CN115528163A - Module that LED lamp pearl of integrated encapsulation was made - Google Patents
Module that LED lamp pearl of integrated encapsulation was made Download PDFInfo
- Publication number
- CN115528163A CN115528163A CN202110724073.5A CN202110724073A CN115528163A CN 115528163 A CN115528163 A CN 115528163A CN 202110724073 A CN202110724073 A CN 202110724073A CN 115528163 A CN115528163 A CN 115528163A
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- CN
- China
- Prior art keywords
- support
- electrodes
- control element
- led
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000005538 encapsulation Methods 0.000 title claims description 4
- 239000011324 bead Substances 0.000 claims abstract description 50
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 30
- 239000003292 glue Substances 0.000 claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 claims abstract description 13
- 238000004021 metal welding Methods 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 2
- 239000008393 encapsulating agent Substances 0.000 claims 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a module made of an integrally packaged LED lamp bead, in particular to an integrally packaged LED lamp bead which is made of LED chips and control elements and is made on a support, wherein the LED support is an LED support made of metal embedded on resin, the front surface of the support is provided with metal electrodes, the back surface of the support is provided with metal welding feet, the support is provided with at least 2 cups, the metal electrodes are exposed at the bottoms of the cups, the control elements are welded on the two electrodes in one cup, the LED chips are packaged on the two electrodes in the other cup, one electrode of a conducting chip and one electrode of the conducting control element are connected into a whole, at least two metal welding feet are exposed at the back surface of the support, the LED chips are sealed by packaging glue or the LED chips and the control elements are sealed, the integrally packaged LED lamp bead is made, and the integrally packaged LED lamp bead is welded on a circuit board to make the integrated module.
Description
Technical Field
The invention relates to the field of LEDs, in particular to a module made of integrally packaged LED lamp beads.
Background
The module of prior art's integrated LED lamp pearl preparation, used LED lamp pearl are all encapsulated the integrated LED lamp pearl of making in a cup of support to controlling element and LED chip, and this kind of lamp pearl has two serious problems:
(1) and because the control element can also generate heat when the lamp beads work, the lighting effect and the service life of the LED chip are influenced.
(2) Because the control element surface absorbs light, the light emitted by the LED chip is lost.
How to solve the two problems, the integrated LED lamp bead manufactured by the invention is manufactured into a module, and the two problems are solved by the specific method as follows:
the utility model provides a module that LED lamp pearl of integrated encapsulation was made, includes: an LED support; an LED chip; a control element; packaging glue; a circuit board; the LED lamp bead integrated package module is characterized in that the LED support is made by metal embedded on resin, metal welding feet are arranged on the back of the support by metal embedded in the resin, metal electrodes are arranged on the front of the support, at least two cups are arranged on the support, metal electrodes are arranged on the bottoms of the cups, a control element is welded on the two metal electrodes on one bottom of each cup, an LED chip is fixedly connected with the metal electrodes in the other cups in a conduction mode, one metal electrode is connected with the control element in one cup, the other metal electrode is connected with the chip in the other cup, at least two metal welding feet are arranged on the back of the support, the LED lamp bead integrated package module is made by welding the LED chip and the control element on one LED support, and packaging glue seals the LED chip or seals both the LED chip and the control element.
Obviously, the lamp bead used for making such a module is characterized in that the LED chip and the control element are respectively arranged in different cups, and the heat generated by the control element is isolated during operation! The influence on the chip is reduced, and meanwhile, the light emitted by the chip cannot be directly transmitted to the control element and is absorbed by the control element.
Disclosure of Invention
The invention relates to a module made of an integrally packaged LED lamp bead, in particular to an integrally packaged LED lamp bead which is made of LED chips and control elements and is made on a support, wherein the LED support is an LED support made of metal embedded on resin, the front surface of the support is provided with metal electrodes, the back surface of the support is provided with metal welding feet, the support is provided with at least 2 cups, the metal electrodes are exposed at the bottoms of the cups, the control elements are welded on the two electrodes in one cup, the LED chips are packaged on the two electrodes in the other cup, one electrode of a conducting chip and one electrode of the conducting control element are connected into a whole, at least two metal welding feet are exposed at the back surface of the support, the LED chips are sealed by packaging glue or the LED chips and the control elements are sealed, the integrally packaged LED lamp bead is made, and the integrally packaged LED lamp bead is welded on a circuit board to make the integrated module.
The invention provides a module made of an integrally packaged LED lamp bead, which comprises: an LED support; an LED chip; a control element; packaging glue; a circuit board; the LED lamp bead integrated package is characterized in that the LED support is made of metal embedded on resin, metal welding feet are arranged on the back of the support by the metal embedded in the resin, metal electrodes are arranged on the front of the support, at least two cups are arranged on the support, the metal electrodes are arranged on the bottoms of the cups, a control element is welded on the two metal electrodes on one bottom of the cup, an LED chip is fixed and connected with the metal electrodes in the other cup in a conduction mode, one metal electrode is connected with the control element in one cup, the other metal electrode is connected with the chip in the other cup, at least two metal welding feet are arranged on the back of the support, the LED lamp bead integrated package is made of the LED chip and the control element on one LED support, the LED chip is sealed by packaging glue or both the LED chip and the control element are sealed, and the module made of the LED lamp bead integrated package is made of the LED lamp bead integrated package by welding the LED lamp bead integrated package on a circuit board.
