CN115528157A - Oblique-arranged LED wire circuit board lamp strip - Google Patents

Oblique-arranged LED wire circuit board lamp strip Download PDF

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Publication number
CN115528157A
CN115528157A CN202110716427.1A CN202110716427A CN115528157A CN 115528157 A CN115528157 A CN 115528157A CN 202110716427 A CN202110716427 A CN 202110716427A CN 115528157 A CN115528157 A CN 115528157A
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CN
China
Prior art keywords
led
circuit board
strip
wire
control element
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Pending
Application number
CN202110716427.1A
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Chinese (zh)
Inventor
王晟齐
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Individual
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Individual
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Priority to CN202110716427.1A priority Critical patent/CN115528157A/en
Publication of CN115528157A publication Critical patent/CN115528157A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The invention relates to an oblique-row LED wire circuit board lamp strip, in particular to an oblique-row LED wire circuit board lamp strip which is manufactured by welding an integrally packaged LED lamp bead on a wire circuit board. The wire circuit board is a wire circuit board formed by 3 parallel wires, and the obliquely arranged wire circuit board lamp strip is manufactured by welding integrally packaged LED lamp beads on a circuit board of the 3 wires, all the lamp beads are welded on the middle No. 2 wire, the middle wire is a common anode or cathode of all the lamp beads, the lamp beads arranged in odd number in sequence are welded on the No. 1 wire, and the lamp beads arranged in even number are welded on the No. 3 wire.

