CN1159133A - 印制线路板的金属基片的制造方法 - Google Patents
印制线路板的金属基片的制造方法 Download PDFInfo
- Publication number
- CN1159133A CN1159133A CN97101827A CN97101827A CN1159133A CN 1159133 A CN1159133 A CN 1159133A CN 97101827 A CN97101827 A CN 97101827A CN 97101827 A CN97101827 A CN 97101827A CN 1159133 A CN1159133 A CN 1159133A
- Authority
- CN
- China
- Prior art keywords
- hole
- insulating material
- metal substrate
- pcb
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960001041A KR0176436B1 (ko) | 1996-01-18 | 1996-01-18 | 금속 기판의 제작 방법 |
KR1041/96 | 1996-01-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1159133A true CN1159133A (zh) | 1997-09-10 |
Family
ID=19449708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN97101827A Pending CN1159133A (zh) | 1996-01-18 | 1997-01-18 | 印制线路板的金属基片的制造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH09205263A (ko) |
KR (1) | KR0176436B1 (ko) |
CN (1) | CN1159133A (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102076165A (zh) * | 2011-01-30 | 2011-05-25 | 乐健线路板(珠海)有限公司 | 双层高散热夹芯金属基印刷电路板 |
CN109587953A (zh) * | 2018-12-12 | 2019-04-05 | 东莞市若美电子科技有限公司 | 厚铜铜基板蚀孔工艺 |
-
1996
- 1996-01-18 KR KR1019960001041A patent/KR0176436B1/ko not_active IP Right Cessation
-
1997
- 1997-01-08 JP JP9001071A patent/JPH09205263A/ja active Pending
- 1997-01-18 CN CN97101827A patent/CN1159133A/zh active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102076165A (zh) * | 2011-01-30 | 2011-05-25 | 乐健线路板(珠海)有限公司 | 双层高散热夹芯金属基印刷电路板 |
CN109587953A (zh) * | 2018-12-12 | 2019-04-05 | 东莞市若美电子科技有限公司 | 厚铜铜基板蚀孔工艺 |
Also Published As
Publication number | Publication date |
---|---|
KR970060445A (ko) | 1997-08-12 |
KR0176436B1 (ko) | 1999-04-15 |
JPH09205263A (ja) | 1997-08-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |