CN115706035A - Semiconductor cleaning equipment and wafer overturning device thereof - Google Patents
Semiconductor cleaning equipment and wafer overturning device thereof Download PDFInfo
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- CN115706035A CN115706035A CN202110925922.3A CN202110925922A CN115706035A CN 115706035 A CN115706035 A CN 115706035A CN 202110925922 A CN202110925922 A CN 202110925922A CN 115706035 A CN115706035 A CN 115706035A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The embodiment of the application provides semiconductor cleaning equipment and a wafer overturning device thereof. In the wafer overturning device, an overturning mechanism is connected with an overturning support, a first clamping mechanism and a second clamping mechanism are symmetrically arranged at two ends of the overturning support, the overturning mechanism is used for driving the overturning support to overturn, and the first clamping mechanism and the second clamping mechanism are both used for selectively clamping or releasing a wafer; when the first clamping mechanism is located at the first position and the second clamping mechanism is located at the second position, the first clamping mechanism can clamp the wafer from the front manipulator, and the rear manipulator can take the wafer from the second clamping mechanism; when the first clamping mechanism is located at the second position and the second clamping mechanism is located at the first position, the rear manipulator can take the wafer away from the first clamping mechanism, and the second clamping mechanism can clamp the wafer from the front manipulator. The embodiment of the application realizes the cooperation with the front and rear manipulators simultaneously, thereby greatly shortening the wafer overturning and transmitting time.
Description
Technical Field
The application relates to the technical field of semiconductor processing, in particular to a semiconductor cleaning device and a wafer overturning device thereof.
Background
At present, a single-chip cleaning process is used in a semiconductor processing process, a single-chip cleaning machine in semiconductor cleaning equipment is compared with a groove type cleaning machine, because a single wafer is cleaned, the cleaning effect is good, but the efficiency is low, so that the beat time of the single-chip cleaning machine is required to be shortened as much as possible to increase the working efficiency of the equipment, the single-chip cleaning machine needs to turn over the wafer by 180 degrees as the back of the wafer needs to be cleaned, but the working efficiency is seriously influenced by the longer turning and transmission time of the existing single-chip cleaning machine.
In the prior art, the wafer turnover mechanism consists of a turnover manipulator and a bearing table, wherein the turnover manipulator consists of a base, a 45-degree rotation module, a 180-degree rotation module and a clamping arm. The technological process of the wafer turnover mechanism includes that the wafer is taken out of the wafer box by the front-end manipulator and placed on the bearing table, the wafer is clamped by the clamping arms from two sides of the wafer box, the clamping arms are driven by the 45-degree rotating module to rise to avoid the bearing table, the clamping arms and the wafer are turned over by the 180-degree rotating module for 180 degrees, then the wafer is placed on the bearing table by the 45-degree rotating module to descend, the clamping arms are lifted by the 45-degree rotating module again, and finally the wafer is taken out of the bearing table by the rear-end manipulator to be conveyed to a process in the process chamber. The existing turnover mechanism only allows one of the front manipulator and the rear manipulator to take and place the wafer, and the turnover mechanism structure causes more turnover steps, so that the working efficiency of the single-chip cleaning machine is reduced.
Disclosure of Invention
The application aims at the defects of the prior art and provides semiconductor cleaning equipment and a wafer overturning mechanism thereof, and the technical problem that the working efficiency is low in the prior art is solved.
In a first aspect, an embodiment of the present application provides a wafer turnover device for a semiconductor cleaning device, which is disposed between a front manipulator and a rear manipulator of the semiconductor cleaning device, and is used for the front manipulator and the rear manipulator to pick and place a wafer and turn the wafer, and the wafer turnover device includes: the device comprises a turnover mechanism, a turnover support, a first clamping mechanism and a second clamping mechanism; the turnover mechanism is connected with the turnover support, the first clamping mechanism and the second clamping mechanism are symmetrically arranged at two ends of the turnover support, the turnover mechanism is used for driving the turnover support to turn over so as to drive the first clamping mechanism and the second clamping mechanism to turn over between a first position and a second position, and the first clamping mechanism and the second clamping mechanism are both used for selectively clamping or releasing the wafer; when the first clamping mechanism is located at the first position and the second clamping mechanism is located at the second position, the first clamping mechanism can clamp the wafer from the front manipulator, and the rear manipulator can take the wafer from the second clamping mechanism; when the first clamping mechanism is located at the second position and the second clamping mechanism is located at the first position, the rear manipulator can take the wafer from the first clamping mechanism, and the second clamping mechanism can clamp the wafer from the front manipulator.
In an embodiment of the present application, each of the first clamping mechanism and the second clamping mechanism includes a mounting shell, a driving assembly and a clamping assembly, the plurality of clamping assemblies are uniformly arranged along a circumferential direction of the mounting shell and extend along a radial direction of the mounting shell, and the driving assembly is disposed on the mounting shell and is configured to drive the plurality of clamping assemblies to move simultaneously relative to the mounting shell so as to clamp or release the wafer; and a gap between any two adjacent clamping assemblies is used for the front manipulator or the rear manipulator to extend into so as to take and place the wafer.
In an embodiment of the present application, the clamping assembly is pivotally connected to the mounting housing, and the clamping assembly can swing along a first direction relative to the mounting housing to clamp the wafer; the clamping assembly can swing along a second direction relative to the mounting shell so as to release the wafer; the first direction and the second direction are both circumferential directions of the mounting case, and the first direction and the second direction are opposite.
In one embodiment of the present application, the clamping assembly includes a swing arm and a clamping post; a first end of the swing arm extends into the mounting shell, a second end of the swing arm is provided with the clamping column, the clamping column is used for contacting with the edge of the wafer to clamp the wafer, and a pivot hole is formed in the swing arm close to the first end; a pivot shaft capable of being arranged in the pivot hole in a penetrating mode is arranged in the mounting shell, and the swing arm is connected with the mounting shell in a pivoting mode through the pivot shaft.
In an embodiment of the present application, the driving assembly includes a first driving element, a second driving element and a driver, the first driving element is disposed in the mounting case and is configured to drive the swing arm to swing along a first direction; the second driving piece is arranged in the installation shell, the driver is arranged on the installation shell, and the driver is connected with the first ends of the swing arms through the second driving piece and used for driving the swing arms to swing along a second direction through the second driving piece.
