TW202318563A - Semiconductor process equipment and grasping device thereof - Google Patents

Abstract

A semiconductor process equipment and a grasping device thereof. The grabbing device is used for grabbing the wafer, and is connected with the driving device in the semiconductor process equipment, and is used for transmitting the wafer under the driving of the driving device, including: a housing, a driving mechanism and a plurality of clamping pieces; The housing is used for connecting with the drive device and moving under the drive of the drive device; A plurality of clips are rotationally connected with the housing and distributed at intervals along the circumference of the housing. The driving mechanism is used to synchronously drive each clip to rotate to clamp or release the edge of the wafer.

Description

Semiconductor process equipment and grabbing device

The present application relates to the technical field of semiconductor processing, and in particular, the present application relates to a semiconductor processing equipment and a gripping device.

In the wet cleaning equipment in the field of integrated circuits, the transmission system plays a vital role. The way and position of the wafer pick-up affect the final process effect of the wafer, especially the stability during the pick-up process. .

In the prior art, the front end of the grabbing device is fixedly provided with a front limit stopper, and the rear end is slidably provided with a rear limit stopper, and the movement of the rear limit stopper is controlled by a cylinder. During the grabbing process, the wafer is limited by the two front limit stops, and the rear limit stop is pushed towards the direction close to the wafer by the cylinder until the rear limit stop is in contact with the two front limit stops. However, when gas is blown to the lower surface of the wafer through the carrier device to suspend the wafer above the carrier device using Bernoulli's principle, the wafer will be in the carrier device. Multiple card pins shake inside, resulting in a slight deviation of the wafer when grabbing the wafer, resulting in the failure of the grabbing device to pick up the wafer. It may also happen that although the wafer is picked up successfully, the front limit stop or rear A condition where the limit stop does not clamp the wafer, causing the wafer to break off during transport.

Aiming at the shortcomings of the existing methods, the present application proposes a semiconductor manufacturing equipment and a gripping device to solve the technical problems of chip picking failure and debris caused by wafer offset existing in the prior art.

In the first aspect, the embodiment of the present application provides a grabbing device for semiconductor processing equipment, which is used for grabbing wafers, and is connected with the driving device in the semiconductor processing equipment, and is used for transporting wafers driven by the driving device. circle, including: a housing, a driving mechanism and a plurality of engaging parts; the housing is used to connect with the driving device and is used to move under the drive of the driving device; a plurality of the engaging parts and the housing Rotationally connected and distributed at intervals along the circumference of the housing, the driving mechanism is used to synchronously drive the rotation of each engaging member to clamp or release the edge of the wafer.

In an embodiment of the present application, when the plurality of clamping parts clamp the wafer, the wafer is located under the housing, and the housing has a hollow portion, and the hollow portion is used to make the wafer The upper surface is exposed.

In an embodiment of the present application, each of the engaging parts includes a rotating shaft and an eccentric shaft, the rotating shaft is rotatably connected to the housing, the eccentric shaft is eccentrically arranged with the rotating shaft, and is fixedly connected, and the rotating shaft can rotate around Its axis rotates clockwise or counterclockwise to drive the eccentric shaft to rotate to a first position for clamping the edge of the wafer, or a second position for releasing the edge of the wafer.

In an embodiment of the present application, a bearing part is disposed on the end of the eccentric shaft away from the rotating shaft, and the bearing part is used to support the bottom edge of the wafer when the eccentric shaft rotates to the first position.

In an embodiment of the present application, the eccentric shaft includes a clamping column, and the bearing portion includes a bearing plate; one end of the clamping column is connected to the rotating shaft, and the other end of the clamping column is connected to the bearing plate; the bearing The plate is spaced below the rotating shaft and is eccentrically arranged with the clamping column for supporting the bottom edge of the wafer when the eccentric shaft rotates to the first position.

In one embodiment of the present application, the driving mechanism includes an annular driving member arranged in the housing and arranged around the circumference of the housing, the annular driving member is connected to the rotating shafts of a plurality of the engaging members, The shaft for synchronously driving a plurality of engaging parts rotates clockwise or counterclockwise around its axis.

In an embodiment of the present application, a toothed structure is provided on the outer peripheral surface of the ring-shaped driving member, and a first tooth portion meshing with the toothed structure is provided on the outer peripheral surface of the rotating shafts of the plurality of engaging members. The driving member rotates around its own axis to synchronously drive the rotating shafts of the plurality of engaging members to rotate clockwise or counterclockwise around their axes.

In an embodiment of the present application, the driving mechanism further includes a transmission member and a driver, the transmission member is disposed in the housing, and the outer circumference of the transmission member has a second tooth portion meshing with the toothed structure, and the driver and The transmission member is connected to drive the ring drive member to rotate by driving the transmission member to rotate around its own axis.

In one embodiment of the present application, the housing includes a first cover plate and a second cover plate, the first cover plate is covered on the second cover plate, and the first cover plate and the second cover plate are both There is a notch to form the hollow part by butting; an installation space is formed by butting between the two, and the installation space is used for accommodating the first tooth part, the ring-shaped driving part and the transmission part.

In an embodiment of the present application, the grabbing device further includes a connection structure, one end of the connection structure is connected to the casing, and the other end of the connection structure is higher than the top surface of the casing, and is used for connecting with the driving device connect.

In the second aspect, the embodiment of the present application provides a semiconductor processing equipment, including: a processing chamber, a driving device, and a gripping device as provided in the first aspect, the processing chamber is provided with a liftable carrying device, and the gripping device The fetching device is connected with the driving device, and is used to move above the carrying device under the driving of the driving device to grab or release the wafer.

The beneficial technical effects brought by the technical solutions provided by the embodiments of the present application are:

In the embodiment of the present application, the housing is provided with a plurality of engaging parts distributed along the circumferential direction, and through the cooperation of the plurality of engaging parts with the edge of the wafer, the clamping and clamping of the wafer is realized, and then the alignment is realized through the driving device. Wafer transfer. Since a plurality of engaging parts are arranged along the circumferential direction of the housing, the ring formed by the plurality of engaging parts can be arranged concentrically with the housing, and the wafer can be connected with multiple cards in the process of actually grabbing the wafer. The assembly and the shell are arranged concentrically, so as to avoid the wafer grabbing failure caused by the offset between the wafer and the grabbing device, or the wafer falling off and fragments due to the wafer offset after the grabbing is successful, so as to ensure the pickup The stability and success rate of wafers can be improved, thereby improving wafer transfer efficiency and wafer yield.

The following disclosure provides many different embodiments, or examples, of different means for implementing the disclosure. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description a first member is formed over or on a second member may include embodiments in which the first member and the second member are formed in direct contact, and may also include embodiments in which additional members An embodiment may be formed between the first member and the second member so that the first member and the second member may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and/or letters in various instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.

In addition, for ease of description, spatially relative terms such as "below", "below", "under", "above", "upper" and the like may be used herein to describe the relationship between one element or member and another(s) The relationship between elements or components, as illustrated in the figure. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and thus the spatially relative descriptors used herein should be interpreted similarly.

Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Furthermore, as used herein, the term "about" generally means within 10%, 5%, 1%, or 0.5% of a given value or range. Alternatively, the term "about" means within an acceptable standard error of the mean when considered by one of ordinary skill in the art. Except in operating/working examples, or unless expressly specified otherwise, all numerical ranges such as for amounts of materials disclosed herein, durations of time, temperatures, operating conditions, ratios of amounts, and the like, Amounts, values and percentages should be understood as being modified by the term "about" in all instances. Accordingly, unless indicated to the contrary, the numerical parameters set forth in this disclosure and the accompanying claims are approximations that may vary as desired. At a minimum, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges can be expressed herein as from one endpoint to the other or as between two endpoints. All ranges disclosed herein are inclusive of endpoints unless otherwise specified.

The embodiment of the present application provides a grabbing device for semiconductor processing equipment, which is used to grab a wafer 100, and is connected to a driving device in the semiconductor processing equipment, and is used to transport the wafer under the driving of the driving device. The structural schematic diagram of the grasping device is shown in Figure 1A, Figure 1B and Figure 3, including: a housing 1, a driving mechanism 3 and a plurality of engaging parts 2; the housing 1 is used to connect with the driving device in the semiconductor process equipment , used to move under the drive of the driving device; a plurality of engaging parts 2 are rotationally connected with the housing 1, and are distributed along the circumferential direction of the housing 1, and the driving mechanism 3 is used to synchronously drive each engaging part 2 to rotate, so as to Clamp or release the edge of the wafer 100.

