniformly melted
It melts, not only saves the take-down time, and avoid the operation error of maintenance personal；By the way that lift lever and separation unit are arranged on the base
Part, realizing can quickly and easily separate SOP encapsulation IC chip from the pcb board, to improve SOP encapsulation collection
At the removal efficiency of circuit chip.
Detailed description of the invention
Attached drawing 1 is the schematic front view that the SOP of the utility model encapsulates the detaching equipment of IC chip；
Attached drawing 2 is the schematic side view that the SOP of the utility model encapsulates the detaching equipment of IC chip；
Attached drawing 3 is the schematic top plan view that the SOP of the utility model encapsulates the detaching equipment of IC chip；
Wherein: 100, SOP encapsulates the detaching equipment of IC chip；1, pedestal；11, claw；2, heating system；21,
Heating blower；22, hot-blast outlet；23, hot-air channel；3, chip detachment apparatus；31, lift lever；32, separation unit；33, it resets
Spring.
Specific embodiment
By the technology contents of utility model are described in detail, construction feature, are reached purpose and efficacy, below in conjunction with implementation
Example simultaneously cooperates attached drawing to be described in detail.
With reference to the accompanying drawings shown in 1~attached drawing 3, the detaching equipment 100 that SOP encapsulates IC chip includes pedestal 1, heating system
System 2 and chip detachment apparatus 3.
The claw 11 for blocking pcb board is provided on pedestal 1, claw 11 shares 4, the one end hinge of each claw 11
The peripheral direction of pedestal 1 is connect on pedestal 1 and be distributed in, is hinged with linkage between each claw 11 and pedestal 1, in order to
Open and close claw 11.
Heating system 2 is used to melt the scolding tin between the pin and pcb board of SOP encapsulation IC chip, heating system 2
Including be arranged on 1 upper surface of pedestal heating blower 21, be arranged on the lower surface of pedestal 1 and be connected with heating blower 21
Hot-blast outlet 22 and be arranged on pedestal 1 and be connected to the hot-air channel 23 of heating blower 21 and hot-blast outlet 22.Wherein, hot
There are two rows in wind outlet 22, this two rows of hot-blast outlet 22 is distributed in two side positions of the lower surface of pedestal 1, with the SOP on pcb board
The pin for encapsulating IC chip is corresponding.
Chip detachment apparatus 3 is used to separate SOP encapsulation IC chip from pcb board, and chip detachment apparatus 3 includes
The lift lever 31 being arranged on pedestal 1 can be moved and run through along the vertical direction, be fixed on 31 lower end of lift lever
Separation unit 32, is provided with reset spring 33 between lift lever 31 and pedestal 1, reset spring 33 is arranged by initial tension of spring
Between lift lever 31 and pedestal 1.Separation unit 32 is located between two rows of hot-blast outlets 22.In the present embodiment, in order to grab
The surface of chip will not be caused to damage during chip, separation unit 32 is preferably with vacuum chuck.
In other embodiments, a driving cylinder or driving motor be can use to drive lift lever 31 to move up and down；Point
It is also possible to that chip can be played the structure of clamping action from component, for example, clamping jaw.
The working principle of the detaching equipment 100 of the SOP encapsulation IC chip of this case is as follows: maintenance personal is utilizing this
When detaching equipment dismantles SOP encapsulation IC chip from pcb board, pcb board is blocked and fixed first with claw 11, so
Afterwards open heating blower 21, by hot-blast outlet 22 to SOP encapsulate IC chip pin and pcb board between scolding tin into
Row heating, and it is allowed to uniform melt；Then lift lever 31 is operated, first presses down on lift lever 31, and vacuum chuck is driven to adsorb
On the surface of SOP encapsulation IC chip, 33 forced compression of reset spring and elastic deformation is generated at this time, and vacuum chuck
SOP encapsulation IC chip absorption is fixed, then maintenance personal unclamps lift lever 31, and reset spring 33 restores elastic shape
Become to generate a upward elastic force to lift lever 31, so that chip be driven to move upwardly together, at the same time, chip is also
It is separated from and between pcb board, complete the dismantlement work of chip, it is convenient not only to operate, and time saving and energy saving.
The above embodiments are only for explaining the technical ideas and features of the present invention, and its object is to allow be familiar with technique
Personage can understand the content of the utility model and implement accordingly, do not limit the protection scope of the present invention.
All equivalent changes or modifications made according to the spirit of the present invention should be covered within the scope of the utility model.
Claims (7)
1. a kind of detaching equipment of SOP encapsulation IC chip characterized by comprising
Pedestal (1) is provided with the claw (11) for blocking pcb board on the pedestal (1)；
Heating system (2), the scolding tin between pin and the pcb board for melting SOP encapsulation IC chip are described
Heating system (2) includes the heating blower (21) being arranged on the pedestal (1) upper surface, is arranged under the pedestal (1)
The hot-blast outlet (22) being connected on surface and with the heating blower (21)；
Chip detachment apparatus (3), for SOP encapsulation IC chip to be separated from the pcb board, the chip
Separator (3) includes the lift lever (31) that can be movably arranged at along the vertical direction on the pedestal (1), is fixed at
The lower end of the lift lever (31) and the separation unit (32) that IC chip is encapsulated for clamping/adsorbing the SOP.