In an embodiment of this application, the first driving piece includes a plurality of elastomeric element, and is a plurality of elastomeric element and a plurality of swing arm one-to-one sets up, and is a plurality of elastomeric element follows the circumference of installation shell all is located a plurality ofly same one side of swing arm, elastomeric element's one end with the installation shell is connected, and the other end is in the pivot hole with position between the second end with the swing arm is connected for provide an elasticity in order to drive the swing arm is followed the first direction swing.
In an embodiment of this application, in the installation shell and all be provided with the spliced pole on the swing arm, elastomeric element's both ends respectively with in the installation shell the spliced pole and on the swing arm the spliced pole is connected.
In an embodiment of the present application, the driver is disposed at the top of the mounting shell, and an output shaft of the driver extends into the mounting shell; the second driving piece is located the installation shell, the top of the second driving piece with output shaft, the bottom with a plurality of the first end contact of swing arm for the top is supported first end in order to drive the swing arm is along the swing of second direction.
In an embodiment of this application, the second driving piece is including driving disk and rolling part, the driving disk with the coaxial setting of output shaft, the driving disk deviates from it has a plurality of rolling parts, and is a plurality of to deviate from the equipartition has on the side of driver rolling part and a plurality of the swing arm one-to-one sets up, and the rolling part with the elastomeric element is located the relative both sides of swing arm, but the rolling part is supporting in the top can autogyration when first end.
In an embodiment of this application, rolling member includes installation axle and bearing, the installation axle with driving plate fixed connection, the bearing housing is located install epaxial.
In an embodiment of this application, the installing shell includes roof, stand and bottom plate, and is a plurality of the stand is located the roof reaches between the bottom plate, and follow the roof reaches the even and interval of circumference of bottom plate is arranged, arbitrary two clearance between the stand is used for supplying the first end of swing arm stretches into, install on the roof drive assembly.
In an embodiment of the present application, one end of the clamping column is connected to the second end, and an axial direction of the clamping column is perpendicular to an axial direction of the swing arm; and the other end of the clamping column is provided with a limiting groove for accommodating the edge of the wafer.
In an embodiment of the application, the turnover mechanism includes a driving portion and a connecting shaft, the driving portion is fixedly disposed, and a rotating shaft of the driving portion is connected with the turnover support through the connecting shaft.
In an embodiment of the application, the upset support includes semi-annular's rotatory support and connection support, rotatory support with it constitutes the cover of the pipe shape to connect the support cooperation the upset support, tilting mechanism with rotatory support is connected, first fixture with the part of second fixture is located in the upset support.
In a second aspect, the present invention provides a semiconductor cleaning apparatus, which includes a front-end robot, a rear-end robot, a process chamber, and the wafer flipping device as provided in the first aspect, wherein the front-end robot is configured to transfer a wafer in a cassette onto the first clamping mechanism or the second clamping mechanism, and the rear-end robot is configured to transfer a wafer on the first clamping mechanism or the second clamping mechanism into the process chamber.
The technical scheme provided by the embodiment of the application has the following beneficial technical effects:
according to the embodiment of the application, the first clamping mechanism and the second clamping mechanism are symmetrically arranged at two ends of the turnover support, the first clamping mechanism and the second clamping mechanism are driven by the driving mechanism to turn over at the first position and the second position, when the wafer taking and placing device is in practical use, the first clamping mechanism is matched with the front manipulator to take and place the wafer, and the second clamping mechanism can be matched with the rear manipulator to take and place the wafer. When one clamping mechanism and the front manipulator are matched to take and place the wafer, the other clamping mechanism can be matched with the rear manipulator to take and place the wafer, and the wafer can be matched with the front manipulator and the rear manipulator to work simultaneously, so that the embodiment of the application can greatly shorten the wafer overturning and transmission time while realizing the wafer overturning, thereby greatly improving the working efficiency of the wafer transmission process and further greatly improving the working efficiency of the semiconductor cleaning equipment.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1A is a schematic structural view illustrating a wafer clamping structure of a wafer flipping device according to an embodiment of the present disclosure;
fig. 1B is an exploded schematic view of a wafer flipping apparatus according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a first clamping mechanism and a second clamping mechanism according to an embodiment of the present disclosure;
FIG. 3 is an exploded view of a first clamping mechanism and a second clamping mechanism according to an embodiment of the present disclosure;
FIG. 4 is a schematic structural diagram of a clamping assembly according to an embodiment of the present disclosure;
fig. 5 is a partial structural schematic view of a mounting housing according to an embodiment of the present disclosure;
FIG. 6 is a schematic perspective view of a second driving member in a top view according to an embodiment of the present application;
FIG. 7 is a perspective view of the second driving member in a bottom view according to the embodiment of the present application;
fig. 8A is an enlarged partial view of the first clamping mechanism and the second clamping mechanism provided in the embodiment of the present application, with a portion of the structure omitted;
fig. 8B is a schematic top view of a first clamping mechanism and a second clamping mechanism clamping a wafer according to an embodiment of the present disclosure;
fig. 9 is a schematic structural diagram of a semiconductor cleaning apparatus according to an embodiment of the present application.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.
The embodiment of the application provides a wafer turning device of semiconductor cleaning equipment, set up between the front-end manipulator and the rear-end manipulator of semiconductor cleaning equipment for supply front-end manipulator and rear-end manipulator to get and put the wafer, and overturn the wafer, this wafer turning device's structural schematic diagram is shown in fig. 1A and fig. 1B, includes: the device comprises a turnover mechanism 1, a turnover support 2, a first clamping mechanism 3 and a second clamping mechanism 4; the turnover mechanism 1 is connected with the turnover support 2, the first clamping mechanism 3 and the second clamping mechanism 4 are symmetrically arranged at two ends of the turnover support 2, the turnover mechanism 1 drives the turnover support 2 to turn over so as to drive the first clamping mechanism 3 and the second clamping mechanism 4 to turn over between a first position and a second position, and the first clamping mechanism 3 and the second clamping mechanism 4 are both used for selectively clamping or releasing the wafer 100; when the first clamping mechanism 3 is located at the first position and the second clamping mechanism 4 is located at the second position, the first clamping mechanism 3 can clamp the wafer 100 from the front-end robot (not shown), and the rear-end robot (not shown) can take away the wafer 100 from the second clamping mechanism 4; when the first clamping mechanism 3 is located at the second position and the second clamping mechanism 4 is located at the first position, the rear robot can take the wafer 100 from the first clamping mechanism 3, and the second clamping mechanism 4 can clamp the wafer 100 from the front robot.
