CN115411025A - Module of LED lamp pearl preparation that contains controlling element - Google Patents

Module of LED lamp pearl preparation that contains controlling element Download PDF

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Publication number
CN115411025A
CN115411025A CN202110611529.7A CN202110611529A CN115411025A CN 115411025 A CN115411025 A CN 115411025A CN 202110611529 A CN202110611529 A CN 202110611529A CN 115411025 A CN115411025 A CN 115411025A
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Prior art keywords
led
support
control element
module
electrodes
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CN202110611529.7A
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Chinese (zh)
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王晟齐
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Individual
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Individual
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Priority to CN202110611529.7A priority Critical patent/CN115411025A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

The invention relates to a module for manufacturing an LED lamp bead with a control element, in particular to a module for manufacturing an LED lamp bead with a control element, which is manufactured by welding the LED lamp bead with the control element on a flexible circuit board.

Description

Module of LED lamp pearl preparation that contains controlling element
Technical Field
The invention relates to the field of LEDs, in particular to a module for manufacturing an LED lamp bead with a control element.
Background
When the LED lamp beads are used for manufacturing module products, series connection relation is often required to be formed between the LED lamp beads and a control element (such as a resistor), the LED and the control element are respectively welded on a circuit board to manufacture the LED module products, the control element and the LED in the prior art are respectively independent devices, and the two independent devices are welded on the circuit board.
The SMD LED lamp bead (LED paster lamp bead) of prior art does not make controlling element such as resistance on the lamp bead, because controlling element devices such as resistance generate heat and can influence the life-span and the light efficiency of LED chip.
However, the resistor or other control elements and the LED chip are directly fabricated on the support in a layered manner, and for the LED module product requiring the control elements, the cost of the control elements from the layer to the bead is lower compared with the manner of separately welding and mounting the control elements and the LED bead.
How to fabricate a resistor or other control element on an LED support in a layered manner to form an LED lamp bead with a control element, and then use the lamp bead to fabricate an LED module? And the control element on this lamp pearl does not influence the luminous of LED chip, and control element's heating has little influence again on LED chip?
The module for manufacturing the LED lamp bead with the control element is manufactured by the following invention technology, and the specific method is as follows:
the utility model provides a module that contains control element's LED lamp pearl preparation, includes: an LED support; an LED chip; a control element; packaging glue; a circuit board; the LED module is characterized in that the module is formed by welding a plurality of LED lamp beads containing control elements on the circuit board, and the LED lamp beads are characterized in that an LED chip is packaged on an LED support by packaging glue, the control elements are welded or bonded on the support, at least three electrodes are arranged on the support, at least two welding feet are arranged on the LED support and are communicated with the electrodes, the LED chip and the control elements are fixed on the electrodes, the LED chip and the control elements are connected into a series connection structure through the electrodes, at least two welding feet are in conductive connection with the LED chip and the control elements through the electrodes, the chip and the electrodes are connected through wires to form conduction, or are connected through tin solder to form conduction, or are connected through conductive glue to form conduction, and the LED module manufactured by the LED lamp beads with the control elements is formed by welding the plurality of LED lamp beads with the control elements on the circuit board.
The LED lamp bead with the control element is characterized in that the control element is a resistor or a capacitor or a control diode, the chip is packaged on the bracket by packaging glue, and the control element is not packaged by the packaging glue and is still exposed outside, so that the purpose is to prevent heat emitted by the control element from being directly transmitted to the chip through the packaging glue. The LED lamp is characterized in that the support of the lamp bead is provided with the raised resin which separates the LED chip from the control element, light emitted by the LED chip does not directly irradiate the control element, the control element does not influence the light emission of the LED, meanwhile, heat emitted by the control element is isolated, and the influence of the heat of the control element on the chip is reduced to the minimum. The module is made by welding the lamp beads on the circuit board.
An explanation and description of the electrodes and fillets is provided below:
1. the electrode of the bracket is a metal electrode and is used for fixing and conducting the chip and the control element, and the electrode is generally arranged in a cup of the bracket or on the plane of a device such as a bracket welding chip and the like.
2. The welding feet are metal feet which are used for being welded and connected with a circuit board or a lead on the lamp bead and are all exposed at the bottom of the lamp bead.
Disclosure of Invention
The invention relates to a module for manufacturing an LED lamp bead containing a control element, in particular to a module for manufacturing an LED lamp bead containing a control element, which is manufactured by welding the LED lamp bead containing the control element on a flexible circuit board.
