TW202307919A - Semiconductor cleaning device and wafer turnover device thereof - Google Patents
Semiconductor cleaning device and wafer turnover device thereof Download PDFInfo
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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Abstract
Description
本申請涉及半導體加工技術領域,具體而言,本申請涉及一種半導體清洗設備及其晶圓翻轉裝置。The present application relates to the technical field of semiconductor processing, and in particular, the present application relates to a semiconductor cleaning device and a wafer inversion device thereof.
目前,半導體加工製程中通常會採用單片清洗製程對晶圓進行清洗,半導體清洗設備中的單片清洗機,由於是對單個晶圓進行清洗,相比於槽式清洗機的清洗效果較好,但是工作效率較低,這就要求單片清洗機要盡可能的縮短節拍時間,以提高設備的工作效率。At present, the single-wafer cleaning process is usually used to clean the wafer in the semiconductor processing process. The single-wafer cleaning machine in the semiconductor cleaning equipment cleans a single wafer, and the cleaning effect is better than that of the tank cleaning machine. , but the work efficiency is low, which requires the single chip cleaning machine to shorten the takt time as much as possible to improve the work efficiency of the equipment.
單片清洗機由於需要清洗晶圓的背面,因此需要將晶圓進行180°翻轉,但是現有單片清洗機由於翻轉及傳輸時間較長嚴重影響工作效率。Since the single-wafer cleaning machine needs to clean the back of the wafer, it needs to flip the wafer 180°. However, the existing single-wafer cleaning machine seriously affects the work efficiency due to the long flipping and transmission time.
本申請針對現有方式的缺點,提出一種半導體清洗設備及其晶圓翻轉機構,用以解決現有技術存在工作效率較低的技術問題。In view of the shortcomings of the existing methods, the present application proposes a semiconductor cleaning device and a wafer turning mechanism thereof to solve the technical problem of low work efficiency in the prior art.
第一個方面,本申請實施例提供了一種半導體清洗設備的晶圓翻轉裝置,設置於該半導體清洗設備的前置機械手及後置機械手之間,用於供該前置機械手及該後置機械手取放晶圓,並且對該晶圓進行翻轉,包括:翻轉機構、翻轉支座、第一夾持機構及第二夾持機構;該翻轉機構與該翻轉支座連接,該第一夾持機構及該第二夾持機構對稱設置於該翻轉支座的兩端,該翻轉機構用於驅動該翻轉支座翻轉,以帶動該第一夾持機構及該第二夾持機構在第一位置及第二位置之間相互替換,該第一夾持機構及該第二夾持機構均用於選擇性夾持或釋放該晶圓;該第一夾持機構及該第二夾持機構中的一者位於該第一位置,另一者位於該第二位置時,可配合該前置機械手進行放片,同時配合該後置機械手進行取片。In the first aspect, the embodiment of the present application provides a wafer flipping device for semiconductor cleaning equipment, which is installed between the front manipulator and the rear manipulator of the semiconductor cleaning equipment, and is used for the front manipulator and the back manipulator. The rear manipulator picks and places the wafer, and flips the wafer, including: a flipping mechanism, a flipping support, a first clamping mechanism and a second clamping mechanism; the flipping mechanism is connected with the flipping support, and the first The clamping mechanism and the second clamping mechanism are symmetrically arranged at both ends of the turning support, and the turning mechanism is used to drive the turning support to turn over, so as to drive the first clamping mechanism and the second clamping mechanism The first position and the second position are interchangeable, the first clamping mechanism and the second clamping mechanism are used to selectively clamp or release the wafer; the first clamping mechanism and the second clamping mechanism When one of them is at the first position and the other is at the second position, it can cooperate with the front manipulator to release the film, and at the same time cooperate with the rear manipulator to take the film.
於本申請的一實施例中,該第一夾持機構及該第二夾持機構均包括安裝殼、驅動元件及多個夾持元件,多個該夾持組件沿該安裝殼的周向均勻且間隔設置;該驅動組件設置在該安裝殼上,用於驅動多個該夾持元件相對於該安裝殼同時運動,以夾持或釋放該晶圓;任意相鄰的兩個夾持元件之間的間隙用於供該前置機械手或者該後置機械手伸入以取放該晶圓。In an embodiment of the present application, the first clamping mechanism and the second clamping mechanism both include a mounting shell, a driving element and a plurality of clamping elements, and a plurality of the clamping components are uniform along the circumference of the mounting shell and arranged at intervals; the driving assembly is arranged on the mounting shell, and is used to drive multiple clamping elements to move simultaneously relative to the mounting shell to clamp or release the wafer; any two adjacent clamping elements The gap between is used for the front manipulator or the rear manipulator to reach in to pick and place the wafer.
於本申請的一實施例中,每個該夾持元件均與該安裝殼樞轉連接,且能相對於該安裝殼沿第一方向或沿與之方向相反的第二方向擺動;多個該夾持組件能均沿該第一方向擺動,以夾持該晶圓;或者,均沿該第二方向擺動,以釋放該晶圓。In one embodiment of the present application, each of the clamping elements is pivotally connected with the installation shell, and can swing relative to the installation shell in a first direction or in a second direction opposite to the direction; a plurality of the clamping elements The clamping components can both swing along the first direction to clamp the wafer; or can swing along the second direction to release the wafer.
於本申請的一實施例中,每個該夾持元件均包括擺臂及夾持柱;該擺臂的第一端通過樞轉軸與該安裝殼樞轉連接,該擺臂的第二端設置有該夾持柱,多個該夾持柱用於共同夾持該晶圓的邊緣。In one embodiment of the present application, each of the clamping elements includes a swing arm and a clamping post; the first end of the swing arm is pivotally connected to the mounting shell through a pivot shaft, and the second end of the swing arm is provided There is the clamping column, and a plurality of the clamping columns are used to jointly clamp the edge of the wafer.
於本申請的一實施例中,該驅動元件包括第一驅動件、第二驅動件及驅動器,該第一驅動件和該第二驅動件均設置於該安裝殼內,該驅動器設置於該安裝殼上,且與該第二驅動件連接,該驅動器用於在通電時通過該第二驅動件同時驅動多個該夾持元件的該擺臂圍繞該樞轉軸沿該第二方向擺動;該第一驅動件用於在該驅動器斷電時,同時帶動多個該夾持元件的該擺臂圍繞該樞轉軸沿該第一方向擺動。In one embodiment of the present application, the driving element includes a first driving element, a second driving element and a driver, the first driving element and the second driving element are both arranged in the mounting shell, and the driver is arranged in the mounting shell. on the shell, and is connected with the second driving part, and the driver is used to simultaneously drive the swing arms of a plurality of the clamping elements to swing around the pivot shaft along the second direction through the second driving part when the power is turned on; A driving member is used for simultaneously driving the swing arms of the plurality of clamping elements to swing around the pivot shaft along the first direction when the driver is powered off.
於本申請的一實施例中,該第一驅動件包括多個彈性部件,多個該彈性部件與多個該擺臂一一對應設置,並且多個該彈性部件沿該安裝殼的周向均位於多個該擺臂的同一側,該彈性部件的一端與該安裝殼連接,另一端與該擺臂連接,用於提供能夠在該驅動器斷電時使該擺臂復位的彈力。In an embodiment of the present application, the first driving member includes a plurality of elastic components, and the plurality of elastic components are arranged in one-to-one correspondence with the plurality of swing arms, and the plurality of elastic components are located at multiple positions along the circumferential direction of the installation shell. On the same side of the swing arm, one end of the elastic member is connected to the mounting case, and the other end is connected to the swing arm, so as to provide elastic force that can reset the swing arm when the driver is powered off.