Description

Oblique-arranged LED wire circuit board lamp strip
Technical Field
The invention relates to the field of LEDs, in particular to an obliquely-arranged LED wire circuit board lamp strip.
Background
In the prior art, the obliquely-arranged LED strips are manufactured in a mode of adding a control element (such as a resistor), the circuit board design is complex, and the circuit board cost is high.
The method of the built-in control element is adopted to package the integrated lamp beads, and when the lamp strip is manufactured, the obliquely arranged LED lamp strip can be manufactured only by welding the lamp beads through a circuit board with 3 wires, and the LED lamp strip can also be manufactured into a double-color lamp strip.
The integrated LED lamp bead manufactured by the method is used for lighting and manufacturing an oblique LED conducting wire circuit board lamp strip, and the specific method is as follows:
the specific method comprises the following steps:
an oblique-row LED wire circuit board strip, comprising: an LED support; an LED chip; a control element; packaging glue; a wire circuit board; the LED lamp strip is characterized in that the LED support is made by embedding metal on resin, metal welding feet are arranged on the back of the support by the metal embedded in the resin, metal electrodes are arranged on the front of the support, at least two cups are arranged on the support, the metal electrodes are arranged on the bottoms of the cups, a control element is welded on the two metal electrodes on one bottom of the cup, an LED chip is fixedly connected with the metal electrodes in the other cup in a conduction mode, one metal electrode is connected with the control element in one cup, the other metal electrode is connected with the chip in the other cup, at least two metal welding feet are arranged on the back of the support, the LED lamp strip is integrally packaged, the LED chip and the control element are made on the LED support, packaging glue seals the LED chip or seals the LED chip and the control element, the lead circuit board is a lead circuit board formed by 3 parallel leads, the oblique-row LED lead circuit board is made by welding LED lamp beads integrally packaged on 3 leads, each LED lamp bead is provided with two lead welding feet which are arranged on a cathode wire of an odd number 2, and all the lead wires are arranged on an even number of a cathode wire on a lead wire of a lead wire, and a cathode wire of a lead wire of an odd number 1.
Obviously, the lamp bead used for manufacturing the lamp strip is characterized in that the LED chip and the control element are respectively arranged in different cups, heat generated by the control element is isolated to a certain extent during operation, the influence on the chip is reduced, and meanwhile light emitted by the chip cannot be directly transmitted to the control element to be absorbed by the control element.
Disclosure of Invention
The invention relates to an oblique-row LED wire circuit board lamp strip, in particular to an oblique-row LED wire circuit board lamp strip which is manufactured by welding LED lamp beads packaged in a layer on a wire circuit board. The wire circuit board is a wire circuit board formed by 3 parallel wires, and the obliquely arranged wire circuit board lamp strip is manufactured by welding integrally packaged LED lamp beads on a circuit board of the 3 wires, all the lamp beads are welded on the middle No. 2 wire, the middle wire is a common anode or cathode of all the lamp beads, the lamp beads arranged in odd number in sequence are welded on the No. 1 wire, and the lamp beads arranged in even number are welded on the No. 3 wire.
The invention provides an oblique-arranged LED wire circuit board lamp strip which comprises an LED bracket; an LED chip; a control element; packaging glue; a wire circuit board; the LED lamp is characterized in that the LED support is an LED support made of metal embedded on resin, metal welding feet are arranged on the back of the support by the metal embedded in the resin, metal electrodes are arranged on the front of the support, at least two cups are arranged on the support, the metal electrodes are arranged on the bottoms of the cups, a control element is welded on the two metal electrodes on one cup bottom, an LED chip is fixed and connected with the metal electrodes in the other cup in a conducting mode, the metal electrodes are connected into a whole, the LED chip is connected with the control element in one cup, the LED chip is connected with the chip in the other cup, at least two metal welding feet are arranged on the back of the support, the LED lamp beads packaged integrally are LED lamp beads made on the LED support by the LED chip and the control element, a packaging adhesive seals the LED chip or seals the LED chip and the control element, the wire circuit board is a wire circuit board formed by 3 parallel wires, the oblique-row LED wire circuit board is made of LED lamp beads welded on the integrally-packaged LED chip on 3 wires, each LED lamp bead is provided with two welding feet, the middle wires, the LED lamp beads are arranged on the middle wires, the middle wires of the wires, the number of the LED lamp beads is 3 wires is 2, and all the wires are arranged on the middle wires, and the wires are arranged on the wires, and the wires of the wires are arranged in an odd number of the middle wire is 1.
According to a preferred embodiment of the present invention, the LED wire circuit board strip is characterized in that the control element is a resistor or a capacitor or a control diode.
According to a preferred embodiment of the present invention, the LED wire circuit board strip is characterized in that the LED chip is fixed on the electrode No. 1 and connected to the electrodes No. 1 and No. 2 by bonding wires, the control element is fixed on the electrodes No. 2 and No. 3, and the control element is electrically connected to the electrodes No. 2 and No. 3.
According to a preferred embodiment of the invention, the oblique-arranged LED wire circuit board strip is characterized in that the LED chips are fixed on the electrodes No. 1 and No. 2 and are connected and conducted to the electrodes No. 1 and No. 2, the control element is fixed on the electrodes No. 2 and No. 3, and the control element is connected and conducted with the electrodes No. 2 and No. 3.
According to a preferred embodiment of the present invention, the LED wire circuit board strip is characterized in that the lamp beads are SMD patch lamp beads.
According to a preferred embodiment of the present invention, the LED strip is characterized in that the chip is encapsulated on the support by an encapsulation adhesive, and the control element is still exposed without being encapsulated by the encapsulation adhesive.
According to a preferred embodiment of the present invention, the LED strip is characterized in that the LED chip and the control element are both encapsulated by the encapsulant on the support, but the control element is still visible through the encapsulant.
According to a preferred embodiment of the present invention, the LED wire circuit board strip is characterized in that after being powered on, all the integrally packaged LED beads on the strip are beads emitting light of one color, or one part of the beads emit light of one color, and the other part of the beads emit light of another color.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
FIG. 1 is a schematic plan view of a single stent.
Fig. 2 is a perspective view of a single stent.
FIG. 3 is a schematic cross-sectional view of a single stent.
FIG. 4 is a schematic cross-sectional view of a support with a front-mounted LED chip and a resistor.
Fig. 5 is a schematic cross-sectional view of a flip-chip LED chip and a resistor fabricated on a support.
Fig. 6 is a schematic cross-sectional view of an integrally packaged LED lamp bead in which both the front-mounted LED chip and the resistor are covered by the phosphor paste.
Fig. 7 is a schematic cross-sectional view of an integrally packaged LED lamp bead with a front-mounted LED chip covered by phosphor paste and a resistor uncovered by phosphor paste.
Fig. 8 is a schematic cross-sectional view of an integrally packaged LED lamp bead in which both the flip LED chip and the resistor are covered by phosphor paste.
Fig. 9 is a schematic cross-sectional view of an integrally packaged LED lamp bead with a flip-chip LED chip covered by phosphor glue and a resistor uncovered by phosphor glue.
Fig. 10 is a schematic plan view of a flexible circuit board with three parallel flat conductors.
Fig. 11 is a schematic plan view of an obliquely arranged LED wire circuit board strip with both chips and resistors covered by phosphor paste.
Fig. 12 is a schematic plan view of a light strip of an oblique LED wire circuit board, in which a chip is covered by a phosphor paste and a resistor is not covered by a phosphor paste.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are only exemplary and descriptive of some preferred embodiments and are not intended to limit the claims of the present invention in any way.
Examples
1, preparation of the scaffold
A copper strip 1.1 with the thickness of 0.2MM is prepared to be punched into a circuit prototype through a special die, then silver is plated, PPA2.1 is injection molded to manufacture a bracket with a beam, and each bracket comprises 3 electrodes, namely a No. 1 electrode 1.1a, a No. 2 electrode 1.1b, a No. 3 electrode 1.1c, two welding feet 1.2 and a beam 1.3 (shown in a figure 1, a figure 2 and a figure 3).
2, the LED chip and the resistor are manufactured on the bracket
The method comprises the following steps: with normally-mounted LED chip and resistor
(1) And fixing the blue light chip 3.1a on the No. 1 electrode of the bracket by using die bond adhesive, and baking to solidify the die bond adhesive.
(2) The resistor 4.1 is adhered to the No. 2 and No. 3 electrodes of the bracket by a die bonder through solder paste, and the resistor is welded to the bracket electrodes through reflow soldering.
(3) The LED front chip 3.1a is communicated with the No. 1 and No. 2 electrodes of the bracket through a bonding wire 5.1 by a bonding machine (shown in figure 4).
The second method comprises the following steps: with flip-chip LED chip and resistor
(1) And bonding the flip blue LED chip 3.1b on the No. 1 and No. 2 electrodes by using a die bonder and solder paste.
(2) And adhering the resistor 4.1 to the No. 2 and No. 3 electrodes by using a die bonder and solder paste.
(3) The LED flip chip 3.1b and the resistor 4.1 are soldered to the LED support electrodes by reflow (fig. 5).
3, preparation of packaging adhesive
Respectively dripping 6.1 of fluorescent powder glue into the bracket cup and heating and curing in an oven to prepare the following four kinds of semi-finished LED lamp beads manufactured by the two methods:
A. an integrally packaged LED lamp bead (shown in fig. 6) in which both the front-mounted LED chip and the resistor are covered by the phosphor paste;
B. an integrally packaged LED lamp bead (shown in fig. 7) in which the front-mounted LED chip is covered by the phosphor paste and the resistor is not covered by the phosphor paste;
C. an integrally packaged LED lamp bead (shown in fig. 8) in which both the flip-chip LED chip and the resistor are covered by the phosphor paste;
D. an integrally packaged LED lamp bead (shown in fig. 9) in which the flip-chip LED chip is covered by the phosphor paste and the resistor is not covered by the phosphor paste;
4. manufacturing method of flexible circuit board
Three copper-clad aluminum wires are pressed into flat wires 7.1, a layer of PI covering film is punched into a plurality of bonding pad windows 7.1a by a die, the spacing of the three wires is controlled by controlling the spacing control of the wires on a wire covering machine, the three wires are kept at equal spacing, the flat wires are clamped in the middle by a layer of PI film 8.1 with glue and a punched PI film and are firmly bonded, the middle wire of the three parallel flat wires is a No. 2 wire 7.12, and the wires on the two sides are a No. 1 wire 7.11 and a No. 3 wire 7.13 respectively, so that a flexible circuit board (shown in figure 10) of the three parallel flat wires is manufactured.
5. Production of lamp belt
The manufactured LED white light beads with the resistors are welded on a flexible circuit board with three parallel flat wires through an SMT (surface mount technology) process to manufacture an oblique LED wire circuit board lamp strip with the chips and the resistors covered by fluorescent powder glue, or an oblique LED wire circuit board lamp strip with the chips covered by the fluorescent powder glue and the resistors not covered by the fluorescent powder glue (shown in figures 11 and 12).
Description of the drawings: the LED lamp bead is characterized by comprising an integrally packaged LED lamp bead 9.1a with a chip and a resistor both covered by fluorescent powder glue, and an integrally packaged LED lamp bead 9.1b with a chip covered by fluorescent powder glue and a resistor not covered by fluorescent powder glue.
The invention is described in detail with reference to the drawings, wherein the drawings show a specific embodiment of the oblique-arranged LED wire circuit board strip. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.