The invention provides a module for manufacturing an LED lamp bead with a control element, which comprises: an LED support; an LED chip; a control element; packaging glue; a circuit board; the LED module is characterized in that the module is formed by welding a plurality of LED lamp beads containing control elements on the circuit board, and the LED lamp beads are characterized in that an LED chip is packaged on an LED support by packaging glue, the control elements are welded or bonded on the support, at least three electrodes are arranged on the support, at least two welding feet are arranged on the LED support and are communicated with the electrodes, the LED chip and the control elements are fixed on the electrodes, the LED chip and the control elements are connected into a series connection structure through the electrodes, at least two welding feet are in conductive connection with the LED chip and the control elements through the electrodes, the chip and the electrodes are connected through wires to form conduction, or are connected through tin solder to form conduction, or are connected through conductive glue to form conduction, and the LED module manufactured by the LED lamp beads with the control elements is formed by welding the plurality of LED lamp beads with the control elements on the circuit board.
According to a preferred embodiment of the invention, the module for manufacturing the LED lamp bead with the control element is characterized in that the control element is a resistor or a capacitor or a control diode.
According to a preferred embodiment of the present invention, the module for manufacturing the LED lamp bead with the control element is characterized in that the chip is packaged on the support by the packaging adhesive, and the control element is still exposed without being packaged by the packaging adhesive.
According to a preferred embodiment of the invention, the module made of the LED lamp beads with the control elements is characterized in that the support of the lamp beads is provided with the raised resin to separate the LED chip and the control elements, light emitted by the LED chip does not directly irradiate the control elements, and the control elements do not influence the light emission of the LEDs.
According to a preferred embodiment of the invention, the module for manufacturing the LED lamp bead with the control element is characterized in that the LED chip is fixed on the electrode No. 1 and connected to the electrodes No. 1 and No. 2 through bonding wires, the control element is fixed on the electrodes No. 2 and No. 3, and the control element is in conductive connection with the electrodes No. 2 and No. 3.
According to a preferred embodiment of the invention, the module for manufacturing the LED lamp bead with the control element is characterized in that the LED chip is fixed on the No. 1 and No. 2 electrodes and is connected and conducted to the No. 1 and No. 2 electrodes, the control element is fixed on the No. 2 and No. 3 electrodes, and the control element is connected with the No. 2 and No. 3 electrodes in a conduction manner.
According to a preferred embodiment of the present invention, the module for manufacturing the LED lamp bead with the control element is characterized in that the LED support is an LED support formed by embedding metal on resin, or a PCB-type LED support.
According to a preferred embodiment of the present invention, the module made of the LED lamp bead with the control element is characterized in that the conductive connection between the control element and the support electrode is formed by soldering or by conductive adhesive.
According to a preferred embodiment of the present invention, the module for manufacturing the LED lamp bead with the control element is characterized in that the lamp bead is an SMD patch lamp bead.
According to a preferred embodiment of the present invention, the module for manufacturing the LED lamp bead with the control element is characterized in that the support is a support with a cup, the LED chip of the lamp bead is packaged in the cup of the support by the packaging adhesive, and the control element is arranged on the support outside the cup.
According to a preferred embodiment of the present invention, the module for manufacturing the LED lamp bead with the control element is characterized in that the surface of the support is a planar or near-planar structure, the LED chip of the LED lamp bead is packaged on the upper surface of the support by the packaging adhesive, and the control element is exposed outside on the upper surface of the support outside the packaging adhesive.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
FIG. 1 is a schematic plan view of a single stent.
Fig. 2 is a perspective view of a single stent.
FIG. 3 is a schematic cross-sectional view of a single stent.
FIG. 4 is a schematic cross-sectional view of a support with a front-mounted LED chip and a resistor.
Fig. 5 is a schematic cross-sectional view of a flip-chip LED chip and a resistor fabricated on a support.
FIG. 6 is a schematic cross-sectional view of an LED white light bead fabricated on a support with a normally mounted LED chip and a resistor.
FIG. 7 is a schematic cross-sectional view of an LED white light bead fabricated on a support with an LED chip and a resistor flipped over.
Fig. 8 is a schematic plan view of a single planar stent.
Fig. 9 is a schematic cross-sectional view of a single planar stent.
FIG. 10 is a schematic cross-sectional view of a flat support with a front mounted LED chip and a resistor.
Fig. 11 is a schematic cross-sectional view of a flip-chip LED chip and a resistor fabricated on a planar support.
FIG. 12 is a schematic cross-sectional view of an LED white light bead fabricated on a planar support with a front-mounted LED chip and a resistor.
Fig. 13 is a schematic cross-sectional view of an LED white light bead fabricated on a planar support by using a flip LED chip and a resistor.
Fig. 14 is a schematic plan view of a laminate of two parallel flat conductor flexible wiring boards.
Fig. 15 is a schematic plan view of a module made of LED white light beads with control elements, which is made of LED white light beads with front-mounted LED chips and resistors on a support.
Fig. 16 is a schematic plan view of a module made of LED white light beads with control elements, which is made of LED white light beads with front-mounted LED chips and resistors on a planar support.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Example one
1, preparation of the scaffold
A copper strip 1.1 with the thickness of 0.2MM is prepared to be punched into a circuit prototype through a special die, then silver is plated, PPA2.1 is injected to manufacture a bracket, and each bracket comprises 3 electrodes, namely a No. 1 electrode 1.1a, a No. 2 electrode 1.1b, a No. 3 electrode 1.1c and two welding feet 1.2 (shown in figures 1, 2 and 3).
2, the LED chip and the resistor are manufactured on the bracket
The method comprises the following steps: with positively-mounted LED chip and resistor
(1) And fixing the blue light chip 3.1a on the No. 1 electrode of the bracket by using die bond adhesive, and baking to solidify the die bond adhesive.
(2) The resistor 4.1 is adhered to the No. 2 and No. 3 electrodes of the bracket by a die bonder through solder paste, and the resistor is welded to the bracket electrodes through reflow soldering.
(3) The LED front chip 3.1a is communicated with the No. 1 and No. 2 electrodes of the bracket through a bonding wire 5.1 by a bonding machine (shown in figure 4).
The second method comprises the following steps: with flip-chip LED chip and resistor
(1) And bonding the flip blue LED chip 3.1b on the No. 1 and No. 2 electrodes by using a die bonder and solder paste.
(2) The resistor 4.1 is adhered to the No. 2 and No. 3 electrodes by a die bonder and solder paste.
(3) And soldering the LED flip chip 3.1b and the resistor 4.1 on the LED support electrode by reflow soldering (shown in figure 5).
3, preparation of packaging adhesive
And (3) respectively dripping high-fluidity fluorescent powder glue 6.1 into the cup of the support to obtain the semi-finished product of the LED lamp bead manufactured by the two methods, and heating and curing in an oven to obtain the LED white light lamp bead 9.1a manufactured on the support by using a normally installed LED chip and a resistor, or the LED white light lamp bead manufactured on the support by using a reversely installed LED chip and a resistor (shown in figures 6 and 7).
4. Manufacturing method of flexible circuit board
Two copper-clad aluminum wires are pressed into a flat wire 7.1, a layer of PI covering film is punched into a plurality of pad windows 7.1a by a mould, the interval control of the two wires is controlled by controlling the interval between the wires on a wire covering machine, the two wires are kept at equal intervals, a layer of PI film 8.1 with glue and the punched PI film are used for clamping the flat wire in the middle and firmly adhering the flat wire, and a flexible circuit board (shown in figure 14) with two parallel flat wires is manufactured.
5. Manufacture of module
A plurality of LED white light beads with resistors are soldered on a flexible circuit board with two parallel flat wires by SMT process to make a module (shown in fig. 15) containing control elements for LED beads.
Example two
1, manufacturing of planar support
A copper strip 1.1 with the thickness of 0.2MM is prepared to be punched into a circuit prototype through a special die, then silver is plated, PPA2.1 is injected to manufacture a bracket, and each bracket comprises 3 electrodes, namely a No. 1 electrode 1.1a, a No. 2 electrode 1.1b, a No. 3 electrode 1.1c and two welding feet 1.2 (shown in figures 8 and 9).
2, the LED chip and the resistor are manufactured on the plane support
The method comprises the following steps: with normally-mounted LED chip and resistor
(1) And fixing the blue light chip 3.1a on the No. 1 electrode of the bracket by using die bond adhesive, and baking to solidify the die bond adhesive.
(2) The resistor 4.1 is adhered to the No. 2 and No. 3 electrodes of the bracket by a die bonder through solder paste, and the resistor is welded to the bracket electrodes through reflow soldering.
(3) The LED front chip 3.1a is communicated with the No. 1 and No. 2 electrodes of the bracket through a bonding wire 5.1 by a bonding machine (shown in figure 10).
The second method comprises the following steps: with flip-chip LED chip and resistor
(1) And bonding the flip blue LED chip 3.1b on the No. 1 and No. 2 electrodes by using a die bonder and solder paste.
(2) And adhering the resistor 4.1 to the No. 2 and No. 3 electrodes by using a die bonder and solder paste.
(3) The LED flip chip 3.1b and the resistor 4.1 are soldered to the LED support electrodes by reflow (fig. 11).
3, preparation of packaging adhesive
And (3) respectively dripping low-fluidity fluorescent powder glue 6.1 at the position of a chip of the planar support to form a semi-sphere on the semi-finished product of the LED lamp bead manufactured by the two methods, and heating and curing in an oven to manufacture LED white light lamp beads 9.1b manufactured on the planar support by using a forward-mounted LED chip and a resistor, or manufacturing LED white light lamp beads on the planar support by using an inverted LED chip and a resistor (shown in figures 12 and 13).
4. Manufacturing method of flexible circuit board
Two copper-clad aluminum wires are pressed into flat wires 7.1, a layer of PI covering film is punched into a plurality of bonding pad windows 7.1a by a mould, the interval between the two wires is controlled by controlling the interval between the wires on a wire covering machine, the two wires are kept at equal intervals, the flat wires are clamped between a layer of PI film 8.1 with glue and the punched PI film, and the flat wires are firmly bonded, so that the flexible circuit board with two parallel flat wires is manufactured (shown in figure 14).
5. Fabrication of modules
A plurality of LED white light beads with resistors are soldered on a flexible circuit board with two parallel flat wires by SMT process to make a module (shown in fig. 16) containing control elements.
The present invention is described in detail with reference to the accompanying drawings by using a specific embodiment of a module for manufacturing an LED lamp bead with a control element. It will be understood by those skilled in the art, however, that the foregoing descriptions are merely illustrative of and descriptive of certain embodiments and that the invention, including the claims, is not to be in any way limiting.