於本申請的一實施例中,該安裝殼內及該擺臂上均設置有連接柱,該彈性部件的兩端分別與安裝殼內的該連接柱以及該擺臂上的該連接柱連接。In an embodiment of the present application, connecting posts are provided in the installation case and on the swing arm, and both ends of the elastic member are respectively connected to the connecting posts in the installation case and the connecting posts on the swing arm.
於本申請的一實施例中,該驅動器設置於該安裝殼的外部,且該驅動器的輸出軸伸入該安裝殼內,並與該第二驅動件連接,用於驅動該第二驅動件轉動;多個該擺臂的第一端伸入該安裝殼內,並與該第二驅動件相接觸,以使該第二驅動件在轉動時,能夠推動該擺臂沿該第二方向擺動。In one embodiment of the present application, the driver is arranged outside the installation case, and the output shaft of the driver extends into the installation case and is connected with the second drive member for driving the second drive member to rotate The first ends of a plurality of the swing arms protrude into the installation shell and contact the second driving member, so that when the second driving member rotates, it can push the swing arm to swing along the second direction.
於本申請的一實施例中,該第二驅動件包括有傳動盤及滾動部件,該傳動盤與該驅動器的輸出軸同軸設置,該傳動盤背離該驅動器的側面上設置有多個滾動部件,各個該擺臂的該第一端一一對應地延伸至各個該滾動部件在該傳動盤圓周方向上的一側,並與該滾動部件滾動接觸;該彈性部件和該滾動部件分別位於對應的該擺臂的相對兩側。In one embodiment of the present application, the second driving member includes a transmission disc and a rolling member, the transmission disc is arranged coaxially with the output shaft of the driver, and a plurality of rolling members are arranged on the side of the transmission disc away from the driver, The first end of each of the swing arms extends to one side of each of the rolling members in the circumferential direction of the transmission disc, and makes rolling contact with the rolling members; the elastic member and the rolling member are respectively located at the corresponding Opposite sides of the swing arm.
於本申請的一實施例中,該滾動部件包括安裝軸及軸承,該安裝軸與該傳動盤固定連接,且該安裝軸的軸線與該驅動器的輸出軸相互平行;該軸承套設於該安裝軸上。In one embodiment of the present application, the rolling member includes a mounting shaft and a bearing, the mounting shaft is fixedly connected to the transmission disc, and the axis of the mounting shaft is parallel to the output shaft of the driver; the bearing is sleeved on the mounting on axis.
於本申請的一實施例中,該安裝殼包括頂板、立柱及底板,多個該立柱位於該頂板及該底板之間,並且沿該頂板及該底板的周向均勻且間隔排布,任意兩個該立柱之間的間隙用於供該擺臂的第一端伸入,該驅動器設置於該頂板背離該底板一側。In one embodiment of the present application, the installation shell includes a top plate, a column and a bottom plate, and a plurality of the columns are located between the top plate and the bottom plate, and are arranged evenly and at intervals along the circumference of the top plate and the bottom plate, and any two The gap between the two columns is used for the first end of the swing arm to extend in, and the driver is arranged on the side of the top plate away from the bottom plate.
於本申請的一實施例中,該夾持柱的一端與該擺臂的第二端連接,並且該夾持柱的軸向與該擺臂的軸向相互垂直設置;該夾持柱的另一端開設有限位槽,用於容納該晶圓的邊緣。In one embodiment of the present application, one end of the clamping column is connected to the second end of the swing arm, and the axial direction of the clamping column is perpendicular to the axial direction of the swing arm; the other end of the clamping column A limiting slot is provided at one end for accommodating the edge of the wafer.
於本申請的一實施例中,該翻轉機構包括驅動部及連接軸,該驅動部固定設置,該驅動部的旋轉軸通過該連接軸與該翻轉支座連接。In an embodiment of the present application, the turning mechanism includes a driving part and a connecting shaft, the driving part is fixedly arranged, and the rotating shaft of the driving part is connected to the turning support through the connecting shaft.
於本申請的一實施例中,該翻轉支座包括半環形的旋轉支座及半環形的連接支座,該旋轉支座與該連接支座配合構成套筒形的該翻轉支座,該翻轉機構與該旋轉支座連接,該第一夾持機構與該第二夾持機構的部分位於該翻轉支座內。In one embodiment of the present application, the turning support includes a semi-circular rotating support and a semi-circular connecting support, the rotating support cooperates with the connecting support to form a sleeve-shaped turning support, the turning The mechanism is connected with the rotating support, and parts of the first clamping mechanism and the second clamping mechanism are located in the turning support.
第二個方面,本申請實施例提供了一種半導體清洗設備,包括前置機械手、後置機械手、製程腔室及如第一個方面提供的晶圓翻轉裝置,該前置機械手用於將片盒內的晶圓傳送至該第一夾持機構或者該第二夾持機構上,該後置機械手用於將該第一夾持機構或者該第二夾持機構上的晶圓傳送至該製程腔室內。In the second aspect, the embodiment of the present application provides a semiconductor cleaning equipment, including a front manipulator, a rear manipulator, a process chamber, and a wafer flipping device as provided in the first aspect. The front manipulator is used for Transfer the wafers in the cassette to the first clamping mechanism or the second clamping mechanism, and the rear manipulator is used to transfer the wafers on the first clamping mechanism or the second clamping mechanism into the process chamber.
本申請實施例提供的技術方案帶來的有益技術效果是:本申請實施例通過在翻轉支座的兩端對稱設置有第一夾持機構及第二夾持機構,並且通過翻轉機構帶動兩者在第一位置及第二位置 之間相互替換,在實際使用時,第一夾持機構及第二夾持機構中的一者位於第一位置,另一者位於第二位置時,一者配合前置機械手進行放片,同時另一者配合後置機械手進行取片,實現了同時與前、後置機械手配合工作,節省了翻轉步驟,從而在實現晶圓翻轉的同時,大幅縮短了晶圓翻轉及傳輸時間,從而大幅提高了晶圓傳輸過程的工作效率,進而大幅提高了半導體清洗設備的工作效率。The beneficial technical effect brought by the technical solution provided by the embodiment of the present application is: the embodiment of the present application symmetrically arranges the first clamping mechanism and the second clamping mechanism at both ends of the overturning support, and drives the two clamping mechanisms through the overturning mechanism. The first position and the second position are interchangeable. In actual use, one of the first clamping mechanism and the second clamping mechanism is at the first position, and the other is at the second position. The front manipulator is used to place the film, and the other one cooperates with the rear manipulator to take the film at the same time, which realizes the simultaneous work with the front and rear manipulators, saving the flipping steps, thus greatly shortening the time while realizing wafer flipping. The wafer turnover and transmission time are shortened, thereby greatly improving the work efficiency of the wafer transmission process, thereby greatly improving the work efficiency of the semiconductor cleaning equipment.
本申請附加的方面和優點將在下面的描述中部分給出,這些將從下面的描述中變得明顯,或通過本申請的實踐瞭解到。Additional aspects and advantages of the application will be set forth in part in the description which follows, and will become apparent from the description, or may be learned by practice of the application.