As shown in fig. 1A and fig. 1B, the semiconductor cleaning apparatus may be specifically a single-chip cleaning machine for performing a cleaning process on a wafer, and the wafer flipping device may be disposed between a front robot and a rear robot (neither shown) of the semiconductor cleaning apparatus for flipping the wafer, but the embodiment of the present disclosure is not limited thereto, and a person skilled in the art may adjust the configuration according to actual situations. The turnover mechanism 1 can specifically adopt a rotary cylinder for driving the turnover support 2 to turn over, and is accurate in control and low in cost. Specifically, the turnover mechanism 1 may be fixedly disposed on a platform through a bracket 11, but it may also be directly disposed on a platform, and therefore the embodiment of the present invention is not limited thereto. The overturning support 2 is for example of a sleeve structure, the periphery of the overturning support 2 is connected with the overturning mechanism 1, and the two ends of the overturning support are respectively provided with a first clamping mechanism 3 and a second clamping mechanism 4. When the first clamping mechanism 3 is located at the first position and the second clamping mechanism 4 is located at the second position, the first clamping mechanism 3 is located at the bottom end of the overturning support 2, and the second clamping mechanism 4 can be located at the top end of the overturning support 2; when the first clamping mechanism 3 is located at the second position and the second clamping mechanism 4 is located at the first position, the second clamping mechanism 4 is located at the bottom end of the turning support 2, and the first clamping mechanism 3 is located at the top end of the turning support 2. The turnover mechanism 1 drives the turnover support 2 to turn over for 180 degrees so as to drive the first clamping mechanism 3 and the second clamping mechanism 4 to turn over, so that the first clamping mechanism and the second clamping mechanism turn over between a first position and a second position. In practical application, the first clamping mechanism 3 is located at the bottom end of the flip support 2, and the second clamping mechanism 4 is located at the bottom end of the flip support 2, that is, when the first clamping mechanism 3 is located at the first position and the second clamping mechanism 4 is located at the second position, the front-end robot can transfer the wafer 100 to the first clamping mechanism 3, the wafer 100 is clamped by the first clamping mechanism 3, the flip mechanism 1 drives the flip support 2 to flip for 180 degrees to drive the first clamping mechanism 3 to flip to the second position, and simultaneously drives the second clamping mechanism 4 to flip to the first position, at this time, the rear-end robot can take away the wafer 100 from the first clamping mechanism 3, and the front-end robot can simultaneously transfer the wafer 100 to the second clamping mechanism 4, and the wafer 100 is clamped by the second clamping mechanism 4, at this time, the flip mechanism 1 can again drive the first clamping mechanism 3 and the second clamping mechanism 4 to flip to interchange the positions, and so on the like.
According to the embodiment of the application, the first clamping mechanism and the second clamping mechanism are symmetrically arranged at two ends of the overturning support, and are driven to overturn at the first position and the second position through the driving mechanism. When one clamping mechanism and the front manipulator are matched to take and place the wafer, the other clamping mechanism can be matched with the rear manipulator to take and place the wafer, and the wafer can be matched with the front manipulator and the rear manipulator to work simultaneously, so that the embodiment of the application can greatly shorten the wafer overturning and transmission time while realizing the wafer overturning, thereby greatly improving the working efficiency of the wafer transmission process and further greatly improving the working efficiency of the semiconductor cleaning equipment.
In an embodiment of the present application, as shown in fig. 1A to fig. 2, each of the first clamping mechanism 3 and the second clamping mechanism 4 includes a mounting shell 51, a plurality of clamping assemblies 52 and a driving assembly 53, wherein the plurality of clamping assemblies 52 are uniformly arranged along a circumferential direction of the mounting shell 51 and extend along a radial direction of the mounting shell 41, and the driving assembly 53 is disposed on the mounting shell 51 and is configured to drive the plurality of clamping assemblies 52 to move simultaneously relative to the mounting shell 51 so as to clamp or release the wafer 100; the gap between any two adjacent clamping assemblies 52 is used for the front-end robot or the rear-end robot to extend into for taking and placing the wafer 100.
As shown in fig. 1A to fig. 2, the first clamping mechanism 3 and the second clamping mechanism 4 may be configured identically so as to meet the need of a front-back robot for picking and placing the wafer 100, but the embodiment of the present invention is not limited thereto, and for example, the first clamping mechanism and the second clamping mechanism may be configured differently. First fixture 3 and second fixture 4 all can adopt cylindrical structure including installation shell 51 and centre gripping subassembly 52, installation shell 51, and installation shell 51 is whole to set up on the tip of upset support 2 to have accommodation space 514 in the installation shell 51, in order to be used for installing a plurality of centre gripping subassemblies 52. The specific number of the clamping assemblies 52 may be three, and the three clamping assemblies 52 may be uniformly distributed along the circumferential direction of the mounting shell 51, and one end of each clamping assembly extends into the accommodating space 514 of the mounting shell 51, and the other end of each clamping assembly is radially far away from the mounting shell 51 along the radial direction of the mounting shell 51, that is, the plurality of clamping assemblies 52 are radially distributed along the radial direction of the mounting shell 51. Further, there is a gap between any two adjacent clamping assemblies 52, and since three clamping assemblies 52 are used, there is a gap of 120 degrees between any two adjacent clamping assemblies 52, so that a front-back robot can extend into the gap to pick and place the wafer 100, but the embodiment of the present invention does not limit the specific number of the clamping assemblies 52, for example, the number of the clamping assemblies 52 may also be more than three. A drive assembly 53 is provided on the mounting shell 51 for driving the plurality of gripper assemblies 52 to move simultaneously relative to the mounting shell 51. In practice, the plurality of clamping assemblies 52 are driven by the driving assembly 53 to move simultaneously relative to the mounting housing 51 to achieve selective clamping or releasing of the wafer 100. By adopting the design, the structure of the robot is simple and easy to realize, and mechanical interference with the front and rear manipulators can be avoided, so that the application and maintenance cost of the embodiment of the application is greatly improved.
It should be noted that the present embodiment does not limit the movement manner between the plurality of clamping assemblies 52 and the mounting shell 51, for example, the driving assembly 53 may drive the plurality of clamping assemblies 52 to simultaneously extend or swing relative to the mounting shell 51, so as to clamp or release the wafer 100. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In one embodiment of the present application, as shown in fig. 2, the clamping assembly 52 is pivotally connected to the mounting housing 51, and the clamping assembly 52 can swing along a first direction relative to the mounting housing 51 to clamp the wafer; and the clamping assembly 52 can swing along a second direction relative to the mounting shell 51 to release the wafer; the first direction and the second direction are both circumferential directions of the mounting case 51, and the first direction is opposite to the second direction.
As shown in fig. 2, each of the plurality of clamping assemblies 52 is pivotally connected to the mounting shell 51, and the driving assembly 53 drives the plurality of clamping assemblies 52 to swing relative to the mounting shell 51 in a first direction, such as a clockwise direction, so that one end of the clamping assembly 52 away from the mounting shell 51 simultaneously approaches the mounting shell 51, thereby clamping the wafer. The driving assembly 53 drives the plurality of clamping assemblies 52 to swing relative to the mounting shell 51 along a second direction, which may be, for example, a counterclockwise direction, so that one end of the clamping assembly 52 far away from the mounting shell 51 is far away from the mounting shell 51 at the same time, thereby releasing the wafer. By adopting the design, the plurality of clamping components 52 swing towards the first direction simultaneously to clamp the wafer, and the plurality of clamping components 52 swing towards the second direction simultaneously to release the wafer, so that the wafer clamping efficiency can be improved, the structural complexity of the embodiment of the application can be greatly reduced, and the application and maintenance cost is greatly reduced.
It should be noted that, the embodiments of the present application do not limit the specific directions of the first direction and the second direction, for example, the first direction is a counterclockwise direction, and the second direction is a clockwise direction, which can achieve the above technical effects. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In one embodiment of the present application, as shown in fig. 2 to 5, the clamping assembly 52 includes a swing arm 521 and a clamping post 522; a first end 524 of the swing arm 521 extends into the mounting shell 51, a second end 525 of the swing arm 521 is provided with a clamping column 522, the clamping column 522 is used for contacting with the edge of the wafer to clamp the wafer, and a pivot hole 526 is formed on the swing arm 521 near the first end 524; a pivot shaft 523 which can be arranged in the pivot hole 526 in the mounting shell 51 is arranged in the mounting shell 51, and the swing arm 521 is pivotally connected with the mounting shell 51 through the pivot shaft 523.
As shown in fig. 2 to 5, the swing arm 521 may be a rod-shaped structure made of a metal material, a first end 524 of the swing arm 521 extends into the mounting shell 51, a second end 525 extends along a radial direction of the mounting shell 51, and a bottom of the second end 525 may be provided with a clamping column 522, and the clamping columns 522 on the swing arms 521 cooperate with each other to clamp an edge of a wafer. The pivot shaft 523 penetrates through the pivot hole 526 of the swing arm 521, the pivot hole 526 is disposed near the first end 524, the pivot shaft 523 is fixedly connected inside the mounting shell 51 to achieve the pivotal connection between the swing arm 521 and the mounting shell 51, and the pivot shaft 523 may be disposed near the first end 524 of the swing arm 521, so that the first end 524 protrudes into the mounting shell 51. It should be noted that the embodiment of the present application does not limit the specific number of the pivot shafts 523, as long as the pivot shafts are arranged in one-to-one correspondence with the swing arms 521. By adopting the design, the structure of the embodiment of the application is simple and easy to realize, so that the application and maintenance cost is greatly reduced.
In an embodiment of the present application, as shown in fig. 2 to 4, the driving assembly 53 includes a first driving member 6, a second driving member 7 and a driver 8, the first driving member 6 is disposed in the mounting shell 51 for driving the swing arm 521 to swing along a first direction; the second driving element 7 is disposed in the mounting case 51, the driver 8 is disposed on the mounting case 51, and the driver 8 is connected to the first ends 524 of the swing arms 521 through the second driving element 7, and is configured to drive the swing arms 521 to swing along the second direction through the second driving element 7.
As shown in fig. 2 to 4, the driving assembly 53 includes a first driving member 6, a second driving member 7 and a driver 8, wherein the first driving member 6 is disposed in the mounting case 51 for driving the plurality of swing arms 521 to swing along a first direction at the same time. The second driving member 7 is disposed in the mounting case 51, the driver 8 is disposed on the mounting case 51, and the driver 8 is in transmission connection with the first ends 524 of the swing arms 521 through the second driving member 7, so as to drive the swing arms 521 to swing along the second direction. Adopt above-mentioned design, because first driving piece 6 and second driving piece 7 drive swing arm 521 respectively and swing along first direction and second direction for this application embodiment can control swing arm 521's swing direction respectively, not only can reduce response time by a wide margin, thereby improve this application embodiment's control efficiency, but also can make a plurality of swing arms 521 can simultaneous control, thereby improve control accuracy by a wide margin.
It should be noted that, the embodiment of the present application does not limit that the driving assembly 53 necessarily includes two driving members, for example, the driving assembly 53 may also include only the second driving member 7, and the driver 8 drives the plurality of swing arms 521 to swing along the first direction or the second direction through the second driving member 7. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 2 to 4, the first driving element 6 includes a plurality of elastic members 61, the plurality of elastic members 61 are disposed in one-to-one correspondence with the plurality of swing arms 521, and the plurality of elastic members 61 are located on the same side of the plurality of swing arms 521 along the circumferential direction of the mounting shell 51, one end of the elastic member 61 is connected to the mounting shell 51, and the other end is connected to the swing arms 521 between the pivot hole 526 and the second end 525 for providing an elastic force (e.g., an elastic restoring force) to drive the swing arms 521 to swing along the first direction. Specifically, the three elastic members 61 are disposed in a one-to-one correspondence with the three swing arms 521, and the three elastic members 61 are all located on one side of the swing arms 521 in the clockwise direction, that is, the elastic members 61 are located on the same side of the swing arms 521 in the circumferential direction of the mounting case 51. The elastic member 61 has one end connected to the inside of the mounting case 51 and the other end connected to a position between the pivot hole 526 and the second end 525 and connected to the swing arm 521. Through applying a pretightning force to elastomeric element 61 for elastomeric element 61 exerts an elastic restoring force to swing arm 521 all the time, so as to drive swing arm 521 and swing along first direction all the time, because a plurality of elastomeric elements 61 all are located swing arm 521 clockwise one side, make first direction be clockwise. By adopting the design, the swinging of the plurality of swing arms 521 along the first direction can be realized by adopting a simpler structure, so that the processing and manufacturing difficulty can be reduced, and the application and maintenance cost can be greatly reduced.
It should be noted that the embodiment of the present application does not limit the specific position of the elastic member 61, for example, the elastic member 61 may be disposed on one side of the swing arm 521 in the counterclockwise direction, so that the first direction is the counterclockwise direction. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 2 to fig. 5, the connection posts 62 are disposed in the mounting shell 51 and on the swing arm 521, and two ends of the elastic component 61 are respectively connected to the connection posts 62 in the mounting shell 51 and the connection posts 62 on the swing arm 521. Specifically, the elastic component 61 may specifically be a coil spring, the two connecting posts 62 are respectively disposed in the mounting shell 51 and on the swing arm 521, the connecting post 62 on the swing arm 521 is located between the pivot hole 526 and the second end 525 and is disposed on the same side as the clamping post 522, and both ends of the elastic component 61 are connected to the mounting shell 51 and the swing arm 521 through the connecting post 62. Elastic restoring force of elastic component 61 can drive swing arm 521 along first direction swing to the messenger sets up and carries out the centre gripping to the wafer in centre gripping post 522 of second end 525, owing to adopt elastic component 61's elastic restoring force to carry out the centre gripping to the wafer, makes the wafer atress less, can also avoid because the clamping-force is great causes the wafer to damage. By adopting the design, the structure of the embodiment of the application is simple, the design is reasonable, and the application and maintenance cost can be greatly reduced. However, the embodiment of the present application is not limited to the specific implementation of the elastic component 61, for example, the elastic component 61 may also adopt other types of elastic structures, so the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the structure according to the actual situation.
In an embodiment of the present application, as shown in fig. 2 to 5, the driver 8 is disposed on the top of the mounting shell 51, and the output shaft of the driver 8 extends into the mounting shell 51; the second driving member 7 is disposed in the mounting case 51, the top of the second driving member 7 is connected to the output shaft, and the bottom of the second driving member is in contact with the first ends 524 of the swing arms 521, so as to abut against the first ends 524 to drive the swing arms 521 to swing along the second direction.
As shown in fig. 2 to 5, the driver 8 may specifically adopt a stepping motor or a servo motor, the driver 8 may be disposed on the top of the mounting shell 51, and an output shaft of the driver 8 extends into the accommodating space 514 of the mounting shell 51. The second driving member 7 is disposed in the accommodating space 514 of the mounting shell 51 and is disposed coaxially with the mounting shell 51. The top center of the second driving member 7 can be fixedly connected to the output shaft of the driver 8, and the bottom is respectively in contact with the first ends 524 of the swing arms 521. In practical applications, the driver 8 drives the second driving member 7 to rotate, and the second driving member 7 abuts against the first ends 524 of the swing arms 521, so that the swing arms 521 can overcome the elastic restoring force of the first driving member 6 to swing in the second direction, so that the clamping posts 522 release the wafer. With the above design, the second driving element 7 contacts with the first ends 524 of the swing arms 521, and the elastic restoring force of the first driving element 6 is overcome, so that the swing arms 521 swing along the second direction to release the wafer, the control logic of the embodiment of the present application is simple, and the safety and the stability can be improved.
It should be noted that the embodiment of the present application does not limit the contact manner between the second driver 7 and the first ends 524 of the swing arms 521, for example, the contact manner can be achieved by adopting a pivot connection manner between the second driver 7 and the swing arms 521. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 2 to 7, the second driving element 7 includes a driving disc 71 and rolling members 72, the driving disc 71 is disposed coaxially with the output shaft, a plurality of rolling members 72 are uniformly distributed on a side of the driving disc 71 away from the driver 8, the rolling members 72 and the swing arms 521 are disposed in a one-to-one correspondence, the rolling members 72 and the elastic members 61 are located on two opposite sides of the swing arms 521, and the rolling members 72 can rotate when abutting against the first end 524.
As shown in fig. 2 to 7, the transmission disc 71 may specifically be a circular plate-shaped structure made of a metal material, the top surface of the transmission disc 71 is connected to the output shaft of the driver 8 at a central position, and a plurality of rolling members 72 are uniformly distributed on the bottom surface, that is, a plurality of rolling members 72 are uniformly distributed on the side surface of the transmission disc 71 away from the driver 8. The number of the plurality of rolling members 72 is set to correspond to the number of the swing arms 521, for example, three rolling members 72 are provided, that is, the plurality of rolling members 72 and the plurality of swing arms 521 are provided in one-to-one correspondence. Further, the rolling members 72 and the elastic members 61 are respectively located at two opposite sides of the first end 524 of the swing arm 521, that is, the rolling members 72 are located at one side of the swing arms 521 in the counterclockwise direction, so as to cooperate with the elastic members 61 to drive the swing arms 521 to swing. In practical application, the driver 8 drives the rolling members 72 to move simultaneously through the driving disc 71, and the rolling members 72 simultaneously prop against the first ends 524 of the swing arms 521, so that the swing arms 521 swing along the second direction simultaneously, and at this time, the rolling members 72 rotate automatically to reduce impurities generated by friction with the first ends 524, thereby avoiding impurity contamination to the wafer. By adopting the design, the plurality of rolling parts 72 are positioned on one side of the swing arm 521, so that the structure of the embodiment of the application is simple, the disassembly, assembly and maintenance efficiency is greatly improved, and the working efficiency of the embodiment of the application is further improved.
It should be noted that the present embodiment does not limit the installation positions of the plurality of rolling members 72, and for example, the rolling members 72 may be located on one side of the swing arm 521 in the clockwise direction, that is, the positions of the rolling members 72 and the elastic member 61 may be interchanged. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 2 to 7, the rolling member 72 includes a mounting shaft 73 and a bearing 74, the mounting shaft 73 is fixedly connected to the transmission plate 71, and the bearing 74 is sleeved on the mounting shaft 73. Specifically, the three mounting shafts 73 are all disposed on the bottom surface of the transmission disc 71 and are uniformly and alternately arranged along the circumferential direction of the transmission disc 71, the three bearings 74 are respectively disposed on the mounting shafts 73, and the peripheries of the bearings 74 are used for achieving rolling contact with the first ends 524 of the swing arms 521. By adopting the design, the application and maintenance cost of the embodiment of the application is lower, so that the working efficiency and the economic benefit are improved. However, the embodiment of the present application is not limited to the specific implementation of the rolling member 72, for example, the rolling member 72 only includes a bearing 74, and the inner ring thereof is disposed on the transmission disc 71. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 2 to 7, the mounting case 51 includes a top plate 511, a plurality of columns 512 and a bottom plate 513, the plurality of columns 512 are located between the top plate 511 and the bottom plate 513 and are uniformly and alternately arranged along the circumferential direction of the top plate 511 and the bottom plate 513, a gap between any two columns 512 is used for a first end 524 of the swing arm 521 to extend into, and the top plate 511 is mounted with the driving assembly 53.
As shown in fig. 2 to 7, each of the top plate 511 and the bottom plate 513 may be a circular plate-shaped structure made of metal, the pillars 512 may be integrally formed on the top surface of the bottom plate 513, and the pillars 512 are uniformly and alternately distributed along the circumferential direction of the bottom plate 513. The top plate 511 may be disposed above the bottom plate 513 and fixedly connected to the multiple pillars 512 through a plurality of fasteners to form a receiving space 514 in cooperation with the bottom plate 513, and the top surface of the top plate 511 may be used for mounting the driver 8 of the driving assembly 53. Since the number of the swing arms 521 is three, the specific number of the upright posts 512 can be three, so that a gap is formed between any two adjacent upright posts 512, so that the first end 524 of the swing arm 521 extends into the accommodating space 514 of the mounting shell 51, and the gap can be used for mounting the pivot shaft 523 of the swing arm 521 and the connecting post 62 of the elastic component 61. However, the embodiment of the present application does not limit the specific number of the columns 512, and the specific number of the connecting columns 62 may be set corresponding to the number of the swing arms 521, so the embodiment of the present application is not limited thereto, and those skilled in the art may adjust the setting according to actual situations. Adopt above-mentioned design for the dismouting maintenance of being convenient for of this application embodiment is maintained, even if be convenient for install second driving piece 7 and driver 8, thereby further improves dismouting maintenance efficiency.
It should be noted that the embodiment of the present application does not limit the specific implementation of the mounting case 51, and for example, a split structure is adopted between the plurality of pillars 512 and the bottom plate 513. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 4, one end of the clamping column 522 is connected to the second end 525 of the swing arm 521, and the axial direction of the clamping column 522 is perpendicular to the axial direction of the swing arm 521; the other end of the clamping column 522 is formed with a stop slot 527 for receiving the edge of the wafer. Specifically, the axial direction of the clamp column 522 may be perpendicular to the axial direction of the swing arm 521, so that the swing arm 521 can clamp or release the wafer when swinging. The top end of the clamping column 522 is connected to the second end 525 of the swing arm 521, for example, by a screw connection, but the embodiment of the present application is not limited to a specific connection. Annular spacing groove 527 can be seted up to the bottom of centre gripping post 522, and when a plurality of centre gripping posts 522 cooperation centre gripping wafer, spacing groove 527 can the edge of holding wafer to the realization is to the spacing of wafer prevent to drop, thereby improves this application embodiment stability and security by a wide margin, and then improves the technology yield of wafer. However, the embodiment of the present application does not limit the specific structure of the clamping column 522, and those skilled in the art can adjust the arrangement according to the actual situation.
In an embodiment of the present application, as shown in fig. 1A and 1B, the turnover mechanism 1 includes a driving portion 12 and a connecting shaft 13, the driving portion 12 is fixedly disposed, and a rotating shaft of the driving portion 12 is connected to the turnover support 2 through the connecting shaft 13. Particularly, the driving portion 12 can specifically adopt a rotary cylinder, and has the advantages of accurate control and simple control, and is convenient for directly overturning the first clamping mechanism 3 and the second clamping mechanism 4 in place at one time, so that the overturning efficiency of the embodiment of the application is greatly improved. One end of the connecting shaft 13 is connected with the rotating shaft of the driving part 12, the other end of the connecting shaft is connected with the overturning support 2, and the two ends of the overturning support 2 are respectively provided with the first clamping mechanism 3 and the second clamping mechanism 4, so that the two clamping mechanisms and the overturning mechanism 1 have a certain distance by arranging the connecting shaft 13, and the mechanical interference between the two clamping mechanisms and the overturning mechanism 1 in the overturning process is avoided, so that the structural design of the embodiment of the application is reasonable, and the failure rate is greatly reduced, and the service life is prolonged. It should be noted that the embodiment of the present application is not limited to the specific implementation of the turnover mechanism 1, and for example, the driving portion 12 may adopt a stepping motor or a servo motor. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
To further illustrate the working principle of the embodiments of the present application, a specific implementation of the present application is described below with reference to fig. 1A to 8B. Specifically, when the first gripper mechanism 3 picks up the wafer 100 from the front end robot, the first gripper mechanism 3 is located at the first position and the second gripper mechanism 4 is located at the second position, the driver 8 of the first gripper mechanism 3 drives the second driver 7 to rotate clockwise, the rolling member 72 abuts against the first ends 524 of the swing arms 521, so that the second ends 525 of the swing arms 521 swing in the second direction, and the circular diameter size formed by the gripping posts 522 on the swing arms 521 is increased, specifically, as shown in fig. 8A and 8B, the front end robot may convey the wafer 100 to the lower side of the first gripper mechanism 3, the driver 8 drives the second driver 7 to rotate counterclockwise, the rolling member 72 no longer abuts against the first ends 524 of the swing arms, and the swing arms 521 swing in the first direction under the tightening action of the elastic restoring force of the elastic member 61, so that the circular diameter size formed by the gripping posts 522 on the swing arms 521 is decreased, and the wafer 100 is gripped. Then tilting mechanism 1 can drive first fixture 3 and overturn to the second position to drive second fixture 4 and overturn to the first position, the driver 8 of first fixture 3 drives second driving piece 7 along clockwise rotation once more, so that the second end 525 of a plurality of swing arms 521 swings along the second direction, thereby make the circle diameter size grow that the centre gripping post 522 on a plurality of swing arms 521 is constituteed, place the wafer 100 of centre gripping on the rearmounted manipulator. It should be noted that the working principle of the second clamping mechanism 4 is the same as that of the first clamping mechanism 3, and the description thereof is omitted.
In an embodiment of the present application, as shown in fig. 1A to fig. 3, the flipping base 2 includes a semi-annular rotating base 21 and a connecting base 22, the rotating base 21 and the connecting base 22 cooperate to form a sleeve-shaped flipping base 2, the flipping mechanism 1 is connected to the rotating base 21, and portions of the first clamping mechanism 3 and the second clamping mechanism 4 are located in the flipping base 2.
As shown in fig. 1A to 3, the flip support 2 and the connecting support 22 may be made of a semi-annular sleeve made of a metal material, and the two may be fixedly connected by a fastener. The periphery of the rotating support 21 is provided with a rectangular boss, and the end part of the connecting shaft 13 can be connected with the rectangular boss on the rotating support 21 by adopting a plurality of fasteners; and the connection holder 22 may be fixedly disposed at one side of the rotation holder 21 using a fastener. The top plate 511 of the first clamping mechanism 3 may be connected to the bottom end of the flip stand 2, and the driver 8 of the first clamping mechanism 3 may be located in the flip stand 2, while the second clamping mechanism 4 may be symmetrically disposed on the top end of the flip stand 2. Furthermore, the rotating support 21 and the connecting support 22 can cooperate with each other to clamp the first clamping mechanism 3 and the second clamping mechanism 4 on the turning support 2, so as to greatly improve the assembly, disassembly and maintenance efficiency. Adopt above-mentioned design, because the part of first fixture 3 and second fixture 4 can be located upset support 2 to can save the space of this application embodiment by a wide margin and occupy, and because upset support 2 adopts split type structure, make this application embodiment simple structure, thereby improve dismouting maintenance efficiency by a wide margin.
It should be noted that the embodiment of the present application is not limited to the specific structure of the flip support 2, and for example, the flip support 2 may also be formed in an integral manner. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
Based on the same inventive concept, an embodiment of the present application provides a semiconductor cleaning apparatus, as shown in a schematic structural diagram 9, including: the front-end robot 201 is used for transferring the wafers in the wafer box 205 to the first clamping mechanism 3 or the second clamping mechanism 4, the rear-end robot 202 is used for transferring the wafers in the first clamping mechanism 3 or the second clamping mechanism 4 to the process chamber 203, and the wafer turnover device 204 is provided in each embodiment. Specifically, the plurality of process chambers 203 may be arranged in two rows, two cassettes 205 may be spaced apart from one end of each of the two rows of process chambers 203, the front robot 201 may be disposed adjacent to the two cassettes 205, the rear robot 202 may be disposed between the end portions of the two rows of process chambers 203, and the wafer flipping device 204 may be disposed between the front robot 201 and the rear robot 202. By adopting the design, the first clamping mechanism 3 and the front manipulator 201 are matched to take and place the wafer, and the second clamping mechanism 4 and the rear manipulator 202 are matched to take and place the wafer, so that the transmission efficiency of the semiconductor cleaning equipment is greatly improved, and the working efficiency of the semiconductor cleaning equipment is greatly improved. However, it should be noted that the embodiment of the present application does not limit the specific number of the process chambers 203 and the cassettes 205, and the setting can be adjusted by a person skilled in the art according to the actual situation.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
according to the embodiment of the application, the first clamping mechanism and the second clamping mechanism are symmetrically arranged at two ends of the overturning support, and are driven to overturn at the first position and the second position through the driving mechanism. When one clamping mechanism and the front manipulator are matched to take and place the wafer, the other clamping mechanism can be matched with the rear manipulator to take and place the wafer, and the wafer can be matched with the front manipulator and the rear manipulator to work simultaneously, so that the wafer overturning and transmission time is greatly shortened while the wafer is overturned, the working efficiency of the wafer transmission process is greatly improved, and the working efficiency of the semiconductor cleaning equipment is greatly improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (15)
1. The utility model provides a wafer turning device of semiconductor cleaning equipment, sets up between leading manipulator and the rearmounted manipulator of semiconductor cleaning equipment for supply leading manipulator and rearmounted manipulator to get and put the wafer, and overturn the wafer, its characterized in that includes: the device comprises a turnover mechanism, a turnover support, a first clamping mechanism and a second clamping mechanism;
the turnover mechanism is connected with the turnover support, the first clamping mechanism and the second clamping mechanism are symmetrically arranged at two ends of the turnover support, the turnover mechanism is used for driving the turnover support to turn over so as to drive the first clamping mechanism and the second clamping mechanism to turn over between a first position and a second position, and the first clamping mechanism and the second clamping mechanism are both used for selectively clamping or releasing the wafer;
when the first clamping mechanism is located at the first position and the second clamping mechanism is located at the second position, the first clamping mechanism can clamp the wafer from the front manipulator, and the rear manipulator can take the wafer from the second clamping mechanism; when the first clamping mechanism is located at the second position and the second clamping mechanism is located at the first position, the rear manipulator can take the wafer from the first clamping mechanism, and the second clamping mechanism can clamp the wafer from the front manipulator.
2. The wafer turnover device of claim 1, wherein the first clamping mechanism and the second clamping mechanism each comprise a mounting shell, a driving assembly and a clamping assembly, the plurality of clamping assemblies are uniformly arranged along the circumferential direction of the mounting shell and extend along the radial direction of the mounting shell, and the driving assembly is arranged on the mounting shell and is used for driving the plurality of clamping assemblies to move relative to the mounting shell simultaneously so as to clamp or release the wafer; and a gap between any two adjacent clamping assemblies is used for the front-end manipulator or the rear-end manipulator to extend into so as to take and place the wafer.
3. The wafer flipping apparatus of claim 2, wherein the clamping assembly is pivotally coupled to the mounting housing, the clamping assembly being pivotable in a first direction relative to the mounting housing to clamp the wafer; the clamping assembly can swing along a second direction relative to the mounting shell so as to release the wafer; the first direction and the second direction are both circumferential directions of the mounting case, and the first direction and the second direction are opposite.
4. The wafer flipping apparatus of claim 3, wherein the clamping assembly comprises a swing arm and a clamping post; a first end of the swing arm extends into the mounting shell, a second end of the swing arm is provided with the clamping column, the clamping column is used for contacting with the edge of the wafer to clamp the wafer, and a pivot hole is formed in the swing arm close to the first end; a pivot shaft capable of being arranged in the pivot hole in a penetrating mode is arranged in the mounting shell, and the swing arm is connected with the mounting shell in a pivoting mode through the pivot shaft.
5. The wafer turnover device as claimed in claim 4, wherein the driving assembly includes a first driving member, a second driving member and a driver, the first driving member being disposed in the mounting housing for simultaneously driving the swing arm to swing in a first direction; the second driving piece is arranged in the installation shell, the driver is arranged on the installation shell, and the driver is connected with the first ends of the swing arms through the second driving piece and used for driving the swing arms to swing along a second direction through the second driving piece.