As shown in FIG. 1A and FIG. 1B, the semiconductor manufacturing equipment may be equipment for performing a monolithic wet etching process, and the grasping device may grasp the wafer 100 and transport the wafer 100 under the drive of the driving device, To be able to move in or out of the process chamber, but the embodiment of the present application does not limit the specific type of semiconductor process equipment, those skilled in the art can adjust according to the actual situation. The housing 1 can be a disc structure made of metal material, the engaging part 2 can be a columnar structure made of metal material, and a plurality of engaging parts 2 can be arranged in the housing 1 along the circumferential direction of the housing 1 bottom, and the tops of a plurality of engaging parts 2 are rotatably connected with the housing 1, and the bottoms of the plurality of engaging parts 2 cooperate with each other for contacting with the edge of the wafer 100, so as to realize the carrying device from the process chamber (Fig. (none of which are shown in the figure) grabs the wafer 100, and since the housing 1 is connected to the driving device of the semiconductor process equipment, the housing 1 and the engaging member 2 can transport the wafer 100 under the drive of the driving device. The driving mechanism 3 may be in transmission connection with a plurality of engaging parts 2, and is used to synchronously drive the rotation of each engaging part 2, so that the plurality of engaging parts 2 rotate simultaneously to clamp or release the edge of the wafer. Further, since a plurality of engaging parts 2 are arranged along the circumference of the housing 1, the circle formed by the plurality of engaging parts 2 can be arranged concentrically with the housing 1, and in the process of actually grabbing the wafer 100 The wafer 100 can be arranged concentrically with the plurality of engaging parts 2 and the housing 1, thereby avoiding the failure of the wafer 100 to be grasped due to the deviation between the wafer 100 and the grasping device, or the failure of the wafer 100 to be grasped after the grasp is successful. The deviation of the wafer 100 causes the wafer 100 to fall off and fragment, thereby greatly improving the yield rate of the wafer 100 .

In the embodiment of the present application, the housing is provided with a plurality of engaging parts distributed along the circumferential direction, and through the cooperation of the plurality of engaging parts with the edge of the wafer, the clamping and clamping of the wafer is realized, and then the alignment is realized through the driving device. Wafer transfer. Since a plurality of engaging parts are arranged along the circumference of the housing, the circle surrounded by the plurality of engaging parts can be set concentrically with the housing, and the wafer can be connected with multiple cards in the process of actually grabbing the wafer. The assembly and the shell are arranged concentrically, so as to avoid the wafer grabbing failure caused by the offset between the wafer and the grabbing device, or the wafer falling off and fragments due to the wafer offset after the grabbing is successful, so as to ensure the pickup The stability and success rate of wafers can be improved, thereby improving wafer transfer efficiency and wafer yield.

It should be noted that the embodiment of the present application does not limit the installation positions of the plurality of engaging parts 2, for example, the plurality of engaging parts 2 can also be arranged on the top of the housing 1, so as to achieve grasping from the bottom of the wafer 100 . Therefore, the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the setting by themselves according to the actual situation.

In an embodiment of the present application, as shown in FIG. 1B , when the wafer 100 is clamped by a plurality of engaging members 2 , the wafer 100 is positioned under the housing 1 , and the housing 1 has a hollow portion 11 , the hollow Section 11 is used to expose the upper surface of wafer 100 . Specifically, the shell 1 can adopt a ring structure made of metal material, so that a circular hollow part 11 is formed in the center of the shell 1, and the diameter of the hollow part 11 can be slightly smaller than the size of the wafer 100. The effective process area of the wafer 100 except the edge is exposed. In addition, the diameter of the hollow part 11 may also be smaller than the diameter of the circle surrounded by the plurality of engaging elements 2, so that a plurality of engaging elements 2 are provided on the housing 1, so that the implementation of the present application has a simple structure and a reasonable design. With the above-mentioned design, the upper surface of the wafer 100 can always be exposed under the electrostatic generator and the fan assembly components on the top of the process chamber due to the existence of the hollow part 11 during actual chip removal, thereby ensuring the electrostatic balance of the upper surface of the wafer 100 and cleanliness, reduce the overall particle pollution of the wafer 100, thereby improving the effect of the process.

It should be noted that the embodiment of the present application does not limit the specific diameter of the hollow portion 11 , the diameter of the hollow portion 11 can be set corresponding to the diameter of the wafer 100 as long as the diameter of the hollow portion 11 is slightly smaller than the diameter of the wafer 100 . Therefore, the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the setting by themselves according to the actual situation.

In one embodiment of the present application, as shown in FIG. 1A and FIG. 1B , each engaging member 2 is rotatably disposed on the housing 1 , and multiple engaging members 2 can clamp or release the wafer through rotation. Edge of 100. Specifically, a plurality of engaging parts 2 can rotate around their own central axes, and in the process of synchronous rotation, the size of the circle enclosed by the plurality of engaging parts 2 will change, and the circle can be realized by switching the direction of rotation. The size of the shape can be switched between increasing and decreasing, by driving multiple engaging parts 2 to rotate simultaneously, and when the multiple engaging parts 2 rotate to the maximum size of the enclosed circle, the multiple engaging parts 2 can be released Wafer 100 ; when the multiple clamping components 2 are rotated to the minimum size of the enclosed circle, the multiple clamping components 2 can clamp the edge of the wafer 100 . With the above-mentioned design, the clamping and releasing of the wafer 100 can be realized by rotating a plurality of clamping parts 2, which is not only convenient for adjustment and takes up less space, but also the engagement of the clamping parts 2 with the edge of the wafer 100 enables the implementation of the present application. For example, the contact area with the wafer 100 is small, thereby effectively reducing the contact area with the wafer 100 and avoiding contamination during the process of grabbing the wafer 100 . Further, a plurality of engaging parts 2 may be disposed on the bottom of the casing 1, so as to facilitate grabbing the wafer 100 from above the carrying device.

It should be noted that the embodiment of the present application does not limit the specific implementation of the clamping part 2 , for example, the clamping part 2 can also rotate around other central axes, as long as it can clamp the edge of the wafer 100 after moving. Therefore, the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the setting by themselves according to the actual situation.

In one embodiment of the present application, as shown in FIGS. 1A to 2B , each engaging member 2 includes a rotating shaft 21 and an eccentric shaft 22 , the rotating shaft 21 is rotatably connected to the housing 1 , and the eccentric shaft 22 is connected to the rotating shaft 21 Eccentrically arranged and fixedly connected, the rotating shaft 21 can rotate clockwise or counterclockwise around its axis to drive the eccentric shaft 22 to rotate to the first position for clamping the edge of the wafer 100, or the second position for releasing the edge of the wafer 100 .

As shown in FIG. 1A to FIG. 2B , the engaging member 2 may include an integrally formed rotating shaft 21 and an eccentric shaft 22 , and the overall shape may be a rod-like structure. The top of the rotating shaft 21 can be disposed in the housing 1 , the eccentric shaft 22 can be located at the bottom of the rotating shaft 21 , and the eccentric shaft 22 is offset to one side of the bottom of the rotating shaft 21 . However, the embodiment of the present application does not limit the specific structure of the engaging member 2. For example, the eccentric shaft 22 can be welded on the rotating shaft 21, or the eccentric shaft 22 can also be fixed to the bottom of the rotating shaft 21 with fasteners, as long as the eccentric shaft 22 is on the rotating shaft 21. When it rotates around its central axis to the first position or the second position, it only needs to be able to engage with or release from the edge of the wafer 100 . In actual application, the rotating shaft 21 can be rotated clockwise by a predetermined angle, so that the eccentric shafts 22 of the plurality of engaging parts 2 move toward the middle of the housing 1 at the same time, so that the circular size formed by the plurality of engaging parts 2 shrink, so as to achieve clamping on the edge of the wafer 100; or, rotate the rotating shaft 21 counterclockwise by a preset angle, so that the eccentric shafts 22 of a plurality of engaging parts 2 move toward the edge of the housing 1 at the same time, so that multiple The size of the circle formed by the two engaging parts 2 increases, so as to realize the release of the wafer 100 . The above-mentioned design makes the structure of the embodiment of the present application simple and easy to control, thereby greatly improving the grabbing efficiency and reducing the failure rate.

In an embodiment of the present application, the end of the eccentric shaft 22 facing away from the rotating shaft 21 is provided with a supporting part, and the supporting part is used to support the bottom edge of the wafer 100 when the eccentric shaft 22 rotates to the above-mentioned first position. By means of the carrying part, while the edge of the wafer 100 can be clamped by the eccentric shaft 22, the bottom edge of the wafer 100 can be supported by the carrying part, so that a locking position is formed between the carrying part and the bottom end of the rotating shaft 21 for use The edge of the wafer 100 is engaged in the engaging position, so as to prevent the wafer 100 from falling off from the engaging member 2 . With the above design, since the carrying part can be located at the bottom of the wafer 100 during use, even if the clamping column 23 is not strong enough to clamp the wafer 100, the wafer 100 cannot fall off from the clamping member 2, thereby greatly improving the performance of the present application. The safety and stability of embodiment taking sheet.

In one embodiment of the present application, as shown in FIGS. 1A to 2B , the eccentric shaft 22 includes a clamping column 23; the bearing portion includes a bearing plate 24; one end of the clamping column 23 is connected to the rotating shaft 21, and the clamping column 23 The other end of the bearing plate 24 is connected to the bearing plate 24; the bearing plate 24 is arranged below the rotating shaft 21 at intervals, and is eccentrically arranged with the clamping column 23, so as to support the bottom edge of the wafer 100 when the eccentric shaft 22 rotates to the above-mentioned first position In this way, the bottom edge of the wafer 100 can be supported by the carrier plate 24 while the edge of the wafer 100 is clamped by the clamping column 23 . Optionally, the bottom end of the carrier plate 24 and the rotating shaft 21 can also clamp the edge of the wafer 100 together, that is, the carrier plate 24 supports the bottom edge of the wafer 100, while the bottom end of the rotating shaft 21 presses the edge of the wafer 100. top edge. In practical applications, the clamping column 23 and the bearing plate 24 may adopt an integrated structure, or both may adopt a split structure and be fixedly connected by fasteners.

In a specific embodiment, as shown in FIG. 2A and FIG. 2B, one end of the clamping column 23 is connected to the rotating shaft 21, and the other end is connected to the bearing plate 24; the clamping column 23 is, for example, a bar-shaped column, and the bar-shaped column The length direction is set along the axial direction of the rotating shaft 21, and the thickness direction is set along the radial direction of the rotating shaft 21. The outer peripheral wall of the bar-shaped column is, for example, arc-shaped, and part of the outer peripheral wall of the bar-shaped column is aligned with the partial peripheral wall of the rotating shaft 21. , that is to realize the eccentric setting of the two. Carrying plate 24 is such as circular plate, and the projection of clamping post 23 on carrying plate 24 is positioned at the edge area of carrying plate 24, and the diameter of this carrying plate 24 is greater than the thickness of strip column, and the part periphery of carrying plate 24 and clamping Part of the surrounding walls of the pillars 23 are aligned so that the carrier plate 24 can extend into the bottom of the wafer when the strip pillars touch the edge of the wafer. In practical applications, the above-mentioned clamping column 23 is not limited to the use of a bar-shaped column, and it can also adopt any other shape, such as a cylinder, an ellipse, etc., as long as it can rotate around its central axis on the rotating shaft 21 to the first position or the second position, it only needs to be able to engage or release the edge of the wafer 100; the above-mentioned carrier plate 24 is not limited to the use of a circular plate, and it can also adopt other arbitrary shapes, such as rectangle, square, ellipse, etc. , as long as the bottom edge of the wafer 100 can be supported or released when the rotating shaft 21 rotates around its central axis to the first position or the second position. The embodiment of the present application is not limited thereto, and those skilled in the art can adjust the settings according to actual conditions.

In one embodiment of the present application, as shown in FIG. 1A to FIG. 3 , the driving mechanism 3 includes an annular driving member 31 arranged in the housing 1 and arranged around the circumference of the housing 1 . The annular driving member 31 and the The rotating shafts 21 of the plurality of engaging parts 2 are connected to synchronously drive the rotating shafts 21 of the plurality of engaging parts 2 to rotate clockwise or counterclockwise around their axes, so that the engaging parts 2 clamp or release the wafer 100 .

As shown in FIGS. 1A to 3 , the annular driving member 31 can be a circular structure made of metal, which is arranged in the housing 1 and is located inside a plurality of engaging members 2 . contact with each of the engaging parts 2 to drive all the engaging parts 2 to rotate. Further, the specific number of engaging parts 2 can be six, and every three are divided into one group, and the two groups of engaging parts 2 are symmetrically arranged on the upper and lower sides of the ring drive part 31, so as to effectively reduce the number of engaging parts 2. The number, thereby reducing application and maintenance costs. In this way, a plurality of engaging elements 2 are driven to rotate by one annular driving element 31 , which facilitates the control of the engaging elements 2 and facilitates the setting of the annular driving elements 31 . With the above design, only one ring-shaped driving member 31 can simultaneously drive multiple engaging members 2 to rotate, which can not only greatly reduce application and maintenance costs, but also improve stability and reduce failure rate.

It should be noted that the embodiment of the present application does not limit the specific implementation of the ring drive member 31. For example, a plurality of engaging members 2 may be arranged on the inner peripheral edge of the ring drive member 31, or each engaging member 2 is separately provided with A ring driver 31. Therefore, the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the setting by themselves according to the actual situation.

In one embodiment of the present application, as shown in FIGS. 1A to 3 , the outer peripheral surface of the annular drive member 31 is provided with a toothed structure, and the outer peripheral surface of the rotating shaft 21 of the plurality of engaging parts 2 is provided with a toothed structure meshing. In the first tooth portion, the ring driving member 31 synchronously drives the rotating shafts 21 of the plurality of engaging members 2 to rotate clockwise or counterclockwise around their axes by rotating around their own axes. Specifically, the outer peripheral wall of the ring-shaped driving member 31 is provided with a tooth-shaped structure, that is, the overall structure of the ring-shaped driving member 31 is in the shape of a hollow gear. The top of the rotating shaft 21 of the engaging member 2 may be provided with a first tooth portion, such as a gear set on the top of the rotating shaft 21, the first tooth portion of the engaging member 2 and the toothed structure of the ring drive member 31 Engagement settings. The toothed structure of the ring driving part 31 is meshed with the first tooth part of the engaging part 2, and the power is transmitted from the ring driving part 31 to the engaging part 2. The power transmission is relatively stable and accurate, and it is convenient to control the engagement through the number of meshed teeth. The rotation angle of the component 2 can prevent the wafer 100 from being fragmented due to the large clamping force of the clamping component 2 on the wafer 100 , thereby improving the safety and stability of the embodiment of the present application.

It should be noted that the embodiment of the present application does not limit the specific transmission mode of the annular driving member 31 and the engaging member 2 , for example, the transmission of the two can also be realized through contact friction, thereby reducing the processing cost. Therefore, the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the setting by themselves according to the actual situation.

In an embodiment of the present application, as shown in FIGS. 1A to 3 , the driving mechanism 3 further includes a transmission member 32 and a driver (not shown in the figure), the transmission member 32 is arranged in the housing 1, and the transmission member 32 The outer circumference of the ring has a second tooth portion meshed with the toothed structure, and the driver is connected to the transmission member 32 for driving the ring drive member 31 to rotate by driving the transmission member 32 to rotate around its own axis. Specifically, the transmission member 32 may adopt a gear structure, that is, the outer circumference of the transmission member 32 has a second tooth portion meshing with the toothed structure. The transmission member 32 can be set in the housing 1 as a whole, and the second tooth portion is engaged with the toothed structure of the ring drive member 31. The driver is connected to the transmission member 32. The driver is, for example, a motor, and the transmission member is used to transfer the power of the driver The power is transmitted to the ring driving member 31 , and then the toothed structure of the ring driving member 31 meshes with the first tooth portion of the engaging member 2 , so that the power is transmitted from the ring driving member 31 to the engaging member 2 . Since the transmission part 32, the ring drive part 31 and the engaging part 2 are all driven by gears, the power transmission is relatively stable and accurate, and it is convenient to control the rotation angle of the transmission part 32 through the number of meshed teeth, so as to avoid the impact of the transmission part 32 on the wafer 100. The greater clamping force causes the wafer 100 to fragment, thereby further improving the safety and stability of the embodiment of the present application.

It should be noted that the embodiment of the present application does not limit the specific number of transmission elements 32 , for example, there may be multiple transmission elements 32 distributed on the outer circumference of the annular driving element 31 , so as to improve the stability of power transmission. Therefore, the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the setting by themselves according to the actual situation.

In one embodiment of the present application, as shown in FIG. 1A to FIG. 3 , the housing 1 includes a first cover plate 12 and a second cover plate 13, the first cover plate 12 covers the second cover plate 13, and the second cover plate 13 Both the first cover plate 12 and the second cover plate 13 have circular gaps to form the hollow part 11 by butting; and the two are butted to form an installation space, and the installation space is used to accommodate the first tooth portion, the ring drive member 31 and the transmission member 32.

As shown in Fig. 1A to Fig. 3, the first cover plate 12 and the second cover plate 13 both adopt circular structures, that is, both the first cover plate 12 and the second cover plate 13 have circular gaps, when the first cover plate When the plate 12 and the second cover plate 13 are closed, the circular notch cooperates to form the hollow part 11 of the above-mentioned embodiment. Both the first cover plate 12 and the second cover plate 13 are formed with annular grooves extending along their circumferential direction. When the first cover plate 12 and the second cover plate 13 are closed, the two cover plates can form an installation space. In order to accommodate the first tooth portion of the rotating shaft 21 , the ring driving member 31 and the transmission member 32 . Further, the first tooth part of the engaging part 2 is located in the installation space, the top end of the engaging part 2 can be connected with the first cover plate 12, and part of the rotating shaft 21 and the eccentric shaft 22 of the engaging part 2 pass through the second cover plate 13 behind the bottom of the second cover 13 ; In practical application, only the second cover plate 13 needs to be disassembled to realize disassembly and maintenance of various components, thereby greatly improving the disassembly and maintenance efficiency of the embodiment of the present application.

It should be noted that the embodiment of the present application does not limit the cooperation between the engaging part 2, the transmission part 32 and the driving part and the housing 1, for example, the engaging part 2, the transmission part 32 and the annular driving part 31 can all be set on the second housing 1. Therefore, the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the setting by themselves according to the actual situation.