以下揭露提供用於實施本揭露之不同構件之許多不同實施例或實例。下文描述組件及配置之特定實例以簡化本揭露。當然,此等僅為實例且非意欲限制。舉例而言,在以下描述中之一第一構件形成於一第二構件上方或上可包含其中該第一構件及該第二構件經形成為直接接觸之實施例,且亦可包含其中額外構件可形成在該第一構件與該第二構件之間,使得該第一構件及該第二構件可不直接接觸之實施例。另外,本揭露可在各個實例中重複參考數字及/或字母。此重複出於簡化及清楚之目的且本身不指示所論述之各個實施例及/或組態之間的關係。The following disclosure provides many different embodiments, or examples, of different means for implementing the disclosure. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description a first member is formed over or on a second member may include embodiments in which the first member and the second member are formed in direct contact, and may also include embodiments in which additional members An embodiment may be formed between the first member and the second member so that the first member and the second member may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and/or letters in various instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.
此外,為便於描述,諸如「下面」、「下方」、「下」、「上方」、「上」及類似者之空間相對術語可在本文中用於描述一個元件或構件與另一(些)元件或構件之關係,如圖中圖解說明。空間相對術語意欲涵蓋除在圖中描繪之定向以外之使用或操作中之裝置之不同定向。設備可以其他方式定向(旋轉90度或按其他定向)且因此可同樣解釋本文中使用之空間相對描述詞。In addition, for ease of description, spatially relative terms such as "below", "below", "under", "above", "upper" and the like may be used herein to describe the relationship between one element or member and another(s) The relationship between elements or components, as illustrated in the figure. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and thus the spatially relative descriptors used herein should be interpreted similarly.
儘管陳述本揭露之寬泛範疇之數值範圍及參數係近似值,然儘可能精確地報告特定實例中陳述之數值。然而,任何數值固有地含有必然由於見於各自測試量測中之標準偏差所致之某些誤差。再者,如本文中使用,術語「大約」通常意謂在一給定值或範圍之10%、5%、1%或0.5%內。替代地,術語「大約」意謂在由此項技術之一般技術者考量時處於平均值之一可接受標準誤差內。除在操作/工作實例中以外,或除非以其他方式明確指定,否則諸如針對本文中揭露之材料之數量、時間之持續時間、溫度、操作條件、數量之比率及其類似者之全部數值範圍、數量、值及百分比應被理解為在全部例項中由術語「大約」修飾。相應地,除非相反地指示,否則本揭露及隨附發明申請專利範圍中陳述之數值參數係可根據需要變化之近似值。至少,應至少鑑於所報告有效數位之數目且藉由應用普通捨入技術解釋各數值參數。範圍可在本文中表達為從一個端點至另一端點或在兩個端點之間。本文中揭露之全部範圍包含端點,除非另有指定。Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Furthermore, as used herein, the term "about" generally means within 10%, 5%, 1%, or 0.5% of a given value or range. Alternatively, the term "about" means within an acceptable standard error of the mean when considered by one of ordinary skill in the art. Except in operating/working examples, or unless expressly specified otherwise, all numerical ranges such as for amounts of materials disclosed herein, durations of time, temperatures, operating conditions, ratios of amounts, and the like, Amounts, values and percentages should be understood as being modified by the term "about" in all instances. Accordingly, unless indicated to the contrary, the numerical parameters set forth in this disclosure and the accompanying claims are approximations that may vary as desired. At a minimum, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges can be expressed herein as from one endpoint to the other or as between two endpoints. All ranges disclosed herein are inclusive of endpoints unless otherwise specified.
現有技術的一種晶圓翻轉機構由翻轉機械手和承載台組成,其中,翻轉機械手由基座、45°旋轉模組、180°旋轉模組和夾持臂組成。該晶圓翻轉機構的製程流程為:首先,由前置機械手從片盒取出晶圓,放置於承載臺上,此時夾持臂從兩側將晶圓夾住,並由45°旋轉模組帶動夾持臂升起以使晶圓與承載台分離;再由180°旋轉模組將夾持臂及晶圓翻轉180°,之後再由45°旋轉模組使晶圓下降並置於承載臺上,然後45°旋轉模組再次上升以將夾持臂抬起,最後再由後置機械手從承載臺上取走晶圓以傳送至製程腔室內進行製程。A wafer inversion mechanism in the prior art is composed of an inversion manipulator and a carrier table, wherein the inversion manipulator is composed of a base, a 45° rotation module, a 180° rotation module and a clamping arm. The process flow of the wafer turning mechanism is as follows: firstly, the front manipulator takes out the wafer from the cassette and places it on the carrier table. At this time, the clamping arm clamps the wafer from both sides, and the The group drives the clamping arm to rise to separate the wafer from the carrier; then the 180°rotation module turns the clamping arm and the wafer 180°, and then the 45°rotation module lowers the wafer and places it on the carrier Then the 45°rotation module rises again to lift the clamping arm, and finally the rear manipulator removes the wafer from the carrier table and transfers it to the process chamber for processing.
上述晶圓翻轉機構翻轉晶圓的步驟較多,而且只能先通過前置機械手進行放片,後通過後置機械手進行取片,這兩個動作在同一時間只允許進行一個,從而造成翻轉及傳輸時間較長,嚴重影響了工作效率。The above-mentioned wafer flipping mechanism has many steps to flip the wafer, and the wafer can only be placed by the front manipulator first, and then taken by the rear manipulator. Only one of these two actions is allowed at the same time, resulting in It takes a long time to turn over and transfer, which seriously affects the work efficiency.
下面以具體地實施例對本申請的技術方案以及本申請的技術方案如何解決上述技術問題進行詳細說明。The technical solution of the present application and how the technical solution of the present application solves the above technical problems will be described in detail below with specific embodiments.