Claims (11)

1. The utility model provides a module that contains control element's LED lamp pearl preparation, includes:
an LED support;
an LED chip;
a control element;
packaging glue;
a circuit board;
the LED module is characterized in that the module is formed by welding a plurality of LED lamp beads containing control elements on the circuit board, and the LED lamp beads are characterized in that an LED chip is packaged on an LED support by packaging glue, the control elements are welded or bonded on the support, at least three electrodes are arranged on the support, at least two welding feet are arranged on the LED support and are communicated with the electrodes, the LED chip and the control elements are fixed on the electrodes, the LED chip and the control elements are connected into a series connection structure through the electrodes, at least two welding feet are in conductive connection with the LED chip and the control elements through the electrodes, the chip and the electrodes are connected through wires to form conduction, or are connected through tin solder to form conduction, or are connected through conductive glue to form conduction, and the LED module manufactured by the LED lamp beads with the control elements is formed by welding the plurality of LED lamp beads with the control elements on the circuit board.
2. The module of claim 1 for the manufacture of an LED lamp bead with a control element, wherein the control element is a resistor or a capacitor or a control diode.
3. The module of claim 1, wherein the chip is encapsulated by an encapsulant on the support, and the control element is exposed without being encapsulated by the encapsulant.
4. The module of claim 1, wherein the LED bead has a support with a protrusion formed thereon to separate the LED chip from the control element, and the LED chip emits light that does not directly illuminate the control element, and the control element does not affect the light emission of the LED.
5. The module of claim 1, wherein the LED chip is fixed to the electrode No. 1 and connected to the electrodes No. 1 and No. 2 by bonding wires, the control element is fixed to the electrodes No. 2 and No. 3, and the control element is electrically connected to the electrodes No. 2 and No. 3.
6. The module of claim 1 for manufacturing an LED lamp bead with a control element, wherein the LED chip is fixed on the No. 1 and No. 2 electrodes and is connected and conducted to the No. 1 and No. 2 electrodes, the control element is fixed on the No. 2 and No. 3 electrodes, and the control element is connected and conducted with the No. 2 and No. 3 electrodes.
7. The module of claim 1, wherein the LED support is an LED support formed by embedding metal on resin, or a PCB type LED support.
8. The module of claim 1, wherein the control element is electrically connected to the electrodes of the support by soldering or by conductive adhesive.
9. The module of claim 1 for manufacturing an LED lamp bead with a control element, wherein the LED lamp bead is an SMD (surface mounted device) patch lamp bead.
10. The module of claim 1, wherein the support is a support with a cup, the LED chip of the lamp bead is packaged in the cup of the support by the packaging adhesive, and the control element is on the support outside the cup.
11. The module of claim 1, wherein the surface of the support is a flat or near-flat structure, the LED chip of the LED lamp bead is encapsulated on the upper surface of the support by an encapsulant, and the control element is exposed on the upper surface of the support outside the encapsulant.
CN202110611529.7A 2021-05-26 2021-05-26 Module of LED lamp pearl preparation that contains controlling element Pending CN115411025A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110611529.7A CN115411025A (en) 2021-05-26 2021-05-26 Module of LED lamp pearl preparation that contains controlling element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110611529.7A CN115411025A (en) 2021-05-26 2021-05-26 Module of LED lamp pearl preparation that contains controlling element

Publications (1)

Publication Number Publication Date
CN115411025A true CN115411025A (en) 2022-11-29

Family

ID=84155547

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110611529.7A Pending CN115411025A (en) 2021-05-26 2021-05-26 Module of LED lamp pearl preparation that contains controlling element

Country Status (1)

Country Link
CN (1) CN115411025A (en)

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