Claims (8)

1. An oblique-row LED wire circuit board strip, comprising:
an LED support;
an LED chip;
a control element;
packaging glue;
a wire circuit board;
the LED lamp strip is characterized in that the LED support is made by embedding metal on resin, metal welding feet are arranged on the back of the support by the metal embedded in the resin, metal electrodes are arranged on the front of the support, at least two cups are arranged on the support, the metal electrodes are arranged on the bottoms of the cups, a control element is welded on the two metal electrodes on one bottom of the cup, an LED chip is fixedly connected with the metal electrodes in the other cup in a conduction mode, one metal electrode is connected with the control element in one cup, the other metal electrode is connected with the chip in the other cup, at least two metal welding feet are arranged on the back of the support, the LED lamp strip is integrally packaged, the LED chip and the control element are made on the LED support, packaging glue seals the LED chip or seals the LED chip and the control element, the lead circuit board is a lead circuit board formed by 3 parallel leads, the oblique-row LED lead circuit board is made by welding LED lamp beads integrally packaged on 3 leads, each LED lamp bead is provided with two lead welding feet which are arranged on a cathode wire of an odd number 2, and all the lead wires are arranged on an even number of a cathode wire on a lead wire of a lead wire, and a cathode wire of a lead wire of an odd number 1.
2. The angled LED wire circuit board strip according to claim 1, wherein said control element is a resistor or capacitor or control diode.
3. The LED strip of claim 1, wherein said LED chips are mounted on electrode No. 1 and connected to electrode No. 1 and electrode No. 2 by bonding wires, the control element is mounted on electrode No. 2 and electrode No. 3, and the control element is in conductive connection with electrode No. 2 and electrode No. 3.
4. The LED strip of claim 1, wherein said LED chips are mounted on electrodes No. 1 and No. 2 and connected to electrodes No. 1 and No. 2, said control elements are mounted on electrodes No. 2 and No. 3, and said control elements are connected to electrodes No. 2 and No. 3.
5. The LED wired circuit board strip as claimed in claim 1, wherein said LED wired circuit board strip is an SMD patch lamp bead.
6. The LED strip of claim 1, wherein said chip is mounted on said support by an encapsulant, and said control element is exposed without being encapsulated by said encapsulant.
7. The LED strip of claim 1, wherein said LED chips and said control elements are encapsulated by an encapsulant on said support, but said control elements are still visible through said encapsulant.
8. The LED wire circuit board strip of claim 1, wherein after being powered on, all the LED beads in the LED strip are beads emitting light of one color, or one part of the beads emit light of one color and the other part of the beads emit light of another color.
CN202110716427.1A 2021-06-24 2021-06-24 Oblique-arranged LED wire circuit board lamp strip Pending CN115528157A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110716427.1A CN115528157A (en) 2021-06-24 2021-06-24 Oblique-arranged LED wire circuit board lamp strip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110716427.1A CN115528157A (en) 2021-06-24 2021-06-24 Oblique-arranged LED wire circuit board lamp strip

Publications (1)

Publication Number Publication Date
CN115528157A true CN115528157A (en) 2022-12-27

Family

ID=84693863

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110716427.1A Pending CN115528157A (en) 2021-06-24 2021-06-24 Oblique-arranged LED wire circuit board lamp strip

Country Status (1)

Country Link
CN (1) CN115528157A (en)

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