本申請實施例提供了一種半導體清洗設備的晶圓翻轉裝置,設置於半導體清洗設備的前置機械手及後置機械手之間,用於供前置機械手及後置機械手取放晶圓,並且對晶圓進行翻轉,該晶圓翻轉裝置的結構示意圖如圖1A及圖1B所示,包括:翻轉機構1、翻轉支座2、第一夾持機構3及第二夾持機構4;翻轉機構1與翻轉支座2連接,第一夾持機構3及第二夾持機構4對稱設置於翻轉支座2的兩端,翻轉機構1用於驅動翻轉支座2翻轉,以帶動第一夾持機構3及第二夾持機構4在第一位置及第二位置之間相互替換,第一夾持機構3及第二夾持機構4均用於選擇性夾持或釋放晶圓100;第一夾持機構3及第二夾持機構4中的一者位於上述第一位置,另一者位於上述第二位置時,可配合前置機械手進行放片,同時配合後置機械手進行取片。The embodiment of the present application provides a wafer flipping device for semiconductor cleaning equipment, which is installed between the front manipulator and the rear manipulator of the semiconductor cleaning equipment, and is used for the front manipulator and the rear manipulator to pick and place the wafer. And the wafer is turned over. The structural diagram of the wafer turning device is shown in Figure 1A and Figure 1B, including: turning mechanism 1, turning
當第一夾持機構3位於第一位置及第二夾持機構4位於第二位置時,第一夾持機構3可從前置機械手(圖中未示出)上夾持晶圓100,後置機械手(圖中未示出)可從第二夾持機構4上取走晶圓100;當第一夾持機構3位於第二位置且第二夾持機構4位於第一位置時,後置機械手可從第一夾持機構3取走晶圓100,第二夾持機構4可從前置機械手上夾持晶圓100。When the
如圖1A及圖1B所示,半導體清洗設備具體可以是單片清洗機,用於對晶圓執行清洗製程,晶圓翻轉裝置可以設置於半導體清洗設備的前置機械手及後置機械手(圖中均未示出)之間,用於對晶圓進行翻轉,但是本申請實施例並不以此為限,本領域技術人員可以根據實際情況自行調整設置晶圓翻轉裝置的位置。翻轉機構1具體可以採用回轉氣缸,用於驅動翻轉支座2進行翻轉,其不僅控制精確且成本較低。翻轉機構1具體可以通過一支架11固定設置於一平臺上,但是其也可以直接設置於一平臺上,因此本申請實施例並不以此為限。翻轉支座2例如採用一套筒結構,翻轉支座2的外周(在套筒的外周壁上)與翻轉機構1連接,並且,翻轉支座2在其軸向上的兩端分別與第一夾持機構3及第二夾持機構4連接。翻轉機構1驅動翻轉支座2圍繞其徑向中心線翻轉,例如,如果在翻轉前,翻轉支座2的其中一端朝上,那麼在經過180°翻轉後,該端朝下,由此,分別與翻轉機構1的兩端連接的第一夾持機構3和第二夾持機構4所在位置即為上述第一位置和第二位置,在翻轉支座2經過180°翻轉時,第一夾持機構3和第二夾持機構4可以實現在第一位置和第二位置之間相互替換。As shown in Figure 1A and Figure 1B, the semiconductor cleaning equipment can specifically be a single-chip cleaning machine, which is used to perform a cleaning process on the wafer, and the wafer turning device can be installed on the front manipulator and the rear manipulator of the semiconductor cleaning equipment ( (not shown in the figure) is used to flip the wafer, but the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the position of the wafer flipping device according to the actual situation. The overturning mechanism 1 can specifically adopt a rotary cylinder for driving the overturning
例如,當第一夾持機構3位於第一位置且第二夾持結構4位於第二位置時,第一夾持機構3位於翻轉支座2的底端,第二夾持機構4則可以位於翻轉支座2的頂端;而當第一夾持機構3位於第二位置且第二夾持結構4位於第一位置時,第二夾持機構4位於翻轉支座2的底端,而第一夾持機構3則位於翻轉支座2的頂端。在實際應用時,第一夾持機構3位於翻轉支座2的底端,而第二夾持機構4位於翻轉支座2的頂端,即第一夾持機構3位於第一位置且第二夾持機構4位於第二位置時,前置機械手可以將第一個晶圓100傳送至第一夾持機構3上,由第一夾持機構3對第一個晶圓100進行夾持,即實現放片,翻轉機構1驅動翻轉支座2翻轉180°,以帶動第一夾持機構3翻轉至第二位置,同時帶動第二夾持結構4翻轉至第一位置,此時後置機械手可以由第一夾持機構3上取走第一個晶圓100,即實現取片,同時前置機械手可以繼續將第二個晶圓100傳送至第二夾持機構4上,由第二夾持機構4對晶圓100進行夾持,此時翻轉機構1可以再次帶動第一夾持機構3及第二夾持機構4翻轉以使兩者的位置互換,並且以此類推。For example, when the
本申請實施例通過在翻轉支座的兩端對稱設置有第一夾持機構及第二夾持機構,並且通過翻轉機構帶動兩者在第一位置及第二位置 之間相互替換,在實際使用時,第一夾持機構及第二夾持機構中的一者位於第一位置,另一者位於第二位置時,一者配合前置機械手進行放片,同時另一者配合後置機械手進行取片,實現了同時與前、後置機械手配合工作,節省了翻轉步驟,從而在實現晶圓翻轉的同時,大幅縮短了晶圓翻轉及傳輸時間,從而大幅提高了晶圓傳輸過程的工作效率,進而大幅提高了半導體清洗設備的工作效率。In the embodiment of the present application, a first clamping mechanism and a second clamping mechanism are arranged symmetrically at both ends of the overturning support, and the two are driven by the overturning mechanism to replace each other between the first position and the second position. When one of the first clamping mechanism and the second clamping mechanism is at the first position, and the other is at the second position, one of them cooperates with the front manipulator to release the film, while the other cooperates with the rear mechanical arm The hand is used to pick up the wafer, which realizes the simultaneous work with the front and rear manipulators, saving the flipping step, thus greatly shortening the wafer flipping and transfer time while realizing the wafer flipping, thereby greatly improving the wafer transfer process. The work efficiency, and then greatly improve the work efficiency of semiconductor cleaning equipment.
於本申請的一實施例中,如圖1A至圖2所示,第一夾持機構3及第二夾持機構4均包括安裝殼51、多個夾持元件52及驅動元件53,其中,多個夾持組件52沿安裝殼51的周向均勻且間隔設置;驅動組件53設置在安裝殼51上,用於驅動多個夾持元件52相對於安裝殼51同時運動,以夾持或釋放晶圓100;任意相鄰的兩個夾持元件52之間的間隙用於供前置機械手或者後置機械手伸入以取放晶圓100。In an embodiment of the present application, as shown in FIGS. 1A to 2 , the
如圖1A至圖2所示,第一夾持機構3及第二夾持機構4可以採用完全相同的結構,以便於配合前、後置機械手取放晶圓100的需要,但是本申請實施例並不以此為限,例如兩者也可以採用不同的結構。第一夾持機構3及第二夾持機構4均可以包括安裝殼51及多個夾持元件52,安裝殼51可以採用圓柱形結構,安裝殼51整體可以設置在翻轉支座2的端部上,並且安裝殼51內具有容置空間514,以用於安裝多個夾持元件52。夾持元件52的具體數量可以為三個,三個夾持元件52可以沿安裝殼51的周向均勻分佈,並且可選的,夾持元件52的一端可以伸入安裝殼51的容置空間514內,另一端沿安裝殼51的徑向或者與該徑向呈夾角的方向延伸至遠離安裝殼51的位置處,即多個夾持組件52沿安裝殼51的不同徑向或與不同徑向呈夾角的方向呈放射狀分佈。進一步的,任意相鄰的兩個夾持元件52之間具有間隙,由於採用三個夾持元件52,任意相鄰的兩個夾持元件52之間呈120°的夾角,以供前、後置機械手從該間隙內伸入以實現取放晶圓100,但是本申請實施例並不限定夾持元件52的具體數量,例如夾持元件52的數量還可以是三個以上。驅動組件53設置在安裝殼51上,用於驅動多個夾持元件52相對於安裝殼51同時運動。在實際應用時,多個夾持元件52在驅動元件53的驅動下相對於安裝殼51同時運動,以實現選擇性夾持或釋放晶圓100。採用上述設計,使得本申請結構簡易於實現,並且還能避免與前、後置機械手發生機械干涉,從而大幅提高本申請實施例的應用及維護成本。As shown in Figure 1A to Figure 2, the
需要說明的是,本申請實施例並不限定多個夾持元件52與安裝殼51之間的運動方式,例如驅動元件53可以驅動多個夾持元件52同時相對於安裝殼51伸縮或擺動,從而實現對晶圓100的夾持或釋放。因此本申請實施例並不以此為限,本領域技術人員可以根據實際情況自行調整設置。It should be noted that the embodiment of the present application does not limit the movement mode between the plurality of clamping
於本申請的一實施例中,如圖2所示,每個夾持元件52均與安裝殼51樞轉連接,且能相對於安裝殼51沿第一方向或沿與之方向相反的第二方向擺動;多個夾持組件52能均沿上述第一方向擺動,以夾持晶圓;或者,均沿上述第二方向擺動,以釋放晶圓;第一方向與第二方向均為安裝殼51的周向,並且第一方向與第二方向相反。In one embodiment of the present application, as shown in FIG. 2 , each clamping
如圖2所示,多個夾持元件52均與安裝殼51樞轉連接,並且驅動元件53驅動多個夾持元件52相對於安裝殼51沿第一方向擺動,該第一方向例如為順時針方向,以使多個夾持元件52遠離安裝殼51的一端同時靠近安裝殼51,從而實現對晶圓進行夾持。驅動元件53驅動多個夾持元件52相對於安裝殼51沿第二方向擺動,該第二方向例如可以為逆時針方向,以使多個夾持元件52遠離安裝殼51的一端同時遠離安裝殼51,從而實現對晶圓進行釋放。採用上述設計,由於多個夾持元件52同時朝第一方向擺動以夾持晶圓,並且多個夾持元件52同時朝第二方向擺動以釋放晶圓,不僅能提高夾持晶圓的效率,而且還能大幅降低本申請實施例的結構複雜性,從而大幅降低應用及維護成本。As shown in FIG. 2 , a plurality of clamping
需要說明的是,本申請實施例並不限定第一方向及第二方向的具體方向,例如第一方向為逆時針方向,而第二方向為順時針方向,同樣能夠達到上述技術效果。因此本申請實施例並不以此為限,本領域技術人員可以根據實際情況自行調整設置。It should be noted that the embodiment of the present application does not limit the specific directions of the first direction and the second direction. For example, the first direction is counterclockwise and the second direction is clockwise, and the above technical effect can also be achieved. Therefore, the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the setting by themselves according to the actual situation.
於本申請的一實施例中,如圖2至圖5所示,每個夾持元件52均包括擺臂521及夾持柱522;擺臂521的第一端524通過樞轉軸523與安裝殼51樞轉連接,擺臂521的第二端525設置有夾持柱522,多個夾持柱522用於與晶圓的邊緣接觸以共同夾持晶圓。具體地,擺臂521上靠近第一端524處開設有樞轉孔526;安裝殼51內設置有可穿設在樞轉孔526中的樞轉軸523,擺臂521通過樞轉軸523與安裝殼51樞轉連接。In one embodiment of the present application, as shown in FIGS. 2 to 5 , each clamping
如圖2至圖5所示,擺臂521具體可以為採用金屬材質製成的杆狀結構,可選的,多個擺臂521的第一端524伸入安裝殼51內,第二端525沿安裝殼51的徑向或與徑向呈夾角的方向延伸設置,並且第二端525的底部可以設置有夾持柱522,多個擺臂521上的夾持柱522相互配合以用於夾持晶圓的邊緣。樞轉軸523穿設於擺臂521的樞轉孔526中,並且樞轉孔526靠近第一端524設置,樞轉軸523固定連接於安裝殼51內,以實現擺臂521與安裝殼51的樞轉連接,樞轉軸523可以靠近擺臂521的第一端524設置,以使得第一端524伸入安裝殼51內。需要說明的是,本申請實施例並不限定樞轉軸523的具體數量,只要其與擺臂521一一對應設置即可。採用上述設計,使得本申請實施例結構簡單易於實現,從而大幅降低應用及維護成本。As shown in Figures 2 to 5, the
於本申請的一實施例中,如圖2至圖4所示,驅動元件53包括第一驅動件6、第二驅動件7及驅動器8,其中,第一驅動件6和第二驅動件7均設置於安裝殼51內,驅動器8設置於安裝殼51上,且與第二驅動件7連接,驅動器8用於在通電時通過第二驅動件7同時驅動多個夾持元件52的擺臂521圍繞樞轉軸523沿上述第二方向擺動;第一驅動件6用於在驅動器8斷電時,同時帶動多個夾持元件52的擺臂521圍繞樞轉軸523沿上述第一方向擺動。採用上述設計,由於第一驅動件6及第二驅動件7分別帶動擺臂521沿第一方向及第二方向擺動,使得本申請實施例可以對擺臂521的擺動方向進行分別控制,不僅可以大幅降低回應時間,從而提高本申請實施例的控制效率,而且還能使得多個擺臂521能夠同時控制,從而大幅提高控制精°。In one embodiment of the present application, as shown in FIGS. They are all arranged in the
需要說明的是,本申請實施例並不限定驅動元件53必須包括有兩個驅動件,例如驅動元件53還可以僅包括有第二驅動件7,由驅動器8通過第二驅動件7帶動多個擺臂521沿第一方向或第二方向擺動。因此本申請實施例並不以此為限,本領域技術人員可以根據實際情況自行調整設置。It should be noted that the embodiment of the present application does not limit the driving
於本申請的一實施例中,如圖2至圖4所示,第一驅動件6包括多個彈性部件61,多個彈性部件61與多個擺臂521一一對應設置,並且多個彈性部件61沿安裝殼51的周向均位於多個擺臂521的同一側,彈性部件61的一端與安裝殼51連接,另一端與擺臂521連接,連接位置例如在樞轉孔526與第二端525之間,用於提供能夠在驅動器8斷電時使擺臂521重定的彈力(例如彈性恢復力),以帶動擺臂521沿第一方向擺動。具體來說,三個彈性部件61與三個擺臂521採用一一對應的方式設置,並且三個彈性部件61均位於擺臂521順時針方向的一側,即多個彈性部件61沿安裝殼51的周向位於多個擺臂521的同一側。彈性部件61的一端與安裝殼51內連接,另一端連接至樞轉孔526與第二端525之間的位置上,並且與擺臂521連接。通過對彈性部件61施加一預緊力,使得彈性部件61始終對擺臂521施加一彈性恢復力,以帶動擺臂521始終沿第一方向擺動,由於多個彈性部件61均位於擺臂521順時針方向的一側,使得第一方向為順時針方向。採用上述設計,由於採用較為簡單的結構即可以實現多個擺臂521同時沿第一方向擺動,不僅能降低加工製造難度,而且還能大幅降低應用及維護成本。In an embodiment of the present application, as shown in FIGS. The
需要說明的是,本申請實施例並不限定彈性部件61的具體位置,例如彈性部件61也可以設置於擺臂521逆時針方向的一側,使得第一方向為逆時針方向。因此本申請實施例並不以此為限,本領域技術人員可以根據實際情況自行調整設置。It should be noted that the embodiment of the present application does not limit the specific position of the
於本申請的一實施例中,如圖2至圖5所示,安裝殼51內及擺臂521上均設置有連接柱62,彈性部件61的兩端分別與安裝殼51內的連接柱62以及擺臂521上的連接柱62連接。具體來說,彈性部件61具體可以採用卷圈彈簧,兩個連接柱62分別設置於安裝殼51內以及擺臂521上,擺臂521上的連接柱62位於樞轉孔526及第二端525之間,並且與夾持柱522同側設置,彈性部件61的兩端均通過連接柱62與安裝殼51與擺臂521連接。彈性部件61的彈性恢復力可以帶動擺臂521沿第一方向擺動,以使設置於第二端525的夾持柱522對晶圓進行夾持,由於採用彈性部件61的彈性恢復力對晶圓進行夾持,使得晶圓受力較小,還能避免由於夾持力較大造成晶圓損壞。採用上述設計,不僅使得本申請實施例結構簡單設計合理,而且還能大幅降低應用及維護成本。但是本申請實施例並不限定彈性部件61的具體實施方式,例如彈性部件61的也可以採用其它類型的彈性結構,因此本申請實施例並不以此為限,本領域技術人員可以根據實際情況自行調整。In one embodiment of the present application, as shown in Fig. 2 to Fig. 5, a connecting
於本申請的一實施例中,如圖2至圖5所示,驅動器8設置於安裝殼51的外部,且驅動器8的輸出軸伸入安裝殼51內,並與第二驅動件7連接,用於驅動第二驅動件7轉動;多個擺臂521的第一端524伸入安裝殼51內,並與第二驅動件7相接觸,以使第二驅動件7在轉動時,能夠推動擺臂521沿上述第二方向擺動。具體地,驅動器8例如位於安裝殼51的頂部,第二驅動件7設置於安裝殼51內,第二驅動件7的頂部與輸出軸連接,底部與多個擺臂521的第一端524接觸,用於頂抵第一端524以帶動擺臂521沿第二方向擺動。In one embodiment of the present application, as shown in FIGS. 2 to 5 , the
如圖2至圖5所示,驅動器8具體可以採用步進電機或者伺服電機,驅動器8可以設置於安裝殼51的頂部,並且驅動器8的輸出軸伸入安裝殼51的容置空間514內。第二驅動件7設置於安裝殼51的容置空間514內,並且與安裝殼51同軸設置。第二驅動件7的頂部居中位置可以與驅動器8的輸出軸固定連接,底部分別與多個擺臂521的第一端524接觸。在實際應用時,驅動器8驅動第二驅動件7轉動,第二驅動件7通過頂抵多個擺臂521的第一端524,以使多個擺臂521能克服第一驅動件6的彈性恢復力,從而沿第二方向擺動,以使得多個夾持柱522釋放晶圓。採用上述設計,由於第二驅動件7與多個擺臂521的第一端524接觸,並且通過克服第一驅動件6的彈性恢復力,使得多個擺臂521同時沿第二方向擺動以釋放晶圓,使得本申請實施例的控制邏輯簡單,並且還能提高安全性及穩定性。As shown in FIGS. 2 to 5 , the
需要說明的是,本申請實施例並不限定第二驅動件7與多個擺臂521的第一端524的接觸的方式,例如第二驅動件7與多個擺臂521之間採用樞轉連接方式即可以實現接觸。因此本申請實施例並不以此為限,本領域技術人員可以根據實際情況自行調整設置。It should be noted that the embodiment of the present application does not limit the contact mode between the
