CN116469830B - Wafer box overturning device of etching machine - Google Patents
Wafer box overturning device of etching machine Download PDFInfo
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- CN116469830B CN116469830B CN202310722041.0A CN202310722041A CN116469830B CN 116469830 B CN116469830 B CN 116469830B CN 202310722041 A CN202310722041 A CN 202310722041A CN 116469830 B CN116469830 B CN 116469830B
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- 238000003825 pressing Methods 0.000 claims abstract description 143
- 230000007306 turnover Effects 0.000 claims abstract description 17
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The application provides a wafer box overturning device of an etching machine, which comprises an overturning structure, wherein a wafer box fixing structure is arranged on the overturning structure. The wafer box fixing structure comprises a fixing platform, wherein the fixing platform comprises a bottom plate and a vertical plate which are perpendicular to each other, a pressing component and a clamping component are arranged on the vertical plate, the pressing component is used for pressing the wafer box on the bottom plate, and the clamping component is used for clamping the wafer box. The bottom plate is provided with a micro switch which is used for sensing whether the wafer box is placed on the bottom plate. The wafer box turnover device of the etching machine has the characteristics of compact space, low price, universal adaptability, capability of reducing abnormal equipment butt joint, capability of adapting to the development of modern semiconductor equipment and the like.
Description
Technical Field
The application belongs to the field of semiconductor element manufacturing, relates to a wafer box overturning design technology in an etching machine, and particularly relates to a wafer box overturning device of the etching machine.
Background
In the semiconductor manufacturing process, a wafer needs to be taken and placed from a wafer box, and a common operation method is that the wafer box arranged on a wafer box mounting mechanism is subjected to subsequent operation after a material taking angle and a wafer position are adjusted through a mechanical arm and then the wafer box is turned to a sampling position.
At present, the existing wafer box installation mechanism is generally a device with a fixed angle, which is difficult to randomly adjust the sampling angle of the wafer box according to the requirement of a user, has a relatively narrow application range, and designs different wafer box installation mechanisms according to different requirements, so that the design cost can be greatly increased.
Moreover, the existing wafer box mounting mechanism generally adopts a clamping groove or a positioning block mode to fix the wafer box, and the wafer box is easy to loose and topple over in the wafer box moving process in the fixing mode, so that the stability of the wafer box is poor, and the wafer box is easy to break and the fragment rate is improved.
Therefore, it is necessary to design a device which is suitable for different sampling angle requirements of users and can ensure the stability of the wafer box so as to ensure normal sampling.
Disclosure of Invention
The application aims to solve the problems that in the prior art, a wafer box mounting mechanism is difficult to randomly adjust the sampling angle of a wafer box according to the requirement of a user, the wafer box is poor in stability on the wafer box mounting mechanism, the wafer box is easy to damage and the like, and further designs a wafer box overturning device of an etching machine.
The technical scheme for realizing the aim of the application is as follows: the wafer box overturning device of the etching machine comprises an overturning structure, wherein a wafer box fixing structure is arranged on the overturning structure.
The wafer box fixing structure comprises a fixing platform, wherein the fixing platform comprises a bottom plate and a vertical plate which are perpendicular to each other, a pressing component and a clamping component are arranged on the vertical plate, the pressing component is used for pressing the wafer box on the bottom plate, and the clamping component is used for clamping the wafer box.
The bottom plate is provided with a micro switch which is used for sensing whether the wafer box is placed on the bottom plate.
According to the wafer box overturning device of the etching machine, the wafer box is tightly pressed on the bottom plate through the pressing component, and the wafer box is clamped through the clamping component, so that the wafer box can be stably arranged on the wafer box fixing structure. Meanwhile, the micro switch can sense whether the wafer box is placed on the bottom plate or not, and further monitor whether abnormal conditions such as position change and the like occur in the wafer box on the wafer box fixing structure, and can send signals to the controller when the wafer box is detected on the bottom plate, so that the controller can control the following photoelectric sensor to start working.
