CN115863208A - 晶圆释放方法 - Google Patents
晶圆释放方法 Download PDFInfo
- Publication number
- CN115863208A CN115863208A CN202210890755.8A CN202210890755A CN115863208A CN 115863208 A CN115863208 A CN 115863208A CN 202210890755 A CN202210890755 A CN 202210890755A CN 115863208 A CN115863208 A CN 115863208A
- Authority
- CN
- China
- Prior art keywords
- wafer
- set position
- chuck
- transfer
- transfer speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210126578A KR102419287B1 (ko) | 2021-09-24 | 2021-09-24 | 웨이퍼 디척킹 방법 |
| KR10-2021-0126578 | 2021-09-24 | ||
| KR1020220010655A KR102604456B1 (ko) | 2021-09-24 | 2022-01-25 | 웨이퍼 디척킹 방법 |
| KR10-2022-0010655 | 2022-01-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115863208A true CN115863208A (zh) | 2023-03-28 |
Family
ID=85660387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210890755.8A Pending CN115863208A (zh) | 2021-09-24 | 2022-07-27 | 晶圆释放方法 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102604456B1 (ko) |
| CN (1) | CN115863208A (ko) |
| TW (1) | TWI822220B (ko) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005129837A (ja) | 2003-10-27 | 2005-05-19 | Seiko Epson Corp | 基板処理装置及び基板処理方法 |
| JP4580327B2 (ja) * | 2005-11-21 | 2010-11-10 | 東京エレクトロン株式会社 | 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構 |
| JP4970337B2 (ja) * | 2008-04-30 | 2012-07-04 | 積水化学工業株式会社 | 表面処理用ステージ装置 |
| JP2010272709A (ja) * | 2009-05-22 | 2010-12-02 | Tokyo Electron Ltd | 基板処理装置，基板脱離方法，プログラム |
| JP6974065B2 (ja) | 2017-08-16 | 2021-12-01 | 株式会社荏原製作所 | 基板処理装置および基板を基板処理装置のテーブルから離脱させる方法 |
| US11456203B2 (en) * | 2018-07-13 | 2022-09-27 | Taiwan Semiconductor Manufacturing Co., Ltd | Wafer release mechanism |
| JP7340953B2 (ja) * | 2019-04-26 | 2023-09-08 | 東京エレクトロン株式会社 | 除電方法、基板処理方法及び基板処理装置 |
-
2022
- 2022-01-25 KR KR1020220010655A patent/KR102604456B1/ko active IP Right Grant
- 2022-07-27 CN CN202210890755.8A patent/CN115863208A/zh active Pending
- 2022-08-01 TW TW111128812A patent/TWI822220B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202314951A (zh) | 2023-04-01 |
| KR20230043655A (ko) | 2023-03-31 |
| TWI822220B (zh) | 2023-11-11 |
| KR102604456B1 (ko) | 2023-11-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |