CN115264419A - Lamp strip made of LED lamp beads containing resistors - Google Patents

Lamp strip made of LED lamp beads containing resistors Download PDF

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Publication number
CN115264419A
CN115264419A CN202110492838.7A CN202110492838A CN115264419A CN 115264419 A CN115264419 A CN 115264419A CN 202110492838 A CN202110492838 A CN 202110492838A CN 115264419 A CN115264419 A CN 115264419A
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CN
China
Prior art keywords
led
led lamp
electrodes
resistor
resistors
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Pending
Application number
CN202110492838.7A
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Chinese (zh)
Inventor
王定锋
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Individual
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Individual
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Application filed by Individual filed Critical Individual
Priority to CN202110492838.7A priority Critical patent/CN115264419A/en
Publication of CN115264419A publication Critical patent/CN115264419A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

The invention relates to a lamp belt made of LED lamp beads containing resistors, in particular to a lamp belt made of LED lamp beads containing resistors, wherein at least three electrodes are arranged on a support of each LED lamp bead, at least two welding feet are arranged on each LED lamp bead, a resistor and an LED chip are packaged on the support, the LED chip and the resistor are fixed on the electrodes, the LED chip and the resistor are connected into a series connection structure through the electrodes, at least two welding feet, the LED chip and the resistor form conduction connection to form the LED lamp beads with the resistors, and then the LED lamp beads with the resistors are welded on a flexible circuit board made of two conducting wires to form the lamp belt made of the LED lamp beads containing the resistors.

Description

Lamp strip made of LED lamp beads containing resistors
Technical Field
The invention relates to the field of LEDs (light emitting diodes), in particular to a lamp strip made of LED lamp beads with resistors.
Background
When the LED lamp beads are used for manufacturing LED lamp strip products, the LED lamp beads and the resistors are often required to form a series connection relation, the LEDs and the resistors are respectively welded on the flexible circuit board to manufacture the LED lamp strip products, the resistors and the LEDs in the prior art are respectively independent devices, and the two independent devices are welded on the flexible circuit board.
The lamp strip manufactured by the LED lamp beads containing the resistors does not need an external resistor, and the LED lamp strip manufactured by the lamp strip product is small in size, light in weight, more attractive, high in manufacturing efficiency and low in cost.
The specific method comprises the following steps:
the utility model provides a lamp area that LED lamp pearl preparation that contains resistance, includes: an LED support; an LED chip; a resistance; packaging glue; a flexible circuit board; the LED lamp strip is formed by welding a plurality of LED lamp beads with resistors on the flexible circuit board, and is characterized in that an LED chip and a resistor are packaged on an LED support by packaging glue, the support is provided with at least three electrodes, the LED support is provided with at least two welding legs, the at least two welding legs are communicated with the electrodes, the LED chip and the resistor are fixed on the electrodes, the LED chip and the resistor are connected into a series connection structure through the electrodes, the at least two welding legs, the LED chip and the resistor are communicated through the electrodes, the chip and the electrodes are communicated through lead wires, or are communicated through tin welding, or are communicated through conductive glue, the flexible circuit board is characterized in that the flexible circuit board is a flexible circuit board formed by only two metal conductors arranged in parallel, a plurality of bonding pads are formed on the two metal conductors, and the LED lamp strip manufactured by the LED lamp beads with resistors is a lamp strip formed by welding the LED lamp beads with resistors on the flexible circuit board, and all the LED lamp beads are connected to the two metal leads of the flexible circuit board in parallel.
Or a lamp area that contains LED lamp pearl preparation of resistance includes: an LED support; flip-chip LED chips or CSP LEDs; a resistance; a flexible circuit board; the LED lamp strip is characterized in that a plurality of LED lamp beads with resistors are welded on the flexible circuit board to form the lamp strip, the lamp beads are characterized in that an LED flip chip or a CSP LED and a resistor are welded on an LED support, at least three electrodes are arranged on the support, at least two welding feet are arranged on the LED support, at least two welding feet and electrodes are conducted, the LED flip chip or the CSP LED and the resistor are welded on the electrodes, the LED flip chip or the CSP LED and the resistor are connected into a series connection structure through the electrodes, the LED lamp beads are provided with at least two welding feet, the welding feet and the LED flip chip or the CSP LED form conduction connection through the electrodes, the welding feet and the resistor also form conduction connection through the electrodes, and the flexible circuit board is characterized in that: the flexible circuit board is a flexible circuit board of a circuit formed by only two metal conductors which are arranged in parallel, a plurality of welding pads are formed on the two metal conductors, the LED lamp strip manufactured by the LED lamp beads with the resistors is welded on the lamp strip formed on the flexible circuit board, and all the lamp beads are connected to two metal wires on the flexible circuit board in parallel.
The electrodes and solder feet are explained and illustrated below:
1. the electrode of the bracket is a metal electrode and is used for fixing and conducting a light source such as a chip and the like and a resistance device, and the electrode is generally arranged in a cup of the bracket or on the plane of the device such as a bracket welding chip and the like.
2. The welding feet are metal feet which are used for being welded and connected with a circuit board or a conductor on the lamp bead and are all exposed at the bottom of the lamp bead.
Disclosure of Invention
The invention relates to a lamp belt made of LED lamp beads containing resistors, in particular to a lamp belt made of LED lamp beads containing resistors, wherein at least three electrodes are arranged on a support of each LED lamp bead, at least two welding feet are arranged on each LED lamp bead, a resistor and an LED chip are packaged on the support, the LED chip and the resistor are fixed on the electrodes, the LED chip and the resistor are connected into a series connection structure through the electrodes, at least two welding feet, the LED chip and the resistor form conduction connection to form the LED lamp beads with the resistors, and then the LED lamp beads with the resistors are welded on a flexible circuit board made of two conducting wires to form the lamp belt made of the LED lamp beads containing the resistors.
The invention provides a lamp strip made of LED lamp beads containing resistors, which comprises: an LED support; an LED chip; a resistance; packaging glue; a flexible circuit board; the LED lamp strip is characterized in that the LED lamp strip is formed by welding a plurality of LED lamp beads with resistors on a flexible circuit board, the LED lamp strip is characterized in that an LED chip and a resistor are packaged on an LED support by packaging glue, at least three electrodes are arranged on the support, at least two welding feet are arranged on the LED support, at least two welding feet are communicated with the electrodes, the LED chip and the resistor are fixed on the electrodes, the LED chip and the resistor are connected into a series connection structure through the electrodes, at least two welding feet, the LED chip and the resistor are communicated through the electrodes, the chip and the electrodes are connected and communicated through wires, or are communicated through tin welding, or are connected and communicated through conductive glue, the flexible circuit board is characterized in that the flexible circuit board is formed by arranging only two metal conductors in parallel, a plurality of bonding pads are formed on the two metal conductors, and the LED lamp strip manufactured by the LED lamp beads with resistors is formed by welding the LED lamp beads with the resistors on the flexible circuit board, and all the LED lamp strips are connected to two metal wires of the flexible circuit board in parallel.
According to the invention, the invention also provides a lamp strip made of the LED lamp beads containing the resistors, which comprises: an LED support; flip-chip LED chips or CSP LEDs; a resistance; a flexible circuit board; the LED lamp strip is characterized in that a plurality of LED lamp beads with resistors are welded on the flexible circuit board, the lamp beads are characterized in that an inverted LED chip or a CSP LED and a resistor are welded on an LED support, at least three electrodes are arranged on the support, at least two welding feet are arranged on the LED support, at least two welding feet and electrodes are conducted, the LED inverted chip or the CSP LED and the resistor are welded on the electrodes, the LED inverted chip or the CSP LED and the resistor are connected into a series connection structure through the electrodes, the LED lamp beads are at least provided with two welding feet, the welding feet and the LED inverted chip or the CSP LED form conduction connection through the electrodes, the welding feet and the resistor also form conduction connection through the electrodes, and the flexible circuit board is characterized in that: the flexible circuit board is a flexible circuit board of a circuit formed by only two metal conductors which are arranged in parallel, a plurality of welding pads are formed on the two metal conductors, the LED lamp strip manufactured by the LED lamp beads with the resistors is welded on the lamp strip formed on the flexible circuit board, and all the lamp beads are connected to two metal wires on the flexible circuit board in parallel.
According to a preferred embodiment of the invention, the lamp strip manufactured by the LED lamp beads containing the resistors is characterized in that the LED chip is fixed on the No. 1 electrode and is connected to the No. 1 and No. 2 electrodes through bonding wires, the resistors are fixed on the No. 2 and No. 3 electrodes, and the resistors are in conductive connection with the No. 2 and No. 3 electrodes.
According to a preferred embodiment of the invention, the lamp strip made of the LED lamp beads containing the resistors is characterized in that the LED chips are fixed on the No. 1 and No. 2 electrodes and are conducted to the No. 1 and No. 2 electrodes through soldering tin connection, the resistors are fixed on the No. 2 and No. 3 electrodes, and the resistors are in conducting connection with the No. 2 and No. 3 electrodes.
According to a preferred embodiment of the invention, the lamp strip made of the LED lamp beads containing the resistors is characterized in that the LED flip chip is a flip chip with core light powder on the surface.
According to a preferred embodiment of the invention, the lamp strip made of the LED lamp beads containing the resistors is characterized in that the CSP LED is an LED device with core light powder on the surface.
According to a preferred embodiment of the invention, the lamp strip manufactured by the LED lamp bead containing the resistor is characterized in that the LED chip and the resistor are packaged on the LED support by packaging adhesive, and the packaging adhesive is packaging adhesive containing yellow fluorescent powder or packaging adhesive not containing yellow fluorescent powder.
According to a preferred embodiment of the invention, the lamp strip made of the LED lamp beads containing the resistors is characterized in that the LED support is formed by embedding metal on resin.
According to a preferred embodiment of the present invention, the lamp strip manufactured by the LED lamp bead with the resistor is characterized in that the conductive connection between the resistor and the support electrode is formed by soldering or by conductive adhesive.
According to a preferred embodiment of the present invention, the lamp strip manufactured by the LED lamp bead with the resistor is characterized in that the LED lamp bead with the resistor is an SMD patch lamp bead.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
FIG. 1 is a schematic plan view of a single stent.
Fig. 2 is a perspective view of a single stent.
FIG. 3 is a schematic cross-sectional view of a single stent.
FIG. 4 is a schematic cross-sectional view of a chip and a resistor fabricated on a support.
Fig. 5 is a schematic cross-sectional view of a flip chip and resistor fabricated on a support.
FIG. 6 is a schematic cross-sectional view of an LED white light bead fabricated on a support with a front-mounted chip and a resistor.
FIG. 7 is a schematic cross-sectional view of an LED white light bead fabricated on a support with a flip chip and a resistor.
FIG. 8 is a schematic cross-sectional view of an LED bead fabricated on a support with CSP LEDs and resistors.
Fig. 9 is a schematic plan view of a laminate of two parallel flat conductor flexible wiring boards.
Fig. 10 is a schematic plan view of a lamp strip made of a resistor-containing LED lamp bead.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Example one
1, preparation of the scaffold
A copper strip 1.1 with the thickness of 0.2MM is prepared to be punched into a circuit prototype through a special die, then silver is plated, PPA1.2 is injection molded to manufacture a bracket, and each bracket comprises 3 electrodes, namely a No. 1 electrode 1.1a, a No. 2 electrode 1.1b and a No. 3 electrode 1.1c (shown in figures 1, 2 and 3).
2, the chip and the resistor are manufactured on the bracket
The method comprises the following steps: using a positively-mounted chip and resistor
(1) And fixing the blue light chip 3.1a on the No. 1 electrode of the bracket by using die bond adhesive, and baking to solidify the die bond adhesive.
(2) The resistor 4.1 is adhered to the No. 2 and No. 3 electrodes of the bracket by a die bonder through solder paste, and the resistor is welded to the bracket electrodes through reflow soldering.
(3) The LED forward chip 3.1a is communicated with the No. 1 and No. 2 electrodes of the bracket through a bonding wire 5.1 by a bonding machine (shown in figure 4).
The second method comprises the following steps: using flip-chip and resistor
(1) And bonding the flip blue LED chip 3.1b on the No. 1 and No. 2 electrodes by using a die bonder and solder paste.
(2) And adhering the resistor 4.1 to the No. 2 and No. 3 electrodes by using a die bonder and solder paste.
(3) The LED flip chip 3.1b and the resistor 4.1 are soldered to the LED support electrodes by reflow (fig. 5).
3, preparation of packaging adhesive
And (3) respectively dripping fluorescent powder glue 6.1 into the bracket cup of the semi-finished LED lamp bead manufactured by the two methods, and heating and curing in an oven to manufacture two LED white light lamp beads 9.1 with resistors, wherein the LED white light lamp beads are manufactured by a front chip and a flip chip respectively (shown in figures 6 and 7).
4. Manufacturing method of flexible circuit board
Two copper-clad aluminum wires are pressed into a flat wire 7.1, a layer of PI covering film is punched into a plurality of pad windows 7.1a by a mould, the interval between the two wires is controlled by controlling the interval control of the conductors on a wire covering machine, the two wires are kept at equal intervals, a layer of PI film 8.1 with glue and the punched PI film are used for clamping the flat wire in the middle and firmly adhering the flat wire, and a flexible circuit board (shown in figure 9) with two parallel flat wires is manufactured.
5. Production of lamp belt
And welding the LED lamp beads 9.1 with the resistors on a flexible circuit board with two parallel flat wires by an SMT (surface mount technology) process to manufacture the lamp strip (shown in figure 10) made of the LED lamp beads with the resistors.
Example two
1, preparation of the scaffold
A copper strip 1.1 with the thickness of 0.2MM is prepared to be punched into a circuit prototype through a special die, then silver is plated, PPA1.2 is injection molded to manufacture a bracket, and each bracket comprises 3 electrodes, namely a No. 1 electrode 1.1a, a No. 2 electrode 1.1b and a No. 3 electrode 1.1c (shown in figures 1, 2 and 3).
2, CSP LED and resistor are manufactured on the bracket
(1) And adhering the small CSP LED device 3.1c with fluorescent powder on the No. 1 and No. 2 electrodes by using a die bonder and solder paste.
(2) And adhering the resistor 4.1 to the No. 2 and No. 3 electrodes by using a die bonder and solder paste.
(3) And soldering the small CSP LED device 3.1c and the resistor 4.1 on the LED support electrode through reflow soldering to form an LED lamp bead 9.1 with a resistor, wherein the resistor of the lamp bead and the CSP LED device are exposed (shown in figure 8).
3. Manufacturing method of flexible circuit board
Two copper-clad aluminum wires are pressed into a flat wire 7.1, a layer of PI covering film is punched into a plurality of pad windows 7.1a by a mould, the interval between the two wires is controlled by controlling the interval control of the conductors on a wire covering machine, the two wires are kept at equal intervals, a layer of PI film 8.1 with glue and the punched PI film are used for clamping the flat wire in the middle and firmly adhering the flat wire, and a flexible circuit board (shown in figure 9) with two parallel flat wires is manufactured.
4. Production of lamp belt
And welding the LED lamp beads 9.1 with the resistors on a flexible circuit board with two parallel flat wires by an SMT (surface mount technology) process to manufacture the lamp strip (shown in figure 10) made of the LED lamp beads with the resistors.
The invention is described in detail with reference to the drawings, in which a specific embodiment of a lamp strip made of a resistance-containing LED lamp bead is described. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.