According to a preferred embodiment of the present invention, the module made of the integrally packaged LED lamp bead is characterized in that the control element is a resistor or a capacitor or a control diode.
According to a preferred embodiment of the present invention, the module made of the integrally packaged LED lamp bead is characterized in that the LED chip is fixed on the electrode No. 1 and connected to the electrodes No. 1 and No. 2 through bonding wires, the control element is fixed on the electrodes No. 2 and No. 3, and the control element is electrically connected to the electrodes No. 2 and No. 3.
According to a preferred embodiment of the invention, the module made of the integrally packaged LED lamp bead is characterized in that the LED chip is fixed on the electrodes No. 1 and No. 2 and is connected and conducted to the electrodes No. 1 and No. 2, the control element is fixed on the electrodes No. 2 and No. 3, and the control element is connected and conducted with the electrodes No. 2 and No. 3.
According to a preferred embodiment of the invention, the module made of the integrally packaged LED lamp bead is characterized in that the LED chip is fixed on the electrodes No. 1 and No. 2 and is connected and conducted to the electrodes No. 1 and No. 2, the control element is fixed on the electrodes No. 2 and No. 3, and the control element is connected and conducted with the electrodes No. 2 and No. 3.
According to a preferred embodiment of the present invention, the module made of the integrally packaged LED lamp bead is characterized in that the chip is packaged on the support by the packaging adhesive, and the control element is still exposed without being packaged by the packaging adhesive.
According to a preferred embodiment of the present invention, the module made of the integrally packaged LED lamp bead is characterized in that the LED chip and the control element are both packaged on the support by the packaging adhesive, but the control element can still be seen through the packaging adhesive.
According to a preferred embodiment of the present invention, the module made of the integrally packaged LED lamp bead is characterized in that the circuit board is a rigid circuit board or a flexible circuit board.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
FIG. 1 is a schematic plan view of a single stent.
Fig. 2 is a perspective view of a single stent.
FIG. 3 is a schematic cross-sectional view of a single stent.
FIG. 4 is a schematic cross-sectional view of a support with a front-mounted LED chip and a resistor.
Fig. 5 is a schematic cross-sectional view of a flip-chip LED chip and a resistor fabricated on a support.
Fig. 6 is a schematic cross-sectional view of an integrally packaged LED lamp bead in which both the front-mounted LED chip and the resistor are covered by the phosphor glue.
Fig. 7 is a schematic cross-sectional view of an integrally packaged LED lamp bead with a front-mounted LED chip covered by phosphor glue and a resistor uncovered by phosphor glue.
Fig. 8 is a schematic cross-sectional view of an integrally packaged LED lamp bead in which both the flip LED chip and the resistor are covered by phosphor paste.
Fig. 9 is a schematic cross-sectional view of an integrally packaged LED lamp bead with a flip-chip LED chip covered by phosphor glue and a resistor uncovered by phosphor glue.
Fig. 10 is a schematic plan view of a flexible wiring board with two parallel flat conductors.
Fig. 11 is a schematic plan view of a module made of an integrally packaged LED lamp bead with both the chip and the resistor covered by the phosphor paste.
Fig. 12 is a schematic plan view of a module made of an integrally packaged LED lamp bead with a chip covered by phosphor paste and a resistor uncovered by phosphor paste.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Examples
1, preparation of the scaffold
A copper strip 1.1 with the thickness of 0.2MM is prepared to be punched into a circuit prototype through a special die, then silver is plated, PPA2.1 is injection molded to manufacture a bracket with a beam, and each bracket comprises 3 electrodes, namely a No. 1 electrode 1.1a, a No. 2 electrode 1.1b, a No. 3 electrode 1.1c, two welding feet 1.2 and a beam 1.3 (shown in a figure 1, a figure 2 and a figure 3).
2, the LED chip and the resistor are manufactured on the bracket
The method comprises the following steps: with positively-mounted LED chip and resistor
(1) And fixing the blue light chip 3.1a on the No. 1 electrode of the bracket by using die bond adhesive, and baking to solidify the die bond adhesive.
(2) The resistor 4.1 is adhered to the No. 2 and No. 3 electrodes of the bracket by a die bonder through solder paste, and the resistor is welded to the bracket electrodes through reflow soldering.
(3) The LED forward chip 3.1a is communicated with the No. 1 and No. 2 electrodes of the bracket through a bonding wire 5.1 by a bonding machine (shown in figure 4).
The second method comprises the following steps: with flip-chip LED chip and resistor
(1) And bonding the flip blue LED chip 3.1b on the No. 1 and No. 2 electrodes by using a die bonder and solder paste.
