CN115529846A - 显示基板及其制作方法、显示装置 - Google Patents
显示基板及其制作方法、显示装置 Download PDFInfo
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- CN115529846A CN115529846A CN202180000897.6A CN202180000897A CN115529846A CN 115529846 A CN115529846 A CN 115529846A CN 202180000897 A CN202180000897 A CN 202180000897A CN 115529846 A CN115529846 A CN 115529846A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 46
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- 238000005520 cutting process Methods 0.000 claims abstract description 111
- 230000000903 blocking effect Effects 0.000 claims abstract description 101
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 75
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- 238000005538 encapsulation Methods 0.000 claims description 33
- 239000010409 thin film Substances 0.000 claims description 16
- 125000006850 spacer group Chemical group 0.000 claims description 15
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- 239000004642 Polyimide Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
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- 238000002347 injection Methods 0.000 description 2
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- 238000000926 separation method Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
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Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
本公开提供一种显示基板及其制作方法、显示装置。显示基板包括显示区域,显示区域包括开孔区,第一像素区和隔离区;隔离区位于第一像素区和开孔区之间,隔离区环绕开孔区,开孔区与隔离区之间的边界线为切割线;显示基板还包括:裂痕阻挡结构,剥离阻挡结构和封装结构,裂痕阻挡结构位于隔离区,隔离区包括位于裂痕阻挡结构与开孔区之间的保留切割过渡区;剥离阻挡结构位于保留切割过渡区;剥离阻挡结构最靠近开孔区的一侧与切割线之间的距离L满足:0μm≤L≤30μm;封装结构的第一部分位于剥离阻挡结构背向基底的一侧;剥离阻挡结构使显示基板中与第一部分接触的表面凹凸不平。
Description
PCT国内申请,说明书已公开。
Claims (20)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2021/089609 WO2022226686A1 (zh) | 2021-04-25 | 2021-04-25 | 显示基板及其制作方法、显示装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115529846A true CN115529846A (zh) | 2022-12-27 |
Family
ID=83846686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202180000897.6A Pending CN115529846A (zh) | 2021-04-25 | 2021-04-25 | 显示基板及其制作方法、显示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20230345798A1 (zh) |
CN (1) | CN115529846A (zh) |
WO (1) | WO2022226686A1 (zh) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10608062B2 (en) * | 2017-03-16 | 2020-03-31 | Sharp Kabushiki Kaisha | Display device |
KR102576994B1 (ko) * | 2018-06-28 | 2023-09-12 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
CN110518046A (zh) * | 2019-08-30 | 2019-11-29 | 云谷(固安)科技有限公司 | 一种显示面板以及显示装置 |
CN111129351B (zh) * | 2020-01-02 | 2022-10-28 | 武汉天马微电子有限公司 | 一种显示面板及显示装置 |
CN111933822B (zh) * | 2020-08-20 | 2022-10-14 | 昆山国显光电有限公司 | 显示面板的制作方法、显示面板以及显示装置 |
-
2021
- 2021-04-25 CN CN202180000897.6A patent/CN115529846A/zh active Pending
- 2021-04-25 US US17/636,147 patent/US20230345798A1/en active Pending
- 2021-04-25 WO PCT/CN2021/089609 patent/WO2022226686A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20230345798A1 (en) | 2023-10-26 |
WO2022226686A1 (zh) | 2022-11-03 |
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