Claims (10)

1. The utility model provides a lamp area that LED lamp pearl preparation that contains resistance, includes:
an LED support;
an LED chip;
a resistance;
packaging glue;
a flexible circuit board;
the LED lamp strip is characterized in that the LED lamp strip is formed by welding a plurality of LED lamp beads with resistors on a flexible circuit board, the LED lamp strip is characterized in that an LED chip and a resistor are packaged on an LED support by packaging glue, at least three electrodes are arranged on the support, at least two welding feet are arranged on the LED support, at least two welding feet are communicated with the electrodes, the LED chip and the resistor are fixed on the electrodes, the LED chip and the resistor are connected into a series connection structure through the electrodes, at least two welding feet, the LED chip and the resistor are communicated through the electrodes, the chip and the electrodes are connected and communicated through wires, or are communicated through tin welding, or are connected and communicated through conductive glue, the flexible circuit board is characterized in that the flexible circuit board is formed by arranging only two metal conductors in parallel, a plurality of bonding pads are formed on the two metal conductors, and the LED lamp strip manufactured by the LED lamp beads with resistors is formed by welding the LED lamp beads with the resistors on the flexible circuit board, and all the LED lamp strips are connected to two metal wires of the flexible circuit board in parallel.
2. The utility model provides a lamp area that LED lamp pearl preparation that contains resistance, includes:
an LED support;
flip-chip LED chips or CSP LEDs;
a resistance;
a flexible circuit board;
the LED lamp strip is characterized in that a plurality of LED lamp beads with resistors are welded on the flexible circuit board, the lamp beads are characterized in that an inverted LED chip or a CSP LED and a resistor are welded on an LED support, at least three electrodes are arranged on the support, at least two welding feet are arranged on the LED support, at least two welding feet and electrodes are conducted, the LED inverted chip or the CSP LED and the resistor are welded on the electrodes, the LED inverted chip or the CSP LED and the resistor are connected into a series connection structure through the electrodes, the LED lamp beads are at least provided with two welding feet, the welding feet and the LED inverted chip or the CSP LED form conduction connection through the electrodes, the welding feet and the resistor also form conduction connection through the electrodes, and the flexible circuit board is characterized in that: the flexible circuit board is a flexible circuit board of a circuit formed by only two metal conductors which are arranged in parallel, a plurality of welding pads are formed on the two metal conductors, the LED lamp strip manufactured by the LED lamp beads with the resistors is welded on the lamp strip formed on the flexible circuit board, and all the lamp beads are connected to two metal wires on the flexible circuit board in parallel.
3. A light strip made of LED lamp beads containing resistors as claimed in claim 1, wherein said LED chip is fixed on electrode No. 1 and connected to electrode No. 1 and electrode No. 2 by bonding wires, the resistor is fixed on electrode No. 2 and electrode No. 3, and the resistor is connected to electrode No. 2 and electrode No. 3 in a conductive manner.
4. A light strip made of LED lamp beads with resistors as claimed in claim 1, wherein said LED chips are fixed on the electrodes No. 1 and No. 2 and have been connected to the electrodes No. 1 and No. 2 by soldering, the resistors are fixed on the electrodes No. 2 and No. 3, and the resistors have been connected to the electrodes No. 2 and No. 3.
5. A light strip made of LED lamp beads containing resistors as claimed in claim 2, wherein said LED flip chip is a flip chip with core powder on its surface.
6. A light strip made of LED lamp beads containing resistors as claimed in claim 2, wherein said CSP LED is a LED device with core powder on the surface.
7. The lamp strip manufactured by the LED lamp bead with the resistor according to claim 1, wherein the LED chip and the resistor are packaged on the LED support by packaging adhesive, and the packaging adhesive is packaging adhesive containing yellow fluorescent powder or packaging adhesive without the yellow fluorescent powder.
8. A light strip made of LED lamp beads containing resistors as claimed in claim 1 or 2, wherein said LED support is made of metal embedded in resin.
9. A light strip manufactured by an LED lamp bead with a resistor according to claim 1 or 2, wherein the resistor is connected to the support electrode by soldering or by conductive adhesive.
10. A light strip made of LED lamp beads containing resistors as claimed in claim 1 or 2, wherein said LED lamp beads containing resistors are SMD patch lamp beads.
CN202110492838.7A 2021-04-30 2021-04-30 Lamp strip made of LED lamp beads containing resistors Pending CN115264419A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110492838.7A CN115264419A (en) 2021-04-30 2021-04-30 Lamp strip made of LED lamp beads containing resistors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110492838.7A CN115264419A (en) 2021-04-30 2021-04-30 Lamp strip made of LED lamp beads containing resistors

Publications (1)

Publication Number Publication Date
CN115264419A true CN115264419A (en) 2022-11-01

Family

ID=83745641

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110492838.7A Pending CN115264419A (en) 2021-04-30 2021-04-30 Lamp strip made of LED lamp beads containing resistors

Country Status (1)

Country Link
CN (1) CN115264419A (en)

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Addressee: Ran Chongyou

Document name: Review Business Special Letter