6. The wafer turnover device as recited in claim 5, wherein the first driving member includes a plurality of elastic members, the elastic members are disposed in a one-to-one correspondence with the swing arms, and the elastic members are disposed on a same side of the swing arms along a circumferential direction of the mounting case, one end of the elastic member is connected to the mounting case, and the other end of the elastic member is connected to the swing arm at a position between the pivot hole and the second end, for providing an elastic force to drive the swing arm to swing along a first direction.
7. The wafer turnover device as claimed in claim 6, wherein connection posts are disposed in the mounting shell and on the swing arm, and two ends of the elastic member are respectively connected to the connection posts in the mounting shell and the connection posts on the swing arm.
8. The wafer turnover device as recited in claim 6, wherein the driver is disposed at a top portion of the mounting shell, and an output shaft of the driver extends into the mounting shell; the second driving piece is located the installation shell, the top of the second driving piece with output shaft, the bottom with a plurality of the first end contact of swing arm for the top is supported first end in order to drive the swing arm is along the swing of second direction.
9. The wafer turnover device as recited in claim 8, wherein the second driving member includes a driving disc and rolling members, the driving disc and the output shaft are coaxially disposed, a plurality of rolling members are uniformly disposed on a side of the driving disc away from the driver, the rolling members and the swing arms are disposed in a one-to-one correspondence, the rolling members and the elastic members are disposed on opposite sides of the swing arms, and the rolling members are capable of rotating automatically when abutting against the first end.
10. The wafer flipping apparatus of claim 9, wherein the rolling member comprises a mounting shaft and a bearing, the mounting shaft is fixedly connected to the transmission plate, and the bearing is sleeved on the mounting shaft.
11. The wafer turnover device of claim 4, wherein the mounting case includes a top plate, a plurality of columns and a bottom plate, the plurality of columns are located between the top plate and the bottom plate and are uniformly and alternately arranged along the circumferential direction of the top plate and the bottom plate, a gap between any two columns is used for the first end of the swing arm to extend into, and the top plate is provided with the driving assembly.
12. The wafer turnover device of claim 4, wherein one end of the clamping column is connected with the second end, and the axial direction of the clamping column and the axial direction of the swing arm are perpendicular to each other; and the other end of the clamping column is provided with a limiting groove for accommodating the edge of the wafer.
13. The wafer turnover device of any one of claims 1 to 12, wherein the turnover mechanism includes a driving portion and a connecting shaft, the driving portion is fixedly disposed, and a rotation shaft of the driving portion is connected to the turnover support through the connecting shaft.
14. The wafer flipping apparatus of any one of claims 1 to 12, wherein the flipping support comprises a semi-annular rotating support and a connecting support, the rotating support and the connecting support cooperate to form a sleeve-shaped flipping support, the flipping mechanism is connected to the rotating support, and portions of the first clamping mechanism and the second clamping mechanism are located in the flipping support.
15. A semiconductor cleaning apparatus comprising a front end effector for transferring a wafer in a cassette onto the first or second gripper mechanism, a rear end effector for transferring a wafer on the first or second gripper mechanism into the process chamber, and a wafer flipping apparatus according to any one of claims 1 to 14.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110925922.3A CN115706035A (en) | 2021-08-12 | 2021-08-12 | Semiconductor cleaning equipment and wafer overturning device thereof |
| PCT/CN2022/111073 WO2023016436A1 (en) | 2021-08-12 | 2022-08-09 | Semiconductor cleaning device and wafer turning apparatus thereof |
| TW111129896A TWI808865B (en) | 2021-08-12 | 2022-08-09 | Semiconductor cleaning device and wafer turnover device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110925922.3A CN115706035A (en) | 2021-08-12 | 2021-08-12 | Semiconductor cleaning equipment and wafer overturning device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115706035A true CN115706035A (en) | 2023-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110925922.3A Pending CN115706035A (en) | 2021-08-12 | 2021-08-12 | Semiconductor cleaning equipment and wafer overturning device thereof |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN115706035A (en) |
| TW (1) | TWI808865B (en) |
| WO (1) | WO2023016436A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116364643B (en) * | 2023-06-01 | 2023-08-11 | 北京特思迪半导体设备有限公司 | Wafer clamping device and wafer cleaning system |
| CN116469830B (en) * | 2023-06-19 | 2023-08-22 | 北京芯士联半导体科技有限公司 | Wafer box overturning device of etching machine |
| CN116968071B (en) * | 2023-09-07 | 2024-03-08 | 上海广川科技有限公司 | Anti-skid device for wafer transmission and mechanical finger |
| CN117524967B (en) * | 2024-01-08 | 2024-03-15 | 无锡星微科技有限公司 | Wafer transmission system |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090038247A (en) * | 2007-10-15 | 2009-04-20 | 세메스 주식회사 | Method for reversing wafer |
| CN102097352B (en) * | 2010-07-14 | 2013-01-23 | 北京七星华创电子股份有限公司 | Disk fixing device |
| JP5323867B2 (en) * | 2011-01-19 | 2013-10-23 | 東京エレクトロン株式会社 | Substrate inversion apparatus, substrate inversion method, peeling system, program, and computer storage medium |
| JP5993625B2 (en) * | 2012-06-15 | 2016-09-14 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate reversing apparatus and substrate processing apparatus |
| JP6009832B2 (en) * | 2012-06-18 | 2016-10-19 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
| KR101379232B1 (en) * | 2012-07-18 | 2014-04-07 | 주식회사 로보스타 | Apparatus for reversing wafer |
| CN111029273B (en) * | 2018-10-10 | 2022-04-05 | 沈阳芯源微电子设备股份有限公司 | Low contact wafer upset system |
| CN110534472B (en) * | 2019-09-06 | 2021-05-25 | 杭州众硅电子科技有限公司 | Wafer transmission manipulator and wafer overturning method thereof |
| CN111604810B (en) * | 2020-07-24 | 2020-11-03 | 杭州众硅电子科技有限公司 | Wafer transmission equipment, chemical mechanical planarization device and wafer transmission method |
| CN112133671B (en) * | 2020-09-22 | 2024-04-12 | 北京北方华创微电子装备有限公司 | Wafer tilting mechanism and wafer cleaning equipment |
-
2021
- 2021-08-12 CN CN202110925922.3A patent/CN115706035A/en active Pending
-
2022
- 2022-08-09 TW TW111129896A patent/TWI808865B/en active
- 2022-08-09 WO PCT/CN2022/111073 patent/WO2023016436A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWI808865B (en) | 2023-07-11 |
| TW202307919A (en) | 2023-02-16 |
| WO2023016436A1 (en) | 2023-02-16 |
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