In an embodiment of the present application, as shown in FIGS. 1A to 3 , the grabbing device further includes a connection structure 5, one end (such as the bottom end) of the connection structure 5 is connected to the housing 1, and one end of the connection structure 5 (such as The top) is higher than the top surface of the housing 1 and is used for connecting with the driving device. Specifically, the connecting structure 5 and the casing 1 may adopt an integrally formed structure, but the embodiment of the present application is not limited thereto, for example, the two may also adopt a split structure. Further, the connecting structure 5 can specifically adopt an inverted "L"-shaped structure, wherein the vertical bar of the connecting structure 5 can be arranged on one side of the housing 1, and the bottom end of the vertical bar can be integrally formed with the outer peripheral wall of the housing 1, The top is higher than the top surface of the housing 1, that is, the height of the vertical rod is greater than the axial height of the housing 1. One end of the cross bar of the connecting structure 5 can be connected to the top of the vertical rod, and the other end is used to connect with the driving device. In actual application, the driving device can directly drive the housing 1 into the process chamber to take the slices. Specifically, when the process chamber is used to perform the cleaning process, the carrying device can be lifted and lowered in the process chamber, and the connecting structure 5 It is designed so that the carrying device drives the wafer up to a certain distance from the opening of the process chamber. At this time, the housing 1 can be extended into the process chamber to pick and place the wafer, which avoids the need for the carrying device in the prior art to raise the wafer to Only when the gripping device is flush with the opening of the process chamber can the wafer be picked and placed, thus causing the problem of particle contamination. Therefore, the embodiment of the present application not only prevents the upper surface of the wafer 100 from being contaminated by particles to a certain extent, but also improves the transmission efficiency. efficiency. Furthermore, since there is no need for the carrying device to rise to a higher position, mechanical interference between the casing 1 and the carrying device can be avoided, thereby further improving the safety and stability of the embodiment of the present application.

In order to further illustrate the technical effects of the embodiments of the present application, a specific implementation of the present application will be described below in conjunction with the accompanying drawings.

As shown in Figures 1 to 4B, when the process chamber completes the process, since the carrying device 201 and the engaging member do not rotate relatively, the angles of the two can be adjusted by preset to realize the six positions of the carrying device 201. The positions of the pins 202 and the positions of the six engaging parts 2 are staggered, for example, the angle between any two adjacent pins 202 and engaging parts 2 and the line connecting the axis of the housing 1 is 15 degrees. At this time, the driving device drives the housing 1 to move into the process chamber, and when the axis of the grasping device coincides with the axis of the process chamber, the housing 1 and the engaging part 2 descend at the same time. The upper surface of the carrier plate 24 drops to 1 mm from the lower surface of the wafer 100 and stops falling. Because there is a protective gas between the carrying device and the lower surface of the wafer 100, the wafer 100 shakes within the range of the six card pins 202. At this time, the housing 1 is controlled to rise so that the upper surface of the carrying plate 24 is in contact with the wafer 100. The lower surface contacts, the wafer 100 stops shaking, and the clamping part 2 rotates a preset angle under the drive of the ring drive part 31 to gather the wafer 100 to the center of the housing 1. After the wafer 100 is clamped, the housing 1 goes up and takes out the wafer 100. When releasing the wafer, the grabbing device grabs the wafer 100 into the process chamber and places it on the carrier device 201, the six engaging parts 2 are opened to release the wafer 100, and then the grabbing device lifts up to leave the process chamber.

Based on the same inventive concept, an embodiment of the present application provides a semiconductor process equipment, including: a process chamber, a driving device, and a grasping device as provided in the above-mentioned embodiments. A liftable carrying device is provided in the process chamber, and the grasping device Connected with the driving device, it is used to move to the carrier device under the driving device to grab or release the wafer.

Optionally, the semiconductor processing equipment may be, for example, single wafer cleaning equipment.

By applying the embodiments of the present application, at least the following beneficial effects can be achieved:

In the embodiment of the present application, the housing is provided with a plurality of engaging parts distributed along the circumferential direction, and through the cooperation of the plurality of engaging parts with the edge of the wafer, the clamping and clamping of the wafer is realized, and then the alignment is realized through the driving device. Wafer transfer. Since a plurality of engaging parts are arranged along the circumferential direction of the housing, the ring formed by the plurality of engaging parts can be arranged concentrically with the housing, and the wafer can be connected with multiple cards in the process of actually grabbing the wafer. The assembly and the shell are arranged concentrically, so as to avoid the wafer grabbing failure caused by the offset between the wafer and the grabbing device, or the wafer falling off and fragments due to the wafer offset after the grabbing is successful, so as to ensure the pickup The stability and success rate of wafers can be improved, thereby improving wafer transfer efficiency and wafer yield.

The foregoing content summarizes the features of several embodiments, so that those skilled in the art can better understand aspects of the present disclosure. Those skilled in the art should appreciate that they can readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments described herein. Those skilled in the art should also understand that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.

