KR20090038247A - Method for reversing wafer - Google Patents

Method for reversing wafer Download PDF

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Publication number
KR20090038247A
KR20090038247A KR1020070103650A KR20070103650A KR20090038247A KR 20090038247 A KR20090038247 A KR 20090038247A KR 1020070103650 A KR1020070103650 A KR 1020070103650A KR 20070103650 A KR20070103650 A KR 20070103650A KR 20090038247 A KR20090038247 A KR 20090038247A
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KR
South Korea
Prior art keywords
wafer
inversion
rotating
unit
reversing
Prior art date
Application number
KR1020070103650A
Other languages
Korean (ko)
Inventor
김진섭
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020070103650A priority Critical patent/KR20090038247A/en
Publication of KR20090038247A publication Critical patent/KR20090038247A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A method for reversing a wafer is provided to increase process efficiency by reducing a time of the wafer turning process remarkably. A shifter(20) is located at a first location(P1), and an extension part is moved to a wafer inserted into a cartridge. The wafer is gripped with a locking ARM, and a reverse is moved to the second position(P2). A wafer is reversed by rotating the reversing unit, and the reversing unit is moved to a third location(P3). The reversing unit loads a wafer on the spin chuck(40), and a wafer process including a cleaning process is performed. The reversing unit is moved to a first location, and is moved to a third location(P3) after completing the wafer process. The reversing unit transfers a wafer from a third position to a second position.

Description

Method for reversing wafer

The present invention relates to a wafer reversal method, and more particularly, to a wafer reversal method for reversing a wafer during wafer processing.

Semiconductor manufacturing processes include various wafer processing processes. In the wafer processing step, both surfaces of the wafer may be processed as in the cleaning step.

For example, in a photolithography process, brush cleaning is performed on a front surface of a substrate in a spin scrubber prior to applying a resist. The general cleaning method is to insert the wafer into the cleaning apparatus after the robot arm clamps the wafer and to remove the wafer from the cleaning apparatus when the cleaning is completed. In recent years, it has become common practice to clean not only the front surface of the substrate but also the backside. In order to clean the back surface opposite to the front surface of the wafer, the wafer is turned upside down by a separate wafer reversal means, and then the wafer is removed by the above method. Should be cleaned. Therefore, an apparatus capable of reversing the wafer is essential to the wafer processing process.

Conventional wafer reversing apparatus loads a wafer onto a pin of a loading plate by a conveying apparatus. When the wafer is fixed by a motorized fixed arm, the loading plate is pulled down by the cylinder to deviate from the wafer rotation radius. When it is confirmed that the loading plate is down to a position where there is no interference with the wafer inversion, the wafer inversion is made by the motor driving. After the inversion operation is completed, the loading plate is raised again to support the wafer, and the fixed arm loads the wafer. The wafer thus inverted is unloaded by the conveying apparatus and transferred to a cleaning unit or a subsequent process.

This wafer reversal process is precisely controlled and takes considerable time during the process time. Therefore, there is a need to reduce the inversion time by simplifying the wafer inversion process.

Accordingly, an object of the present invention is to provide a wafer inversion method for inverting a wafer during a wafer process.

The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a method of inverting a wafer, the inverting part holding a wafer at a first position, and the inverting unit moving the wafer from the first position to a second position. And rotating the inverter to invert the wafer at the second position, the inverter to move the wafer from the second position to the third position, and the inverter to the wafer at the third position. Loading the wafer into the rotary chuck, and after the wafer is loaded into the rotary chuck, the inverting unit moves to the first position in a rotated state, and the inverting unit holds the wafer again at the rotating chuck. Thereafter, rotating at the second position to reinvert the wafer, and the inverting portion moving from the second position to the first position. .

The wafer reversal method according to the embodiments of the present invention as described above can significantly reduce the time of the wafer reversal process during the semiconductor process, thereby increasing the efficiency of the semiconductor process and simplifying the operation of the wafer reversal apparatus. The device can be used efficiently.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Hereinafter, a wafer inversion apparatus according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2. 1 is a perspective view of a wafer inversion apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view of an inversion part included in the wafer inversion apparatus of FIG. 1.