(2) And adhering the resistor 4.1 to the No. 2 and No. 3 electrodes by using a die bonder and solder paste.
(3) And soldering the LED flip chip 3.1b and the resistor 4.1 on the LED support electrode by reflow soldering (shown in figure 5).
3, preparation of packaging adhesive
Respectively dripping 6.1 of fluorescent powder glue into the bracket cup and heating and curing in an oven to prepare the following four lamp beads from the semi-finished product of the LED lamp bead prepared by the two methods:
A. an integrally packaged LED lamp bead (shown in fig. 6) in which both the front-mounted LED chip and the resistor are covered by the phosphor paste;
B. an integrally packaged LED lamp bead (shown in fig. 7) in which the front-mounted LED chip is covered by the phosphor paste and the resistor is not covered by the phosphor paste;
C. an integrally packaged LED lamp bead (shown in fig. 8) in which both the flip LED chip and the resistor are covered by the phosphor glue;
D. an integrally packaged LED lamp bead (shown in fig. 9) in which the flip-chip LED chip is covered by the phosphor paste and the resistor is not covered by the phosphor paste;
4. manufacturing method of flexible circuit board
Two copper-clad aluminum wires are pressed into flat wires 7.1, a layer of PI covering film is punched into a plurality of bonding pad windows 7.1a by a mould, the interval between the two wires is controlled by controlling the interval between the wires on a wire covering machine, the two wires are kept at equal intervals, the flat wires are clamped between a layer of PI film 8.1 with glue and the punched PI film, and the flat wires are firmly bonded, so that the flexible circuit board with two parallel flat wires is manufactured (shown in figure 10).
5. Manufacture of module
The LED white light beads with the resistors manufactured in the above way are welded on the flexible circuit board with two parallel flat wires through an SMT process, and a module made of the integrally packaged LED beads with the chips and the resistors covered by the fluorescent powder glue or a module made of the integrally packaged LED beads with the chips covered by the fluorescent powder glue and the resistors not covered by the fluorescent powder glue is manufactured (shown in fig. 11 and 12).
The present invention has been described in detail with reference to the accompanying drawings, which illustrate specific embodiments of a module made of an integrally packaged LED lamp bead. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (8)
1. The utility model provides a module that LED lamp pearl of integrated encapsulation was made, includes:
an LED support;
an LED chip;
a control element;
packaging glue;
a circuit board;
the LED lamp bead integrated package is characterized in that the LED support is made of metal embedded on resin, metal welding feet are arranged on the back of the support by the metal embedded in the resin, metal electrodes are arranged on the front of the support, at least two cups are arranged on the support, the metal electrodes are arranged on the bottoms of the cups, a control element is welded on the two metal electrodes on one bottom of the cup, an LED chip is fixed and connected with the metal electrodes in the other cup in a conduction mode, one metal electrode is connected with the control element in one cup, the other metal electrode is connected with the chip in the other cup, at least two metal welding feet are arranged on the back of the support, the LED lamp bead integrated package is made of the LED chip and the control element on one LED support, the LED chip is sealed by packaging glue or both the LED chip and the control element are sealed, and the module made of the LED lamp bead integrated package is made of the LED lamp bead integrated package by welding the LED lamp bead integrated package on a circuit board.
2. The module of claim 1, wherein the control element is a resistor, a capacitor or a control diode.
3. The module of claim 1, wherein the LED chip is fixed to the electrode No. 1 and connected to the electrodes No. 1 and No. 2 by bonding wires, the control element is fixed to the electrodes No. 2 and No. 3, and the control element is electrically connected to the electrodes No. 2 and No. 3.
4. The module of claim 1, wherein the LED chip is fixed to the electrodes No. 1 and No. 2 and is electrically connected to the electrodes No. 1 and No. 2, the control element is fixed to the electrodes No. 2 and No. 3, and the control element is electrically connected to the electrodes No. 2 and No. 3.
5. The module of claim 1, wherein the LED lamp bead is an SMD (surface mounted device) patch lamp bead.
6. The module of claim 1, wherein the chip is mounted on the support by an encapsulant, and the control element is exposed without being encapsulated by the encapsulant.
7. The module of claim 1, wherein the LED chip and the control element are encapsulated by the encapsulant on the support, but the control element is still visible through the encapsulant.
8. The module of claim 1, wherein the circuit board is a rigid circuit board or a flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110724073.5A CN115528163A (en) | 2021-06-24 | 2021-06-24 | Module that LED lamp pearl of integrated encapsulation was made |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110724073.5A CN115528163A (en) | 2021-06-24 | 2021-06-24 | Module that LED lamp pearl of integrated encapsulation was made |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115528163A true CN115528163A (en) | 2022-12-27 |
Family
ID=84694581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110724073.5A Pending CN115528163A (en) | 2021-06-24 | 2021-06-24 | Module that LED lamp pearl of integrated encapsulation was made |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115528163A (en) |
-
2021
- 2021-06-24 CN CN202110724073.5A patent/CN115528163A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20221227 |
|
| WD01 | Invention patent application deemed withdrawn after publication |