Further, the pressing component comprises a supporting frame and a pressing block.
Wherein, the support frame is fixed in riser upper end, and the free end rotation of support frame is connected with down the briquetting, and is close to riser one end on the briquetting down and is the pressure portion of holding, keeps away from riser one end and is equipped with the rolling element.
The rolling piece is equipped with the clamp plate below, and one side rotation of clamp plate sets up on the riser, and the rolling piece is used for being close to or keep away from the clamp plate upper surface, and rolls at the clamp plate upper surface after rolling piece and clamp plate upper surface contact to realize that the clamp plate rotates on the riser.
Still further, the hold-down assembly further includes a photo sensor.
The photoelectric sensor is arranged on the support frame and used for sensing the relative position of the pressing plate and the support frame;
or the photoelectric sensor is arranged on the lower pressing block and used for sensing the relative position of the pressing plate and the lower pressing block.
Still further, the pressure holding assembly further comprises a reset piece, one end of the reset piece is connected with the upper end of the support frame or the vertical plate, and the other end of the reset piece is connected with the pressure plate.
Further, one side surface or two side surfaces of the lower pressing block are provided with limit posts, and the limit posts are positioned close to the pressing part.
Further, the free end of the pressing plate is provided with a square groove, and the upper surface of the pressing plate is provided with a rolling groove of the rolling piece.
Preferably, the pressure plate is made of elastic material.
Further, the upper surface of bottom plate is equipped with the shifting chute, is equipped with the movable block in the shifting chute, and is fixed with micro-gap switch on the movable block.
Further, the clamping assembly comprises two strip-shaped blocks, the two strip-shaped blocks are parallel to each other, the distance between the two strip-shaped blocks is adjustable, and a clamping space for clamping the wafer box is formed between the two strip-shaped blocks.
Further, the turnover structure comprises a rotating shaft fixing plate and a worm and gear transmission assembly.
The upper surface of the rotating shaft fixing plate is connected with the lower surface of the bottom plate through a plurality of struts, and the lower part of the rotating shaft fixing plate is connected with a worm wheel of the worm and gear transmission assembly through a rotating shaft; the worm of the worm gear and worm transmission assembly is connected with the motor through a coupler.
Further, a reinforcing piece is arranged at the connection position of the bottom plate and the vertical plate.
Compared with the prior art, the application has the beneficial effects that: the wafer box turnover device of the etching machine has the characteristics of compact space, low price, universal adaptability, capability of reducing abnormal equipment butt joint, capability of adapting to the development of modern semiconductor equipment and the like, and has the following advantages:
1. can realize the fixed to arbitrary specification wafer box among the etching machine wafer box turning device, and through pressing the subassembly and clamping assembly (or through pressing subassembly, clamping assembly, movable block) with the stable installation of wafer box to the device, avoid the wafer box not hard up even break away from the risk on the device.
2. In the process of fixing the wafer box by using the wafer box fixing structure, the relative position of the pressing plate and the supporting frame or the relative position of the pressing plate and the lower pressing block can be sensed in real time by the photoelectric sensor, whether the pressing plate is in a clamping state to the wafer box can be timely judged, and meanwhile, when the position of the wafer box is changed by using the turnover structure to rotate, the operator can timely take measures after warning is provided for the operator after abnormality is timely found.
3. The turnover structure adopts the worm and gear transmission assembly, the volume of the turnover structure is greatly reduced through the transmission of the worm and the gear, and the turnover structure can be used for taking and placing the wafer in the wafer box in a butt joint manner with the manipulator at any angle within a set angle range, so that the applicability of the turnover device for the wafer box of the etching machine is greatly improved, and the standardization of semiconductor equipment is obviously improved.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described.