1: Shell 2: Fastening parts 3: Driving mechanism 5: Connection structure 11: Hollow out part 12: The first cover 13:Second cover plate 21: Shaft 22: Eccentric shaft 23: clamping column 24: Loading board 31: ring drive 32: Transmission parts 100: Wafer 201: carrying device 202: stuck needle

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying drawings. It should be noted that, in accordance with the standard practice in the industry, various components are not drawn to scale. In fact, the dimensions of the various components may be arbitrarily increased or decreased for clarity of discussion. FIG. 1A is a schematic front view of a grabbing device provided in an embodiment of the present application; FIG. 1B is a schematic top view of a grabbing device provided in an embodiment of the present application; Fig. 2A is a schematic front view of a fastener provided in an embodiment of the present application; Fig. 2B is a schematic bottom view of a fastener provided in the embodiment of the present application; Fig. 3 is a schematic bottom view of an omitted part of a grabbing device provided by an embodiment of the present application; Fig. 4A is a schematic structural diagram of the cooperation between a grabbing device and a carrying device provided in an embodiment of the present application; Fig. 4B is a schematic diagram of the structure of a pin cooperation between a grabbing device and a carrying device according to an embodiment of the present application.

1: Shell

2: Fastening parts

5: Connection structure

12: The first cover

13:Second cover plate

100: Wafer

Claims (11)

A grabbing device for semiconductor processing equipment, used for grabbing wafers, and connected to a drive device in the semiconductor process equipment, used to transport wafers under the drive of the drive device, including: a housing, a drive Mechanism and a plurality of engaging parts; the housing is used to connect with the driving device, and is used to move under the drive of the driving device; a plurality of the engaging parts are rotatably connected with the housing, and along the circumference of the housing Distributed at intervals, the driving mechanism is used to synchronously drive the rotation of each engaging member to clamp or release the edge of the wafer. The grabbing device as claimed in claim 1, wherein, when the plurality of engaging members clamp the wafer, the wafer is located below the housing, and the housing has a hollow part, and the hollow part is used for to expose the top surface of the wafer. The grabbing device as claimed in claim 1 or 2, wherein each engaging member includes a rotating shaft and an eccentric shaft, the rotating shaft is rotatably connected to the housing, the eccentric shaft is eccentrically arranged with the rotating shaft, And fixedly connected, the rotating shaft can rotate clockwise or counterclockwise around its axis, so as to drive the eccentric shaft to rotate to a first position for clamping the edge of the wafer, or a second position for releasing the edge of the wafer. The grabbing device as claimed in claim 3, wherein, the end of the eccentric shaft away from the rotating shaft is provided with a bearing part, and the bearing part is used to support the bottom of the wafer when the eccentric shaft rotates to the first position at the edge. The grabbing device according to claim 4, wherein the eccentric shaft includes a clamping column, and the bearing part includes a bearing plate; one end of the clamping column is connected to the rotating shaft, and the other end of the clamping column is connected to the rotating shaft. The bearing plate is connected; the bearing plate is arranged below the rotating shaft at intervals, and is eccentrically arranged with the clamping column, so as to support the bottom edge of the wafer when the eccentric shaft rotates to the first position. The grabbing device according to claim 3, wherein the driving mechanism includes an annular driving member arranged in the housing and arranged around the circumference of the housing, the annular driving member is connected with a plurality of the engaging members The rotating shafts are connected to synchronously drive the rotating shafts of the plurality of engaging parts to rotate clockwise or counterclockwise around their axes. The grabbing device as claimed in claim 6, wherein, the outer peripheral surface of the ring-shaped driving member is provided with a toothed structure, and the outer peripheral surface of the rotating shaft of the plurality of engaging members is provided with a first toothed structure meshed with the outer peripheral surface. In the tooth portion, the ring driving part synchronously drives the rotating shafts of the plurality of engaging parts to rotate clockwise or counterclockwise around the axis by rotating around its own axis. The grabbing device as claimed in item 7, wherein the driving mechanism further includes a transmission member and a driver, the transmission member is arranged in the housing, and the outer circumference of the transmission member has a first gear meshed with the toothed structure. The driver is connected with the transmission part, and is used to drive the ring drive part to rotate by driving the transmission part to rotate around its own axis. The gripping device as described in claim 8, wherein the housing includes a first cover plate and a second cover plate, the first cover plate is covered on the second cover plate, the first cover plate and the Each of the second cover plates has a notch to form the hollow part by butting; the two are butted to form an installation space, and the installation space is used to accommodate the first tooth part, the ring-shaped driving part and the transmission part. The grabbing device as claimed in claim 1, wherein the grabbing device further includes a connecting structure, one end of the connecting structure is connected to the housing, and the other end of the connecting structure is higher than the top surface of the housing, for connected to the drive unit. A semiconductor process equipment, including: a process chamber, a driving device, and the grabbing device according to any one of claims 1 to 10, a liftable carrying device is provided in the process chamber, and the grab The fetching device is connected with the driving device, and is used to move above the carrying device under the driving of the driving device to grab or release the wafer.

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