CN115667578A - 导电性颗粒、使用其的导电性材料和连接构造体 - Google Patents

导电性颗粒、使用其的导电性材料和连接构造体 Download PDF

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Publication number
CN115667578A
CN115667578A CN202180036684.9A CN202180036684A CN115667578A CN 115667578 A CN115667578 A CN 115667578A CN 202180036684 A CN202180036684 A CN 202180036684A CN 115667578 A CN115667578 A CN 115667578A
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CN
China
Prior art keywords
conductive
conductive particles
particles
conductive layer
group
Prior art date
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Pending
Application number
CN202180036684.9A
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English (en)
Chinese (zh)
Inventor
松本千纮
田杉直也
星野圭代
山本将浩
稻叶裕之
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Nippon Chemical Industrial Co Ltd
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Nippon Chemical Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021081137A external-priority patent/JP7041305B2/ja
Application filed by Nippon Chemical Industrial Co Ltd filed Critical Nippon Chemical Industrial Co Ltd
Publication of CN115667578A publication Critical patent/CN115667578A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
CN202180036684.9A 2020-05-20 2021-05-18 导电性颗粒、使用其的导电性材料和连接构造体 Pending CN115667578A (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2020088180 2020-05-20
JP2020-088183 2020-05-20
JP2020088183 2020-05-20
JP2020-088180 2020-05-20
JP2021-006520 2021-01-19
JP2021006520 2021-01-19
JP2021-081137 2021-05-12
JP2021081137A JP7041305B2 (ja) 2020-05-20 2021-05-12 導電性粒子、それを用いた導電性材料及び接続構造体
PCT/JP2021/018785 WO2021235434A1 (ja) 2020-05-20 2021-05-18 導電性粒子、それを用いた導電性材料及び接続構造体

Publications (1)

Publication Number Publication Date
CN115667578A true CN115667578A (zh) 2023-01-31

Family

ID=78708522

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180036684.9A Pending CN115667578A (zh) 2020-05-20 2021-05-18 导电性颗粒、使用其的导电性材料和连接构造体

Country Status (4)

Country Link
KR (1) KR20230012496A (ja)
CN (1) CN115667578A (ja)
TW (1) TW202144522A (ja)
WO (1) WO2021235434A1 (ja)

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63153280A (ja) * 1986-12-17 1988-06-25 Nippon Shirika Kogyo Kk 導電性無機珪酸質材料の製造方法
JPH09102661A (ja) * 1995-10-03 1997-04-15 Sekisui Finechem Co Ltd 電極間の導電接続方法及び導電性微粒子
JP2000243132A (ja) * 1999-02-22 2000-09-08 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
KR20070010809A (ko) * 2005-07-20 2007-01-24 제일모직주식회사 이방 전도 접속용 단분산성 고분자 수지 미립자 및 전도성미립자
JP2007035575A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
CN101099218A (zh) * 2005-02-22 2008-01-02 第一毛织株式会社 聚合物颗粒和导电性能增强的导电颗粒以及含有该导电颗粒的各向异性导电封装材料
JP2008059914A (ja) * 2006-08-31 2008-03-13 Hayakawa Rubber Co Ltd 樹脂微粒子及び導電性微粒子
CN102089832A (zh) * 2008-07-24 2011-06-08 索尼化学&信息部件株式会社 导电性粒子、各向异性导电膜、接合体以及连接方法
JP2012028334A (ja) * 2011-09-07 2012-02-09 Sony Chemical & Information Device Corp 異方性導電フィルム及び接続構造体の製造方法
CN103366855A (zh) * 2012-04-10 2013-10-23 日本化学工业株式会社 导电性颗粒和包含该导电性颗粒的导电性材料
JP2014160647A (ja) * 2013-01-24 2014-09-04 Sekisui Chem Co Ltd 基材粒子、導電性粒子、導電材料及び接続構造体
JP2014160648A (ja) * 2013-01-24 2014-09-04 Sekisui Chem Co Ltd 基材粒子、導電性粒子、導電材料及び接続構造体
CN104106182A (zh) * 2012-02-20 2014-10-15 迪睿合电子材料有限公司 各向异性导电连接材料、连接结构体、连接结构体的制造方法和连接方法
JP2014207193A (ja) * 2013-04-15 2014-10-30 株式会社日本触媒 導電性微粒子及びそれを用いた異方性導電材料
CN104541333A (zh) * 2012-12-06 2015-04-22 积水化学工业株式会社 导电材料、连接结构体及连接结构体的制造方法
JP2016041803A (ja) * 2014-08-14 2016-03-31 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体
US20160316569A1 (en) * 2013-12-16 2016-10-27 Dexerials Corporation Mounting body manufacturing method and anisotropic conductive film
CN106233396A (zh) * 2014-05-12 2016-12-14 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
JP2017212223A (ja) * 2017-08-28 2017-11-30 株式会社日本触媒 導電性微粒子及びそれを用いた異方性導電材料

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104380393B (zh) 2012-07-05 2017-11-28 积水化学工业株式会社 导电性粒子、树脂粒子、导电材料及连接结构体
JP6286852B2 (ja) 2013-04-01 2018-03-07 日立化成株式会社 導電粒子、異方導電性接着剤及び導電粒子の製造方法

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63153280A (ja) * 1986-12-17 1988-06-25 Nippon Shirika Kogyo Kk 導電性無機珪酸質材料の製造方法
JPH09102661A (ja) * 1995-10-03 1997-04-15 Sekisui Finechem Co Ltd 電極間の導電接続方法及び導電性微粒子
JP2000243132A (ja) * 1999-02-22 2000-09-08 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
CN101099218A (zh) * 2005-02-22 2008-01-02 第一毛织株式会社 聚合物颗粒和导电性能增强的导电颗粒以及含有该导电颗粒的各向异性导电封装材料
KR20070010809A (ko) * 2005-07-20 2007-01-24 제일모직주식회사 이방 전도 접속용 단분산성 고분자 수지 미립자 및 전도성미립자
JP2007035575A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
JP2008059914A (ja) * 2006-08-31 2008-03-13 Hayakawa Rubber Co Ltd 樹脂微粒子及び導電性微粒子
CN102089832A (zh) * 2008-07-24 2011-06-08 索尼化学&信息部件株式会社 导电性粒子、各向异性导电膜、接合体以及连接方法
JP2012028334A (ja) * 2011-09-07 2012-02-09 Sony Chemical & Information Device Corp 異方性導電フィルム及び接続構造体の製造方法
CN104106182A (zh) * 2012-02-20 2014-10-15 迪睿合电子材料有限公司 各向异性导电连接材料、连接结构体、连接结构体的制造方法和连接方法
CN103366855A (zh) * 2012-04-10 2013-10-23 日本化学工业株式会社 导电性颗粒和包含该导电性颗粒的导电性材料
CN104541333A (zh) * 2012-12-06 2015-04-22 积水化学工业株式会社 导电材料、连接结构体及连接结构体的制造方法
JP2014160647A (ja) * 2013-01-24 2014-09-04 Sekisui Chem Co Ltd 基材粒子、導電性粒子、導電材料及び接続構造体
JP2014160648A (ja) * 2013-01-24 2014-09-04 Sekisui Chem Co Ltd 基材粒子、導電性粒子、導電材料及び接続構造体
JP2014207193A (ja) * 2013-04-15 2014-10-30 株式会社日本触媒 導電性微粒子及びそれを用いた異方性導電材料
US20160316569A1 (en) * 2013-12-16 2016-10-27 Dexerials Corporation Mounting body manufacturing method and anisotropic conductive film
CN106233396A (zh) * 2014-05-12 2016-12-14 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
JP2016041803A (ja) * 2014-08-14 2016-03-31 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体
JP2017212223A (ja) * 2017-08-28 2017-11-30 株式会社日本触媒 導電性微粒子及びそれを用いた異方性導電材料

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WO2021235434A1 (ja) 2021-11-25
TW202144522A (zh) 2021-12-01
KR20230012496A (ko) 2023-01-26

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