FIG. 1 is a schematic diagram of a wafer cassette flipping mechanism of an etcher in accordance with the present application;
FIG. 2 is a schematic view of a wafer cassette fixing structure according to an embodiment;
FIG. 3 is a schematic view of a platen pressing a wafer cassette against a base plate in an embodiment;
FIG. 4 is a schematic view of a platen without acting on a cassette in an embodiment;
FIG. 5 is a schematic view of a photo sensor on a wafer cassette holding structure according to one embodiment;
FIG. 6 is a schematic diagram of a flip structure in an embodiment;
wherein, 100, the overturning structure; 1. a bottom plate; 2. a vertical plate; 3. a press-holding assembly; 4. a clamping assembly; 5. a wafer cassette; 6. a micro-switch; 7. a moving groove; 8. a moving block; 9. a reinforcing member; 31. a support frame; 32. pressing the block; 33. a rolling member; 34. a pressing plate; 35. a photoelectric sensor; 36. a reset member; 37. a limit column; 341. a square groove; 51. a transverse connecting rod; 101. a rotation shaft fixing plate; 102. a worm gear transmission assembly; 1021. a worm wheel; 1022. a worm; 103. a rotation shaft; 104. a coupling; 105. and a motor.
Detailed Description
The application will be further described with reference to specific embodiments, and advantages and features of the application will become apparent from the description. These examples are merely exemplary and do not limit the scope of the application in any way. It will be understood by those skilled in the art that various changes and substitutions of details and forms of the technical solution of the present application may be made without departing from the spirit and scope of the present application, but these changes and substitutions fall within the scope of the present application.
Furthermore, unless defined otherwise, technical or scientific terms used in the description of the application should be given the ordinary meaning as understood by one of ordinary skill in the art to which the application pertains. The terms "upper," "lower," "left," "right," "center," "vertical," "horizontal," "inner," "outer," and the like as used in the description of the present application are merely used for indicating relative directions or positional relationships, and do not imply that the devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and that the relative positional relationships may be changed when the absolute position of the object to be described is changed, thus not being construed as limiting the application. The use of the terms "first," "second," "third," and the like in the description of the present application, are for descriptive purposes only and are not intended to be an absolute limitation on the amount, but rather at least one, of the terms "a," "an," or "the" and the like are used to distinguish between different groups. As used in this description of the application, the terms "comprises," "comprising," or the like are intended to cover an element or article that appears before the term as such, but does not exclude other elements or articles from the list of elements or articles that appear after the term.
Furthermore, unless specifically stated and limited otherwise, the terms "mounted," "connected," and the like in the description of the present application are used in a broad sense, and for example, the connection may be a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can also be communicated with the inside of two elements, and the specific meaning of the two elements can be understood by a person skilled in the art according to specific situations.
The embodiment provides an etcher wafer cassette turning device, referring to fig. 1, the etcher wafer cassette turning device includes a turning structure 100, and a wafer cassette fixing structure is disposed on the turning structure 100.
Referring to fig. 1 and 2, the wafer box fixing structure comprises a fixing platform, the fixing platform comprises a bottom plate 1 and a vertical plate 2 which are perpendicular to each other, a pressing component 3 and a clamping component 4 are arranged on the vertical plate 2, the pressing component 3 is used for pressing the wafer box on the bottom plate 1, and the clamping component 4 is used for clamping the wafer box 5. The bottom plate 1 is provided with a micro switch 6, the micro switch 6 is used for sensing whether the wafer box 5 is placed on the bottom plate 1, and the micro switch 6 can be an Omron brand micro switch.
According to the wafer box overturning device of the etching machine, the wafer box 5 is tightly pressed on the bottom plate 1 through the pressing component 3, the wafer box 5 is clamped through the clamping component 4, and the wafer box 5 can be stably arranged on the wafer box fixing structure. Meanwhile, the micro switch 6 can sense whether the wafer box 5 is placed on the bottom plate 1, further monitor whether abnormal conditions such as position change and the like occur on the wafer box 5 on the wafer box fixing structure, and can send signals to the controller when the wafer box 5 is detected on the bottom plate 1 so as to realize that the following photoelectric sensor is controlled by the controller to start working.
In one embodiment of the present application, referring to fig. 2, the press-holding assembly 3 includes a support frame 31 and a pressing block 32. The support frame 31 is fixed in riser 2 upper end, and the free end rotation of support frame 31 is connected with down briquetting 32, and is close to riser 2 one end on the briquetting 32 down and is the pressure portion of holding, is equipped with rolling element 33 far away from riser 2 one end. In this embodiment, the lower pressing block 32 may be made of an aluminum material, and is rotatably disposed on the supporting frame 31 through a pin.
Referring to fig. 1, 3 and 4, a pressing plate 34 is disposed below the rolling member 33, one side of the pressing plate 34 is rotatably disposed on the vertical plate 2, the rolling member 33 is used for approaching to or separating from the upper surface of the pressing plate 34, and the rolling member 33 rolls on the upper surface of the pressing plate 34 after contacting with the upper surface of the pressing plate 34, so as to realize the rotation of the pressing plate 34 on the vertical plate 2. In this embodiment, the rolling element 33 may be an NSK brand bearing, which is in line contact with the pressing plate 34, so that the line contact can reduce the contact area to reduce the friction force, and avoid the occurrence of jamming during the operation.
In this embodiment, the rolling members 33 roll on the upper surface of the pressing plate 34 in the following manner: referring to fig. 3, a schematic view of the pressing plate 34 pressing the wafer cassette 5 onto the base plate 1 is shown; referring to fig. 4, there is shown a schematic view in which the pressing plate 34 does not act on the wafer cassette 5, that is, a schematic view in which the wafer cassette 5 is not placed on the bottom plate 1.
As shown in fig. 3, the pressing portion of the lower pressing block 32 is controlled to move away from the base plate 1 (i.e., the pressing portion is lifted upward); the rolling element 33 is continuously close to the pressing plate 34 and rolls along the direction from the free end to the fixed end of the pressing plate 34 when contacting with the pressing plate 34; when the rolling member 33 rolls on the pressing plate 34, the pressing plate 34 applies a force in the direction of the bottom plate 1, so that the pressing plate 34 rotates in the direction of the bottom plate 1, and when the rolling member 33 is perpendicular to the pressing plate 34, the distance between the rolling member 33 and the bottom plate 1 is minimum, and the wafer cassette 5 is pressed on the bottom plate 1 to the greatest extent. Meanwhile, since the rolling member 33 rolls along the free end of the pressing plate 34 toward the fixed end, after the rolling member 33 and the pressing plate 34 vertically press the wafer cassette, the rolling member 33 is difficult to roll in the opposite direction, so that the pressing plate 34 can press and lock the wafer cassette 5.
As shown in fig. 4, when the rolling member 33 continues to roll on the pressing plate 34 in the direction of the free end of the pressing plate 34 toward the fixed end, or rolls on the pressing plate 34 in the direction of the fixed end toward the free end, the force applied to the pressing plate 34 by the rolling member 33 is reduced until the pressing plate 34 is separated from the pressing plate 34, and the pressing plate 34 does not have a pressing action on the wafer cassette 5, so that the wafer cassette 5 can be taken out.
It should be noted here that the rolling member 33 may roll on the upper surface of the pressing plate 34 in other manners, for example: when the wafer cassette 5 is pressed against the base plate 1, the pressing portion of the lower pressing block 32 is controlled to move in a direction approaching the base plate 1, the rolling member 33 is continuously approaching the pressing plate 34, and when the rolling member is in contact with the pressing plate 34, the rolling member rolls along the pressing plate 34 in a direction toward the free end of the fixed end until the wafer cassette 5 is pressed against the base plate 1.
In this rolling mode, after the rolling member 33 is perpendicular to the pressing plate 34 and presses the wafer box, an external force is required to press and lock the pressing plate 34 to the wafer box 5, for example, a locking structure may be provided to lock the position of the pressing plate 32, or other modes may be used to lock the pressing plate 34, so as to prevent the rolling member 33 from rolling on the pressing plate 34.
In this embodiment, the pressing portion of the lower pressing block 32 may be manually operated, or may be a driving structure disposed in the pressing portion, and the controller controls the driving structure to operate so as to implement the operation of the lower pressing block 32.
In a modified embodiment, in order to facilitate the determination that the rolling member 33 and the pressing plate 34 press the wafer cassette 5 against the base plate 1 and monitor the state in real time, the pressing assembly 3 further includes a photo sensor 35, which may be a model of a Panasonic brand photo sensor PM-L25, as shown in fig. 5. The photoelectric sensor 35 is used for detecting the pressing plate 34 in real time, for example, detecting a distance signal between the pressing plate 34 and the pressing plate, and sending the detected distance signal to the controller to assist in judging the pressing state of the wafer cassette 5. Thus, the photoelectric sensor 35 may be disposed on the support 31 for sensing the relative position of the platen 34 and the support 31; alternatively, the photo sensor 35 is provided on the lower press block 32, and the photo sensor 35 senses the relative position of the pressing plate 34 and the lower press block 32.
The principle of the photoelectric sensor 35 for monitoring whether the wafer cassette 5 is locked is as follows: the photoelectric sensor 35 detects the distance signal between the pressing plate 34 and the rolling member 33 in real time, and when the distance is calculated to be minimum according to the collected distance signal, the rolling member 33 and the pressing plate 34 are in a vertical state, and meanwhile, when the wafer box 5 is turned over, whether the wafer box 5 is pressed on the bottom plate 1 can be monitored according to the change condition of the detected distance signal.
In a modified embodiment, in order to facilitate the separation of the pressing assembly 3 from the wafer cassette 5 when the wafer cassette 5 needs to be removed from the wafer cassette fixing structure, as shown in fig. 3 and 4, the pressing assembly 3 further includes a reset member 36, one end of the reset member 36 is connected to the upper end of the support frame 31 or the vertical plate 2, and the other end is connected to the pressing plate 34.
In the present embodiment, the reset element 36 is used to separate the rolling element 33 from the pressing plate 34, so that the pressing plate 34 is restored to the initial position, and the pressing plate 34 is released from the pressing action on the wafer cassette 5. Therefore, the return member 36 is selected from an elastic member or a non-elastic return structure, and the elastic member may be selected from a spring, a rubber band, and the like, and in this embodiment, the return member 36 is preferably selected from a spring. When a spring is used as the return member 36, the spring is in a stretched state when the rolling member 33 and the pressing plate 34 are in a vertical state, the driving structure in the pressing portion continues to operate, the driving force given by the driving structure and the stretching of the spring are in a balanced state, or the locking structure makes the spring unable to return. When the wafer cassette 5 needs to be taken out, the driving force of the driving structure is reduced, or the locking structure is released to lock the pressing plate 34, and at the moment, the spring in the stretching state resets to rotate the pressing plate 34 in a direction away from the bottom plate 1 and separate from the wafer cassette 5.
In a modified embodiment, in order to avoid that the rolling member 33 continues to roll on the upper surface of the pressing plate 34 after being perpendicular to the pressing plate 34, so that the pressing plate 34 is separated from the wafer cassette 5 again, as shown in fig. 2 to 4, a limit post 37 is provided on one side or both sides of the lower pressing plate 32, and the limit post 37 is provided at a position close to the position of the holding portion.
In an improved embodiment, but not shown in the drawings, in order to avoid the rolling element 33 from rolling on the upper surface of the pressing plate 34 at will, rolling element rolling grooves are formed on the upper surface of the pressing plate 34, and the rolling element 33 is limited by the rolling element rolling grooves, so that the rolling element 33 can only roll back and forth in the rolling element rolling grooves to ensure the pressing plate 34, and meanwhile, the position and the length of the rolling element rolling grooves can be set, and the condition that the rolling element 33 continues to roll after being perpendicular to the pressing plate 34 can be avoided.
In a modified embodiment, in order to avoid damage to the wafer cassette 5 caused by excessive compression of the platen 34 by the wafer cassette 5, the free end of the platen 34 is provided with a square groove 341, as shown in fig. 2-4. The height of the square groove 341 may be set to 1.0 to 2.0mm; the width may be set to 0.2 to 0.6 times the width of the platen 34, such as 10 to 30mm; the length may be 0.5 to 1.0 times the length of the platen 34, such as 50 to 90mm. In this embodiment, the square groove 341 preferably has a height of 1.6mm, a width of 20mm, and a length of 75mm.
Meanwhile, in order to ensure the service life of the pressing plate 34, the pressing plate 34 is preferably made of an elastic material, for example, a PTFE material may be selected, and the pressing of the wafer box 5 can be achieved through elastic deformation of the pressing plate 34 without damaging the wafer box 5.
In this embodiment, the micro switch 6 is used for sensing whether the wafer box 5 is placed on the base plate 1, and the wafer boxes 5 have different specifications, so that the micro switch 6 can identify the wafer boxes 5 with various specifications, as shown in fig. 1 and 2, the upper surface of the base plate 1 is provided with a moving groove 7, a moving block 8 is arranged in the moving groove 7, and the micro switch 6 is fixed on the moving block 8. In this embodiment, the moving groove 7 may be a U-shaped groove, a square groove, or the like, and 2 rows of screw holes are provided on both sides of the moving groove 7, and the moving block 8 may be fixed to the moving groove 7 after the position of the moving block 8 is determined.
When the wafer cassettes 5 with different specifications are fixed, the movable block 8 is moved on the movable groove 7, so that the movable block 8 is opposite to the transverse connection rod 51 of the wafer cassette 5, and the micro switch 6 fixed on the movable block 8 can identify the transverse connection rod 51.
Meanwhile, in the present embodiment, the moving block 8 can also limit or fix the wafer cassette 5, so as to improve the stability of the wafer cassette 5 in the wafer cassette fixing structure. For example, the movable block 8 may be disposed on a side away from the vertical plate 2 such that the thickness of the movable block 8 is equal to or greater than the thickness of the transverse link 51, and the movable block 8 abuts against the transverse link 51 to limit the wafer cassette 5. A limit groove can be further formed in the moving block 8, so that the transverse connecting rod 51 is partially embedded into the limit groove to fix the wafer box 5.
In one embodiment of the present application, referring to fig. 1 and 2, the clamping assembly 4 includes two bar blocks, which are parallel to each other and have an adjustable distance therebetween, and a clamping space is formed between the two bar blocks for clamping the wafer cassette 5. In this embodiment, a waist-shaped hole, a rectangular groove, etc. may be provided on the vertical plate 2, so as to fix the two bar blocks with bolts after adjusting the positions of the two bar blocks according to the specification of the wafer box 5, so as to adjust the distance between the two bar blocks, and ensure that the two bar blocks can clamp the wafer box 5.
Preferably, the bar blocks are made of PTFE (polytetrafluoroethylene) material in order to avoid clamping damage to the wafer cassette 5 caused by the bar blocks.
In one embodiment of the present application, referring to fig. 6, the turnover structure 100 includes a rotation shaft fixing plate 101 and a worm gear assembly 102. The upper surface of the rotating shaft fixing plate 101 is connected with the lower surface of the bottom plate 1 through a plurality of struts, and the lower part of the rotating shaft fixing plate 101 is connected with a worm gear 1021 of the worm gear transmission assembly 102 through a rotating shaft 103. The worm 1022 of the worm gear assembly 102 is connected to the motor 105 via the coupling 104.
