CN215220718U

CN215220718U - LED module of LED lamp pearl preparation of electrified body resistance

Info

Publication number: CN215220718U
Application number: CN202120954419.6U
Authority: CN
Inventors: 王定锋; 徐文红; 冉崇友; 徐磊; 宋健
Original assignee: Tongling Guozhan Electronic Co ltd
Current assignee: Tongling Guozhan Electronic Co ltd
Priority date: 2021-04-29
Filing date: 2021-04-29
Publication date: 2021-12-17
Anticipated expiration: 2031-04-29

Abstract

The utility model relates to a LED module of LED lamp pearl preparation of electrified body resistance, particularly, there is three electrode at least on LED lamp pearl's the support, there are two fillets at least on LED lamp pearl, there are a resistance and a LED chip to encapsulate on the support in the lamp pearl, LED chip and resistance have been fixed on the electrode, LED chip and resistance have been connected into series connection structure through the electrode, there are two at least fillets and LED chip and resistance to have formed the on-state connection, make a LED lamp pearl of electrified body resistance, then weld the LED lamp pearl of electrified body resistance on the circuit board, make the LED module of a LED lamp pearl preparation of electrified body resistance.

Description

LED module of LED lamp pearl preparation of electrified body resistance

Technical Field

The utility model relates to a LED field, concretely relates to LED module of LED lamp pearl preparation of band resistor.

Background

When the LED lamp beads are used for manufacturing LED module products, the LED lamp beads and the resistors are often required to form a series connection relation, the LEDs and the resistors are respectively welded on the circuit board to manufacture the LED module products, the resistors and the LEDs in the prior art are respectively independent devices, and the two independent devices are welded on the circuit board.

Our utility model relates to a LED module of LED lamp pearl preparation of band resistance, the LED module product of preparation need not external resistance, makes LED module product small, light in weight, more pleasing to the eye with it, and the preparation is efficient, and is with low costs.

The specific method comprises the following steps:

the utility model provides a LED module of LED lamp pearl preparation of band resistance, includes: an LED support; an LED chip; a resistance; packaging glue; a circuit board; the LED module is characterized in that the LED module is formed by welding a plurality of LED lamp beads with resistors on the circuit board, and is characterized in that an LED chip and a resistor are packaged on an LED bracket by packaging glue, the bracket is provided with at least three electrodes, the LED bracket is provided with at least two welding feet, at least two welding feet are conducted with the electrodes, the LED chip and the resistor are fixed on the electrodes, the LED chip and the resistor are connected into a series connection structure through the electrodes, at least two welding feet are conducted with the LED chip and the resistor through the electrodes, the chip and the electrodes are connected and conducted through wires, or has been connected and conducted by soldering or by conductive adhesive, the circuit board is characterized by a flexible circuit board or a rigid circuit board, the LED module manufactured by the LED lamp beads with the resistors is a module formed by welding the LED lamp beads with the resistors on the circuit board.

Or a LED module of LED lamp pearl preparation of band resistance, include: an LED support; flip-chip LED chips or CSP LEDs; a resistance; a circuit board; the LED module is characterized in that the LED module is formed by welding a plurality of LED lamp beads with resistors on the circuit board, the lamp beads are characterized in that an LED flip chip or a CSP LED and a resistor are welded on an LED support, the support is provided with at least three electrodes, the LED support is provided with at least two welding feet, at least two welding feet and the electrodes are conducted, the LED flip chip or the CSP LED and the resistor are welded on the electrodes, the LED flip chip or the CSP LED and the resistor are connected into a series connection structure through the electrodes, the LED lamp beads are provided with at least two welding feet, the welding feet and the LED flip chip or the CSP LED are conducted and connected through the electrodes, and the welding feet and the resistor are also conducted and connected through the electrodes, and the circuit board is characterized in that: the LED module is characterized in that the LED module is a flexible circuit board or a rigid circuit board, and the LED module made of the LED lamp beads with the resistors is a module formed by welding the LED lamp beads with the resistors on the circuit board.

The electrodes and solder feet are explained and illustrated below:

1. the electrode of the bracket is a metal electrode and is used for fixing and conducting a light source such as a chip and the like and a resistance device, and the electrode is generally arranged in a cup of the bracket or on the plane of the device such as a bracket welding chip and the like.

2. The welding feet are metal feet which are used for being welded and connected with a circuit board or a conductor on the lamp bead and are all exposed at the bottom of the lamp bead.

SUMMERY OF THE UTILITY MODEL

According to the utility model provides a LED module of LED lamp pearl preparation of band resistance, include: an LED support; an LED chip; a resistance; packaging glue; a circuit board; the LED module is characterized in that the LED module is formed by welding a plurality of LED lamp beads with resistors on the circuit board, and is characterized in that an LED chip and a resistor are packaged on an LED bracket by packaging glue, the bracket is provided with at least three electrodes, the LED bracket is provided with at least two welding feet, at least two welding feet are conducted with the electrodes, the LED chip and the resistor are fixed on the electrodes, the LED chip and the resistor are connected into a series connection structure through the electrodes, at least two welding feet are conducted with the LED chip and the resistor through the electrodes, the chip and the electrodes are connected and conducted through wires, or has been connected and conducted by soldering or by conductive adhesive, the circuit board is characterized by a flexible circuit board or a rigid circuit board, the LED module manufactured by the LED lamp beads with the resistors is a module formed by welding the LED lamp beads with the resistors on the circuit board.

According to the utility model also provides a LED module of LED lamp pearl preparation of band resistance, include: an LED support; flip-chip LED chips or CSP LEDs; a resistance; a circuit board; the LED module is characterized in that the LED module is formed by welding a plurality of LED lamp beads with resistors on the circuit board, and the lamp beads are characterized in that: a flip-chip LED chip or a CSP LED and a resistance have welded on the LED support, there are three electrodes at least on the support, there are two fillets at least on the LED support, it has formed and switched on to have two fillets and electrode at least, LED flip-chip or CSP LED and resistance have welded on the electrode, LED flip-chip or CSP LED and resistance have connected into series connection structure through the electrode, LED lamp pearl has two fillets at least, fillet and LED flip-chip or CSP LED have formed the turn-on connection through the electrode, fillet and resistance have also formed the turn-on connection through the electrode, the characteristic of circuit board is: the circuit board is a flexible circuit board or a rigid circuit board, and the LED module manufactured by the LED lamp beads with the resistors is a module formed by welding the LED lamp beads with the resistors on the circuit board.

According to the utility model discloses a preferred embodiment, a LED module of LED lamp pearl preparation of band resistance, a serial communication port, the LED chip fix on No. 1 electrode to be connected to on No. 1 and No. 2 electrodes through the bonding wire, resistance has been fixed on No. 2 and No. 3 electrodes, resistance has formed the turn-on connection with No. 2 and No. 3 electrodes.

According to the utility model discloses a preferred embodiment, a LED module of LED lamp pearl preparation of band resistance, a serial communication port, the LED chip fix on 1 and 2 electrodes to switch on 1 and 2 electrodes through soldering tin connection on, resistance has been fixed on 2 and 3 electrodes, resistance has formed the turn-on connection with 2 and 3 electrodes.

According to the utility model discloses a preferred embodiment, a LED module of LED lamp pearl preparation of band resistance, a serial communication port, LED flip chip be the flip chip of surface band core light powder.

According to the utility model discloses a preferred embodiment, a LED module of LED lamp pearl preparation of band resistance, a serial communication port, CSP LED be the LED device that the surface has core light powder.

According to the utility model discloses a preferred embodiment, a LED module of LED lamp pearl preparation of band resistance, a serial communication port, LED chip and resistance all sealed the encapsulation on the LED support by the encapsulation, the encapsulation is glued to the encapsulation that contains yellow phosphor powder or is not contained yellow phosphor powder's encapsulation and glues.

According to the utility model discloses a preferred embodiment, a LED module of LED lamp pearl preparation of band resistance, its characterized in that, the LED support be the LED support that the metal was inlayed and is formed on the resin.

According to the utility model discloses a preferred embodiment, a LED module of LED lamp pearl preparation of band resistance, a serial communication port, resistance and support electrode's conductive connection be through soldering tin connection, perhaps connect through the conducting resin.

According to the utility model discloses a preferred embodiment, a LED module of LED lamp pearl preparation of band resistance, a serial communication port, a LED lamp pearl of band resistance be SMD paster lamp pearl.

The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.

Drawings

The features, objects, and advantages of the present invention will become more apparent from the reading of the specification in conjunction with the following drawings, a brief description of which follows.

FIG. 1 is a schematic plan view of a single stent.

Fig. 2 is a perspective view of a single stent.

FIG. 3 is a schematic cross-sectional view of a single stent.

FIG. 4 is a schematic cross-sectional view of a chip and a resistor fabricated on a support.

Fig. 5 is a schematic cross-sectional view of a flip chip and resistor fabricated on a support.

FIG. 6 is a schematic cross-sectional view of an LED white light bead fabricated on a support with a front-mounted chip and a resistor.

FIG. 7 is a schematic cross-sectional view of an LED white light bead fabricated on a support with a flip chip and a resistor.

FIG. 8 is a schematic cross-sectional view of an LED bead fabricated on a support with CSP LEDs and resistors.

Fig. 9 is a schematic plan view of a laminate of two parallel flat conductor flexible wiring boards.

Fig. 10 is a schematic plan view of an LED module manufactured by using a resistive LED lamp bead.

Detailed Description

The present invention will be described in detail below by taking preferred embodiments as examples.

It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.

Example one

1, preparation of the scaffold

A copper strip 1.1 with the thickness of 0.2MM is prepared to be punched into a circuit prototype through a special die, then silver is plated, PPA1.2 is injection molded to manufacture a bracket, and each bracket comprises 3 electrodes, namely a No. 1 electrode 1.1a, a No. 2 electrode 1.1b and a No. 3 electrode 1.1c (shown in figures 1, 2 and 3).

2, the chip and the resistor are manufactured on the bracket

The method comprises the following steps: using a positively-mounted chip and resistor

Firstly, fixing the blue light chip 3.1a on the No. 1 electrode of the bracket by using die bond adhesive, and baking to solidify the die bond adhesive.

Secondly, a die bonder is used for bonding the resistor 4.1 to the No. 2 and No. 3 electrodes of the bracket through solder paste, and the resistor is welded to the bracket electrodes through reflow soldering.

Thirdly, the LED normal chip 3.1a is communicated with the No. 1 and No. 2 electrodes of the bracket through a bonding wire 5.1 by a bonding machine (shown in figure 4).

The second method comprises the following steps: using flip-chip and resistor

Firstly, a die bonder and solder paste are used for bonding the flip blue LED chip 3.1b on the No. 1 and No. 2 electrodes.

Secondly, a die bonder and solder paste are used for bonding the resistor 4.1 on the No. 2 and No. 3 electrodes.

And thirdly, soldering the LED flip chip 3.1b and the resistor 4.1 on the LED support electrode through reflow soldering (shown in figure 5).

3, preparation of packaging adhesive

And (3) respectively dripping fluorescent powder glue 6.1 into the bracket cup of the semi-finished LED lamp bead manufactured by the two methods, and heating and curing in an oven to manufacture two LED white light lamp beads 9.1 with resistors, wherein the LED white light lamp beads are manufactured by a front chip and a flip chip respectively (shown in figures 6 and 7).

4. Manufacturing method of flexible circuit board

Two copper-clad aluminum wires are pressed into a flat wire 7.1, a layer of PI covering film is punched into a plurality of pad windows 7.1a by a mould, the interval between the two wires is controlled by controlling the interval control of the conductors on a wire covering machine, the two wires are kept at equal intervals, a layer of PI film 8.1 with glue and the punched PI film are used for clamping the flat wire in the middle and firmly adhering the flat wire, and a flexible circuit board (shown in figure 9) with two parallel flat wires is manufactured.

5. Manufacture of module

And welding the LED lamp beads 9.1 with the resistors on the flexible circuit board with two parallel flat wires by an SMT (surface mount technology) process to manufacture the LED module (shown in figure 10) made of the LED lamp beads with the resistors.

Example two

1, preparation of the scaffold

2, CSP LED and resistor are made on the support

Firstly, a chip bonder and solder paste are used for bonding the small CSP LED device 3.1c with fluorescent powder on the No. 1 and No. 2 electrodes.

And thirdly, soldering the small CSP LED device 3.1c and the resistor 4.1 on the LED support electrode through reflow soldering to form an LED lamp bead 9.1 with a resistor, wherein the resistor of the lamp bead and the CSP LED device are exposed (shown in figure 8).

3. Manufacturing method of flexible circuit board

4. Manufacture of module

The specific embodiment of the above LED module that combines the figure to make the LED lamp pearl of a kind of strip resistance is right the utility model discloses carry out detailed description. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.

Claims

1. The utility model provides a LED module of LED lamp pearl preparation of band resistance, includes:

an LED support;

an LED chip;

a resistance;

packaging glue;

a circuit board;

the LED module is characterized in that the LED module is formed by welding a plurality of LED lamp beads with resistors on the circuit board, and is characterized in that an LED chip and a resistor are packaged on an LED bracket by packaging glue, the bracket is provided with at least three electrodes, the LED bracket is provided with at least two welding feet, at least two welding feet are conducted with the electrodes, the LED chip and the resistor are fixed on the electrodes, the LED chip and the resistor are connected into a series connection structure through the electrodes, at least two welding feet are conducted with the LED chip and the resistor through the electrodes, the chip and the electrodes are connected and conducted through wires, or has been connected and conducted by soldering or by conductive adhesive, the circuit board is characterized by a flexible circuit board or a rigid circuit board, the LED module manufactured by the LED lamp beads with the resistors is a module formed by welding the LED lamp beads with the resistors on the circuit board.

2. The utility model provides a LED module of LED lamp pearl preparation of band resistance, includes:

an LED support;

flip-chip LED chips or CSP LEDs;

a resistance;

a circuit board;

the LED module is characterized in that the LED module is formed by welding a plurality of LED lamp beads with resistors on the circuit board, and the lamp beads are characterized in that: a flip-chip LED chip or a CSP LED and a resistance have welded on the LED support, there are three electrodes at least on the support, there are two fillets at least on the LED support, it has formed and switched on to have two fillets and electrode at least, LED flip-chip or CSP LED and resistance have welded on the electrode, LED flip-chip or CSP LED and resistance have connected into series connection structure through the electrode, LED lamp pearl has two fillets at least, fillet and LED flip-chip or CSP LED have formed the turn-on connection through the electrode, fillet and resistance have also formed the turn-on connection through the electrode, the characteristic of circuit board is: the circuit board is a flexible circuit board or a rigid circuit board, and the LED module manufactured by the LED lamp beads with the resistors is a module formed by welding the LED lamp beads with the resistors on the circuit board.

3. The LED module manufactured by the LED lamp bead with the resistor as claimed in claim 1, wherein the LED chip is fixed on the No. 1 electrode and connected to the No. 1 and No. 2 electrodes through bonding wires, the resistor is fixed on the No. 2 and No. 3 electrodes, and the resistor is in conductive connection with the No. 2 and No. 3 electrodes.

4. The LED module manufactured by the LED lamp bead with the resistor as claimed in claim 1, wherein the LED chip is fixed on the No. 1 and No. 2 electrodes and is conducted to the No. 1 and No. 2 electrodes through soldering tin connection, the resistor is fixed on the No. 2 and No. 3 electrodes, and the resistor is conducted with the No. 2 and No. 3 electrodes.

5. The LED module manufactured by the LED lamp bead with the resistor as claimed in claim 2, wherein the LED flip chip is a flip chip with core powder on the surface.

6. The LED module manufactured by the LED lamp bead with the resistor as claimed in claim 2, wherein the CSP LED is an LED device with core light powder on the surface.

7. The LED module manufactured by the LED lamp bead with the resistor according to claim 1, wherein the LED chip and the resistor are packaged on the LED support by packaging adhesive, and the packaging adhesive is packaging adhesive containing yellow fluorescent powder or packaging adhesive without yellow fluorescent powder.

8. The LED module manufactured by the LED lamp bead with the resistor as claimed in claim 1 or 2, wherein the LED support is formed by embedding metal on resin.

9. The LED module manufactured by the LED lamp bead with the resistor as claimed in claim 1 or 2, wherein the resistor is connected with the support electrode in a conduction manner through soldering tin or conductive adhesive.

10. The LED module made of the LED lamp beads with the resistors as claimed in claim 1 or 2, wherein the LED lamp beads with the resistors are SMD paster lamp beads.