於本申請的一實施例中,如圖2至圖7所示,第二驅動件7包括有傳動盤71及滾動部件72,傳動盤71與驅動器8的輸出軸同軸設置,傳動盤71背離驅動器8的側面上設置(例如均勻分佈)有多個滾動部件72,各個擺臂521的第一端524一一對應地延伸至各個滾動部件72在傳動盤71圓周方向上的一側,並與滾動部件72滾動接觸,彈性部件61和滾動部件72分別位於對應的擺臂521的相對兩側。具體地,多個滾動部件72與多個擺臂521一一對應設置,並且滾動部件72與彈性部件61位於擺臂521的相對兩側,滾動部件72在頂抵第一端524時可自旋轉。In one embodiment of the present application, as shown in Figures 2 to 7, the
如圖2至圖7所示,傳動盤71具體可以為採用金屬材質製成的圓形板狀結構,傳動盤71的頂面居中位置與驅動器8的輸出軸連接,底面上均布多個滾動部件72,即傳動盤71背離驅動器8側面上均布有多個滾動部件72。多個滾動部件72的數量與擺臂521的數量對應設置,例如設置有三個,即多個滾動部件72與多個擺臂521一一對應設置。進一步的,滾動部件72與彈性部件61分別位於擺臂521第一端524的相對兩側,即多個滾動部件72均位於多個擺臂521逆時針方向的一側,以用於與彈性部件61配合帶動擺臂521進行擺動。在實際應用時,驅動器8通過傳動盤71帶動多個滾動部件72同時移動,多個滾動部件72同時頂抵擺臂521的第一端524,以使多個擺臂521同時沿第二方向擺動,並且此時滾動部件72自旋轉以減少與第一端524摩擦產生的雜質,從而避免對晶圓造成雜質污染。採用上述設計,由於多個滾動部件72均位於擺臂521的一側,使得本申請實施例結構簡單,從而大幅提高拆裝維護效率,進而進一步提高本申請實施例的工作效率。As shown in Figures 2 to 7, the
需要說明的是,本申請實施例並不限定多個滾動部件72的設置位置,例如滾動部件72可以位於擺臂521順時針方向的一側,即滾動部件72與彈性部件61的位置互換。因此本申請實施例並不以此為限,本領域技術人員可以根據實際情況自行調整設置。It should be noted that the embodiment of the present application does not limit the installation positions of the plurality of rolling
於本申請的一實施例中,如圖2至圖7所示,滾動部件72包括安裝軸73及軸承74,安裝軸73與傳動盤71固定連接,且安裝軸73的軸線與驅動器8的輸出軸相互平行;軸承74套設於安裝軸73上。具體來說,三個安裝軸73均設置於傳動盤71的底面上,並且沿傳動盤71的周向均勻且間隔排布,三個軸承74分別設置於安裝軸73上,軸承74的外周用於與擺臂521的第一端524實現滾動接觸。採用上述設計使得本申請實施例應用及維護成本較低,從而提高工作效率及經濟效益。但是本申請實施例並不限定滾動部件72的具體實施方式,例如滾動部件72僅包括一軸承74,其內圈設置於傳動盤71即可。因此本申請實施例並不以此為限,本領域技術人員可以根據實際情況自行調整設置。In one embodiment of the present application, as shown in Figures 2 to 7, the rolling
於本申請的一實施例中,如圖2至圖7所示,安裝殼51包括頂板511、立柱512及底板513,多個立柱512位於頂板511及底板513之間,並且沿頂板511及底板513的周向均勻且間隔排布,任意兩個立柱512之間的間隙用於供擺臂521的第一端524伸入,驅動器8設置於頂板511背離底板513一側。In one embodiment of the present application, as shown in FIGS. 2 to 7 , the
如圖2至圖7所示,頂板511與底板513均可以為金屬材質製成的圓形板狀結構,而立柱512可以採用一體成形的方式形成於底板513的頂面上,並且多個立柱512均沿底板513的周向均勻且間隔分佈。頂板511可以設置於底板513的上方,並且通過多個緊固件與多立柱512固定連接,以與底板513配合形成有容置空間514,頂板511的頂面上可以用於安裝驅動元件53的驅動器8。由於擺臂521的數量為三個,因此立柱512的具體數量可以為三個,以便任意兩相鄰的立柱512之間形成有間隙,供擺臂521的第一端524伸入安裝殼51的容置空間514內,並且該間隙可以用於安裝擺臂521的樞轉軸523以及彈性部件61的連接柱62。但是本申請實施例並不限定立柱512的具體數量,連接柱62的具體數量可以與擺臂521的數量對應設置,因此本申請實施例並不以此為限,本領域技術人員可以根據實際情況自行調整設置。採用上述設計,使得本申請實施例便於拆裝維護,即便於安裝第二驅動件7及驅動器8,從而進一步提高拆裝維護效率。As shown in Figures 2 to 7, both the
需要說明的是,本申請實施例並不限定安裝殼51的具體實施方式,例如多個立柱512與底板513之間採用分體式結構。因此本申請實施例並不以此為限,本領域技術人員可以根據實際情況自行調整設置。It should be noted that the embodiment of the present application does not limit the specific implementation manner of the
於本申請的一實施例中,如圖4所示,夾持柱522的一端與擺臂521的第二端525連接,並且夾持柱522的軸向與擺臂521的軸向相互垂直設置;夾持柱522的另一端開設有限位槽527,用於容納晶圓的邊緣。具體來說,夾持柱522的軸向可以與擺臂521的軸向相互垂直設置,以使得擺臂521在擺動時能夾緊或釋放晶圓。夾持柱522的頂端例如採用螺接方式與擺臂521的第二端525連接,但是本申請實施並不限定具體連接方式。夾持柱522的底部可以開設環形的限位槽527,當多個夾持柱522配合夾持晶圓時,限位槽527能容置晶圓的邊緣,以實現對晶圓的限位防止脫落,從而大幅提高本申請實施例穩定性及安全性,進而提高晶圓的製程良率。但是本申請實施例並不限定夾持柱522的具體結構,本領域技術人員可以根據實際情況自行調整設置。In one embodiment of the present application, as shown in FIG. 4, one end of the
於本申請的一實施例中,如圖1A及圖1B所示,翻轉機構1包括驅動部12及連接軸13,驅動部12固定設置,驅動部12的旋轉軸通過連接軸13與翻轉支座2連接。具體來說,驅動部12具體可以採用回轉氣缸,其具有控制精確及控制簡單的優點,便於直接將第一夾持機構3及第二夾持機構4一次性翻轉到位,從而大幅提高了本申請實施例的翻轉效率。連接軸13的一端與驅動部12的旋轉軸連接,另一端與翻轉支座2連接,由於翻轉支座2的兩端分別設置有第一夾持機構3及第二夾持機構4,通過設置連接軸13可以使得兩個夾持機構與翻轉機構1具有一定間距,避免兩個夾持機構在翻轉過程中與翻轉機構1發生機械干涉,從而使得本申請實施例結構設計合理,進而大幅降低故障率及提高使用壽命。需要說明的是,本申請實施例並不限定翻轉機構1的具體實施方式,例如驅動部12可以採用步進電機或者伺服電機。因此本申請實施例並不以此為限,本領域技術人員可以根據實際情況自行調整設置。In one embodiment of the present application, as shown in Figure 1A and Figure 1B, the turning mechanism 1 includes a driving