In this embodiment, the rotation shaft fixing plate 101 is directly connected with the worm gear 1021, the worm gear 1021 is preferably a sector worm gear, and is made of SUS304 material, the parameter is modulus 0.8, throat diameter 64mm, pitch diameter 62.4mm, center distance 36.75mm, and tooth number 78. The worm 1022 is matched with the worm gear 1021 in the direction perpendicular to the 90-degree direction of the rotating shaft, the parameters of the worm 1022 are made of SUS304 materials, the outer diameter is 12.7mm, the modulus is 0.8, the pressure angle is 20 degrees, the pitch diameter is 11.1mm, the center distance is 36.75mm, the worm 1022 is rotated in an auxiliary mode through bearings on two sides, and finally the motor 105 and the worm 1022 are connected through the coupler 104 to form the overturning structure 100. In the overturning structure 100, in a set range of 100 degrees, the motor 105 can drive the wafer box 5 to move to any angle in the range of 0-100 degrees, and after the wafer box is in place, the wafer box can stop at any angle and keep the position motionless due to the self-locking effect of the worm wheel 1021 and the worm 1022 of the worm gear assembly 102.
In a modified embodiment, as shown in fig. 1 and 2, the base plate 1 is further provided with a reinforcement 9 at the location where it is connected to the riser 2.
Meanwhile, the bottom plate 1 and the vertical plate 2 of the fixed platform can be made of aluminum materials, and the bottom plate 1 and the vertical plate 2 are subjected to corrosion prevention treatment in a sand blasting silver plating mode.
The wafer box turnover device of the etching machine has the characteristics of compact space, low price, universal adaptability, capability of reducing abnormal equipment butt joint, capability of adapting to the development of modern semiconductor equipment and the like, and has the following advantages:
1. can realize the fixed to arbitrary specification wafer box among the etching machine wafer box turning device, and through pressing the subassembly and clamping assembly (or through pressing subassembly, clamping assembly, movable block) with the stable installation of wafer box to the device, avoid the wafer box not hard up even break away from the risk on the device.
2. In the process of fixing the wafer box by using the wafer box fixing structure, the relative position of the pressing plate and the supporting frame or the relative position of the pressing plate and the lower pressing block can be sensed in real time by the photoelectric sensor, whether the pressing plate is in a clamping state to the wafer box can be timely judged, and meanwhile, when the position of the wafer box is changed by using the turnover structure to rotate, the operator can timely take measures after warning is provided for the operator after abnormality is timely found.
3. The turnover structure adopts the worm and gear transmission assembly, the volume of the turnover structure is greatly reduced through the transmission of the worm and the gear, and the turnover structure can be used for taking and placing the wafer in the wafer box in a butt joint manner with the manipulator at any angle within a set angle range, so that the applicability of the turnover device for the wafer box of the etching machine is greatly improved, and the standardization of semiconductor equipment is obviously improved.
The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the application.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (9)
1. The utility model provides an etching machine wafer box turning device, includes flip structure (100), its characterized in that: the turnover structure (100) comprises a rotating shaft fixing plate (101) and a worm and gear transmission assembly (102), and a wafer box fixing structure is arranged on the turnover structure (100);
the wafer box fixing structure comprises a fixing platform, wherein the fixing platform comprises a bottom plate (1) and a vertical plate (2) which are perpendicular to each other, a pressing component (3) and a clamping component (4) are arranged on the vertical plate (2), the pressing component (3) comprises a supporting frame (31) and a lower pressing block (32), the supporting frame (31) is fixed at the upper end of the vertical plate (2), the free end of the supporting frame (31) is rotationally connected with the lower pressing block (32), one end, close to the vertical plate (2), of the lower pressing block (32) is a pressing part, and one end, far away from the vertical plate (2), of the lower pressing block is provided with a rolling part (33); a pressing plate (34) is arranged below the rolling piece (33), and one side of the pressing plate (34) is rotatably arranged on the vertical plate (2); the clamping assembly (4) comprises two strip-shaped blocks, the two strip-shaped blocks are parallel to each other, the distance between the two strip-shaped blocks is adjustable, and a clamping space for clamping the wafer box (5) is formed between the two strip-shaped blocks; the clamping assembly (3) is used for pressing the wafer box (5) on the bottom plate (1), and the clamping assembly (4) is used for clamping the wafer box (5);
the wafer box is characterized in that a micro switch (6) is arranged on the bottom plate (1), and the micro switch (6) is used for sensing whether the wafer box (5) is placed on the bottom plate (1).
