CN115537760A - 成膜装置、成膜方法及蒸发源单元 - Google Patents
成膜装置、成膜方法及蒸发源单元 Download PDFInfo
- Publication number
- CN115537760A CN115537760A CN202210710546.0A CN202210710546A CN115537760A CN 115537760 A CN115537760 A CN 115537760A CN 202210710546 A CN202210710546 A CN 202210710546A CN 115537760 A CN115537760 A CN 115537760A
- Authority
- CN
- China
- Prior art keywords
- evaporation source
- evaporation
- monitoring
- film forming
- vapor deposition
- Prior art date
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- Granted
Links
- 238000001704 evaporation Methods 0.000 title claims abstract description 239
- 230000008020 evaporation Effects 0.000 title claims abstract description 239
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 145
- 239000000463 material Substances 0.000 claims abstract description 110
- 238000007740 vapor deposition Methods 0.000 claims abstract description 90
- 238000012544 monitoring process Methods 0.000 claims abstract description 62
- 230000008021 deposition Effects 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 114
- 238000007599 discharging Methods 0.000 claims description 10
- 230000001629 suppression Effects 0.000 claims description 8
- 238000009834 vaporization Methods 0.000 claims 7
- 230000008016 vaporization Effects 0.000 claims 7
- 239000010408 film Substances 0.000 description 216
- 239000010410 layer Substances 0.000 description 93
- 238000012806 monitoring device Methods 0.000 description 68
- 238000000151 deposition Methods 0.000 description 27
- 238000004519 manufacturing process Methods 0.000 description 13
- 230000005525 hole transport Effects 0.000 description 11
- 230000000875 corresponding effect Effects 0.000 description 8
- 238000009826 distribution Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 101001139126 Homo sapiens Krueppel-like factor 6 Proteins 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
- C23C14/546—Controlling the film thickness or evaporation rate using measurement on deposited material using crystal oscillators
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-109399 | 2021-06-30 | ||
| JP2021109399A JP7314209B2 (ja) | 2021-06-30 | 2021-06-30 | 成膜装置、成膜方法及び蒸発源ユニット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115537760A true CN115537760A (zh) | 2022-12-30 |
| CN115537760B CN115537760B (zh) | 2024-09-20 |
Family
ID=84723987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210710546.0A Active CN115537760B (zh) | 2021-06-30 | 2022-06-22 | 成膜装置、成膜方法及蒸发源单元 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7314209B2 (ko) |
| KR (1) | KR20230004284A (ko) |
| CN (1) | CN115537760B (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115537734A (zh) * | 2021-06-30 | 2022-12-30 | 佳能特机株式会社 | 成膜装置、成膜方法及蒸发源单元 |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56160964U (ko) * | 1980-05-02 | 1981-11-30 | ||
| JPH07109569A (ja) * | 1993-10-08 | 1995-04-25 | Shincron:Kk | 薄膜形成方法 |
| JP2004225058A (ja) * | 2002-11-29 | 2004-08-12 | Sony Corp | 成膜装置および表示パネルの製造装置とその方法 |
| JP2011042868A (ja) * | 2009-07-24 | 2011-03-03 | Hitachi High-Technologies Corp | 真空蒸着方法及びその装置 |
| KR20120010736A (ko) * | 2010-07-27 | 2012-02-06 | 히다치 조센 가부시키가이샤 | 증착장치 |
| US20120174865A1 (en) * | 2011-01-12 | 2012-07-12 | Choi Young-Mook | Deposition source and organic layer deposition apparatus including the same |
| CN103282538A (zh) * | 2011-01-18 | 2013-09-04 | 夏普株式会社 | 蒸镀装置、蒸镀方法、有机el元件和有机el显示装置 |
| WO2013132794A1 (ja) * | 2012-03-07 | 2013-09-12 | パナソニック株式会社 | 蒸着装置 |
| JP2013185252A (ja) * | 2012-03-12 | 2013-09-19 | Hitachi High-Technologies Corp | 蒸発源装置及び真空蒸着装置及び有機ｅｌ表示装置の製造方法 |
| JP2014070238A (ja) * | 2012-09-28 | 2014-04-21 | Hitachi High-Technologies Corp | 真空蒸着装置及びその蒸着方法 |
| JP2016117915A (ja) * | 2014-12-18 | 2016-06-30 | キヤノントッキ株式会社 | 蒸着装置並びに蒸着方法 |
| CN106885549A (zh) * | 2017-03-24 | 2017-06-23 | 京东方科技集团股份有限公司 | 一种导向管、薄膜厚度传感器及蒸镀设备 |
| US20170222191A1 (en) * | 2016-11-28 | 2017-08-03 | Shanghai Tianma AM-OLED Co., Ltd. | Vacuum evaporation device and method thereof, and organic light-emitting display panel |
| CN110158036A (zh) * | 2019-03-15 | 2019-08-23 | 上海视涯信息科技有限公司 | 一种蒸镀沉积设备及其使用方法 |
| JP2020020032A (ja) * | 2018-07-31 | 2020-02-06 | キヤノントッキ株式会社 | 蒸発レート測定装置、蒸発レート測定装置の制御方法、成膜装置、成膜方法及び電子デバイスを製造する方法 |
| JP2020139227A (ja) * | 2019-02-27 | 2020-09-03 | キヤノントッキ株式会社 | 成膜装置、成膜方法、及び電子デバイス製造方法 |
| JP2020164920A (ja) * | 2019-03-29 | 2020-10-08 | キヤノントッキ株式会社 | 成膜装置及び成膜方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2185640A1 (en) * | 1995-11-30 | 1997-05-31 | Russell J. Hill | Electron beam evaporation apparatus and method |
| JP6243474B2 (ja) | 2015-06-18 | 2017-12-06 | キヤノントッキ株式会社 | 真空蒸着装置、蒸着膜の製造方法および有機電子デバイスの製造方法 |
| KR101965102B1 (ko) | 2018-06-15 | 2019-04-02 | 캐논 톡키 가부시키가이샤 | 성막장치, 성막방법 및 전자 디바이스 제조방법 |
-
2021
- 2021-06-30 JP JP2021109399A patent/JP7314209B2/ja active Active
-
2022
- 2022-06-22 CN CN202210710546.0A patent/CN115537760B/zh active Active
- 2022-06-23 KR KR1020220076640A patent/KR20230004284A/ko not_active Application Discontinuation
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56160964U (ko) * | 1980-05-02 | 1981-11-30 | ||
| JPH07109569A (ja) * | 1993-10-08 | 1995-04-25 | Shincron:Kk | 薄膜形成方法 |
| JP2004225058A (ja) * | 2002-11-29 | 2004-08-12 | Sony Corp | 成膜装置および表示パネルの製造装置とその方法 |
| JP2011042868A (ja) * | 2009-07-24 | 2011-03-03 | Hitachi High-Technologies Corp | 真空蒸着方法及びその装置 |
| KR20120010736A (ko) * | 2010-07-27 | 2012-02-06 | 히다치 조센 가부시키가이샤 | 증착장치 |
| US20120174865A1 (en) * | 2011-01-12 | 2012-07-12 | Choi Young-Mook | Deposition source and organic layer deposition apparatus including the same |
| CN102586738A (zh) * | 2011-01-12 | 2012-07-18 | 三星移动显示器株式会社 | 沉积源和包括沉积源的有机层沉积装置 |
| CN103282538A (zh) * | 2011-01-18 | 2013-09-04 | 夏普株式会社 | 蒸镀装置、蒸镀方法、有机el元件和有机el显示装置 |
| CN104136653A (zh) * | 2012-03-07 | 2014-11-05 | 松下电器产业株式会社 | 蒸镀装置 |
| WO2013132794A1 (ja) * | 2012-03-07 | 2013-09-12 | パナソニック株式会社 | 蒸着装置 |
| JP2013185252A (ja) * | 2012-03-12 | 2013-09-19 | Hitachi High-Technologies Corp | 蒸発源装置及び真空蒸着装置及び有機ｅｌ表示装置の製造方法 |
| JP2014070238A (ja) * | 2012-09-28 | 2014-04-21 | Hitachi High-Technologies Corp | 真空蒸着装置及びその蒸着方法 |
| JP2016117915A (ja) * | 2014-12-18 | 2016-06-30 | キヤノントッキ株式会社 | 蒸着装置並びに蒸着方法 |
| US20170222191A1 (en) * | 2016-11-28 | 2017-08-03 | Shanghai Tianma AM-OLED Co., Ltd. | Vacuum evaporation device and method thereof, and organic light-emitting display panel |
| CN106885549A (zh) * | 2017-03-24 | 2017-06-23 | 京东方科技集团股份有限公司 | 一种导向管、薄膜厚度传感器及蒸镀设备 |
| JP2020020032A (ja) * | 2018-07-31 | 2020-02-06 | キヤノントッキ株式会社 | 蒸発レート測定装置、蒸発レート測定装置の制御方法、成膜装置、成膜方法及び電子デバイスを製造する方法 |
| JP2020139227A (ja) * | 2019-02-27 | 2020-09-03 | キヤノントッキ株式会社 | 成膜装置、成膜方法、及び電子デバイス製造方法 |
| CN111621762A (zh) * | 2019-02-27 | 2020-09-04 | 佳能特机株式会社 | 成膜装置、成膜方法以及电子器件制造方法 |
| CN110158036A (zh) * | 2019-03-15 | 2019-08-23 | 上海视涯信息科技有限公司 | 一种蒸镀沉积设备及其使用方法 |
| JP2020164920A (ja) * | 2019-03-29 | 2020-10-08 | キヤノントッキ株式会社 | 成膜装置及び成膜方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115537734A (zh) * | 2021-06-30 | 2022-12-30 | 佳能特机株式会社 | 成膜装置、成膜方法及蒸发源单元 |
| CN115537734B (zh) * | 2021-06-30 | 2024-04-19 | 佳能特机株式会社 | 成膜装置、成膜方法及蒸发源单元 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023006676A (ja) | 2023-01-18 |
| CN115537760B (zh) | 2024-09-20 |
| JP7314209B2 (ja) | 2023-07-25 |
| KR20230004284A (ko) | 2023-01-06 |
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