The wafer reversing apparatus 1 includes a frame 10, an inversion unit 20, and a transfer unit 30. The frame 10 holds the skeleton of the wafer reversing apparatus 1 and is formed long in the vertical direction so that the wafer W can be transferred in the vertical direction. The frame 10 supports the inverting unit 20 and includes a conveying unit 30.

 The inversion unit 20 serves to invert the wafer (W). Here, the inversion refers to rotating the wafer W having the front face up 180 ° to face down, or rotating the front face down to face up. In the present specification, one surface of both surfaces of the wafer W is referred to as a front surface, and the opposite surface is referred to as a back surface.

The inverting part 20 includes a seating part 210, fixed arms 220a and 220b, a rotating part 240, and a support part 250. The seating part 210 serves to stably stabilize the wafer W, and may be formed in a circular ring shape to stably seat the circular wafer W. The seating portion 210 is preferably formed to be somewhat larger than the diameter of the wafer (W). The seating portion 210 is connected to the extension 230 is fixed to the rotating part 240.

Meanwhile, a plurality of seating protrusions 215 is formed on the seating part 210. The seating protrusion 215 is formed along the upper surface of the seating portion 210, and the tip is preferably formed in a thin pin shape. Accordingly, the wafer W is seated on the mounting protrusion 215 and reduces the contact surface between the wafer W and the mounting portion 210.

The fixed arms 220a and 220b serve to fix the wafer W seated on the seating portion 210. The fixing arms 220a and 220b are positioned on the seating portion 210 and can be fixed while wrapping the wafer W so as to effectively fix the disk-shaped wafer W. As shown in FIG. 2, the fixed arms 220a and 220b may be divided into two parts to hold the wafer W, but this is divided into one example of the fixed arms 220a and 220b. It will be possible to change. Grip portions 225a and 225b are formed at portions of both ends of the fixed arms 220a and 220b to grip the wafers W, and the other ends thereof are coupled to the rotating portion 240. The other ends of the fixed arms 220a and 220b include a driving unit (not shown) to pinch or unfold both arms of the fixed arms 220a and 220b. The fixed arms 220a and 220b and the mounting portion 210 are connected to the rotating part 240.

The rotating part 240 serves to invert the wafer W, and includes rotating means capable of rotating the fixed arms 220a and 220b and the seating part 210. The rotating part 240 is coupled to rotate with the support part 250, and a rotating means capable of rotating the rotating part 240 may be provided in the rotating part, but is not limited thereto and may be provided in the supporting part 250. . As the rotating means, a rotating motor, a pneumatic rotating device, or the like can be used.

The support part 250 is coupled to the rotating part 240 to support the wafer W fixed by the seating part 210 and the fixing arms 220a and 220b, and the transfer part 30 formed on the frame 10. It is combined with and supported on the frame 10.

The transfer unit 30 serves to move the inversion unit 20 up and down, and moves the inversion unit 20 to the first position P1, the second position P2, and the third position P3. Here, the first position P1 refers to a position where the inverter 20 initially stands, and the second position P2 refers to a position to invert the wafer W, and the third position P3 refers to a wafer ( It says the position which loads W) to the rotary chuck 40. The wafer reversing apparatus 1 has a structure for moving the inverting portion 20 in the vertical direction, so that the first position P1 is located at the top and the second position P2 is located at the middle portion. The third position P3 may be located at the lowermost portion. However, such first to third positions P3 are merely exemplary, and various modifications may be made depending on the place of use of the wafer reversing apparatus 1.

On the other hand, the transfer unit 30 is formed in the frame 10, it is possible to move the inverting unit 20 in the vertical direction by using a hydraulic actuator, the inverting unit 20 by using a transmission device for more real control Can be moved.

Hereinafter, a wafer inversion method according to an embodiment of the present invention will be described in detail with reference to FIGS. 3 to 5. 3 to 5 are schematic diagrams illustrating an operation process of the wafer reversing apparatus of FIG. 1.

First, referring to FIG. 3, the inversion unit 20 is positioned at the first position P1. The first position P1 is an initial position of the inversion unit 20 and corresponds to a standby position before the process proceeds.