為了進一步說明本申請實施例的工作原理,以下結合附圖1A至圖8B對本申請的一具體實施方式進行說明如下。具體來說,當第一夾持機構3由前置機械手上取晶圓100時,第一夾持機構3位於第一位置以及第二夾持機構4位於第二位置,第一夾持機構3的驅動器8驅動第二驅動件7沿順時針旋轉,滾動部件72頂抵多個擺臂521的第一端524,以使得多個擺臂521的第二端525沿第二方向擺動,從而使得多個擺臂521上的夾持柱522組成的圓直徑尺寸變大,具體可以參照如圖8A及圖8B所示,前置機械手可以將晶圓100傳送至第一夾持機構3的下方,此驅動器8驅動第二驅動件7沿逆時針旋轉,滾動部件72不再頂抵擺臂521的第一端524,擺臂521在彈性部件61的彈性恢復力的拉緊作用下,沿第一方向進行擺動,以使多個擺臂521上的夾持柱522組成的圓直徑尺寸變小,從而實現對晶圓100進行夾持。然後翻轉機構1可以帶動第一夾持機構3翻轉至第二位置,並且帶動第二夾持機構4翻轉至第一位置,第一夾持機構3的驅動器8再次驅動第二驅動件7沿順時針旋轉,以使得多個擺臂521的第二端525沿第二方向擺動,從而使得多個擺臂521上的夾持柱522組成的圓直徑尺寸變大,以將夾持的晶圓100放置於後置機械手上。需要說明的是,第二夾持機構4與第一夾持機構3的工作原理相同,於此不再贅述。In order to further illustrate the working principle of the embodiment of the present application, a specific implementation manner of the present application will be described below with reference to FIGS. 1A to 8B . Specifically, when the
於本申請的一實施例中,如圖1A至圖3所示,翻轉支座2包括半環形的旋轉支座21及半環形的連接支座22,旋轉支座21與連接支座22配合構成套筒形的翻轉支座2,翻轉機構1與旋轉支座21連接,第一夾持機構3與第二夾持機構4的部分位於翻轉支座2內。In one embodiment of the present application, as shown in FIGS. 1A to 3 , the turning
如圖1A至圖3所示,翻轉支座2及連接支座22均可以為採用金屬材質製成的半環形套筒結構,並且兩者可以採用緊固件固定連接。其中,旋轉支座21的外周具有矩形凸台,連接軸13的端部可以採用多個緊固件與旋轉支座21上的矩形凸台連接;而連接支座22則可以採用緊固件固定設置於旋轉支座21的一側。第一夾持機構3的頂板511可以與翻轉支座2的底端連接,並且第一夾持機構3的驅動器8可以位於翻轉支座2內,而第二夾持機構4則可以對稱的設置於翻轉支座2的頂端。進一步的,旋轉支座21及連接支座22可以相互配合以將第一夾持機構3及第二夾持機構4卡合於翻轉支座2上,從而大幅提高拆裝維護效率。採用上述設計,由於第一夾持機構3及第二夾持機構4的部分可以位於翻轉支座2內,從而能大幅節省本申請實施例的空間佔用,並且由於翻轉支座2採用分體式結構,使得本申請實施例結構簡單,從而大幅提高拆裝維護效率。As shown in FIGS. 1A to 3 , both the
需要說明的是,本申請實施例並不限定翻轉支座2的具體結構,例如翻轉支座2也可以採用一體成形的方式製成。因此本申請實施例並不以此為限,本領域技術人員可以根據實際情況自行調整設置。It should be noted that the embodiment of the present application does not limit the specific structure of the overturning
基於同一發明構思,本申請實施例提供了一種半導體清洗設備,該半導體清洗設備的結構示意圖9所示,包括:前置機械手201、後置機械手202、製程腔室203及如上述各實施例提供的晶圓翻轉裝置204,前置機械手201用於將片盒205內的晶圓傳送至第一夾持機構3或者第二夾持機構4上,後置機械手202用於將第一夾持機構3或者第二夾持機構4上的晶圓傳送至製程腔室203內。具體來說,多個製程腔室203可以排布為兩行,並且距離兩行製程腔室203一端間隔設置有兩個片盒205,前置機械手201靠近兩個片盒205設置,後置機械手202設置兩行製程腔室203的端部之間,晶圓翻轉裝置204設置於前置機械手201及後置機械手202之間。採用上述設計,由於在第一夾持機構3與前置機械手201配合取放晶圓的同時,第二夾持機構4與後置機械手202配合取放晶圓,從而大幅提高半導體清洗設備的傳輸效率,進而大幅提高半導體清洗設備的工作效率。但是需要說明的是,本申請實施例並不限定製程腔室203及片盒205的具體數量,本領域技術人員可以根據實際情況自行調整設置。Based on the same inventive concept, the embodiment of the present application provides a semiconductor cleaning equipment. The structure schematic diagram of the semiconductor cleaning equipment is shown in 9, including: a
應用本申請實施例,至少能夠實現如下有益效果:By applying the embodiment of the present application, at least the following beneficial effects can be achieved:
本申請實施例通過在翻轉支座的兩端對稱設置有第一夾持機構及第二夾持機構,並且通過翻轉機構帶動兩者在第一位置及第二位置 之間相互替換,在實際使用時,第一夾持機構及第二夾持機構中的一者位於第一位置,另一者位於第二位置時,一者配合前置機械手進行放片,同時另一者配合後置機械手進行取片,實現了同時與前、後置機械手配合工作,節省了翻轉步驟,從而在實現晶圓翻轉的同時,大幅縮短了晶圓翻轉及傳輸時間,從而大幅提高了晶圓傳輸過程的工作效率,進而大幅提高了半導體清洗設備的工作效率。In the embodiment of the present application, a first clamping mechanism and a second clamping mechanism are arranged symmetrically at both ends of the overturning support, and the two are driven by the overturning mechanism to replace each other between the first position and the second position. When one of the first clamping mechanism and the second clamping mechanism is at the first position, and the other is at the second position, one of them cooperates with the front manipulator to release the film, while the other cooperates with the rear mechanical arm The hand is used to pick up the wafer, which realizes the simultaneous work with the front and rear manipulators, saving the flipping step, thus greatly shortening the wafer flipping and transfer time while realizing the wafer flipping, thereby greatly improving the wafer transfer process. The work efficiency, and then greatly improve the work efficiency of semiconductor cleaning equipment.