2. the detaching equipment of SOP encapsulation IC chip according to claim 1, it is characterised in that: the chip
Separator (3) includes reset spring (33), and the reset spring (33) is arranged by initial tension of spring in the lift lever
(31) between the pedestal (1).
3. the detaching equipment of SOP encapsulation IC chip according to claim 1, it is characterised in that: the chip
Separator (3) includes the driving gas for being fixed on the pedestal (1) and being used to drive the lift lever (31) mobile
Cylinder.
4. the detaching equipment of SOP encapsulation IC chip according to claim 1, it is characterised in that: the separation
Component (32) is clamping jaw or vacuum chuck.
5. the detaching equipment of SOP encapsulation IC chip according to claim 1, it is characterised in that: the heating
System (2) includes being arranged on the pedestal (1) and being connected to the heat of the heating blower (21) and the hot-blast outlet (22)
Wind channel (23).
6. the detaching equipment of SOP encapsulation IC chip according to claim 1, it is characterised in that: the hot wind
There are two rows in outlet (22), and hot-blast outlet (22) described in two rows is distributed in the two sides of the pedestal (1) lower surface.
7. the detaching equipment of SOP encapsulation IC chip according to claim 6, it is characterised in that: the separation
Component (32) is located between hot-blast outlet (22) described in two rows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821262891.8U CN208478304U (en) | 2018-08-07 | 2018-08-07 | The detaching equipment of SOP encapsulation IC chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821262891.8U CN208478304U (en) | 2018-08-07 | 2018-08-07 | The detaching equipment of SOP encapsulation IC chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208478304U true CN208478304U (en) | 2019-02-05 |
Family
ID=65208417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821262891.8U Expired - Fee Related CN208478304U (en) | 2018-08-07 | 2018-08-07 | The detaching equipment of SOP encapsulation IC chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208478304U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112509958A (en) * | 2021-02-02 | 2021-03-16 | 度亘激光技术（苏州）有限公司 | Semiconductor device dismounting device and dismounting method thereof |
| CN113843739A (en) * | 2021-10-13 | 2021-12-28 | 潍坊新松机器人自动化有限公司 | Arched sheet carrying robot |
| CN116435219A (en) * | 2023-04-03 | 2023-07-14 | 津日科技(无锡)有限公司 | Chip packaging device capable of preventing static damage |
-
2018
- 2018-08-07 CN CN201821262891.8U patent/CN208478304U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112509958A (en) * | 2021-02-02 | 2021-03-16 | 度亘激光技术（苏州）有限公司 | Semiconductor device dismounting device and dismounting method thereof |
| CN112509958B (en) * | 2021-02-02 | 2021-04-27 | 度亘激光技术（苏州）有限公司 | Semiconductor device dismounting device and dismounting method thereof |
| CN113843739A (en) * | 2021-10-13 | 2021-12-28 | 潍坊新松机器人自动化有限公司 | Arched sheet carrying robot |
| CN116435219A (en) * | 2023-04-03 | 2023-07-14 | 津日科技(无锡)有限公司 | Chip packaging device capable of preventing static damage |
| CN116435219B (en) * | 2023-04-03 | 2024-04-12 | 津日科技(无锡)有限公司 | Chip packaging device capable of preventing static damage |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208478304U (en) | The detaching equipment of SOP encapsulation IC chip | |
| CN206140011U (en) | Net mechanism is pressed in welding | |
| CN109304603A (en) | A kind of screw absorption locking device | |
| CN209266378U (en) | A kind of polycrystalline cell piece handling device | |
| CN206385182U (en) | A kind of embossing device of leather | |
| CN206982607U (en) | A kind of auto parts maintenance operating desk | |
| CN103731607A (en) | Technology for assembling mobile phone camera module | |
| CN208103773U (en) | A kind of power distribution cabinet production Board material for box collection device | |
| CN206652532U (en) | A kind of Novel polycrystalline silicon breaker | |
| CN108092143A (en) | A kind of power distribution cabinet easy to repair | |
| CN208083339U (en) | A kind of Pneumatic riveting machine with automatic rivet placement | |
| CN209306832U (en) | A kind of nodulizer melting pressure magnesium apparatus | |
| CN202581666U (en) | Mounting structure of air conditioner electric control panel | |
| CN207952860U (en) | Solar cell series welding mechanism | |
| CN220030058U (en) | Portable dismounting device of intermediate relay | |
| CN209050003U (en) | A kind of efficient edge rolling structure | |
| CN215452867U (en) | Organic photovoltaic cell containing thiophene ring | |
| CN218835268U (en) | Automatic discharging mechanism | |
| CN219009227U (en) | Automatic extracting device of lithium battery protection board | |
| CN218498622U (en) | Automatic change and merge cabinet | |
| CN215750831U (en) | Uplifting type hot melting equipment | |
| CN216597516U (en) | Integrated circuit routing accurate packaging equipment convenient to clean | |
| CN209551667U (en) | A kind of new type liquid crystal television maintenance box | |
| CN217512717U (en) | Mold closing device of efficient sheet metal forming machine | |
| CN203695518U (en) | COF flip-chip bonding front flexible printed circuit board and chip surface tiny dust remover |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190205 Termination date: 20190807 |