2. The etcher wafer cassette flipping device as in claim 1, wherein: the rolling piece (33) is close to or far away from the upper surface of the pressing plate (34), and the rolling piece (33) rolls on the upper surface of the pressing plate (34) after being contacted with the upper surface of the pressing plate (34) so as to realize the rotation of the pressing plate (34) on the vertical plate (2).
3. The etcher wafer cassette flipping device as in claim 2, wherein: the pressing and holding assembly (3) further comprises a photoelectric sensor (35);
the photoelectric sensor (35) is arranged on the supporting frame (31) and is used for sensing the relative position of the pressing plate (34) and the supporting frame (31);
or, the photoelectric sensor (35) is arranged on the lower pressing block (32) and is used for sensing the relative position of the pressing plate (34) and the lower pressing block (32).
4. The etcher wafer cassette flipping device as in claim 2, wherein: the pressing component (3) further comprises a resetting piece (36), one end of the resetting piece (36) is connected with the upper end of the supporting frame (31) or the vertical plate (2), and the other end of the resetting piece is connected with the pressing plate (34).
5. The wafer cassette flipping device of an etcher as claimed in any of claims 2 to 4, wherein: one side surface or two side surfaces of the lower pressing block (32) are provided with limiting columns (37), and the limiting columns (37) are located at positions close to the pressing part.
6. The wafer cassette flipping device of an etcher as claimed in any of claims 2 to 4, wherein: the free end of the pressing plate (34) is provided with a square groove (341), and the upper surface of the pressing plate (34) is provided with a rolling groove of a rolling piece.
7. The etcher wafer cassette flipping device as in claim 6, wherein: the pressing plate (34) is made of elastic materials.
8. The etcher wafer cassette flipping device as in claim 1, wherein: the upper surface of bottom plate (1) is equipped with removal groove (7), be equipped with movable block (8) in removal groove (7), just be fixed with on movable block (8) micro-gap switch (6).
9. The etcher wafer cassette flipping device as in claim 1, wherein: the upper surface of the rotating shaft fixing plate (101) is connected with the lower surface of the bottom plate (1) through a plurality of struts, and the lower part of the rotating shaft fixing plate (101) is connected with a worm wheel (1021) of the worm gear transmission assembly (102) through a rotating shaft (103);
the worm (1022) of the worm gear and worm transmission assembly (102) is connected with the motor (105) through the coupler (104).
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| CN202310722041.0A CN116469830B (en) | 2023-06-19 | 2023-06-19 | Wafer box overturning device of etching machine |
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| CN202310722041.0A CN116469830B (en) | 2023-06-19 | 2023-06-19 | Wafer box overturning device of etching machine |
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| CN116469830B true CN116469830B (en) | 2023-08-22 |
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| WO2023284484A1 (en) * | 2021-07-13 | 2023-01-19 | 盛美半导体设备(上海)股份有限公司 | Flipping apparatus |
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| WO2023070900A1 (en) * | 2021-10-26 | 2023-05-04 | 江苏亚电科技有限公司 | Wafer box alignment turnover mechanism and device |
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| KR20100077635A (en) * | 2008-12-29 | 2010-07-08 | 삼성테크윈 주식회사 | Wafer automatic feeder |
| CN211895047U (en) * | 2019-12-24 | 2020-11-10 | 杭州中为光电技术有限公司 | Open wafer box clamp |
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| CN116469830A (en) | 2023-07-21 |
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Effective date of registration: 20240321 Address after: 215500 Building 2, No. 2, Jinmen Road, Changshu high tech Industrial Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou xinhuilian Semiconductor Technology Co.,Ltd. Country or region after: Zhong Guo Address before: Room 02b-181, block B (second floor), No. 28, information road, Haidian District, Beijing 100085 Patentee before: Beijing xinshilian Semiconductor Technology Co.,Ltd. Country or region before: Zhong Guo Patentee before: Suzhou xinhuilian Semiconductor Technology Co.,Ltd. |