Meanwhile, the first position P1 may not only be an initial position but also may be a position for holding the wafer W. FIG. That is, the wafer may be gripped by moving the inversion unit 20 to the left and right at the first position P1. The gripping positions of the first position P1 and the wafer W may be formed at different positions, but may be defined at the same height in order to reduce the moving time of the inverting portion 20 and increase the process efficiency.

The extension part 230 moves in the horizontal direction to move the wafer W inserted into the cartridge (not shown) in order to hold the wafer W, and is gripped using the fixed arms 220a and 220b. The inverting unit 20 may move to the second position P2 after the wafer W is held.

Referring to FIG. 4, the inverting unit 20 holding the wafer W is moved to the second position P2 and the inverting unit 20 is rotated to invert the wafer W. Referring to FIG. The second position P2 becomes a space in which the wafer W can be reversed. However, the second position P2 does not need to be separated from the first position P1, and the wafer W may be reversed at the first position P1 depending on the working space.

On the other hand, it is not necessary to separate the moving step of the inversion unit 20 and the inversion step of the inversion unit 20. That is, the inverting unit 20 can be rotated and rotated at the same time to invert the wafer (W). After inverting the wafer W, the inversion unit 20 moves to the third position P3.

Referring to FIG. 5, in the third position P3, the inversion unit 20 loads the wafer W onto the rotary chuck 40. The wafer W loaded on the rotary chuck 40 is subjected to a wafer process such as a cleaning process, and the inverting unit 20 moves to the first position P1. At this time, the inversion unit 20 moves quickly to the first position P1 as it is rotated 180 degrees (see FIG. 3). That is, a separate operation of initializing the inversion unit 20 is omitted and the inversion unit 20 moves to the first position P1 as it is.

Next, when the wafer process is completed, the inversion unit 20 moves to the third position P3 again. The inversion unit 20 grips the wafer W at the third position P3 and transfers it to the second position P2.

Referring back to FIG. 4, the inversion unit 20 rotates again to invert the wafer W again. The inversion unit 20 inverts the wafer W and moves to the first position P1 again.

As described above, the inversion unit 20 omits a separate rotation step in the process of returning the wafer W to the rotary chuck 40 and then returning to the first position P1. That is, the step of continuously initializing the position of the inversion unit 20 is omitted and controlled in a continuous process, thereby eliminating unnecessary steps, thereby greatly reducing the inversion time of the wafer W, thereby increasing the efficiency of the wafer process. .

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

1 is a perspective view of a wafer reversing apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of an inversion unit included in the wafer inversion apparatus of FIG. 1.

3 to 5 are schematic diagrams illustrating an operation process of the wafer reversing apparatus of FIG. 1.

<Description of the symbols for the main parts of the drawings>

1: wafer reversing apparatus 10: frame

20: inversion part 30: transfer part

40: rotation chuck 210: seating portion

215: seating protrusion 220a, 220b: fixed arm

225a and 225b: grip part 230: extension part

240: rotating part 250: supporting part

Claims (2)

The inverting part grasps the wafer at the first position; The inverting portion moving the wafer from the first position to a second position; Rotating the inverter to invert the wafer at the second position; The inverting portion moving the wafer from the second position to a third position; Loading the wafer onto the rotary chuck by the inverter in the third position; After loading the wafer onto the rotary chuck, moving the inverter to the first position in a rotated state; Reversing the wafer by holding the wafer again at the rotary chuck and rotating the wafer at the second position; And And the inversion unit moves from the second position to the first position. The method of claim 1, And the inverting portion inverts the wafer while moving from the first position to the second position.
KR1020070103650A 2007-10-15 2007-10-15 Method for reversing wafer KR20090038247A (en)

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KR1020070103650A KR20090038247A (en) 2007-10-15 2007-10-15 Method for reversing wafer

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KR1020070103650A KR20090038247A (en) 2007-10-15 2007-10-15 Method for reversing wafer

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023016436A1 (en) * 2021-08-12 2023-02-16 北京北方华创微电子装备有限公司 Semiconductor cleaning device and wafer turning apparatus thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023016436A1 (en) * 2021-08-12 2023-02-16 北京北方华创微电子装备有限公司 Semiconductor cleaning device and wafer turning apparatus thereof

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