CN1159133A - 印制线路板的金属基片的制造方法 - Google Patents

印制线路板的金属基片的制造方法 Download PDF

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Publication number
CN1159133A
CN1159133A CN97101827A CN97101827A CN1159133A CN 1159133 A CN1159133 A CN 1159133A CN 97101827 A CN97101827 A CN 97101827A CN 97101827 A CN97101827 A CN 97101827A CN 1159133 A CN1159133 A CN 1159133A
Authority
CN
China
Prior art keywords
hole
insulating material
metal substrate
pcb
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN97101827A
Other languages
English (en)
Chinese (zh)
Inventor
柳在喆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanwha Aerospace Co Ltd
Original Assignee
Samsung Aerospace Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Aerospace Industries Ltd filed Critical Samsung Aerospace Industries Ltd
Publication of CN1159133A publication Critical patent/CN1159133A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN97101827A 1996-01-18 1997-01-18 印制线路板的金属基片的制造方法 Pending CN1159133A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019960001041A KR0176436B1 (ko) 1996-01-18 1996-01-18 금속 기판의 제작 방법
KR1041/96 1996-01-18

Publications (1)

Publication Number Publication Date
CN1159133A true CN1159133A (zh) 1997-09-10

Family

ID=19449708

Family Applications (1)

Application Number Title Priority Date Filing Date
CN97101827A Pending CN1159133A (zh) 1996-01-18 1997-01-18 印制线路板的金属基片的制造方法

Country Status (3)

Country Link
JP (1) JPH09205263A (ko)
KR (1) KR0176436B1 (ko)
CN (1) CN1159133A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102076165A (zh) * 2011-01-30 2011-05-25 乐健线路板（珠海）有限公司 双层高散热夹芯金属基印刷电路板
CN109587953A (zh) * 2018-12-12 2019-04-05 东莞市若美电子科技有限公司 厚铜铜基板蚀孔工艺

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102076165A (zh) * 2011-01-30 2011-05-25 乐健线路板（珠海）有限公司 双层高散热夹芯金属基印刷电路板
CN109587953A (zh) * 2018-12-12 2019-04-05 东莞市若美电子科技有限公司 厚铜铜基板蚀孔工艺

Also Published As

Publication number Publication date
KR970060445A (ko) 1997-08-12
KR0176436B1 (ko) 1999-04-15
JPH09205263A (ja) 1997-08-05

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