前述內容概括數項實施例之特徵,使得熟習此項技術者可更佳地理解本揭露之態樣。熟習此項技術者應瞭解,其等可容易地使用本揭露作為用於設計或修改用於實行本文仲介紹之實施例之相同目的及/或達成相同優點之其他製程及結構之一基礎。熟習此項技術者亦應瞭解,此等等效構造不背離本揭露之精神及範疇,且其等可在不背離本揭露之精神及範疇之情況下在本文中作出各種改變、置換及更改。The foregoing content summarizes the features of several embodiments, so that those skilled in the art can better understand aspects of the present disclosure. Those skilled in the art should appreciate that they can readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments described herein. Those skilled in the art should also understand that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.
1:翻轉機構 2:翻轉支座 3:第一夾持機構 4:第二夾持機構 6:第一驅動件 7:第二驅動件 8:驅動器 11:支架 12:驅動部 13:連接軸 21:旋轉支座 22:連接支座 51:安裝殼 52:夾持組件 53:驅動組件 61:彈性部件 62:連接柱 71:傳動盤 72:滾動部件 73:安裝軸 74:軸承 100:晶圓 201:前置機械手 202:後置機械手 203:製程腔室 204:晶圓翻轉裝置 205:片盒 511:頂板 512:立柱 513:底板 514:容置空間 521:擺臂 522:夾持柱 523:樞轉軸 524:第一端 525:第二端 526:樞轉孔 527:限位槽 1: Flip mechanism 2: flip support 3: The first clamping mechanism 4: The second clamping mechanism 6: The first driver 7: The second driver 8: drive 11: Bracket 12: Drive Department 13: connecting shaft 21: Swivel support 22: Connection support 51: Install the shell 52: clamping components 53: Drive components 61:Elastic part 62: connecting column 71: Transmission disc 72:Rolling parts 73: Install shaft 74: Bearing 100: Wafer 201: Front manipulator 202: rear manipulator 203: Process chamber 204: Wafer flipping device 205: film box 511: top plate 512: column 513: Bottom plate 514:Accommodating space 521: arm swing 522: clamping column 523: Pivot axis 524: first end 525: second end 526: pivot hole 527: limit slot
當結合附圖閱讀時,從以下詳細描述最佳理解本揭露之態樣。應注意,根據產業中之標準實踐,各種構件未按比例繪製。事實上,為了論述的清楚起見可任意增大或減小各種構件之尺寸。 圖1A為本申請實施例提供的一種晶圓翻轉裝置夾持晶圓的結構示意圖; 圖1B為本申請實施例提供的一種晶圓翻轉裝置的分解示意圖; 圖2為本申請實施例提供的一種第一夾持機構及第二夾持機構的結構示意圖; 圖3為本申請實施例提供的一種第一夾持機構及第二夾持機構的分解示意圖; 圖4為本申請實施例提供的一種夾持組件的結構示意圖; 圖5為本申請實施例提供的一種安裝殼的局部結構示意圖; 圖6為本申請實施例提供的一種第二驅動件俯視狀態的立體示意圖; 圖7為本申請實施例提供的一種第二驅動件仰視狀態的立體示意圖; 圖8A為本申請實施例提供的一種第一夾持機構及第二夾持機構省略部分結構的局部放大示意圖; 圖8B為本申請實施例提供的一種第一夾持機構及第二夾持機構夾持晶圓的俯視示意圖; 圖9為本申請實施例提供的一種半導體清洗設備的結構示意圖。 Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying drawings. It should be noted that, in accordance with the standard practice in the industry, various components are not drawn to scale. In fact, the dimensions of the various components may be arbitrarily increased or decreased for clarity of discussion. FIG. 1A is a schematic structural diagram of a wafer flipping device clamping a wafer provided by an embodiment of the present application; FIG. 1B is an exploded schematic diagram of a wafer flipping device provided in an embodiment of the present application; Fig. 2 is a schematic structural diagram of a first clamping mechanism and a second clamping mechanism provided by the embodiment of the present application; Fig. 3 is an exploded schematic diagram of a first clamping mechanism and a second clamping mechanism provided by the embodiment of the present application; FIG. 4 is a schematic structural diagram of a clamping assembly provided in an embodiment of the present application; FIG. 5 is a schematic diagram of a partial structure of an installation shell provided by an embodiment of the present application; Fig. 6 is a perspective schematic diagram of a top view state of a second driving member provided by the embodiment of the present application; Fig. 7 is a schematic perspective view of a second driving member in a bottom view provided by an embodiment of the present application; Fig. 8A is a partially enlarged schematic diagram of a first clamping mechanism and a second clamping mechanism provided by the embodiment of the present application, omitting part of the structure; 8B is a schematic top view of a wafer clamped by a first clamping mechanism and a second clamping mechanism according to an embodiment of the present application; FIG. 9 is a schematic structural diagram of a semiconductor cleaning device provided in an embodiment of the present application.
1:翻轉機構 1: Flip mechanism
2:翻轉支座 2: flip support
11:支架 11: Bracket
100:晶圓 100: Wafer
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CN116469830B (en) * | 2023-06-19 | 2023-08-22 | 北京芯士联半导体科技有限公司 | Wafer box overturning device of etching machine |
CN116968071B (en) * | 2023-09-07 | 2024-03-08 | 上海广川科技有限公司 | Anti-skid device for wafer transmission and mechanical finger |
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